ATP Electronics, a global leader in specialized storage and memory solutions, has once again achieved a breakthrough in extending the endurance of its industrial 3D triple level cell solid state drives (3D TLC SSDs). The N651Si/N651Sc Series now boasts an unparalleled 11,000 program/erase (P/E) cycles endurance - an unprecedented 120% leap from its initial published endurance of 5,000 cycles, making these solutions the highest-endurance industrial native TLC SSDs built on 512 Gb integrated circuits (IC) package.

This remarkable achievement is made possible through ATP's outstanding capabilities that extend the inherent qualities of the NAND flash. The use of prime NAND package, strict NAND IC characterization, 100% NAND screening and validation capabilities, as well as ATP's proprietary firmware, specialized hardware configurations, and own-developed technologies made this extraordinary feat possible.

Acer today unveiled the new TravelMate P6 14 AI, leading the market with Copilot+ PCs under 1 kg. This new Windows 11 Pro laptop delivers exceptional performance, mobility and AI capabilities for businesses and institutions. It is powered by Intel Core Ultra processors (Series 2) with a built-in NPU boasting up to 120 total platform TOPS AI performance in a compact, carbon fiber chassis.

This latest TravelMate boasts a stunning 14-inch WQXGA+ (2880x1800) 16:10 display with IPS technology or WUXGA (1920x1200) panel featuring high 400 nit brightness and 100% sRGB color gamut, supporting outstanding picture quality. Thin bezels and a high 82% screen-to-body ratio maximize the screen area for more immersive viewing experiences.

ATP Electronics, a global leader in specialized storage and memory solutions, proudly announces the launch of the N751Pi PCIe Gen 4 NVMe M.2 2280 SSDs, which set a new industry standard with unmatched endurance among industrial solid state drives (SSDs) configured with pseudo single-level cell (pSLC) NAND.

The groundbreaking 150K P/E cycling configuration of NAND was achieved, thanks to a combination of ATP's exceptional strengths — from the use of prime NAND package, stringent NAND integrated circuits (IC) characterization and 100% NAND screening and validation capabilities, to ATP's own-developed firmware, specialized hardware configurations, and technologies.

Micron Technology, Inc., announced today that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone. Micron G9 NAND features the industry's highest transfer speed of 3.6 GB/s, delivering unsurpassed bandwidth for reading and writing data. The new NAND enables best-in-class performance for artificial intelligence (AI) and other data-intensive use cases from personal devices and edge servers to enterprise and cloud data centers.

"The shipment of Micron G9 NAND is a testament to Micron's prowess in process technology and design innovations," said Scott DeBoer, executive vice president of Technology and Products at Micron. "Micron G9 NAND is up to 73% denser than competitive technologies in the market today, allowing for more compact and efficient storage solutions that benefit both consumers and businesses."

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications.

The latest FerriSSD BGA SSD supports PCIe Gen 4 x4 and uses high density 3D NAND within a compact 16 mm x 20 mm BGA chip-scale package. With storage capacities up to 1 TB, these high-performance embedded SSDs utilize Silicon Motion's latest innovations to achieve high sequential read speeds exceeding 6 GB/s and sequential write speeds exceeding 4 GB/s. Equipped with Silicon Motion's proprietary IntelligentSeries data protection technology that enhances reliability and performance through the use of encryption, data caching, data scanning and protect features, as well as supporting the i-temp requirements of operating in extreme temperatures from -40°C to + 85°C. This latest FerriSSD offers a high performance and highly reliable embedded storage solution for a broad range of applications and operating environments including in-car computing, thin client computing, point-of-sale terminals, multifunction printers, telecommunications equipment, factory automation tools, and a wide range of server applications.

ASRock Industrial releases the NUC Ultra 100 Motherboard Series with breakthrough powered by Intel Core Ultra processors (Meteor Lake-H). Presenting a 3D performance hybrid architecture that supports up to 14 cores and 20 threads, complemented by the latest integrated Intel ARC Graphics and the pioneering Intel NPU AI engine. The NUC Ultra 100 Motherboard Series are designed in NUC form factor, providing two DDR5-5600 MHz memory up to 96 GB, triple storages, 4K quad displays, 2.5G dual LAN, one USB4/Thunderbolt, and four USB 3.2 Gen 2. This advancement expands into enhanced creativity, efficiency, and collaboration using AI across diverse areas such as entertainment, corporate functions, smart retail, kiosks, digital signage, smart cities, embedded industries, Edge AIoT applications, and more.

