MINISFORUM today is launching their BD770i ITX "Mobile on Desktop" motherboard which comes equipped with AMD's 8-core "Zen 4" Ryzen 7 7745HX. Upon the CPU sits a custom "integrated advanced cooling system" which partially exhausts out of the I/O shield and supports installation of a 120 mm fan, which is not included. The board features dual actively cooled M.2 2280 PCI-E Gen 5 SSDs plus M.2 2230 E-Key for WLAN cards, 2.5G Ethernet, a pair of USB 2.0 ports, another pair of USB 3.2 Gen 1 ports, and a USB 3.2 Gen 2 Type-C port that also supports display out as DisplayPort 1.4. The BD770i also features dual SODIMM slots for up to DDR5-5200 DRAM, as well as a full length PCI-E Gen 5 x16 for dedicated graphics cards. A small detail we noticed in the product images is the silhouette of two more M.2 ports on the rear of the board that aren't in the specifications. On the product page there are mentions of a higher-end BD790i with the Ryzen 9 7945HX which does not seem to be available yet, so perhaps this higher end board will feature these extra ports.

Despite the AMD Ryzen 7 7745HX supporting overclocking features such as an unlocked multiplier, AMD EXPO, and Precision Boost Overdrive; MINISFORUM has chosen to not support those features on the BD770i. Perhaps the upcoming BD790i will include OC support and features, we'll have to wait and see. Pricing for the BD770i is currently set at $399 USD for early orders, however the price is expected to increase to $499 USD after the launch period promotion expires.

Razer, the leading global lifestyle brand for gamers, already pushes boundaries of mobile gaming, but today unveiled a substantial update to its Razer Nexus app for both iPhone and Android. Nexus 3.0 brings a variety of innovative new features for Android and a polished and upgraded experience for iPhone users. As the main game launcher for Razer Edge & Kishi V2, and driven by Razer's dedication to high-performance gaming, the Razer Nexus 3.0 update embodies innovation, immersion, and intuitive user experiences. The app update is available to users free of charge.

Redefining Game Discovery: The Razer Nexus app becomes the ultimate game concierge, presenting a meticulously curated selection of games for the Razer community. Optional video previews and carefully considered categories minimize the time between discovery and gameplay. This enriched catalog is now live for Android and iPhone users.

Without fanfare, Intel has launched two new mobile GPUs in the shape of the Arc A570M and the A530M. The Arc A570M gets 16 Xe Cores and 256 execution units, as well as four render slices and 16 RT units. The lower-end Arc A530M gets to make do with 12 Xe cores, 192 execution units, three render slices and 12 RT units, which is a smaller cut than the model name suggests. What's interesting to note here is that the Arc A570M appears to have identical hardware specs to the Arc A550M that launched in the second quarter of 2022, although as we'll see, the clock speeds and TGP differ between the parts. The Arc A570M supports 8 GB of GDDR6 memory, the same as the Arc A550M, with the Arc A530M supports 4 or 8 GB of GDDR6.

Both the Arc A570M and the A530M will get a GPU clock speed of 1,300 MHz, which is a significant boost from the Arc A550M which is plodding along at a mere 900 MHz in comparison. This makes the two newcomers Intel's third highest clocked mobile GPUs, with only the Arc A770M and Arc A370M being clocked higher. The downside of this is an increase in TGP, where the Arc A550M had a fairly reasonable TGP of 60 Watts, the Arc A530M has a TGP range of 65 to 95 Watts, while the Arc A570M extends this to 75-95 Watts. The rest of the specs appear to carry over from the Arc A550M, so the new GPUs will support up to four displays via eDP, DP 2.0 or HDMI 2.1 and the full set of video encoders and decoders are also supported. The new additions are still made using TSMC's N6 node, so what we're looking at are most likely just optimised silicon here, which has led Intel to be able to boost the clock speeds while maintaining acceptable thermals.

Samsung Electronics today announced the first step in a plan to reimagine mobile device security for business customers in partnership with Microsoft. This collaboration has led to the industry's first on-device, mobile hardware-backed device attestation solution that works equally well on both company and personally owned devices.

