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JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard: JESD238 HBM3, available for download from the JEDEC website. HBM3 is an innovative approach to raising the data processing rate used in applications where higher bandwidth, lower power consumption and capacity per area are essential to a solution's market success, including graphics processing and high-performance computing and servers.

Comcast Announces World-First Test of 10G Modem Technology Capable of Delivering Multigigabit Speeds to Homes

Comcast today announced the successful test of a prototype 10G modem using the core technology that will deliver multigigabit speeds to tens of millions of homes. In a world-first lab test, a Full Duplex DOCSIS 4.0 system-on-chip (SoC) cable modem built by Broadcom delivered upload and download speeds faster than 4 gigabits per second (Gbps) powered by 10G network technology. Today's announcement is the latest in a series of 10G milestones from Comcast. In October 2021, the company announced a successful test of a complete 10G connection using a virtualized cable modem termination system (vCMTS) powered by DOCSIS 4.0 technology. That announcement followed major 10G milestone announcements in April 2021, of the first-ever live lab test of a 10G system-on-chip (SOC) and October 2020, of a trial delivering 1.25 gigabit-per-second (Gbps) upload and download speeds over a live production network using Network Function Virtualization (NFV) combined with the latest DOCSIS technology

A key component of 10G, DOCSIS 4.0 is an evolutionary leap forward in the ability to deliver multigigabit upload and download speeds over the connections already installed in hundreds of millions of homes worldwide. "The great strength of our smart network design is that we are able to exceed our customers' demands today, even as we continuously evolve to meet the needs of the future," said Charlie Herrin, President of Technology, Product, Experience at Comcast Cable. "As our 10G journey continues to accelerate, customers will reap the benefits of ever-increasing security, reliability, and speed."

Infotrend Announces EonStor CS NVMe SSD-based NAS

Infortrend Technology, Inc. (TWSE: 2495), the industry-leading enterprise storage provider, satisfies requirements of high throughput and fast response time for high-performance computing (HPC), media post-production, and medical PACS applications ­— with EonStor CS NVMe SSD storage delivering 13 GB/s throughput in a 3-node cluster, and performance linearly increases in a scale-out mode.

Today's HPC applications perform computationally intensive operations with billions of files across multiple resources of different nature at PB scale. Storage for HPC, therefore, must be able to simultaneously support multiple random and sequential IO workloads of different sizes. Otherwise, it can extensively delay the HPC application output and the company's success. EonStor CS NVMe SSD storage, CS 4014U, effectively eliminates these concerns and guarantees fast response time, satisfying various types of IO profiles.\

TOP500 Update Shows No Exascale Yet, Japanese Fugaku Supercomputer Still at the Top

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.

ADATA Unveils LEGEND Series PCIe M.2 2280 Solid State Drives

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces a new series of solid state drives (SSD), the ADATA LEGEND series, geared toward creators of different needs and budgets. They include the ADATA LEGEND 740, 750, and 840.

The LEGEND 740 and 750 utilize PCIe Gen3 x4 and NVMe 1.3 to deliver sequential read and write speeds of up to 2,500/2,000 and 3,500/3,000 MB per second, respectively, to give creators the performance they need to create without limitations. Their M.2 2280 specifications support the latest Intel and AMD platforms for creating on the latest PCs, including desktop and laptops. For users seeking a further boost, the LEGEND 840 takes advantage of PCIe Gen4 x4 and NVMe 1.4 to offer read and write speeds of up to 5,000/4,500 MB per second.

Kingston Announces FURY Renegade Line of Performance PCIe 4.0 NVMe SSDs

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced Kingston FURY Renegade SSD, its next generation PCIe 4.0 NVMe M.2 drive for gamers, enthusiasts, and high-power users. Kingston FURY Renegade SSD delivers cutting-edge performance in high capacities using the latest Gen 4x4 controller and 3D TLC NAND.

By maximizing the available bandwidth of PCIe 4.0, Kingston FURY Renegade SSD achieves speeds up to 7,300/7,000 MB/s read/write and up to 1,000,000 IOPS to deliver amazing consistency for an exceptional gaming experience. The drive is optimized to reduce game and application load times, stream and capture with ease and give your system an overall boost in responsiveness. Available in high capacities up to 4 TB, users can store an extensive library of their favorite games and media and still have space for the latest titles. In addition to formidable speeds and massive capacity options, Kingston FURY Renegade SSD combines a slim M.2 form factor and an advanced low profile, graphene aluminium heatspreader to keep your drive cool during intense usage and bring superior performance to the tightest of spaces in gaming PC's and laptops.