The NUC Ultra 100 Motherboard Series encompass NUC-155H and NUC-125H models, powered by Intel Core Ultra 7/5 processors 155H/125H (Meteor Lake-H). The Series feature the upgraded dual-channel SO-DIMM DDR5 5600 MHz up to 96 GB memory, plus support for up to 4K quad displays with one DP 2.1 (from USB4), one DP 1.4a (from Type-C), and two HDMI 2.0b with Intel ARC Graphics, providing immersive experience. Notable upgrades extend to the triple storages of one M.2 Key M (2242/2280), one M.2 Key M (2242) with PCIe Gen4x4 for SSD, and one SATA 3.0. Moreover, rich I/O connectivity and expansion include one USB4/Thunderbolt 4, four USB 3.2 Gen 2 (Type-C/Type-A), 2.5G dual LAN, and one M.2 Key E (2230) with PCIe x1, USB 2.0 and CNVi for wireless. The Series also provide 12-24 V DC-in jack for flexible power input, -20°C ~ 70°C wide operating temperature, plus TPM support with Intel Platform Trust Technology (PTT) for enhanced security.

ASRock Industrial releases state-of-the-art 4X4 BOX 8040 Series Mini PCs and 4X4 8040 Motherboard Series, powered by AMD Ryzen 8040 Series APUs, crafted to elevate trusted performance and AI PC capabilities. Featuring up to 8 "Zen 4" cores/ 16 threads and AMD Radeon 700M graphics, the Series integrates AMD Ryzen AI with 16 NPU TOPS, delivering up to 1.6x surge in AI processing performance over its predecessor. With support of dual-channel DDR5 5600 MHz memory up to 96 GB, the 4X4 BOX 8040 Series comes with enriched I/O connectivity in a compact fanned box. It enables 4K quad-display outputs, five USB ports, including two USB4, accommodates dual storages, and offers dual LAN up to 2.5G, along with Wi-Fi 6E support. The new Series, marked by a significant speed boost with lower power consumption, paves the way for accelerated generative AI workloads, tailoring heightened experience in content creation, gaming, entertainment, office productivity, commerce, and many other AIoT applications through the quintessential AI PC for you.

ASRock Industrial's 4X4 BOX 8040 Series offers versatile selections: 4X4 BOX-8840U, 4X4 BOX-8640U, powered by AMD Ryzen 8040 Series (Ryzen 7 8840U/ Ryzen 5 8640U). With integration of CPU, GPU, and NPU, the AMD Ryzen AI upgrades to 16 NPU TOPS and 39 total TOPS (NPU+CPU+GPU), reaching up to 1.6x surge in AI processing performance and a notable 40% speed increase in running AI LLM models than prior gen AMD APUs. Featuring 4 nm "Zen 4" architecture with up to 8 cores/ 16 threads, along with AMD Radeon 700M RDNA 3 graphics, and dual-channel DDR5-5600 MHz SO-DIMM memory up to 96 GB. The 4X4 BOX 8040 Series marks a leap forward in AI processing, allowing users to re-imagine dynamic applications on their AI PC, such as enhancing productivity, delivering AI-inspired visuals/content, running AI models right on PCs for various AIoT use cases.

CompactFlash Association (CFA), the organization responsible for professional removable media specifications such as CompactFlash, CFAST, XQD, and CFexpress announces the release of the CFexpress 4.0 logical and physical specifications increasing the performance of the existing CFexpress 2.0 specifications while maintaining backward compatibility targeting the professional imaging and industrial markets requiring high-performance data capture and transfer.

CFexpress 4.0 is an evolutionary specification riding on the great success of CFexpress 2.0 employing the industry standard PCI Express (PCIe) Gen 4 bus and NVM Express (NVMe) 1.4c logical interface for even higher performance and efficient NAND Flash access. With its three form factors, CFexpress 4.0 continues to support diverse performance levels to match various market requirements maintaining consistent electrical, logical, and physical interfaces while setting realistic power consumption targets for wider adoption of the CFexpress 4.0 for battery-powered applications in the imaging and industrial markets. Utilizing widely adopted open standards allow the use of established development platforms saving development time, cost, and effort.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today unveils the brand new M800 Series PCIe Gen4x4 M.2 SSD, designed to revolutionize gaming for everyone from casual enthusiasts to professional gamers and streamers. The all-new M800 Series SSD promises incredible performance and high-speed data transfer, ensuring smoother gameplay and faster load times, ideal for gaming streamers and content creators. Its core features include a PCIe Gen4x4 interface, standard M.2 2280 form factor, BIOSTAR unique design, support for NVMe v1.3, and end-to-end data protection.

