System76 has announced the Thelio Prime, a compact 11-liter (288 x 148.9 x 281.9 mm) desktop built at the company's Denver facility. The chassis is made from milled stainless steel and aluminium parts. To add a bit of finesse, there's a smoked-glass front panel and tool-free magnetic side panels. The interior is designed with two thermal chambers, separating the CPU and GPU. As for performance, System76 describes it as "An 11-liter Linux desktop that fits almost anywhere, without giving up on performance." Users can choose from an AMD Ryzen 9000 processor (up to Ryzen 7 9850X3D) with integrated Radeon graphics or go for a discrete AMD or NVIDIA GPU (up to RTX 5070), depending on configuration. The system can have up to 96 GB of dual-channel DDR5 and up to 8 TB of storage across its M.2 slots (one PCIe 5.0 and one PCIe 4.0).

Front I/O offers a USB 3.2 Gen 1 Type-C, a USB 3.2 Gen 1 Type-A, and the audio jack. The rear adds two USB 3.2 Gen 2 Type-A ports, one USB 3.2 Gen 2 Type-C, one USB 3.2 Gen 1, four USB 2.0 ports, a BIOS Flashback button, and audio line-out. Networking covers 2.5 GbE, Wi-Fi 6E, and Bluetooth 5.2. Display outputs depend on the GPU. Integrated graphics get HDMI 2.1 and USB-C with DisplayPort 1.4. A discrete GPU option typically adds three DisplayPort outputs and one HDMI. Power comes from a 600 W 80 Plus certified supply with at least 90% efficiency. The system comes preinstalled with Pop!_OS 24.04 LTS with COSMIC Desktop Environment or with Ubuntu 24.04 LTS. The Thelio Prime is expected to launch November 18, starting at $1,599.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, gaming monitors, power supply units, and AIO liquid coolers, today announced that the DeskSlim X600 and DeskSlim B760 compact desktop platforms support NVIDIA RTX PRO 4000 Blackwell SFF Edition and NVIDIA RTX PRO 2000 Blackwell professional graphics cards.

Designed for professional users who require desktop-class expandability in a space-saving form factor, the DeskSlim series features a PCIe 5.0 x16 expansion slot that supports a low-profile, dual-slot graphics card up to 200 mm in length. In a compact 5L chassis, the systems can be configured for AI-assisted workflows, content creation, 3D visualization, engineering applications, and data analysis.

System76's high-performance computers have always met the challenges of AI, but with the Sept. 9 launch of the Thelio Mira AI, our customers can now purchase a lower-cost Thelio workstation that's optimized for AI development and local AI workloads.

The Thelio Mira AI - which adds new capabilities to our best-selling Mira desktop - offers a cost-effective GPU workstation solution for AI projects, prioritizing GPU compute. It's powered by dual NVIDIA GPUs and a lower-wattage AMD CPU to free up more power for those GPUs.

A Ryzen 9 9950X3D has reportedly died just an hour after being moved into an ASUS ROG Crosshair X670E Hero motherboard. According to Reddit user SpecialistConcept423, posting in r/GamersNexus, the chip had been running fine for about a year and a half in an ASRock X670E Taichi Carrara before the swap. After switching to the new board, no manual overclocking or voltage tweaks were applied; only one of the board's built-in memory presets was enabled for a set of SK hynix 6200 MHz modules. After saving that setting and rebooting, the board threw a "00" Q-Code and refused to post. Pulling the CPU and inspecting it revealed two brown marks on its contacts, which all but confirmed the catastrophic failure.

Things got stranger when the user resorted to an older Ryzen 5 8500G that had previously worked fine on the same board. That chip apparently now throws a "4D" code too, pointing at the motherboard itself as the culprit, not just the CPU. There's no confirmation yet on whether a faulty BIOS, a bad batch of boards, or something else is to blame, and ASUS hasn't commented on this specific case. It is worth noting that the ASUS board was not new, and it had undergone USB-related repairs and a BIOS rewrite. The user has since contacted AMD in Brazil for an RMA, but has shared no updates yet.

