MyDigitalSSD must have began rethinking their BPX Pro SSD lineup's pricing as soon as they entered the market. A mere three weeks later, the company has announced a 25% cut on its lineup, ranging from your choice of 240 GB ($99.99 originally, now $79.99), 480 GB ($149.99 originally, now $129.99), 960 GB ($279.99 originally, now $259.99) and 1920 GB ($599.99 originally, will be available later at $569.99) capacities.

As a reminder, the MyDigitalSSD BPX (Bullet Proof eXpress) Pro NVMe SSDs leverage the PCIe 3.1 x4 complex in the M.2 SSD form-factor to deliver staggering (up to) sequential read and write speeds of 3,400MB/s and 3,100MB/s, respectively - with not too shabby 4K random performance. These speeds are achieved using Phison's new E12 controller paired with Toshiba-made BiCS3 TLC NAND flash, one of the industry's strongest NAND options. With these price-cuts, they've become one of the cheapest options in the market, and are likely vying for the price/performance crown.

Gigabyte today announced they were expanding their SSD storage lineup (started with the UD PRO series SATA III SSDs) with M.2 solutions. The new SSDs transfer data under the NVMe protocol and carry the M.2 form factor, in 128 GB, 256 GB and 512 GB sizes.

According to Gigabyte's own product pages, the 256 GB version has a sequential read and write speed of up to 1200 MB/s and 800 MB/s, while the 128 GB model cuts those speeds down to 1100 MB/s read and 500 MB/s write.

MyDigitalSSD is out with a relatively ingenious solution for users looking to get the best portable, external SSD performance available. Their new M2X external M.2 enclosure will allow users to create an external storage solution via a DIY kit. The M2X is built on JMicron's JMS583 USB 3.1 Gen 2 to PCIe 3.1 x2 bridge chip (meaning that a PCIe 2x NVMe will be sufficient in maxing out available performance), will only be limited by USB 3.1 Gen 2's 1GB/s throughput. The DIY assembly packs a thermal pad and the enclosure, as well as USB Type-C and Type-A cables, and will be available from Amazon for $39.99 or through MyDigitalDiscount for $36.14.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND flash products, today launched the ADATA IUSP33F PCIe ball grid array (BGA) solid state drive (SSD). The SSD sports a form factor that is 80 percent more compact than M.2 2242 SSDs. Combined with a PCIe Gen3x2 interface and 3D Flash memory for excellent performance and durability, the IUSP33F is an ideal solution for slim-form-factor tablets, notebooks, hybrids, mini-PCs, thin clients, and wearables.

"We are thrilled to be introducing the new IUSP33F SSD, a compact solution that will enable next-generation tablets, ultrabooks, and other slim devices, but without compromising on performance and reliability," said Hedi Huang, Sales Directorof ADATA. "But the versatility of the IUSP33F goes beyond just these applications, and are also well-suited for new emerging applications in areas such as robotics, augmented and virtual reality, and automotive.

KINGMAX, a world-renowned professional memory manufacturer, has consummated its product line of M.2 2280 PCIe NVMe solid-state drives (SSDs), providing users who want to improve their PC performance with a greater variety of choices. In addition to the ultra-fast M.2 PCIe SSD PX-3480 (Gen3x4) and the PX-3280 (Gen3x2), the affordable/entry-level PJ-3280 (Gen3x2) has also been introduced, allowing users who are considering turning to SSDs to boost their computer performance a higher-speed and more economical option aside from 2.5-inch solid-state drives.

An increasing variety of motherboards or notebooks are currently available on the market, including motherboards equipped with Intel Z270, X99 and the latest 2 Series/3 Series chipsets, all of which are equipped with the M.2 PCIe interface as standard equipment to enable future upgrades. As long as the M.2 slot is the M key version, a solid-state drive that comes with the M.2 PCIe interface can be employed to push the speed and performance of a computer to higher levels. The KINGMAX M.2 2280 NVMe SSD PJ-3280 (Gen3x2) is manufactured using 3D NAND Flash stacking technology, making it highly efficient, stable and durable. Meanwhile, the M.2 2280 is 22x80 mm in size and is available in capacities of 128GB, 256GB or 512GB, suitable for improving the performance of space-challenged notebooks and ultrabooks while expanding capacity.