Available in 2 TB, 1 TB, and 512 GB capacity, the M800 series promises a read speed of up to 5000 MB/s and a maximum write speed of 4450 MB/s, outperforming the competition and ensuring an incredibly immersive gaming experience. Moreover, the PCIe Gen 4 x4 interface is designed to leverage the increased bandwidth provided by PCIe Gen 4, offering faster read and write speeds compared to its predecessors. As a result, it enhances the overall system performance, optimizes boot load-up time, and ensures faster application and game loading.

Lexar, a leading global brand of flash memory solutions, is excited to announce the Lexar NM790 M.2 2280 PCIe Gen 4 x4 NVMe SSD. Designed with gamers, creators and professionals in mind, the NM790 delivers incredible speeds of up to 7400 MB/s read and 6500 MB/s write.

Not only twice as fast as PCIe Gen 3 SSDs, the Lexar NM790 M.2 2280 PCIe Gen 4x4 NVMe SSD consumes up to 40% less power than DRAM cache-enabled PCIe Gen 4 SSDs, meaning lower power costs and an extended battery life on portable devices.

Nfina announces the addition of two new server systems to its lineup, customized for small to medium businesses and virtualized environments. Featuring 3rd Gen Intel Xeon Scalable Processors, these scalable server systems fill a void in the marketplace, bringing exceptional multi-socket processing performance, easy setup, operability, and Nfina's five-year warranty.

"We are excited to add two new 3rd generation Intel systems to Nfina's lineup. Performance, scalability, and flexibility are key deciding factors when expanding our offerings," says Warren Nicholson, President and CEO of Nfina. "Both servers are optimized for high- performance computing, virtualized environments, and growing data needs." He continues by saying, "The two servers can also be leased through our managed services division. We provide customers with choices that fit the size of their application and budget - not a one size fits all approach."

Cervoz Technology, a leading supplier of industrial-grade storage and memory solutions, is excited to announce the new NVMe PCIe Gen 4x4 SSDs, the T441. Purposefully designed to cater to the growing automaticity trend of the industry, the T441 is the ideal choice for companies seeking cutting-edge technology in high-performance storage solutions.

Blazing Speeds with High Capacity
The Cervoz T441 SSDs leverage the power of 112-layer 3D TLC NAND flash technology, offering storage capacities of up to 3840 GB in a compact and energy-efficient design. In addition, the high-speed PCIe Gen 4x4 interface enables faster and more efficient data access, with Read/Write speeds of up to 7,100/6,190 MB/s and 4K random IOPS of up to 1,000K. This exceptional performance makes the T441 an ideal solution for applications requiring real-time processing of vast data, such as surveillance, machine vision, and edge AI, as well as those handling massive data sets like CAD, biomedical engineering, and atmospheric sciences.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced the SM2268XT, its latest high-performance PCIe Gen 4 SSD controller solution optimized for higher speed NAND transfer rates. The SM2268XT's superior performance and robust reliability allows customers to accelerate development of next-generation SSDs using current and future TLC and QLC 3D NAND flash with comprehensive data integrity and correction without compromising throughput and latency.

The SM2268XT features a dual-core ARM R8 CPU with four lanes of 16 Gb/s PCIe data flow and supports four NAND channels with up to 3,200 MT/s per channel, enabling designers to take advantage of higher throughput next-generation high-speed TLC and QLC 3D NAND flash. Its multi-core design automatically balances the compute load to deliver industry-leading sequential read and write speeds of 7,400 MB/s & 6,500 MB/s, and random read & write speed of 1,200K IOPS. In addition, its advanced architecture enables lower power consumption and rigorous data protection, providing high performance and reliability in a cost-effective DRAM-less PCIe Gen 4 NVMe SSD solution.

ASUS today announced the all-new TUF Gaming A16 Advantage Edition, an all-AMD gaming laptop with a redesigned chassis and an incredibly immersive 16-inch display. The TUF Gaming A15, A17, F15 and F17 laptops also make a triumphant return, sporting the latest silicon from AMD, Intel, and NVIDIA to power players into the next generation of gaming performance.

