AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

NZXT, a leader in PC gaming components, gear, and prebuilt gaming systems, is excited to announce the N9 X870E ATX motherboard, optimized for the new "Zen 5" architecture based AMD Ryzen 9000 series desktop processors. NZXT's latest motherboard combines high-performance features with a stunning new look that is geared towards enthusiast PC gamers building a high-end AMD system.

The N9 X870E boasts overclocking-ready power delivery and optimized thermals, providing gamers with the tools and headroom to overclock their AMD Ryzen 9000, 8000 or 7000 series processors and memory to their highest levels of performance. Additionally, the N9 X870E ensures prolonged compatibility with future and previous generations of Ryzen processors, thanks to AMD's commitment to support the AM5 platform until 2027+.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, unveils cutting-edge AMD X870E/X870 motherboards. Designed with AI accelerated performance boost, premium thermal management, next-generation memory optimization, intuitive DIY-friendly features, state-of-the-art BIOS technology, GIGABYTE X870E/X870 motherboards maximize the capabilities of the latest AMD Ryzen 9000 series processors and power the gaming performance for AI era.

AORUS AI SNATCH
GIGABYTE X870E/X870 lineup boasts the innovative AORUS AI SNATCH, which can unleash ultimate performance with simple one click. Powered by an AI engine, the memory and system performance can be boosted with improved multitasking and overall system responsiveness. Users can overclock like an expert in a snap through simple interface while enjoy smart and safe overclocking. The AI processing is accelerated as well for better performance with optimal power efficiency.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to unveil the shiny new X870E VALKYRIE flagship motherboard designed to run the latest "Zen 5" architecture based AMD Ryzen 9000 series processors. Built on BIOSTAR's top-of-the-line VALKYRIE platform, the X870E VALKYRIE delivers exceptional features and functionality, catering to gamers, content creators, and PC enthusiasts alike.

Meticulously crafted to cater to the modern-day professional, the X870E VALKYRIE motherboard offers unparalleled power and stability across the most demanding applications. Whether you're designing immersive 3D worlds, rendering high-definition animations, editing ultra-high-resolution videos, or pushing the limits of AAA gaming, this motherboard is engineered to deliver. Powered by the latest AMD Ryzen 9000 series processors built on "Zen 5" architecture, with support for up to 192 GB of DDR5 memory and PCIe 5.0 technology, the X870E VALKYRIE ensures seamless, high-speed performance for even the most intensive tasks, including generative AI computing. With support for AMD EXPO & Intel XMP technologies, it can extract the maximum capability out of all hardware to deliver the best user experience.

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

According to new latest testing, the latest AGESA (AMD Generic Encapsulated Software Architecture) update, version 1.2.0.2, promises a significant boost in performance for AMD Ryzen 9000 "Zen 5" processors. This update is targeting one of the most crucial aspects of multi-core processing: inter-core latency. The AGESA 1.2.0.2 update addresses challenges initially reported in AMD's Zen 5 architecture, particularly in scenarios demanding rapid communication between multiple cores. Early reports suggest a remarkable reduction in inter-core latency by up to 58%. According to Overclock.net testing, older AGESA 1.2.0.1A showed the cross-CCD latency at around 180 ns. However, with the new AGESA 1.2.0.2 BIOS, the latency is seemingly around 75 ns.

Interestingly, the update has arrived on the ASUS ROG Crosshair X670E motherboard, with BIOS version 2401. BIOS updates with the latest AGESA 1.2.0.2 are still rolling out, so it will be interesting to see further testing and possible improvements. It could be that the cross-CCD latency has just been reported badly, so final testing will conclude the latency increase from Zen 4 to Zen 5 debate.

MSI today launched its first wave of Socket AM5 motherboards based on the new AMD X870E and AMD X870 chipsets, which come with drop-in support for the new Ryzen 9000 "Granite Ridge" processors, and new platform I/O. The company debuted products across its four key consumer motherboard brands—MEG, MPG, MAG, and PRO. Leading the pack is the flagship MEG X870E GODLIKE, followed by the performance segment MPG X870E Carbon WIFI, the mid-range MAG X870 Tomahawk WIFI, and the mainstream PRO X870-P WIFI.