MSI, a world leader in gaming hardware, today introduced the MAG Infinite Z, an AMD-powered gaming desktop built for players who want strong performance, smart cooling, and easy upgradability in a compact tower design. Featuring up to an AMD Ryzen 7 9700X processor and up to NVIDIA GeForce RTX 5070 Ti graphics, the MAG Infinite Z delivers powerful gaming performance in a space-saving 25L chassis.

Designed for modern gamers, the MAG Infinite Z combines high-performance hardware, intelligent thermal optimization, and practical upgrade features in one refined gaming desktop. Whether for competitive gaming, AAA titles, streaming, or daily multitasking, the system gives players the speed, stability, and flexibility they need without the oversized footprint of a traditional gaming tower.

Motherboard vendors ASUS and MSI began releasing UEFI firmware updates to their AMD 600-series chipset motherboards that introduce support for AMD EXPO-ULL memory profiles. EXPO-ULL is an SPD extension that simplifies memory settings. While AMD Ryzen 7000 series and Ryzen 9000 series processors are relatively behind Intel in memory clock speeds, there is room for memory vendors to release memory kits with significantly tighter timings within their memory speed classes. An example of an EXPO-ULL profile would be DDR5-6000 with CL26, as opposed to the CL30-36 usually available for this speed.

ASUS began by releasing Beta BIOS 3803 version for its motherboards based on AMD X670E spanning the ROG Crosshair, ROG Strix, ProArt, and TUF Gaming product lines. These include EXPO-ULL support, and AGESA 1.3.0.1b. Meanwhile, MSI released a similar firmware update for its top MEG X670E GODLIIKE motherboard featuring EXPO-ULL support and AGESA 1.3.0.1b. More vendors are expected to catch on, as AMD hasn't restricted EXPO-ULL to any chipset generation.

COLORFUL at the 2026 Computex showed off its new prebuilt notebooks, desktops, and a stunning new prototype product. The company debuted the Epoch Air 14 Ultra, an ultraportable with a powerful set of hardware based on Core Ultra Series 3 processors. The company also showcased the Rimbook S1 Plus and L1 Plus thin-and-light notebooks in larger 16:10 screen formats. Other notebooks shown include the Evol X16 Pro, Evol P16 Pro, the Meow R16 Ultra, Meow R16 Pro, and a prototype gaming notebook with a liquid-cooling solution.

The company also showcased a wide range of iGame series pre-built gaming desktops, with a diverse set of hardware ranging from Core Ultra Series 2 Plus "Arrow Lake Refresh" processors, and Ryzen 9000 "Granite Ridge" processors. The iGame Ultra Zero features an interesting floating PSU compartment concept along with curved glass panels along 3 sides—a design we're sure will catch on. It gets its name from a completely concealed cabling layout. The iGame Mini PC is about the size of an Xbox Series X, but packs powerful hardware, including the company's on Mini series SFF graphics cards.More pictures follow.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the B850 AORUS ELITE-P ICE, the newest addition to its AORUS ARI lineup and the brand's boldest step yet into anime-inspired PC hardware. Building on the massive success of the microATX B850 AORUS ARI motherboard, GIGABYTE now brings the same cultural energy to a full ATX B850 platform—proving that self-expression and uncompromising performance are not a trade-off.

The B850 AORUS ELITE-P ICE is more than a motherboard with an anime aesthetic—it is a cultural statement designed for a new generation of PC builders who demand both personality and power from their rigs. Featuring the most distinctive anime-inspired design on any B850 platform in the market today, the board ships with an exclusive ARI doll blind box accessory, turning the unboxing into an experience that rivals the build itself. For enthusiasts who see their rig as an extension of who they are, the AORUS ARI edition was not designed to fit their world—it was built from it.

Gigabyte Technology Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today marks a defining moment in computing aesthetics with the introduction of the X870E AERO X3D DARK WOOD—a groundbreaking motherboard that transcends technological achievement to become a true design statement. Building on the acclaimed success of the X870E AERO X3D WOOD, the X870E AERO X3D DARK WOOD carries that legacy boldly forward, deepening the experience into something more immersive and emotionally resonant.

Guided by the philosophy of Technology with Warmth, the X870E AERO X3D DARK WOOD envelops the user in a quiet, grounded mood that feels less like a hardware upgrade and more like coming home. The authentic dark wood texture finish brings natural warmth and character into high-performance computing; the supple leather pull tab adds tactile intimacy; and the understated dark metal tones offer calm and breathing room—a deliberate counterpoint to the noise of modern life.