TUF A16 Advantage Edition announced
Built for serious gaming with subtle styling, the TUF Gaming A16 Advantage Edition is a sleek gaming laptop built to demolish the competition. Powered completely by AMD, the TUF Gaming A16 features up to an AMD Ryzen 9 Zen 4 processor and AMD Radeon RDNA 3 mobile graphics. "AMD and ASUS have partnered to deliver our latest 'Zen 4' and RDNA 3 technologies into the most innovative form factors," said Jason Banta, CVP and GM OEM PC. "The TUF Gaming A16 Advantage Edition delivers blistering gaming performance and outstanding power efficiency in a sleek portable chassis."

Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, today is demonstrating the company's latest PCIe Gen5 innovation that is transcending system-level performance to new heights at CES in Las Vegas. Phison is demonstrating the E26 with Phison's proprietary I/O+ Technology to usher a new evolution of gaming experiences. For enterprise, Phison is previewing the company's latest Gen5 X Series SSD enterprise controllers, which can provide twice the performance per watt (in comparison to X1, the previous generation). Following the success of the world's first PCI-SIG Association certified PCIe 5.0 Redriver PS7101, Phison is also introducing the PS7201 Retimer with industry-proven IP. Phison's Retimer is designed to solve performance and data integrity issues in enterprise and automotive applications and further enhances the Gen5 ecosystem.

"Phison is ecstatic to be ringing in the new year by showcasing our product milestones for the industry, our partners and enterprise customers because we are committed and dedicated to engineering next generation technologies through ecosystem excellence," said Michael Wu, GM & President of Phison Technology Inc. (USA). "As a proven category leader, Phison's E26 with I/O+ Technology, latest Enterprise PCIe Gen5 X Series, signal enhancing Redriver and Retimer are product breakthroughs that are a testament to our engineering success."

Acer announced two powerful Predator Helios gaming laptops and a pair of Predator gaming monitors. The laptops feature an all-new design with 16-inch and 18-inch display sizes, the latest 13th Gen Intel Core mobile processors and NVIDIA GeForce RTX 40 Series GPUs, making them Acer's most powerful gaming laptops to date. The Predator X45 showcases a massive 800R curved monitor and has earned a CES Innovation Award in the "Computer Peripherals & Accessories" category. Along with the Predator X27U, both monitors include OLED technology with fast 240 Hz refresh rates.

Predator Helios 16, Predator Helios 18 Laptops
The all-new Predator Helios 16 (PH16-71) and Predator Helios 18 (PH18-71) bring the latest and greatest tech to Acer's most powerful gaming laptop series. Sporting a completely new design and upgraded thermals, they both offer models that include 13th Gen Intel Core i9 or i7 HX processors paired with up to NVIDIA GeForce RTX 4080 Laptop GPU (MGP up to 165 W) and a plethora of must-have top-of-the-line gaming features.

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading brand of personal computers, is introducing new members of the AERO Creator Laptop Series with the 13th Gen. Intel Core Processors and NVIDIA GeForce RTX 40 Series Laptop GPUs: AERO 16 OLED and AERO 14 OLED. As the world is lifting lockdown restrictions, the wheels of the world economy have been revived toward the path of recovery. However, post-pandemic work patterns have become the new norm. Consumers' screen time is prolonged due to hybrid work patterns and working from home, whereas the frequency of business trips has also been rising.

GIGABYTE conducted in-depth analyses about the criticality of screens for creators on the move, which leads to the development of OLED eye-protection laptops with the world's strictest dual color calibration. With the new laptops, consumers will not only get to enjoy the visual feasts but also be prepared for highly productive creation processes. The GIGABYTE AERO Series has been targeting creators, designers, and office workers, offering strict color accuracy, low blue light eye-protection technology, and lightweight for high mobility as its main features. In terms of product design, after undergoing 88 CNC forging processes, the thorough tempering gives the laptop an exquisite appearance, elegant like a masterpiece of fine art. The "Illusory Iridescent" design concept added more quality details to the silky smooth texture, bringing a touch of aesthetic and inspiration to all work hours. The practicality of the creator laptops is once again elevated and now graced with a sleek artistic sense.