MyDigital has finally launched their BPX (Bullet Proof eXpress) Pro NVMe SSDs, which leverage the PCIe 3.1 x4 complex in the M.2 SSD form-factor to deliver staggering (up to) sequential read and write speeds of 3,400MB/s and 3,100MB/s, respectively - with not too shabby 4K random performance. These speeds are achieved using Phison's new E12 controller paired with Toshib-made BiCS3 TLC NAND flash, one of the industry's strongest NAND options.

The BPX Pro M.2 NVMe SSDs are available in your choice of 240 GB ($99.99), 480 GB ($149.99), 960 GB ($279.99) and 1920 GB ($599.99) capacities. All are each backed by a five-year, 3,115 TBW (terabytes written) warranty. The drives are available via online retailers and will start shipping by the middle of September.

Samsung Electronics America, Inc. today unveiled the Samsung Data Center solid-state drive (SSD) lineup to address current and future trends in high performance computing storage in the big data era for small and medium businesses (SMBs). Samsung's new family of Data Center SSD solutions, which consists of the 860 DCT, 883 DCT, 983 DCT and the 983 ZET, are engineered to meet the evolving needs of SMBs, including faster, sustained performance, higher capacities and enterprise-class reliability and security.

Samsung's Data Center SSD portfolio will raise the bar for efficiency compared to legacy storage systems, requiring fewer servers and reduced power and cooling for a lower total cost of ownership (TCO). The new lineup delivers better Quality of Service (QoS) for SMBs by reducing latency and lowering data delays. The entire line provides enhanced reliability and endurance for 24/7 operation backed by a 5-year limited warranty and impressive Drive Writes Per Day (DWPD) ratings.

MSI, the world-leading motherboard manufacturer, announces that MSI MEG X399 CREATION is on shelf now. MSI MEG X399 CREATION is the ultimate motherboard for creators, with design inspired by the concept of element explosion and packed with exclusive features to unleash the overall performance for incredible 32 cores CPU. This time, MEG X399 CREATION also creates incredibly OC records to highlight its maximum performance, with stunning NO.1 records on 9 benchmarks, as table shown below.

New consumer electronics products continue expansion of Silicon Power's diverse line following the success of several key products including memory modules, headphones, and portable SSDs. SP, a leader in memory storage solutions, is introducing four PCIe SSDs to customers to top off an exciting summer for technology and electronic companies.

Superior Storage Performance for Performance Gaming, Modification, and Upgrades
As the company recently expanded and innovated its product line, it returns to its area of expertise by releasing the P34A80/PCle Gen3x4 & NVMe 1.2, the P34M85/PCle Gen3x4 & NVMe 1.2 with an added heat sink, and upgrades to the P32A80/PCle Gen3x2 & NVMe 1.2 and P32M85/PCle Gen3x4 & NVMe 1.2 with added heat sink.

Silicon Power today introduced the P34M85 solid-state drive. Built in the M.2-2280 form-factor, this drive features PCI-Express 3.0 x4 interface, and takes advantage of the NVMe 1.2 protocol. The company didn't drop any hints as to what combination of controller and NAND flash is under its heatspreader. It comes in capacities of 240 GB, 480 GB, and 960 GB. It could be DRAM-less, given its HMB (host memory buffer) support, wherein the drive uses a small portion of your system memory. The P34M85 offers sequential transfer rates of up to 2,700 MB/s reads, with up to 1,400 MB/s writes. The drive is backed by a 5-year warranty. The company didn't reveal pricing.

Samsung Electronics today unveiled its first NVMe-based portable solid state drive (SSD) - the Samsung Portable SSD X5 - achieving new levels of performance and reliability for external storage solutions. Based on the cutting-edge Thunderbolt 3 technology, the new X5 features exceptional speeds in a compact and durable form factor, making it an ideal portable storage for content creators and IT professionals on the go.