MSI is excited to introduce full support for the upcoming AMD Ryzen 9 9950X3D2 Dual Edition processor, built on cutting-edge "Zen 5" architecture and powered by next-generation AMD 3D V-Cache technology. Designed for MSI's AM5 motherboard lineup, this 16-core, 32-thread powerhouse boasts a massive 192 MB L3 cache, up to 5.6 GHz boost clocks, and a 200 W TDP. Whether for intense gaming or heavy content creation, it delivers exceptional speed and efficiency, pushing performance to new heights.

MSI also introduces its new flagship MEG X870E UNIFY-X MAX, built for uncompromising performance. Designed with a specialized 2-DIMM layout and OC Engine, it caters to extreme overclocking enthusiasts seeking maximum potential. A powerful 18+2+1 power phase design (110 A SPS), combined with an advanced cooling solution featuring a Direct Touch Cross Heat-pipe and double-sided EZ M.2 Shield Frozr II, ensures stability under the most demanding conditions. The exclusive Tuning Controller simplifies advanced tuning and CMOS reset, making overclocking accessible even for those new to extreme performance tuning. Fully optimized for AMD Ryzen 9000 Series processors with AMD 3D V-Cache technology, and equipped with Full-Speed Wi-Fi 7 and 5G LAN, it delivers blazing-fast, low-latency connectivity.

ASRock Industrial announces new industrial motherboards supporting AMD EPYC 4005/4004, Ryzen 9000/8000/7000, and Ryzen Embedded 9000/7000 Series processors, expanding its platform portfolio across IMB-A1700, IMB-A1302, IMB-A1003, and IMB-A1002. Powered by AMD EPYC 4005 Series processors with up to 16 cores and 32 threads, delivering high-performance and energy efficiency for edge servers and enterprise workloads, alongside Zen 5-based Ryzen 9000 Series for exceptional computing power and Ryzen Embedded 9000 Series for long-term availability in reliable edge computing. Supporting ATX, microATX, and Mini-ITX form factors, these platforms feature DDR5 memory, PCIe Gen 5 expansion, multi-display capability, and rich industrial I/O to enable flexible system designs for computer vision, video analytics, AI-enhanced workloads, software development, gaming platforms, and professional-grade productivity systems.

IMB-A1700 Series: ATX Motherboard for high-performance
The IMB-A1700 ATX motherboard supports AMD EPYC 4005/4004, Ryzen 9000/8000/7000, and Ryzen Embedded 9000/7000 Series processors, delivering robust computing performance for demanding workloads. The board features four DDR5 5600 MHz ECC/non-ECC U-DIMM slots supporting up to 256 GB of memory, providing a stable foundation for high-throughput and multitasking environments. Expansion capability includes two PCIe x16 (Gen 5) slots, configurable as either one PCIe x16 (Gen 5) or two PCIe x8 (Gen 5), one PCIe x4 (Gen 4), and four PCIe x1 (Gen 4) slots, enabling flexible integration of GPUs, AI accelerators, and add-on cards. Storage support includes one M.2 key M for NVMe SSD and four SATA3 ports with RAID 0/1/10 support, enabling high-speed storage deployment. I/O connectivity is comprehensive, featuring seven USB 3.2 Gen 2 ports, eight USB 2.0 ports, and six COM ports, complemented by three 2.5G LAN and one 1G LAN. Supporting quad-display output via HDMI 2.0b and DisplayPort 1.2++ and built in an ATX form factor (12 x 9.6 inches), the IMB-A1700 is well-suited for AI-driven video analytics platforms, computer vision servers, high-end development systems, and performance-focused computing deployments.

Thermal Grizzly announced its TG Delidded CPUs, which would see the company sell delidded AMD Ryzen 9000 CPUs for enthusiast use with direct-die cooling solutions. The program started with the AMD Ryzen 7 9800X3D and has since expanded to include the AMD Ryzen 9 9950X3D, with the latest addition being the recently released AMD Ryzen 7 9850X3D. The delidded 9850X3D comes in at $876.33 on the Thermal Grizzly store, which is a marked increase over the $500 MSRP, but it also includes a warranty in the case of any manufacturer defects or issues that might arise during the delidding process. The aforementioned warranty is valid for two years and covers material defects of the CPU and even extends to overclocking within manufacturer spec, as long as adequate cooling is provided. It does not cover any physical or liquid damage to the silicon, SMDs, or the PCB.