MSI is announcing the launch of our new Gen4 PCIe NVMe models to its SSD category - SPATIUM M461, M452 & M453 in M.2 2280 form factors that can be easily installed into compatible desktop motherboards and laptops. These new products allow MSI to continue to refine its identity as a high-performance PC brand and grow its product ecosystem by expanding SPATIUM, our high-performance storage category. Our SSDs are built with high-quality, high-density 3D NAND flash that delivers astonishing performance and endurance for professionals, content creators, and gamers.

SPATIUM M461, The Competitive PCIe 4.0 SSD for Mainstream Segment.
SPATIUM M461 was developed to meet the expectations of mainstream SSD consumers. Blazing fast speeds up to 5000 MB/sec sequential read and 4200 MB/sec sequential write speeds allow users using the latest generation of PCs to enjoy the capabilities of the PCIe Gen4 interface. Available storage capacities are 500 GB, 1 TB, 2 TB, and 4 TB.

Micron Technology, Inc.,, today announced it is shipping the Micron 2550 NVMe SSD to global PC OEM customers for use in mainstream laptops and desktops. The 2550 is the world's first client SSD to ship using NAND over 200 layers. Delivering performance that eclipses the competition through its density and power advantages, the 2550 provides users with responsiveness and the low power consumption needed to extend battery life for work and home PCs.

"We focused on delivering a superior user experience for PC users with this SSD," said Praveen Vaidyanathan, vice president and general manager of the Client Storage Group at Micron. "The new 2550 SSD builds on our established and broadly adopted PCIe Gen4 architecture. It also incorporates Micron's industry-leading 232-layer NAND and focuses on thermal architecture and power design. These capabilities deliver impressive application performance and phenomenal power savings."

Team Group, the global leader in industrial memory modules, launches the brand's first industrial grade PCIe Gen4x4 M.2 2280 SSD, P845-M80. With the adoption of the ultra-fast Gen 4 x4 interface, it delivers an exceptional reading/writing performance for a large data amount. Equipped with BiCS 5 112-layer 3D NAND flash memory, it is a highly cost-competitive solution that accelerates the development of biomedical innovation and digital medicine applications. P845-M80 comes in a maximum capacity of 2 TB and meets the NVMe 2.0 standards. Its bandwidth and data transmission speed are twice that of its predecessor PCIe Gen3, making it even more ideal for the transmission of large amounts of data. Meanwhile, its 3K P/E cycles make it the best memory solution in both performance and durability.

In the wake of the global pandemic, science and digital medicine is rapidly on the rise in innovative biomedical fields. In response to the significant increase in the demand for high-performance image processing and stable storage, Team Group introduces the PCIe Gen 4 x4 industrial grade SSD with the adoption of an 8-channel controller and optional patented graphene and aluminium fin heat dissipation technologies. It effectively reduces the thermal energy generated from high-speed reading and writing and maintains system stability. The patented graphene heat dissipation technology (US invention patent number: US 110,513,92 B2 / Taiwan invention patent number: I703921) features a small volume and agility in application, suitable for machines of smaller sizes. Whereas, the patented aluminium fin heat dissipation technology (Taiwan utility model patent number: M541645) enables maximum heat dissipation and prolongs product service life. Both technologies are novel options for biomedical innovators, offering stability, high speed, and low latency.

Nfina announces the addition of three new server systems to its lineup, customized for hybrid/multi-cloud, hyperconverged HA infrastructure, HPC, backup/disaster recovery, and business storage solutions. Featuring 3rd Gen Intel Xeon Scalable Processors, Nfina-Store, and Nfina-View software, these scalable server systems fill a void in the marketplace, bringing exceptional multi-socket processing performance, easy-to-use management tools, built-in backup, and rapid disaster recovery.

"We know we must build systems for the business IT needs of today while planning for unknown future demands. Flexible infrastructure is key, optimized for hybrid/multi-cloud, backup/disaster recovery, HPC, and growing storage needs," says Warren Nicholson, President, and CEO of Nfina. He continues by saying, "Flexible infrastructure also means offering managed services like IaaS, DRaaS, etc., that provide customers with choices that fit the size of their application and budget - not a one size fits all approach like many of our competitors. Our goal is to serve many different business IT applications, any size, anywhere, at any time."