Device attestation can help ensure a device's identity and health, verifying that it has not been compromised. On-device, mobile hardware-backed device attestation—available on Samsung Galaxy devices and combined with protection from Microsoft Intune—now adds enhanced security and flexibility. For enterprises, this is an extra layer of protection against compromised devices falsely claiming to be known and healthy, gaining access to sensitive corporate data. Additionally, organizations can now enable employees to bring their own device (BYOD) to work with the confidence that they are protected with the same level of security as company owned devices. For employees, this means added flexibility for their personal Galaxy devices to safely access their work environment.

Samsung Electronics Co., Ltd. today announced its fifth generation of Galaxy foldables: Galaxy Z Flip5 and Galaxy Z Fold5. The industry-leading form factors offer unique experiences for every user with sleek and compact designs, countless customization options, and powerful performance. The new Flex Hinge makes the foldable experience possible, while offering an aesthetically balanced and solid design. These unrivalled foldable devices unlock extraordinary camera capabilities such as FlexCam to take photos from creative angles. With strong performance and an optimized battery powered by the latest processor, the Samsung Galaxy Z series transforms what is possible with a smartphone - open or closed.

"Samsung is revolutionizing the mobile industry with foldables by setting the standard and continually refining the experience," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "Every day, more people choose our foldables because they offer an experience people want that they can't get on any other device. Galaxy Z Flip5 and Galaxy Z Fold5 are the latest devices that prove our commitment to meeting the needs of our customers through innovative technology."

Today, Lenovo unveiled the newest additions to its ThinkPad mobile workstation portfolio. Powered by the latest AMD Ryzen PRO 7040 Series Mobile processors with optional NVIDIA RTX professional graphics, the new ThinkPad P16v, P16s Gen 2 and P14s Gen 4 complement the models announced in May 2023, offering customers a broad choice in mobile workstation PC solutions. ThinkPad P Series devices deliver breakthrough performance, premium design, and durability for demanding workflows across a variety of price points and include support for Windows 11 and several flavors of Linux. Bringing advanced and power-efficient processors with AMD PRO technologies and Ryzen AI on select models opens up an enhanced world of AI-driven features for advanced collaboration on ThinkPad mobile workstations.

"Our latest workstations are designed to help our customers make a difference and drive a positive long-lasting impact in their fields, whether it's research and design, engineering and finance, media and entertainment, healthcare and education, or anything else. We are committed to delivering human-centric innovations that empower our customers to unleash their potential with ThinkPad mobile workstations," said Rob Herman, VP and GM, Worldwide Workstation and Client AI Business at Lenovo.

TrendForce reports that continued production cuts by DRAM suppliers have led to a gradual quarterly decrease in overall DRAM supply. Seasonal demand, on the other hand, is helping to mitigate inventory pressure on suppliers. TrendForce projects that the third quarter will see the ASP for DRAM converging towards a 0~5% decline. Despite suppliers' concerted efforts, inventory levels persistently remain high, keeping prices low. While production cutbacks may help to curtail quarterly price declines, a tangible recovery in prices may not be seen until 2024.

PC DRAM: The benefits of consolidated production cuts on DDR4 by the top three suppliers are expected to become evident in the third quarter. Furthermore, inventory pressure on suppliers has been partially alleviated due to aggressive purchasing by several OEMs at low prices during 2Q23. Evaluating average price trends for PC DRAM products in 3Q23 reveals that DDR4 will continue to remain in a state of persistent oversupply, leading to an expected quarterly price drop of 3~8%. DDR5 prices—influenced by suppliers' efforts to maintain prices and unmet buyer demand—are projected to see a 0-5% quarterly decline. The overall ASP of PC DRAM is projected to experience a QoQ decline of 0~5% in the third quarter.

Elgato, a subsidiary of CORSAIR (NASDAQ: CRSR), and leading provider of hardware and software for content creators, today announced a major update to the digital version of its celebrated Stream Deck, Stream Deck Mobile. The Stream Deck Mobile app turns any smartphone into a handheld productivity interface. With today's update, Stream Deck Mobile becomes free to use for up to six keys, for anyone with an iPhone or iPad. Other core app changes introduce more ways for users to control their favorite apps and customize their setup.

Now with its "freemium" app model, Stream Deck Mobile is more accessible than ever for millions of customers worldwide. Users can get the best of Stream Deck on their iPhone or iPad for free - including six keys, unlimited actions, and hundreds of plugins for popular apps. An optional Pro subscription or purchase unlocks advanced features like custom layouts, backgrounds, and up to 64 keys - double that of Elgato's largest physical device, Stream Deck XL.