[Editor's note: Our in-depth review of the AMD Ryzen 7 9850X3D is now live]

Roman Hartung, aka Der8auer, famous overclocker and CEO of Thermal Grizzly, published a YouTube video demonstrating the delidding process and documenting potential performance and thermal improvements as a result of delidding and direct-die cooling. In the video, Hartung tests the 9850X3D in Cinebench R23, demonstrating a 90.2° C peak temperature on one CCD, with the average die temperature getting as high as 88.1° C with a peak power draw of 182.35 W in the 10-minute CPU benchmark run. Individual peak CPU core temperatures ranged from 78 to 88.2° C, whereas after applying liquid metal and a direct-die cooling solution resulted in peak CPU core temperatures of 66.1-75.3° C and a peak average CPU temperature of 75.3°C—temperatures were down around 15° C across the board following the delid. Power draw was slightly lower during this test, at 178.09 W peak package power, although the same settings were applied in BIOS ahead of the tests. Hartung also goes on to test the overclocking capabilities of the delidded CPU on the direct-die cooling solution, which can be seen in the video below.

Gigabyte, the world's leading computer brand, partners with AMD to announce the Crimson Desert game bundle to enhance game value across a wide range of components and consumer products. Spanning graphics cards, select AMD Ryzen 9000X3D processors are paired with recommended Gigabyte motherboards, as well as laptops and desktops. Together, Gigabyte and AMD deliver a richer and more immersive gaming experience through cutting-edge hardware innovation.

Gigabyte Radeon RX 9070 Series graphics cards are powered by the AMD RDNA 4 architecture with enhanced ray tracing capabilities and AMD FSR "Redstone" technology, which boosts frame rates and reduces system latency delivering the horsepower needed for demanding gaming. Equipped with Gigabyte's WINDFORCE cooling system, including the Hawk fan design and server-grade thermal conductive gel, these GPUs maintain exceptional thermal efficiency for consistently optimized gameplay.

ASRock is closely monitoring recent discussions regarding the performance and behavior of AMD Ryzen 9000 series processors on ASRock AMD platforms. In response to these reports, we have implemented comprehensive internal reviews and rigorous verification processes. We have been working in seamless coordination with AMD continuously to further validate system performance across a wide range of hardware configurations, while optimizing BIOS and enhancing overall system stability.

ASRock deeply values user feedback as a cornerstone of our continuous improvement. Customers experiencing technical difficulties or seeking further assistance are encouraged to contact the ASRock Technical Support Department. We remain committed to delivering high-performance products that meet the highest standards of quality and performance.

iBUYPOWER, a leading system integrator of gaming and content creation PCs, announced today that AMD's latest flagship gaming CPU, the AMD Ryzen 7 9850X3D, is now available as an option when purchasing a custom PC through iBUYPOWER's custom configurator, or through its recently launched PC Lab service on iBUYPOWER.com. Each computer built with the 9850X3D will also be backed by iBUYPOWER's extensive three-year labor and two-year parts warranty for additional peace of mind.

By boosting clock speed to up to 5.6 GHz for faster single-threaded performance and responsiveness, AMD's Ryzen 7 9850X3D CPU is the new king of PC gaming processors that is backed by unrivaled longevity thanks to the CPU being designed for AMD's Socket AM5 platform. Built on 2nd Gen AMD 3D V-Cache technology, the 9850X3D has been re-engineered to give direct cooler access to the processor cores, and is fully enabled for overclocking out of the box. This enables accelerated performance for everyday productivity tasks and even higher gaming performance.

GIGABYTE, the world's leading computer brand, deepens its strategic partnership with AMD to accelerate on-device AI across three key product lines, including AI gaming laptops, X870E X3D series motherboards, and high-refresh OLED gaming monitors. Powered by AMD platforms and built with GIGABYTE's advanced technology, this collaboration delivers fast, smooth performance for gaming and creation, as well as steady stability for PC builds.