"As a leader in high-performance and reliable storage solutions, we are thrilled to continue to advance the external SSD market with the introduction of our first Thunderbolt 3 portable SSD," said Dr. Mike Mang, vice president of Brand Product Marketing, Memory Business at Samsung Electronics. "The X5 is yet another testament to Samsung's commitment to providing innovative portable storage solutions that enable faster transfer of large data files, saving users' valuable time."

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, today announces the launch of XPG SX6000 Pro PCIe Gen3x4 M.2 2280 SSDs. With NVMe 1.3 technology and 3D NAND Flash, they sport excellent speeds and up to 1TB of capacity, making them a viable alternative to SATA SSDs. In addition, SX6000 Pro SSDs are slimmer than standard M.2 2280 SSDs for a higher level of compatibility thanks to a single-sided design.

ADATA produces the SX6000 Pro in 256GB, 512GB, and 1TB. For PC users looking at tangible performance enhancements, the SX6000 Pro makes complete sense as a SATA successor. The principal advantage of the SX6000 Pro is embodied in its superb cost-performance ratio. Using 3D TLC NAND, NVMe 1.3 technology, and a PCIe Gen3x4 interface, it reaches up to 2100 MB/s read and 1500 MB/s write and random performance of up to 250K/240K IOPS. This means up to four times the speed of typical SATA SSDs.

At the Flash Memory Summit (FMS) 2018, LITE-ON Storage previewed the first EDSFF 1U solid-state drive (SSD) to emerge from its work with CNEX Labs. The revolutionary drive gained great interest among storage advocates.

In collaboration with such partners, LITE-ON delivers an innovative and highly efficient storage solution for scalable computing that aligns to Open Compute Project (OCP) specifications. The resulting EDSFF (Enterprise and Datacenter SSD Form Factor) SSD will provide a more cost-effective solution for enterprise and hyperscale cloud environments.

"Standard SSD solutions are great at handling many typical business workloads, but the complexity of storing information in both cloud and data center infrastructure requires SSD firmware to be flexible and adaptable," said Charlie Tseng, CEO of LITE-ON Storage. "LITE-ON's expertise in SSD firmware is perfect for the varying needs of customers."

All-in-one PCs with a touchscreen are clever: They take up a minimum of space, avoid cable clutter, are quick to set up and, as a result, are comparatively mobile. The 15.6" fanless "X50" models have proven this for many years. Shuttle's range of models is now being expanded to include another fanless, but considerably smaller, 11.6" (29.5 cm) version.

Wherever larger all-in-one PCs are out of place, the XPC all-in-one P20U is right at home. Its external dimensions are just 29.9 x 27.1 x 5.0 cm (D x W x H). If tidied cable routing can be dispensed with, the height can be reduced by an additional 6.8 cm by removing the cable collector box on the bottom of the unit which is new with this model.

MSI today announced the MEG X399 Creation, its flagship socket TR4 motherboard, with out of the box support for 2nd generation AMD Ryzen Threadripper 2000 processors. The company showed off this board at the 2018 Computex, held this June. Although built in the ATX form-factor, this board is recommended only for EATX-capable cases. The highlight of this board is its gargantuan 19-phase CPU VRM that's optimized for overclocking event the 32-core Threadripper 2990WX. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and an optional 4-pin Molex. Heat drawn from the CPU VRM MOSFETS is dissipated not just by a large heatsink that spans almost the entire width of the board, but also a secondary heatsink cooling the SoC phases, via a heat-pipe. The huge chipset heatsink cools not just the X399 chipset, but also three M.2-NVMe slots (two M.2-22110 and one M.2-2280). You get 4 more M.2-2280 slots over the new M.2-Xpander Aero, which is a PCI-Express 3.0 x16 riser card that converts the slot to four M.2-2280 slots with x4 wiring, ventilating them with a 100 mm fan. It ends up looking like a graphics card in doing so.