Qualcomm Technologies, Inc. has announced the new Snapdragon 4 Gen 2 Mobile Platform, which has been creatively engineered to make incredible mobile experiences accessible to more consumers globally. Snapdragon 4 Gen 2 provides effortless, all-day use with fast CPU speeds, sharp photography and videography, plus speedy 5G and Wi-Fi for reliable connections.

"Snapdragon - at its core - is driving innovation while meeting the demands of OEMs and the broader industry," said Matthew Lopatka, director of product management, Qualcomm Technologies, Inc. "With this generational advancement in the Snapdragon 4-series, consumers will have greater access to the most popular and relevant mobile features and capabilities. We optimized every aspect of the platform in order to maximize the experiences for users."

Zebra Technologies Corporation, a leading digital solution provider enabling businesses to intelligently connect data, assets, and people, today announced the launch of the ET6x series of rugged Android tablets. Designed to help front-line workers in warehouses, manufacturing plants, ports, yards, field service and emergency medical environments be more productive and efficient, the ET6x series debuts the industry's only heated touch screen and vehicle dock for forklifts and other material handling vehicles.

The ET60 and ET65 are Zebra's first 2-in-1 Android tablets with a friction-hinge keyboard that transforms the tablets into a laptop to make heavy data entry easy in the office and in the field. The products feature consumer styling that can handle harsh indoor and outdoor environments from sub-zero cold to extreme heat. The tablets are dustproof, corrosion proof and tested for vibration, thermal shock, and solar radiation. Two of the most vulnerable tablet elements - the display and optional scanner exit window - are protected with shatter-and scratch-resistant Corning Gorilla Glass.

Sony Semiconductor Solutions Corporation (SSS) this week announced that it will ship a new line of LYTIA brand products, primarily 50-megapixel models, this fiscal year. LYTIA is the new product brand of image sensors for mobile devices developed by SSS. SSS has leveraged its imaging and sensing technologies to bring value to the market in a variety of ways and deliver a richer imaging experience to users. SSS is expanding its high-quality products under the LYTIA brand so that more users in the mobile market can benefit from its commitment to imaging as they use smartphones to capture images. The first step in this initiative is expanding the line of 50-megapixel products, as it is the most versatile resolution for use in current mobile applications.

More and more people today are using smartphones to enjoy imaging on a daily basis, and the way they use cameras are also diversifying with more and more smartphones coming with multiple built-in cameras. SSS plans to contribute to enhanced imaging experiences with LYTIA products that accommodate diverse shooting scenes and purposes.

Mobile devices touch every aspect of our digital lives. In the palm of your hand is the ability to both create and consume increasingly immersive, AI-accelerated experiences that continue to drive the need for more compute. Arm is at the heart of many of these, bringing unlimited delight, productivity and success to more people than ever. Every year we build foundational platforms designed to meet these increasing compute demands, with a relentless focus on high performance and efficiency. Working closely with our broader ecosystem, we're delivering the performance, efficiency and intelligence needed on every generation of consumer device to expand our digital lifestyles.

Today we are announcing Arm Total Compute Solutions 2023 (TCS23), which will be the platform for mobile computing, offering our best ever premium solution for smartphones. TCS23 delivers a complete package of the latest IP designed and optimized for specific workloads to work seamlessly together as a complete system. This includes a new world-class Arm Immortalis GPU based on our brand-new 5th Generation GPU architecture for ultimate visual experiences, a new cluster of Armv9 CPUs that continue our performance leadership for next-gen artificial intelligence (AI), and new enhancements to deliver more accessible software for the millions of Arm developers.

MediaTek is rumored to have partnered up with NVIDIA in a new joint effort to create graphically powerful mobile chipsets. DigiTimes Asia reports that the two fabless companies are collaborating on a flagship-level smartphone SoC that could arrive in early 2024. MediaTek is hoping that this tech union will help advance its application processors with AI enhancements and greater gaming functionalities. Insider sources also claim that the partnership extends to the development of WOA (Windows on Arm) platform products for notebook applications.

