News Posts matching #ST

Return to Keyword Browsing

2026 All-Time High in Store for Global 300 mm Semiconductor Fab Capacity After 2023 Slowdown

Semiconductor manufacturers worldwide are forecast to increase 300 mm fab capacity to an all-time high of 9.6 million wafers per month (wpm) in 2026, SEMI announced today in its 300 mm Fab Outlook to 2026 report. After strong growth in 2021 and 2022, the 300 mm capacity expansion is expected to slow this year due to soft demand for memory and logic devices.

"While the pace of the global 300 mm fab capacity expansion is moderating, the industry remains squarely focused on growing capacity to meet robust secular demand for semiconductors," said Ajit Manocha, SEMI President and CEO. "The foundry, memory and power sectors will be major drivers of the new record capacity increase expected in 2026."

Strong Growth Expected for Third-Generation Semiconductors in 2021, Says TrendForce

The third-generation semiconductor industry was impaired by the US-China trade war and the COVID-19 pandemic successively from 2018 to 2020, according to TrendForce's latest investigations. During this period, the semiconductor industry on the whole saw limited upward momentum, in turn leading to muted growth for the 3rd gen semiconductor segment as well. However, this segment is likely to enter a rapid upturn owing to high demand from automotive, industrial, and telecom applications. In particular, the GaN power device market will undergo the fastest growth, with a $61 million revenue, a 90.6% YoY increase, projected for 2021.

Alphacool Introduces New NexXxoS ST25 Ultrathin Radiators

Alphacool today joins EKWB and XSPC (and Dazmode, before) in launching ultra thin sub-30 mm thick radiators for PC watercooling. Labeled the NexXxoS ST25, these are 25.5 mm thick and are the same radiators as those used in their Eisbaer LT CPU AIO coolers. These radiators are compatible with copper/brass/nickel loops, with copper fins and coolant channels, a steel housing, and brass threads on the two BSP G1/4" ports aboard the radiator. The core uses 15 FPI fins, which we speculate are the same fin geometry as with their other NexXxoS radiators with a louvered surface and ~25-30 µm in thickness. The NexXxoS ST25 is only available in 120 mm sizes for now, with prices ranging from 31.99€ for the ST25 120, to 39.47€ for the ST25 240, and 58.49€ for the ST25 360, with all prices inclusive of VAT.

Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm

Everspin Technologies, Inc., the world's leading developer and manufacturer of Magnetoresistive RAM (MRAM), today announced an amendment of its Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES (GF ), the world's leading specialty foundry. Everspin and GF have been partners on 40 nm, 28 nm, and 22 nm STT-MRAM development and manufacturing processes and have now updated their agreement to set the terms for a future project on an advanced 12 nm FinFET MRAM solution. Everspin is in production of discrete STT-MRAM solutions on 40 and 28 nm, including its award winning 1 Gb DDR4 device. GF recently announced it has achieved initial production of embedded MRAM (eMRAM) on its 22FDX platform.

SMART Announces Volume Production of HRS-S3 SSD

SMART High Reliability Solutions ("SMART HRS"), a provider of current and next-generation solid-state storage solutions specializing in ruggedized, high-performance and high-capacity solid-state drives ("SSDs") for defense, aerospace and industrial markets, today announced its HRS-S3 2.5" SATA 6Gb/s SSD, which has been successfully sampling with key customers, is now available in volume quantities to qualified customers. As the latest in a robust line of products from SMART HRS that emphasizes the company's exclusive focus on solid-state storage solutions, the HRS-S3 is ideal for industrial temperature applications.

Building on the accomplishments of SMART HRS's long line of SSD products for the defense industry, the HRS-S3 SSD delivers performance metrics of 500MB/s sequential read and 400MB/s sequential write speeds while delivering 35K IOPS and 20K IOPS respectively during random operation. Using highly reliable single-level-cell (SLC) NAND Flash, the HRS-S3 is available in capacities ranging from 120 to 960GB.

BIOSTAR Announces a GeForce GTX 960 Graphics Card

As part of its comeback streak with PC graphics, BIOSTAR announced its GeForce GTX 960 graphics card. Based on a custom-design by the company, the card features a custom PCB design, and a dual-fan aluminium fin-stack heatsink, to which heat is fed by copper heat pipes. The cooler keeps its fans off until the GPU reaches a temperature threshold. The card offers reference clocks of 1127 MHz core, 1187 MHz GPU Boost, and 7.00 GHz (GDDR5-effective) memory. The card draws power from a single 6-pin PCIe power connector. Display outputs include a pair of dual-link DVI, and one each of HDMI 2.0 and DisplayPort 1.2 connectors. Expect the card to be priced at $199.

Intel Launches Low-Power, High-Performance Silvermont Microarchitecture

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont. The technology is aimed squarely at low-power requirements in market segments from smartphones to the data center. Silvermont will be the foundation for a range of innovative products beginning to come to market later this year, and will also be manufactured using the company's leading-edge, 22nm Tri-Gate SoC manufacturing process, which brings significant performance increases and improved energy efficiency.

"Silvermont is a leap forward and an entirely new technology foundation for the future that will address a broad range of products and market segments," said Dadi Perlmutter, Intel executive vice president and chief product officer. "Early sampling of our 22nm SoCs, including "Bay Trail" and "Avoton" is already garnering positive feedback from our customers. Going forward, we will accelerate future generations of this low-power microarchitecture on a yearly cadence."