The MEG X870E GODLIKE isn't just a flagship motherboard with no feature spared, but designed to be a piece of jewelry. It is shrouded almost entirely in heatsinks. Almost all its onboard I/O faces the front-end, including a 24-pin ATX, and two optional 8-pin PCIe power inputs. The two 8-pin EPS power inputs are exposed near the CPU socket area. A 27-phase VRM powers the CPU, with an active fan-heatsink solution that uses a series of aluminium fin-stack heatsinks with heat-pipes spreading heat among them. The CPU is wired to four DDR5 DIMM slots, supporting over DDR5-8000, with preparation for higher memory OC speeds that may come up in the future. Expansion slots include a PCI-Express 5.0 x16, a second x16 (electrical Gen 4), and a x4. There are four M.2 NVMe slots, three of these are Gen 5, and one Gen 4.

MSI is set to launch its most advanced AM5 motherboard to date: the MEG X870E GODLIKE. This flagship model is designed to support AMD's Ryzen 9000 series processors and beyond. The MEG X870E GODLIKE boasts an impressive 28-phase power delivery system with 110 A power stages, surpassing its predecessor's capabilities. This robust VRM design ensures a stable power supply even for the most demanding scenarios of next-generation CPUs. The motherboard's E-ATX form factor provides ample space for its array of features, including support for DDR5 memory speeds exceeding 8000 MT/s and a capacity of up to 256 GB. Connectivity is a strong suit for this motherboard, featuring eight USB Type-C ports with varying speeds of up to 40 Gbps. Storage options include five M.2 slots (two PCIe Gen 5 and three Gen 4) and four SATA III ports.

For graphics, the board offers two PCIe Gen 5.0 slots. MSI has also included several user-friendly features, such as EZ M.2 and PCIe release mechanisms, making component installation and removal a breeze. The M.2 slots are equipped with MSI's Shield Frozr heatsinks, ensuring optimal thermal performance for NVMe SSDs. Perhaps most intriguing is the inclusion of an additional 8-pin power connector, specifically designed to support future multi-GPU setups like NVIDIA's anticipated RTX 50 "Blackwell" series. While pricing details are yet to be announced, the MEG X870E GODLIKE is expected to carry a premium price tag, reflecting its top-tier status in MSI's lineup. With the high-end power delivery setup, overclockers will find this motherboard interesting, and users are planning to upgrade to next-generation RTX 50 series GPUs. Availability is also unknown as of time of writing.

AMD's Ryzen processors have received a significant performance upgrade, thanks to the recent Windows 11 24H2 update. This development addresses initial disappointments with the Ryzen 9000 "Zen 5" series performance, particularly in gaming applications. The update, which improves branch prediction capabilities, has resulted in substantial gains for both the Ryzen 9000 "Zen 5" and Ryzen 7000 "Zen 4" CPU lineups. According to tests by Hardware Unboxed, Ryzen 9000 "Zen 5" CPUs have shown double-digit performance increases across multiple game titles, a boost typically seen only between generational upgrades.

Interestingly, contrary to AMD's initial claims, the performance gains are not limited to the Zen 5 architecture. The Ryzen 7000 "Zen 4" processors have also benefited from the update, with minimal performance differences observed between comparable Zen 5 and Zen 4 models after the update. This development marks a crucial turning point for AMD, addressing earlier criticisms and narrowing the gap between reported and expected performance figures. As users install the Windows 11 24H2 update, they can expect enhanced gaming experiences across a wide range of titles, highlighting the complex interplay between hardware capabilities and software optimization in modern computing. Below are the results from Hardware Unboxed benchmarks.