MS-98M3 is the embedded 3.5" SBC that supports multiplexing with 11th generation Intel IOTG Core processor, codenamed Tiger Lake-UP3 series of ultra-low power and high-performance products, providing the industry with more reliability and high durability with lower power consumption under the same workload. It has up to four-screen display functions and a rich variety of high and low-speed I/O connection interfaces. The unique heat dissipation design is strong, durable and highly reliable. The wide temperature series can support long-term stable operation in the harsh operating temperature environment of -40~+85°C.

It can be widely used in harsh industrial environments, and provide stable computing performance, which can be deployed in industries ranging from the most edge computing to various Embedded platforms such as machine control and multimedia retail and the high-performance edge computing application products are the core of digital transformation, and how to continuously strengthen their capabilities has become more and more important. Power consumption is intended to realize energy-saving and carbon-reducing applications of various edge high-performance computing, and actively deploy in multiple application fields such as autonomous mobile robots (AMR).

KLEVV, an emerging memory brand introduced by Essencore, is excited to announce three new consumer-grade M.2 NVMe SSDs, the CRAS C930, C910, and C730. The new CRAS M.2 NVMe SSD lineup aims to serve a wide range of users, enabling entry-level to top-tier enthusiasts with industry-leading storage technology. Both CRAS 930 and C910 come with an optional add-on heatsink for users to maximize their freedom in the setup.

With an impressive 1500 TBW endurance lifecycle and a significant emphasis on DRAM cache buffer, the CRAS C930 is built to withstand harsh workloads. Utilizing the latest PCIe Gen4 x4 interface supported by NVMe 1.4, it delivers break-neck sequential read/write speed of up to 7400/6800 MB/s at 2 TB max capacity and 4K random read/write up to 1000K IOPS. Exceptional engineering and design elements make the CRAS C930 the crown jewel of KLEVV's new M.2 NVMe SSD lineup, capable of running on PCs, Laptops, and even PS5 consoles. Additionally, the flat fin heatsink addon is a great inclusion with up to 20% temperature reduction, giving users complete flexibility in their choice.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the addition of Kingston FURY Renegade SSD with Heatsink, its second-generation PCIe 4.0 NVMe M.2 drive for console and PC gamers. Kingston FURY Renegade SSD with Heatsink maintains speed and temperature while delivering cutting-edge performance in high capacities using the latest Gen 4x4 controller.

By maximizing the available bandwidth of PCIe 4.0, Kingston FURY Renegade SSDs achieve speeds up to 7,300/7,000 MB/s read/write and up to 1,000,000 IOPS to deliver amazing consistency for an exceptional gaming experience. The drives are optimized to reduce game and application load times, stream and capture with ease and give your system an overall boost in responsiveness. Available in high capacities up to 4 TB, users can store an extensive library of their favorite games and media and still have space for the latest titles. Kingston FURY Renegade SSD offer two options for users both with formidable speeds and massive capacities:

The COVID-19 pandemic and the emergence of next-generation Intel and AMD motherboards have incited a wave of consumer PC replacement as well as growing demand for high-efficiency PCIe 4.0 SSDs. With additional consideration towards the PS5's SSD heat dissipation requirements, ADATA Technology Co., Ltd., a leading global memory products brand, has launched the LEGEND 960 MAX as of today. The LEGEND 960 MAX SSD has won Japan's GOOD DESIGN Award and features continuous read/write speeds of up to 7,400/6,800 MB per second. Its unique 3D radiator fin design can reduce temperatures of SSDs mounted in PS5 consoles by as much as 40%. The LEGEND 960 MAX and LEGEND 960 are part of the same series of SSD products and the prior LEGEND 960 model can be installed in Intel Evo certified lightweight notebooks. In the face of Web 3.0's unlimited creative universe, this new product is expected to become the most ideal storage solution for consumers.

The LEGEND 960 MAX employs a PCIe 4.0 transmission interface conforming to NVMe 1.4 standards. The SSD features exceptional 7,400/6,800 MB per second read/write capabiliies that are 4 times that of standard PCIe 3.0 SSDs and is backward compatible with the PCIe 3.0 platform. When handling a multitude of intensive creations, the LEGEND 960 MAX delivers 750K/630K IOPS random Read/Write speeds, improving multitasking efficiency and is suitable for driving exceptional performance in the latest Intel or AMD platforms. The professionally designed thermal convection effect produced by a 3D radiator fin profile enables an additional 40% cooling on motherboard installed SSDs and is an optimal solution for highly complex design tasks such as 3D animation, game development, and visual virtualization.