DigiTimes believes that NVIDIA is seeking new market scope - outside of its normal staple of gaming and enterprise GPUs - opportunities within the smartphone and notebook market are part of an overall expansion strategy, including the teaming up with MediaTek. Arch rival AMD has been working with Samsung for a number of years on RDNA-based "Xclipse" iGPUs, as featured in several existing and upcoming flagship Exynos mobile chipsets, and Team Green is seemingly interested in doing something similar. MediaTek is keen to expand its processor presence in the notebook world - its current offerings only target the entry-level segment - and the alliance with NVIDIA could result in forthcoming mid-range and high-end WOA platform products.

For anyone struggling to multitask when working from home, Burlington tech company Mobile Pixels Inc. has unveiled the perfect solution. It recently launched a new series of dual monitors that are specially crafted to make work-from-home hassle-free. The latest in Mobile Pixel's innovations, the Geminos Series consists of two foldable and adjustable dual-screen desktop monitors vertically stacked to provide better ergonomic support and increased productivity.

The Geminos Series was brought to life following another wildly successful Mobile Pixels Kickstarter campaign that saw over 3,000 backers pledge as much as $2,161,609. With its official launch, Geminos now promises to revolutionize the lives of all working professionals, gamers, traders, streamers, entrepreneurs, coders, and students.

TrendForce's latest research indicates that, as production cuts to DRAM and NAND Flash have not kept pace with weakening demand, the ASP of some products is expected to decline further in 2Q23. DRAM prices are projected to fall 13~18%; NAND Flash is expected to fall between 8~13%.

TrendForce reports that the significant drop in DRAM prices was mostly attributed to high inventory levels of DDR4 and LPDDR5 as PC DRAM, server DRAM, and mobile DRAM collectively account for over 85% of DRAM consumption. Meanwhile, the market share for DDR5 remains relatively low.

The ASUS ROG Ally handheld games console emerged last month and it was revealed to pack some impressive "custom" AMD hardware - the two companies have boasted that the collaboration has resulted in two special SoCs - the Ryzen Z1 and Ryzen Z1 Extreme. Silicon enthusiasts were quick to point out that the Z1 series sported similar specifications to mobile/ultra-portable chipsets in AMD's 7040U family - in particular the Ryzen 7 7840U looks almost identical to its gaming equivalent (Ryzen Z1 Extreme). Andrew E. Freedman at Tom's Hardware was curious and motivated enough to request clarification (about this situation) from AMD. Team Red were happy to respond and acknowledged the apparent similarities between the gaming and laptop chipset ranges, but also stated that Z1 APUs have been tweaked by company engineers to a certain degree.

Matthew Hurwitz, a client PR manager at AMD, provided a response to the Tom's Hardware-issued query: "The Ryzen Z1 series are purpose-built with handheld gaming in mind. To accomplish this, AMD engineers had to validate entirely new power ranges and optimize the voltage curves specifically for this use case - this optimization and validation work should not be trivialized. So while the technology building blocks (like 'Zen 4' and RDNA 3) are similar between the 7040 and Z1 series, the resulting models have very distinct characteristics customized for their use cases. In addition, the AMD Ryzen AI engine is not available on AMD Ryzen Z1 series processors." Hurwitz also confirmed that AMD's XDNA AI engine is merely disabled (so not removed at hardware level) on the two Z1 APUs - this feature is only enabled on the range-topping Ryzen 7 7840U model and mid-range Ryzen 5 7640U. So yes, there are small differences but AMD and ASUS have probably saved some money on development costs by creating and adopting the "slightly adjusted" Z1 SoC series.

Update May 6th: Tom's Hardware has amended their article (as of May 5, 5:03 p.m. ET) - another source within AMD has informed them about the Z1 and Z1 Extreme APUs having configurable TDPs of 9 W to 30 W. The original story - and AMD's website - claimed a range of 15-30 W.

Samsung Electronics today reported financial results for the first quarter ended March 31, 2023. The Company posted KRW 63.75 trillion in consolidated revenue, a 10% decline from the previous quarter, as overall consumer spending slowed amid the uncertain global macroeconomic environment. Operating profit was KRW 0.64 trillion as the DS (Device Solutions) Division faced decreased demand, while profit in the DX (Device eXperience) Division increased.