For AI gaming laptops, AORUS MASTER 16 is powered by the AMD Ryzen 9 9955HX3D processor with AMD 3D V-Cache technology, an advanced cache design that helps keep frame rates steady in fast-paced games while accelerating demanding creator workloads. GIGABYTE AERO X16 (Copilot+ PC) runs on AMD Ryzen AI 400 Series processors, leveraging the built-in NPU to handle select AI tasks efficiently on-device for everyday AI experiences. To help AMD's performance shine in real sessions, GIGABYTE elevates the experience with WINDFORCE Infinity EX cooling technology on AORUS MASTER 16—rated for 230 W max total thermal power—and GiMATE, GIGABYTE'S exclusive AI agent that streamlines power, performance, and AI features into clear, workflow-friendly controls, so users get strong and steady performance with less manual tuning.

MSI is pleased to announce support for the upcoming AMD Ryzen 7 9850X3D processor, built on the Zen 5 architecture and powered by the latest AMD 3D V-Cache technology from AMD. Compatible with MSI motherboards supporting AMD's AM5 platform, this processor features 8 cores and 16 threads with a massive 104 MB total cache, delivering boost clock speeds of up to 5.60 GHz with a max TDP of 120 W. Designed for outstanding performance and efficiency, it effortlessly handles the most demanding gaming and content creation workloads, setting a new standard for high-performance computing.

At the same time, we also unveil the new flagship MEG X870E UNIFY-X MAX during CES 2026. It is engineered for ultra-high performance, featuring a specialized 2-DIMM layout and OC Engine for extreme overclocking enthusiasts. It is powered by a robust 18+2+1 power phase (110 A SPS) and cooled by an advanced thermal solution, incorporating a Direct Touch Cross Heat-pipe and double-sided EZ M.2 Shield Frozr II. By fully optimizing for AMD Ryzen 9000 Series Processors with AMD 3D V-Cache Technology, integrating cutting-edge Wi-Fi 7 and 5G LAN to ensure peak efficiency and low-latency connectivity for data-intensive applications, MEG X870E UNIFY-X MAX is ready for the challenge. An exclusive Tuning Controller provides instant, hands-on control for enthusiasts, enabling quick access to overclocking adjustments and CMOS clearing, all with a single press.

At CES 2026, GIGABYTE is unlocking the full potential of AMD Ryzen 9000 Series Processors with AMD 3D V-Cache technology. Through its exclusive, AI-powered X3D Turbo Mode 2.0, GIGABYTE delivers real-time, adaptive performance tuning that pushes X3D CPUs beyond traditional limits. Built as a true hardware-software fusion and trained with massive real-world datasets, X3D Turbo Mode 2.0 is fully optimized and ready for the latest X3D Powered Ryzen 9000 Series Processors—right from day one.

Highlighting this breakthrough is the flagship X870E AORUS XTREME X3D AI TOP, engineered for users seeking uncompromising performance. It supports DDR5 speeds up to 9000+ MT/s, enabling exceptional memory bandwidth and stability. Its advanced thermal architecture includes the CPU Thermal Matrix, reducing VRM and DDR temperatures by up to 8.5°C, while DDR Wind Blade XTREME lowers module temperatures by up to 9°C. To maintain storage reliability under heavy workloads, the M.2 Thermal Guard XTREME reduces SSD temperatures by up to 22°C, ensuring sustained speed and endurance.

AMD's Extended Profiles for Overclocking (EXPO) technology is receiving an update with version 1.2. According to the latest HWiNFO v8.35-5890 Beta, this tool has added support for AMD EXPO 1.2, even though AMD has not officially released this version yet. Currently, AMD employs EXPO 1.0 with its Ryzen processors to provide optimal overclocked memory profiles for each configuration. This approach enhances overall system performance and gives the Infinity Fabric, which interconnects the CCDs and IODs, perfect balance of latency and speed.

What will come with EXPO 1.2 remains a mystery. Recently, as part of the "Granite Ridge" Ryzen 9000 X3D series, AMD's upcoming Ryzen 7 9850X3D processor was seen running with 9,800 MT/s DDR5 memory, which is unusually high for its class in this late-cycle "Zen 5" SKU. AMD could bring some late-stage "Zen 5" memory profile optimizations that we haven't seen so far, just in time for the late cycle X3D SKUs.