AMD's upcoming Ryzen 9000X3D series of processors with 3D V-Cache have been reportedly scheduled to arrive in January 2025 and should make a debut at the CES event, a few months later than initially expected. While disappointing for eager enthusiasts, the delay could signify that AMD is taking extra precautions to ensure a smooth launch and deliver a product that meets the high-performance standards set by its previous 3D V-Cache offerings. Delaying the new product launch could also be a strategic move by AMD to avoid potential supply chain issues or to align the launch with other product announcements.

We previously reported that the series will maintain the same cache size configurations as the last generation with 3D V-Cache, and it will just be an upgrade to up the performance of the new Zen 5 design. The launch of the 9000X3D series follows a smaller six-month gap from the regular Ryzen 9000 series, where the previous Ryzen 7000X3D and 5000X3D followed seven and seventeen months after the launch of their regular SKUs, respectively.

AMD Ryzen 9000 "Granite Ridge" desktop processors have been out for a couple of weeks now, and the "Zen 5" based processors have fallen short of gaming performance expectations, set mainly by some of the numbers AMD put out in its Computex 2024 reveal for the processors. The consensus among the tech press is that these processors are roughly 3-5% faster than Ryzen 7000 series "Raphael," but with noteworthy improvements in energy efficiency. AMD set out to study why there are such vast deltas in performance between its numbers and those of reviews, and arrived a few possible explanations. The company also stated that it is working with Microsoft to fix this in the next major update to Windows 11.

One of them is that AMD's testing was done on Windows 11 23H2 with Admin mode (i.e. a local system administrator account was used), while some reviewers tested with a regular user account that has some admin privileges. Apparently this affects the way the branch prediction units of "Zen 5" processors work. "Our automated test methodology was run in "Admin" mode which produced results that reflect branch prediction code optimizations not present in the version of Windows reviewers used to test Ryzen 9000 Series," AMD said in a statement.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced its collaboration with AMD to integrate their recently announced AMD's Ryzen 9000 Series, into a select range of Cooler Master PC Systems. Cooler Master is leveraging AMD's cutting-edge technology to deliver unparalleled performance in their latest products, including the Sneaker X, Ncore 1 Pro, and MasterBox 6 Pro. The collaboration underscores Cooler Master's commitment to pushing the boundaries of what's possible in gaming and professional computing.

The inclusion of AMD's CPUs within Cooler Master products will not only elevate gaming and professional experiences but also highlight the symbiotic relationship between powerful processing and efficient cooling. This is a testament to Cooler Master's relentless pursuit of excellence in thermal management, ensuring that each system operates at peak efficiency.

Recent reports suggest that AMD's Zen 5 desktop processors may soon receive a significant power upgrade. The upcoming AGESA 1.2.0.1A Patch A is rumored to increase the default power limits (TDP) from 65 W to 105 W for certain models, specifically the 8-core Ryzen 7 9700X and the 6-core Ryzen 5 9600X. This development comes as a surprise given that the first reviews of the Ryzen 9000 series were published just last week, with lower power consumption praised as a major advantage over previous generations. The potential TDP increase, while not as high as the 120 W initially rumored for the 9700X, still represents a substantial boost in power allocation.

The rationale behind this significant TDP increase appears to be addressing the lower than expected performance of the Ryzen 7 9700X and Ryzen 5 9600X compared to their predecessors. Initial testing showed that both CPUs performed similarly to earlier models, especially in gaming scenarios, with notable improvements only visible when using Precision Boost Overdrive (PBO). Even at 65 W, the Ryzen 7 9700X struggled to outpace the 7800X3D in gaming performance, highlighting the need for improved power delivery.

ASRock has released the AGESA 1.2.0.0a patch A BIOS update for its AM5 motherboards, enhancing compatibility and performance for AMD Ryzen 9000 series processors. The update is available for ASRock's AM5 motherboard lineup, including models with X670E, B650E, B650, and A620 chipsets. This new BIOS version allows users to fully leverage the capabilities of the Ryzen 9000 series processors, providing improved system performance and stability.

Users can easily download and install the update from the ASRock official website or use features like BIOS Flashback and Instant Flash. ASRock recommends updating to the latest BIOS version to ensure optimal system compatibility and performance for AMD Ryzen 9000 series processors.