Expansion includes eight DDR4 DIMM slots supporting up to 2048 GB of DDR4 ECC memory; four PCI-Express 3.0 x16 slots (full-time x16/x8/x16/x4), and an x1. Storage connectivity includes 7 M.2-NVMe slots (3 onboard, 4 via the included M.2-Xpander Aero accessory); and eight SATA 6 Gbps ports. Connectivity includes MSI's highest-grade onboard audio solution combining an ALC1220 with a headphones amplifier, and audio-grade capacitors; and two 1 GbE interfaces driven by Intel i219-V controllers (10 GbE is a notable absentee); and 802.11ac + BT 5.0 WLAN. You get 10 USB 3.1 ports on the rear panel (including a type-C port), and four USB 3.1 ports via front-panel headers). RGB LED diffusers dot the rear I/O shroud, the chipset heatsink, and the reverse side of the PCB. The board is expected to be priced around $500.

Marvell today announced the industry's first NVMe over Fabric (NVMe-oF) SSD converter controller, the 88SN2400 designed and optimized to convert an NVMe SSD into an NVMe-oF SSD.

By bringing low latency access over the fabric and exposing the entire SSD bandwidth to the network, the Marvell controller supports true scalable, high-performance disaggregation of storage from compute. The 88SN2400 utilizes a simple, low-power and compute-less Ethernet fabric instead of a traditional PCIe fabric controlled and managed by an enterprise-class server SoC with integrated 100GE controllers.

Intel Tuesday introduced the new SSD 660p series M.2 NVMe solid state drives. At the heart of these drives is the new 64-layer 3D QLC (quadruple level cell, or 4 bits per cell) NAND flash memory by IMFlash Technology (an Intel and Micron joint-venture). This memory is mated with a SIlicon Motion SMI 2263 controller. This chip is a derivative of the popular SMI2262EN, built on a newer process, with support for QLC NAND flash, compacted to have a smaller PCB footprint, and is driven by a custom firmware by Intel. The drives use over 10% of the QLC NAND flash area as SLC cache. The 660p series comes in three variants based on size - 512 GB, 1 TB, and 2 TB. The prices are the biggest dividend of QLC: the 512 GB variant goes for USD $99.99, the 1 TB variant at $199.99, and the 2 TB variant for $399.99.

Built in the M.2-2280 form-factor, the SSD 660p series drives feature PCI-Express 3.0 x4 interface. Intel's pricing puts these drives close to competing drives with PCIe x2 interface, but offering higher transfer rates thanks to the wider bus. It's also interesting to note here that the controller is cushioned by a DRAM cache (something PCIe x2 drives tend to lack, to keep costs down). Performance numbers differ by variant, and the 512 GB drive is the slowest, sequentially reading at speeds of up to 1500 MB/s, with up to 1000 MB/s sequential writes; up to 90,000 4K random reads, and up to 220,000 IOPS 4K random writes. The 1 TB and 2 TB variants both sequentially read and write at up to 1800 MB/s. The 1 TB variant offers 150,000 IOPS 4K random reads, and up to 220,000 IOPS random writes; while the 2 TB variant has 4K random reads/writes numbers of 220,000 IOPS.

Following the launch of the first XPC cube for Intel's latest processor generation, now the product family of XPC slim Mini-PCs in a 1.3-litre format welcomes a new member. Based on the Intel H310 chipset from which it also derives its name, the XPC Barebone DH310 supports Intel Core processors of the "Coffee Lake" generation with a TDP of up to 65 Watt. This even includes the versions with 6 cores and 12 threads. Reflecting this, two SO-DIMM slots permit the installation of 32 GB of DDR4 memory modules.

For the first time in this range, it is possible to support two monitors in 4K resolution with 60 Hz. For this purpose, an HDMI 2.0 and a DisplayPort 1.2 connector are available in each case. If required, despite the highly modern features, an analogue VGA connector can also be routed from the mainboard to the back of the device. Two of the three connectors can be used at the same time.