Update 22:15 UTC: According to AMD insider and author of HYDRA, CTR, DRAM calculator for AMD Ryzen 1usmus on X, the EXPO 1.2 will finally include support for CUDIMMs. These are DDR5 modules with integrated clock driver circuits, which improve signal integrity at higher frequencies, allowing the DDR5 modules to reach frequencies beyond JEDEC-provided range. We still have no idea how AMD plans to implement this. The slide below is just for illustrative purposes and is AMD's earlier mention of EXPO. It does not reflect the latest 1.2 version.

AMD's upcoming Ryzen 7 9850X3D processor is slowly hitting the retailer space, and the pricing has been leaked by @momomo_us. At $553, the new "Granite Ridge" Ryzen 9000 X3D SKU is priced roughly $70 more than the Ryzen 7 9800X3D at its launch. The Ryzen 7 9850X3D CPU features 8 cores and 16 threads, 96 MB of L3 cache, and a boost clock up to 5.6 GHz, with a 120 W power envelope. This represents a 400 MHz increase over the Ryzen 7 9800X3D model, which has the same cache and core configuration. At Switzerland retailer Orderflow.ch, the CPU is listed for 473.55 CHF, which is 20% higher than the Ryzen 7 9800X3D.

Officially, AMD's Ryzen 9000 series supports DDR5 memory speeds up to 5600 MT/s, but this model could push that number to 9,800 MT/s if earlier reports are accurate. AMD is likely using higher-binned dies it has saved over the past few months to offer a better alternative to Intel's upcoming "Arrow Lake Refresh," scheduled for early 2026, and "Nova Lake," scheduled for late 2026. As Intel has confirmed it will ship with native support for DDR5 memory speeds reaching 7200 MT/s on CUDIMM modules, AMD is fighting with a faster CPU clock and supposedly better memory speeds to offer good competition in the consumer DIY PC space.

As part of the "Granite Ridge" Ryzen 9000 X3D series, AMD's upcoming Ryzen 7 9850X3D processor has been spotted running with 9,800 MT/s DDR5 memory, placing this late-cycle "Zen 5" SKU unusually high for its class. The AMD Ryzen 7 9850X3D features 8 cores and 16 threads, 96 MB of L3 cache, and a boost clock of up to 5.6 GHz, with a 120 W TDP. What sets this processor apart is not just the 400 MHz increase over the Ryzen 7 9800X3D model, which shares the same cache and core configuration. Officially, AMD's Ryzen 9000 series supports DDR5 memory speeds up to 5600 MT/s, but this model could push that number to 9,800 MT/s if the reports are accurate.

AMD might be using higher-binned IODs it has accumulated over the past few months to offer a competitive alternative to Intel's upcoming "Arrow Lake Refresh," set for early 2026, and "Nova Lake," scheduled for late 2026. Since the overall "Granite Ridge" family officially supports much lower DDR5 memory speeds, in line with JEDEC specifications, a new or better-tested IOD could enable these 9,800 MT/s speeds. In the BIOS image below, you can see a 9,800 MT/s figure. We can disregard the incorrect date, as it could have been intentionally altered by the leaker to prevent AMD from tracing the source. The CPU picture below serves as a mockup of what the actual design might look like.

MaxSun unveiled the iCraft X870M, a Socket AM5 motherboard in the microATX form-factor that's based on AMD X870 chipset. The board comes with "readiness" for future generation processors, and perhaps the most interesting bit here is support for 300 W CPU power delivery that's "unlockable" to 400 W. Current Ryzen 9000 and Ryzen 7000 series processors come with stock TDP as high as 170 W for the 12-core and 16-core models, with PPT (package power tracking) values that go up to 230 W, which is just above the 225 W design limit of the 8-pin EPS connector, requiring an additional 4-pin or 8-pin EPS input, with most board vendors opting for the latter. MaxSun mentioning 300 W delivery capability that can go up to 400 W is interesting, and could be a hint that motherboard vendors anticipate AMD's next-gen processors to come with higher TDP and PPT values. The VRM solution itself consists of a 16+2+1 phase setup, and uses 50 A DrMOS.