The DS Division's profit declined from the previous quarter due to weak demand in the Memory Business, a decline in utilization rates in the Foundry Business and continued weak demand and inventory adjustments from customers. Samsung Display Corporation (SDC) saw earnings in the mobile panel business decline quarter-on-quarter amid a market contraction, while the large panel business slightly narrowed its losses. The DX Division's results improved on the back of strong sales of the premium Galaxy S23 series as well as an enhanced sales mix focusing on premium TVs.

Samsung's unannounced Exynos 2400 mobile chipset has been linked to the upcoming Galaxy S24 smartphone family, but internet tipsters have speculated that the in-house SoC will be reserved for the baseline model only. The more expensive Plus and Ultra variants could be the main targets for flagship smartphone fetishists - it is possible that Qualcomm's upper echelon Snapdragon 8 Gen 3 chipset is set to feature within these premium devices. Samsung's Exynos processors are not considered to be fan favorites, but industry insiders reckon that the latest performance figures indicate that Samsung's up-and-comer has the potential to turn some heads. Exact specifications for the Exynos 2400 are not public knowledge - one of the tipsters suggests that a 10-core layout has been settled on by Samsung, as well as a recent bump up in GPU core count - from 6 to 12. The company's own 4 nm SF4P process is the apparent choice set for production line.

A leaker has posted benchmark scores generated by an unknown device that was running an Exynos 2400 SoC - the Geekbench 5 results indicate an average single-core score of 1530 with a peak of 1711. The multi-core average score is shown to be 6210, and the highest number achieved is 6967. Therefore the Exynos 2400 is 31% percent faster (in multi-core performance) than the refreshed Snapdragon 8 Gen 2 variant currently found in Galaxy S23 Ultra smartphones, but the divide between the two in terms of single-core performance is not so great. The 2400 manages to outpace (by 30%) Apple's present generation Bionic A16's average multi-core score, although the latter beats the presumed engineering sample's single-core result by 20%. The Exynos 2400 will face a new lineup of rival mobile processors in 2024 - namely Apple's next generation Bionic A17 and Qualcomm's Snapdragon 8 Gen 3, so it is difficult to extrapolate today's leaked figures into a future scenario.

The Financial Times this weekend has published details about an interesting development project that is currently in-the-works at British semiconductor specialist firm Arm Ltd. The article states that several executives in the industry have divulged (anonymously) that Arm's engineering team is designing a proprietary chip - these insider sources opine that this new creation could be one of the company's most advanced undertakings. The SoftBank-owned chipmaker is having a bumper year in terms of financial success and has invested in its future - it is speculated that their own semiconductor design will be showcased as a prototype product to potential new clients - with the main goal being to drum up more business and growth. Parent group SoftBank is likely pushing for maximum profit margins as it prepares Arm for an initial public offering (IPO) this year.

Arm's modus operandi involves partnering up with other chip manufacturers in order to license out its semiconductor intellectual properties. In turn these partners are expected to deal with the overall design and manufacturing processes of chips (plus sales of). Arm has teamed up with foundries TSMC and Samsung in the past to create prototypes for software testing purposes, but not much has been heard about those proofing projects in the following years. In an unusual turn (from certain industry perspectives) from its traditional working methodologies, it seems that Arm is embracing a different approach by producing its own compelling designs, with the hope of demonstrating greater potential to customers. FT's sources have provided evidence that Arm has expanded its operations and that a newly formed "solutions engineering" team is focused on prototyping new silicon for usage in mobile hardware and related devices.

An online tipster, posting on the Chinese blog site Weibo, has let slip that Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset is touted to pack some hefty graphical capabilities. The suggested Adreno "750" smartphone and tablet GPU is touted to offer a 50% increase over the present generation Adreno 740 - as featured on the recently released and cutting-edge Snapdragon 8 Gen 2 chipset. The current generation top-of-the-range Snapdragon is no slouch when it comes to graphics benchmarks, where it outperforms Apple's prime contender - the Bionic A16 SoC.