Intel debuted its 3D QLC NAND flash memory on new SSD DC series 2.5-inch U.2 PCIe drives. Its technology partner Micron, too gave its 3D QLC an enterprise debut with the 5120 ION. The first client-segment debut from the IMFlash combine could be the Intel SSD 660p series of M.2 NVMe SSDs. Slotted between the 700p and the 600p, the new 660p implements homebrew 64-layer QLC NAND flash memory, and a new controller. It comes in sizes of 512 GB, 1 TB, and 2 TB.

The best part about the 660p is its performance numbers. The drive takes advantage of PCI-Express 3.0 x4, and offers (at least on paper), performance numbers identical to those of the pricier 700p. The drives read at speeds of up to 1800 MB/s, with up to 1100 MB/s writes. The 600p, in comparison, capped out at 560 MB/s sequential writes, while the 700p is only slightly higher, at 1200 MB/s. Random access speeds are up to 150,000 IOPS (both reads and writes). QLC pays off rich dividends to consumers by way of price/GB. The 660p 512 GB is expected to be priced at 113.90€ (0.22€/GB), the 1 TB variant at 197.75€ (0.20€/GB), and the 2 TB variant at 391.43€ (0.20€/GB). Not bad for launch prices, considering these are PCIe NVMe drives priced competitively with SATA SSDs.

AMD today announced the B450 motherboard chipset for socket AM4 processors and APUs. Positioned as the mid-range option from AMD's 400-series chipset family, the B450 will power motherboards priced anywhere between $70 to $160, and packs certain high-end features that could let you save money over choosing pricier X470-powered boards. To begin with, the B450, like the X470, has a lower TDP and power-draw, so it runs cooler, and can make do with lighter heatsinks. It comes with slightly improved reference CPU VRM and memory wiring specifications that AMD introduced with the X470. The B450, like the X470, also supports XFR 2 "Enhanced" and Precision Boost Overdrive (that lets you tinker with boost frequencies without arbitrarily setting a high clock speed).

The B450 is recommended by AMD for both Ryzen 5 series and Ryzen 7 series, provided you don't need multi-GPU, as motherboards based on B450 aren't allowed to have PEG lane bifurcation. You still get multiplier-unlocked CPU overclocking support (something the competing Intel B360 platform lacks), as well as memory overclocking. The B450 packs out of the box support for AMD StoreMI, a storage virtualization feature that stripes a portion of your memory, your fast SSD, and slower HDD, into a single volume, and juggles hot data in and out of the faster media in the background. You can have any brand of drives to use StoreMI. B350 motherboards support StoreMI through BIOS updates.

Western Digital Corporation, a data technology leader, today introduced the new Ultrastar DC SS530 SAS SSD, the company's highest-density drive and the fastest dual-port SAS SSD in the market¹, enabling server and storage array manufacturers to offer customers substantially lower data center TCO for Fast Data applications. By doubling maximum capacity of the previous generation to 15.36TB within the same 2.5-inch 15-mm form factor, drive storage density also doubles, giving IT managers the potential to reduce the number of drives deployed, consolidate servers and open up valuable rack space for improved CapEx and OpEx costs.

Developed in partnership with Intel , the Ultrastar DC SS530 is based on a trusted third-generation platform that has been previously qualified at most major OEMs worldwide. It offers consistent performance and reliability to meet the rigorous demands of today's toughest data center workloads. Designed with a 12Gb/s SAS interface, and available in capacities from 400GB to 15.36TB, the Ultrastar DC SS530 delivers up to 440,000 random read and 320,000 random write IOPS - providing rapid access to "hot" enterprise data for higher productivity and operational efficiency.

Toshiba today introduced the XG6 series SSDs. Built in the M.2-2280 form-factor with PCI-Express 3.0 x4 interface, the drives take advantage of the NVMe 1.3a protocol, and succeed the XG5 series from 2017. The drives implement Toshiba's new 96-layer 3D TLC NAND flash dubbed BiCS Flash, which went into mass-production in Q1-2018. Available in 256 GB, 512 GB, and 1 TB capacities, the drives offer sequential transfer rates of up to 3,180 MB/s reads, with up to 2,960 MB/s writes. Also on offer are 4K random access transfer rates of up to 355,000 IOPS reads, with up to 365,000 IOPS writes. The drives are expected to be backed by 5-year warranties, when they go on sale at prices competitive with the likes of Samsung's 970 EVO series.