Official Ryzen 9000-series pricing has leaked just ahead of the launch, courtesy of Newegg and BestBuy in the US. Serial leaker @momomo_us over at X/Twitter managed to snap screenshots of the pricing before it was removed by the retailers. This might've been because of a mixup, since the Ryzen 9000-series was supposed to launch today, before being pushed back to the 8th and 14th of August respectively, depending on the SKU. Admittedly the pricing might still change, but it's highly likely that the leaked pricing is AMD's MSRP for the four new CPUs, as both of the retailers have listed identical pricing for the four SKUs.

The good news for prospective buyers of the new CPUs is that AMD has lowered the pricing across the board compared to the launch pricing for the Ryzen 7000-series, especially at the higher-end. The Ryzen 5 9600X should have an MSRP of US$279, followed by US$359 for the Ryzen 7 9700X. That's US$20 and US$40 lower than their Ryzen 7000-series counterparts respectively. The Ryzen 9 9900X should retail for US$449, followed by US$599 for the Ryzen 9 9950, both US$100 less than their Ryzen 7000-series counterparts. This could in part be due to the expected X3D parts coming at a later point in time and AMD now knowing it has to offer the non X3D SKUs for a more competitive price point.

AMD Ryzen 9000 series "Granite Ridge" desktop processors were supposed to start selling on July 31, 2024, but the launch has since been delayed. Since then, social media has been abuzz with theory crafting behind what could be the cause of the delay. AMD's announcement of the delay mentions: "During final checks, we found the initial production units that were shipped to our channel partners did not meet our full quality expectations," causing some to speculate if there are design flaws such as the ones affecting Intel's 13th Gen and 14th Gen Core desktop processors. A picture doing rounds on social media has a more goofy explanation: there is a glaring typo on the product label printed on the integrated heatspreader (IHS) of the processors.

Apparently, some of the first batches of Ryzen 9000 processors see the brand extensions mislabeled. Ryzen 7 9700X is printed as "Ryzen 9 9700X." This error in the brand extension may have been easily "patched" if it was on the retail packaging (the box), where hardware manufacturers tend to fix typos by simply pasting stickers on them. You can't do this with the IHS, which is a key component of the processor's cooling mechanism. Also, since times immemorial, chip labels (information printed on the chip) have served as crucial last resorts for accuracy of information such as the chip's exact model number, steppings or revisions (if any), and production serial numbers, besides the chip's national origin, which determines the applicable import tariffs. A typo here could prove problematic. We're not entirely sure how AMD is fixing these errors with mere 1-2 week delays. It's likely that they're recalling the affected batch and simply replacing inventory in the channel with "good" batches. The recalled chips will simply have their IHS reprinted.

ASRock has silently unveiled the X600TM-ITX, currently the "world's only" AM5 Thin Mini-ITX motherboard designed for AMD Ryzen 9000 "Zen 5" processors along with 8000 and 7000 series CPUs with a max TDP of 65 W. Its "Thin" Mini-ITX form factor (17.0 cm x 17.0 cm) stands out with a compact 25 mm I/O shield height compared to the standard 44 mm.

Unlike traditional Mini-ITX boards, the X600TM-ITX utilizes SODIMM memory (max. 96 GB of Dual DDR5 6400+) and supports onboard power supply via one DC Jack on the rear panel I/O, eliminating the need for a separate ATX PSU. This makes it an ideal choice for DIY mini PC enthusiasts. However, the board lacks PCIe slots for discrete GPUs, limiting its gaming potential. Nevertheless, the integrated graphics in AM5 processors should handle most games at lower settings, especially with higher-end CPUs.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced BIOS updates for X670, B650, and A620 Motherboards to support AMD Ryzen 9000 processors. The critical BIOS updates for GIGABYTE X670, B650, and A620 series motherboards ensure the compatibility and optimized performance with the upcoming AMD Ryzen 9000 series processors.