The Snapdragon 8 Gen 3 SoC is expected to launch in the last quarter of 2023, but details of the flagship devices that it will power are non-existent at the time of writing. The tipster suggests that Qualcomm has decided to remain on TSMC's 4 nm process for its next generation mobile chipset - perhaps an all too safe decision when you consider that Apple has upped the stakes with the approach of its Bionic A17 SoC. It has been reported that the Cupertino, California-based company has chosen to fabricate via TSMC's 3 nm process, although the Taiwanese foundry is said to be struggling with its N3 production line. The engineers at Qualcomm's San Diego headquarters are alleged to be experimenting with increased clock speeds running on the next gen Adreno GPU - as high as 1.0 GHz - in order to eke out as much performance as possible, in anticipation of besting the Bionic A17 in graphics benchmarks. The tipster theorizes that Qualcomm will still have a hard time matching Apple in terms of pure CPU throughput, so the consolation prize will lie with a superior GPU getting rigged onto the Snapdragon 8 Gen 3.

ASUS Republic of Gamers (ROG) today announced the all-new ROG Phone 7 series of gaming smartphones at its For Those Who Dare virtual launch event. The ROG Phone 7 series includes the ROG Phone 7 and ROG Phone 7 Ultimate models and is the latest step in the high-performance evolution of the world's greatest gaming phone. This futuristically-styled phone—which sports a new two-tone design—combines the game-winning power of the flagship Snapdragon 8 Gen 2 Mobile Platform with the advanced GameCool 7 thermal system and special ROG tuning to deliver a truly breathtaking mobile gaming experience—and impressively low power consumption. The key to this power efficiency is the revolutionary new rapid-cycle vapor chamber design, which increases heat dissipation efficiency by up to 168%, allowing the ROG Phone 7 series to run games at full speed while maintaining low temperatures.

To make ROG Phone 7 a powerful and portable theater, we've increased the effective volume of the ROG Phone 7 series' speakers by 50% and tuned the system in cooperation with audio specialists Dirac. ROG Phone 7 series now delivers amazing 2.1-channel sound when the new AeroActive Cooler 7 accessory—which houses a powerful subwoofer—is attached.

Kernel information for a chipset code-named 'Quadra' has been leaked by Home IT. It appears that this SoC is under development at Samsung Electronics, and could be featured in the company's next generation flagship smartphone range. The recently released Galaxy S23 smartphone series is powered by Qualcomm's cutting-edge Snapdragon 8 Gen 2 processor, which ended up being a fine choice for the end user. This was not an ideal partnership for the semiconductor giant, considering its constant push to promote internally developed hardware.

Industry experts have praised Samsung for not integrating an Exynos processor into this generation of devices, including regional model variations, but that has not stopped the company's persistent development cycle of proprietary mobile CPUs. Rumors point to a collaboration with Google, and the Exynos 2300 SoC looks to form the basis of the latter's next generation Tensor G3 chipset. The leak reveals that the standard 2300 has been designed as a 1+4+4 core configuration, comprised of four performance cores, four efficiency cores, and one super core.

AMD has announced the immediate availability of its Ryzen 7045 HX-series (Dragon Range) processors for high performance laptop devices. In a Youtube video released on March 10, AMD's Jason Banta has announced the availability of the world's most powerful mobile processor, the Ryzen 9 7945HX. He listed the OEM partners who have integrated the 7945HX into flagship level laptop models. He also declared that this range topping CPU is a competition beater. Gaming benchmark tests have demonstrated that the Ryzen 9 7945HX beats Intel's Raptor Lake Core i9-13950HX by an average margin of 10%.

AMD "Zen 4" processors offer unmatched efficiency at lower power, and notebook manufacturers are beginning to notice that the company's high core-count Ryzen 7045HX series "Dragon Range" mobile processors offer performance and battery-life highly competitive to 13th Gen Core "Raptor Lake" processors. The Ryzen 7 7745HX is an 8-core/16-thread processor with a single 5 nm "Zen 4" chiplet, and default TDP of 55 W. Chinese tech publication Golden Pig Upgrade reviewed a notebook powered by the 7745HX, and compared it with one rocking a Core i7-13700HX 8P+8E. The reviewer found the 7745HX to offer superior performance/Watt and gaming performance that either matches or beats the "Raptor Lake," which is held back by aggressive power-management and an older 10 nm-class process node.

For more than a decade, Intel and its partners have been on a mission to virtualize the world's networks, from the core to the RAN (radio access network) and out to the edge, moving them from fixed-function hardware onto programmable, software-defined platforms, making networks more agile while driving down their complexity and cost.

Now operators are looking to cross the next chasm in delivering cloud-native functionality for automating, managing and responding to an increasingly diverse mix of data and services, providing organizations with the intelligence needed at the edge of their operations. Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).