The volume of data traffic is growing by the minute, and ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, is meeting colossal storage demands with its latest portfolio built for space-restricted embedded, industrial, and automotive systems. ATP shows off its extensive array of flash memory and storage products at the Flash Memory Summit 2018 in Sta. Clara, USA from August 7 to 9.

"We are seeing data propelling the transformation of cities and nations, and we need effective solutions of handling, storing and analyzing data to deliver rapid, actionable insights that will improve the way we live and do business," noted Marco Mezger, ATP Vice President of Global Marketing. "As the Internet of Things (IoT) adoption gains momentum, systems are diminishing in size so memory and storage solutions have to adapt. ATP is thoroughly amplifying reliability, endurance, performance and capacity in its embedded and removable flash products while keeping them compact and portable," he added.

ASMedia is giving finishing touches to the ASM2824 PCI-Express gen 3.0 x24 switch. With half the fabric as the PLX PEX8747, the chip takes in PCI-Express 3.0 x8, and puts out four PCI-Express 3.0 x4 connections. In theory, this would let a motherboard designer create four M.2 PCIe 3.0 x4 slots from 8 downstream PCIe lanes of the Intel Z390 chipset, saving the remaining PCIe lanes for onboard USB 3.1 controllers (preferably sourced from ASMedia itself), since Intel canned the older 14 nm version of the Z390, which was supposed to put out six 10 Gbps USB 3.1 gen 2 and ten 5 Gbps USB 3.1 gen 1 ports directly from the PCH.

With all four downstream slots populated, ASMedia promises NVMe RAID bandwidths of up to 6,500 MB/s, with some CDM numbers even crossing 6,700 MB/s. Then again, one has to take into account that the test platform probably had the ASM2824 wired to the CPU's PCIe root-complex, and not that of the chipset. Intel is yet to modernize the lousy DMI 3.0 chipset-bus between its latest processors and chipset, and is physically PCI-Express 3.0 x4, which is fundamentally outdated for the bandwidth-heavy interfaces of this generation, such as USB 3.1, M.2 NVMe, and even the upcoming SD Express. The ASM2824 is also a godsend for the AMD AM4 platform, which not only has the same PCI-Express 3.0 x4 chipset bus between the AM4 SoC and the X470 chipset, but also a poor downstream PCIe feature-set of the X470, with just 8 gen 2.0 lanes. Motherboard designers can wire out all of those lanes to an ASM2824 for up to 24 downstream lanes.

High-performance computing (HPC) has been the new trend in our recent times. The applications for HPC range from big data, IOT (internet of things), AI (artificial intelligence), deep learning and blockchains, requires advanced computer hardware to perform their intended functions. From time to time, the performance of HPC has been limited by data storage hardware due to its slow transfer speed, which caps the I/O intensive requirements for these applications. The evolution of data storage from mechanical hard drives to NVMe (non-volatile memory express) SSDs have eventually unleashed the next level of high-performance computing and its applications.

It's clear that installing NVMe U.2 drives requires not only a whole system upgrade but also a system that allows for easy maintenance. Enabling hot-swap functions on NVMe U.2 SSDs and finding the proper equipment in a computer or rackmount system has become a new challenge for many companies, as the current computer chassis are not optimized for NVMe U.2 SSDs. With more than 20 years of expertise, ICY DOCK, who specializes in enterprise data storage enclosures, has already implemented to this drastic change in data storage technology and created the world first NVMe removable drive enclosure, the ToughArmor NVMe series. The ToughArmor's removable drive caddy allows for easy NVMe drive installation and system maintenance for any companies who wish to utilize the benefits of using the next-generation NVMe U.2 SSDs.