As for the product itself, the MaxSun iCraft X870M is a feature-packed motherboard within its form-factor. Two of the features that stand out are active cooling and a true-color display. The motherboard has a rare combination of three M.2 slots, two on the obverse side of the PCB, and one on the reverse side. One of these is Gen 5 x4, and wired to the processor. This slot, along with an FCH-connected Gen 4 M.2 slot, are cooled under the airflow of a 40 mm fan that also cools the FCH. There is a 4-inch true-color display that can be programmed to show just about anything, such as real-time monitoring stats, or cool animations. The board supports DDR5-8400 OC speeds, and a wealth of CPU overclocking options, including that 400 W power delivery unlock.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today marks a revolutionary moment in computing aesthetics with the introduction of X870E AERO X3D WOOD, a groundbreaking motherboard that represents more than a technological advancement—it's a statement piece that harmonizes organic elegance with uncompromising performance. Crafted for the discerning connoisseur, this motherboard transforms cold technology into an inviting element that belongs in your living space.

X870E AERO X3D WOOD brings comfort and harmony to your space through thoughtful design that honors the quiet presence of natural materials. Every detail has been meticulously considered, from the premium leather pull tab—a tactile delight that brings luxurious warmth to your fingertips—to the natural wood aesthetic that evokes the warmth and authenticity of home.

Earlier this week, talk of imminent price increases—affecting current and previous generation AMD Ryzen processors—spread across PC hardware news outlets and communities. It is debated whether Team Red simply directed its retail partners to elevate Ryzen 9000 (Zen 5) and Ryzen 7000/8000 (Zen 4) processor series price tags following the conclusion of Black Friday, Cyber Monday, or discount promotions. Tom's Hardware decided to investigate this controversial matter, by reaching out to trusted contacts. Under an hour ago, their findings were published—according to: "two industry sources that wish to remain anonymous, one from one of the largest U.S. distributors, (believe) that there have been no indications of impending price adjustments for Ryzen processors, and no evidence suggests such changes are imminent, contrary to recent rumors."

Presently, computer memory supply issues have caused manufacturers to assess product pricing, distribution and release strategies. Reportedly, AMD is in the process of finalizing price hikes of current mainstream GPU lines—possibly tacking on an extra $20 across 8 GB SKUs, and a $40 bump up for 16 GB models. The latest report posits that "Granite Ridge" and "Raphael" Ryzen prices will remain intact for the time being, on account of the public's perception of fresh AMD decision-making. Tom's Hardware outlined the circumstances: "SSDs, graphics cards, or memory, processors are less susceptible to price fluctuations caused by NAND shortages....the chip manufacturer (AMD) may be delaying adjustments on processor pricing to prevent further customer dissatisfaction, assuming there was any minimal credence to the rumor to start with." A quick perusal of typical North American and European e-tail outlets shows rough $20 to $30 elevations across modern Ryzen CPU lines, but it is difficult to judge whether these erratic trends are simply jump ups from Black Friday/Cyber Monday baselines.

Amazon US sales data for October, courtesy of @TechEpiphanyYT, reveal a huge disparity between AMD and Intel CPU sales. The combined shipments of AMD's Ryzen 9800X3D and 7800X3D reached roughly 16,000 units, while Intel's entire CPU lineup on the platform did not surpass 10,000 units. This gives AMD about 83.80% of the market share in terms of units sold, meaning that for every ten CPUs sold, more than eight were AMD models. The two X3D models sold roughly 8,000 units each, indicating a strong demand for AMD's high-end gaming processors, even at premium prices. In the value segment, the six-core Ryzen 5 5500 sold nearly 5,000 units, securing the third spot and outperforming common Intel alternatives like the Core i3 models, which typically offer four cores.

Intel saw a limited success with the Core Ultra 7 265K, which sold nearly 1,000 units after its price dropped below $300. However, this single product couldn't offset the production challenges Intel faced with its 12th, 13th, and 14th generation lines, where increasing prices have reduced competitiveness in price-sensitive retail markets. Interestingly, the average selling price of AMD CPUs was $272.05, while Intel's was higher at $308.62. This indicates that AMD is focusing more on the low and mid-range segments, whereas Intel's customers are primarily targeting higher-end builds.