BIOSTAR to Showcase Exclusive Hi-Fi Puro Technology at Computex

Computex is Asia's largest high-tech event and will run from June 4th to to 8th, 2013 in Taipei, Taiwan and BIOSTAR will be showcasing their embedded/IPC solutions and graphics cards products as well as their line of Intel and AMD based motherboards in the Nangang Exhibition Hall at Booth M0402. The theme of their exhibition this year is their Hi-Fi Puro integrated products, including Intel's next generation Haswell based boards and their FM2 motherboards that support AMD's new Fusion "Richland" CPU. Continuing the tradition of their own in-house audio technology called "Puro Hi-Fi Technology"; Biostar is going to present the 2nd generation of this technology, called "Hi-Fi 3D".

Targeting audiophiles, HTPC enthusiasts and high-end gamers alike, Puro Hi-Fi features an integrated independent audio power design with a built-in amplifier. The technology utilizes audio components with an independent power delivery design for a significant reduction in electronic noise producing superb sound quality. The unique noise-blocking multi-layer PCB layout is conducive for an exceptionally clean signal. That design feature, together with a sampling rate of 192 kHz/24-bit, delivers high quality audio through an analog connection to your home theater system, multi-channel speakers or high-end headphones, allowing you to enjoy true high-definition 7.1-channel surround sound.

Palit and PC Partner Beat ASUS in Graphics Card Market Share

According to the latest global graphics card market share seen by Taiwanese tech industry observer DigiTimes, Palit Microsystems and PC Partner have each surpassed ASUSTek. The two relegated ASUS to the position of third biggest graphics card vendor by volume. ASUS is a vendor-neutral graphics card vendor, selling both NVIDIA GeForce and AMD Radeon graphics cards; while Palit beat it with a predominantly GeForce-based product stack. Although Palit Microsystems is vendor-neutral on paper, it virtually stopped making AMD Radeon-based products.

Palit Microsystems runs two major brands, Palit, and Gainward, which target different global markets, and are seldom found in the same market. PC Partner, on the other hand, runs Sapphire, which focuses on AMD Radeon products, and ZOTAC, focusing on NVIDIA GeForce. Both Palit Microsystems and PC Partners also contract-manufacture graphics cards for other companies. With the surge of Palit Microsystems and PC Partner, ASUSTek is pushed down to the third place in global market-share, followed by MSI and GIGABYTE.

ORIGIN PC Unleashes New Game-Changing NVIDIA GeForce GTX 680 and GeForce GTX 675M

ORIGIN PC is excited to announce the launch of the new NVIDIA GeForce GTX 680 video card for their award-winning desktops and the new NVIDIA GeForce GTX 675M notebook GPU for their record breaking EON17-X laptop. Now whether you're gaming at home or on the go, you can now experience faster, smoother and richer gaming like never before. It's more than just innovative, it's game-changing. And to celebrate the launch of the most power efficient GPU ever created, ORIGIN PC is giving away a free 90GB Corsair Force GT Solid State Hard Drive on their systems for a limited time.

Spire Announces Kepler Series Universal CPU Coolers

The Spire all new Kepler universal micro-processor cooler series are direct contact heat-pipe solutions for Core i3/i5 and i7 from Intel and the AMD AM2/3/FM1 micro-processors. There are three (3) different models ranging from two up to four 6mm sinter powder heat-pipes which are in direct contact with the cpu heat-source, dissipating heat effectively and fast.

The high density fins are crowned with a powerful fan for high airflow and great cooling performance. The 92mm dc fan provides ample airflow and silent cooling at 19.0dBA. Compatibility is ensured with the multi-platform mounting clip for Intel 775/1155/1156 sockets and AM2/AM3/FM1 micro-processors. The Kepler series from Spire are build to deliver great cooling for maximum system performance.

Club 3D Announces New Radeon HD 6750 1GB GDDR5

Club 3D B.V. announces the introduction of the Radeon HD 6750 video card based on the Juniper LE chipset, AMD' second generation DirectX 11 cards. Play the latest games in amazing detail with Club 3D Radeon HD 6750 Graphics. With winning performance, advanced technologies and full second generation DirectX 11 support, you're ready to dominate the competition. Now with AMD APP acceleration you can enable smoother video playback, improve your video image quality and enhance your applications performance.

With the latest UVD hardware on board, it considerably reduces the CPU load delivering and decoding stunning Blu-Ray and H.264 content. HDMI has been upgraded to 1.4a for 3D content making it the perfect choice for a HTPC.

ASUS Xonar Essence ST Audio Card with World’s First Precision Audio Clock Tuning

In its search for the purest essence of sound, ASUS have broken the boundaries with the newest soundcard on the market, the Xonar Essence ST. This PCI card is the world's first audio card to incorporate precision clock tuning to minimize audio jitter, bringing the user a clearer, crisper listening experience. The Xonar Essence ST card can also be upgraded to 7.1 channel output with the use of the Xonar H6 multi-channel extension board, which will be sold separately in the near future.

The Xonar Essence ST is capable of achieving an industry-leading 124dB SNR (Signal-to-Noise Ratio) in signal clarity and offers a built-in headphone amplifier to obtain the best performance out of any available pair of headphones. Thanks to ASUS' exclusive Hyper-grounding and EMI Shield design, even the most demanding audiophile will be satisfied with the unprecedented sound quality.

Return to Keyword Browsing
May 5th, 2024 19:16 EDT change timezone

New Forum Posts

Popular Reviews

Controversial News Posts