GIGABYTE remains committed to providing the best possible experience for users and works closely with AMD to ensure prompt updates as new AGESA versions become available. Beta BIOS will be regularly updated on the GIGABYTE website. Users can easily update the BIOS using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology.

AMD is readying a successor to its Ryzen 7045 series "Dragon Range" mobile processor for gaming notebooks and portable workstations. While we don't know its processor model naming yet, the chip is codenamed "Fire Range." We are learning that it will retain the FL1 package as "Dragon Range," which means it will be pin-compatible. This would significantly reduce development costs for notebook OEMs, as they can simply carry over their mainboard designs from their notebooks based on "Dragon Range."

"Fire Range" is essentially a mobile BGA version of the upcoming Ryzen 9000 "Granite Ridge" desktop processor. The FL1 package measures 40 mm x 40 mm in size, and has substrate for two CCDs and a cIOD, just like the desktop chip. "Fire Range" hence features one or two 4 nm "Zen 5" CCDs, depending on the processor model, and the 6 nm client I/O die. Much like "Dragon Range," the "Fire Range" chip will lack support for LPDDR5, and rely on conventional PC DDR5 memory in the SO-DIMM or CAMM2 form-factors. Besides the CPU core count consisting exclusively of full-sized "Zen 5" cores, the main flex for "Fire Range" over "Strix Point" will be its 28-lane PCIe Gen 5 root-complex, which can wire out the fastest discrete mobile GPUs, as well as drive multiple M.2 NVMe slots with Gen 5 wiring, and other high-bandwidth devices, such as Thunderbolt 4, USB4, or Wi-Fi 7 controllers wired directly to the processor.

In a statement published today shortly after the release of a batch of new Zen 5 architecture details, AMD's computing and graphics SVP Jack Huynh released a statement regarding a delay to the release of the Ryzen 9000 processors based on Zen 5. Originally set to launch in just one week on July 31st, the processors have now been pushed back to a staggered release on August 8th and August 15th; one and two weeks after the initial launch window. AMD supposedly found some of the launch inventory processors did not go through proper testing procedures before being shipped out, and AMD is recalling those processors before any potential problems could have a chance to affect the first customers to buy the new chips.

The statement is as follows:

We appreciate the excitement around Ryzen 9000 series processors. During final checks, we found the initial production units that were shipped to our channel partners did not meet our full quality expectations. Out of an abundance of caution and to maintain the highest quality experiences for every Ryzen user, we are working with our channel partners to replace the initial production units with fresh units. As a result, there will be a short delay in retail availability. The Ryzen 7 9700X and Ryzen 5 9600X processors will now go on sale on August 8th and the Ryzen 9 9950X and Ryzen 9 9900X processors will go on-sale on August 15th. We pride ourselves in providing a high-quality experience for every Ryzen user, and we look forward to our fans having a great experience with the new Ryzen 9000 series.

AMD in its architecture deep-dive Q&A session with the press, confirmed that the "Zen 5" and "Zen 5c" cores on the "Strix Point" silicon only feature 256-bit wide FPU data-paths, unlike the "Zen 5" cores in the "Granite Ridge" Ryzen 9000 desktop processors. "The Zen 5c used in Strix has a 256-bit data-path, and so does the Zen 5 used inside of Strix," said Mike Clark, AMD corporate fellow and chief architecture of the "Zen" CPU cores. "So there's no delta as you move back and forth [thread migration between the Zen 5 and Zen 5c complexes] in vector throughput," he added.

It doesn't seem like AMD disabled a physically available feature, but rather, the company developed a variant of both the "Zen 5" and "Zen 5c" cores that physically lack the 512-bit data-paths. "And you get the area advantage to be able to scale out a little bit more," Clark continued. This suggests that the "Zen 5" and "Zen 5c" cores on "Strix Point" are physically smaller than the ones on the 4 nm "Eldora" 8-core CCD that is featured in "Granite Ridge" and some of the key models of the upcoming 5th Gen EPYC "Turin" server processors.

AMD "Granite Ridge" is codename for the four new Ryzen 9000 series desktop processors the company plans to launch on July 31, 2024. The processor is built in the Socket AM5 package, and is meant to be backwards compatible with AMD 600-series chipset motherboards, besides the new 800-series chipset ones that will launch alongside. "Granite Ridge" is a chiplet-based processor, much like the Ryzen 7000 "Raphael," Ryzen 5000 "Vermeer," and Ryzen 3000 "Matisse." AMD is carrying over the 6 nm client I/O die over from "Raphael" in an effort to minimize development costs, much in the same way it carried over the 12 nm cIOD for "Vermeer" from "Matisse."

The SoC I/O features of "Granite Ridge" are contemporary, with its awesome 28-lane PCI-Express Gen 5 root complex that allows a PCI-Express 5.0 x16, two CPU-attached M.2 Gen 5 slots, and a Gen 5 x4 chipset bus. There's also a basic integrated graphics solution based on the older RDNA 2 graphics architecture; which should make these processors fit for all use-cases that don't need discrete graphics. The iGPU even has multimedia accelerators, an audio coprocessor, a display controller, and USB 3.2 interfaces from the processor.

As AMD prepares to roll out its next-generation Ryzen 9000 series of CPUs based on Zen 5 architecture, we are starting to see some systems being tested by third-party OEMs and system integrators. Today, we have Geekbench 6 scores of the Ryzen 9 9900X CPU, and the 12-core, 24-thread processor that has demonstrated impressive performance gains. Boasting a base clock of 4.4 GHz and a boost clock of up to 5.6 GHz, the CPU features only 120 W TDP, a significant reduction from the previous 170 W of the previous generation. In Geekbench 6 tests, the Ryzen 9 9900X achieved a single-core score of 3,401 and a multicore score of 19,756.

These results place it ahead of Intel's current flagship Core i9-14900KS, which scored 3,189 points in single-core performance. Regarding multicore tasks, the i9-14900K scored 21,890 points, still higher than AMD's upcoming 12-core SKU. The benchmark of AMD's CPU was conducted on an ASUS ROG Crosshair X670E Gene motherboard with 32 GB of DDR5 memory. As anticipation builds for the official release, these early benchmarks suggest that AMD will deliver a compelling product that balances high performance with improved energy efficiency. The top tier models will still carry a 170 W TDP, while some high-end and middle-end SKUs get a TDP reduction like the Ryzen 7 9700X and Ryzen 5 9600X dial down to 65 W, decreased from 105 W in their previous iterations.

AMD is preparing to release its next generation of high-performance CPUs, the Ryzen 9000X3D series, and rumors are circulating about potential increases in stacked L3 cache. However, a recent report from Wccftech suggests that the upcoming models will maintain the same 64 MB of additional 3D V-cache as their predecessors. The X3D moniker represents AMD's 3D V-Cache technology, which vertically stacks an extra L3 cache on top of one CPU chiplet. This design has proven particularly effective in enhancing gaming performance, leading AMD to market these processors as the "ultimate gaming" solutions. According to the latest information, the potential Ryzen 9 9950X3D would feature 16 Zen 5 cores with a total of 128 (64+64) MB L3 cache, while a Ryzen 9 9900X3D would offer 12 cores with the same cache capacity. The Ryzen 7 9800X3D is expected to provide 96 (32+64) MB of total L3 cache.

Regarding L2, the CPUs feature one MB of L2 cache per core. Perhaps the most exciting development for overclockers is the reported inclusion of full overclocking support in the new X3D series. This marks a significant evolution from the limited options available in previous generations, potentially allowing enthusiasts to push these gaming-focused chips to new heights of performance. While the release date for the Ryzen 9000X3D series remains unconfirmed, industry speculation suggests a launch window as early as September or October. This timing would coincide with the release of new X870 (E) chipset motherboards. PC enthusiasts would potentially wait to match the next-gen CPU and motherboards, so this should be a significant upgrade cycle for many.