Micron Announces Over $150 Billion in Global Manufacturing and R&D Investments to Address 2030 Era Memory Demand

Micron Technology, Inc. (Nasdaq: MU), the only U.S.-based manufacturer of memory and one of the world's largest semiconductor manufacturers, today announced that it intends to invest more than $150 billion globally over the next decade in leading-edge memory manufacturing and research and development (R&D), including potential U.S. fab expansion. Micron's investment will address increasing demand for memory that is essential to all computing.

Memory and storage are a growing portion of the global semiconductor industry, and today represent approximately 30% of the semiconductor market. Secular growth drivers like 5G and AI will expand usage of memory and storage across the data center and the intelligent edge, and in areas like automotive and a diversity of user devices.

Intel Advances Neuromorphic with Loihi 2, New Lava Software Framework and New Partners

Today, Intel introduced Loihi 2, its second-generation neuromorphic research chip, and Lava, an open-source software framework for developing neuro-inspired applications. Their introduction signals Intel's ongoing progress in advancing neuromorphic technology. Neuromorphic computing, which draws insights from neuroscience to create chips that function more like the biological brain, aspires to deliver orders of magnitude improvements in energy efficiency, speed of computation and efficiency of learning across a range of edge applications: from vision, voice and gesture recognition to search retrieval, robotics, and constrained optimization problems.

"Loihi 2 and Lava harvest insights from several years of collaborative research using Loihi. Our second-generation chip greatly improves the speed, programmability, and capacity of neuromorphic processing, broadening its usages in power and latency constrained intelligent computing applications. We are open sourcing Lava to address the need for software convergence, benchmarking, and cross-platform collaboration in the field, and to accelerate our progress toward commercial viability." -- Mike Davies, director of Intel's

ZeroPoint Technologies wants to Compress the Data in your RAM

Some of you might be old enough to remember various "RAM doubling" software software solutions that appeared back in the late 1980's for Apple, as well as in the mid 90's for Windows 95 computers. Most of them never really delivered on their claims, but now it looks like we might be getting something similar, albeit in hardware.

Swedish company ZeroPoint Technology AB has announced that it has raised €2.5 million in a seed round to bring its Ziptilion patented memory compression technology IP to the market. ZeroPoint claims a compression ratio of two to three times depending on the workload, which seems very impressive. Unlike current software compression technologies such as ZSWAP or ZRAM that are used to compress data in RAM at a rate of 1.4 to 1.5 times, ZeroPoint promises that it's hardware IP won't have any real world negative effects on system performance. In fact, they claim it'll only cause one nanosecond of extra latency when writing data and 100 nanoseconds delay when it comes to reading the compressed data from RAM.

TYAN Launches Intel Xeon E-2300 Processor-based Server Platform

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced a new Intel Xeon E-2300 processor-based server motherboard to the market. The new product is designed to offer enhanced performance, greater PCIe support and faster memory speeds for entry-level servers in data centers and prevailing Multi-access Edge Computing (MEC) servers in 5G networks.

"TYAN's Tempest CX S5560 server motherboard based on Intel Xeon E-2300 processor is optimized for cloudand edge computing applications. By utilizing Intel's features of increased DDR4 speeds, double M.2 slots, and PCIe 4.0 capabilities, TYAN's customers can get outstanding performance and maintain their competitiveness with cost-effective benefit", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit.

IBM Unveils New Generation of IBM Power Servers for Frictionless, Scalable Hybrid Cloud

IBM (NYSE: IBM) today announced the new IBM Power E1080 server, the first in a new family of servers based on the new IBM Power10 processor, designed specifically for hybrid cloud environments. The IBM Power10-equipped E1080 server is engineered to be one of the most secured server platforms and is designed to help clients operate a secured, frictionless hybrid cloud experience across their entire IT infrastructure.

The IBM Power E1080 server is launching at a critical time for IT. As organizations around the world continue to adapt to unpredictable changes in consumer behaviors and needs, they need a platform that can deliver their applications and insights securely where and when they need them. The IBM Institute of Business Value's 2021 CEO Study found that, of the 3,000 CEOs surveyed, 56% emphasized the need to enhance operational agility and flexibility when asked what they'll most aggressively pursue over the next two to three years.

Qualcomm Adds Bluetooth Lossless Audio Technology to Snapdragon Sound

Qualcomm Technologies International, Ltd. today continued to demonstrate its vision and leadership in the wireless audio space with the introduction of Qualcomm aptX Lossless audio technology to its already extensive audio portfolio. aptX Lossless is a new capability of the proven aptX Adaptive technology and a new feature of Snapdragon Sound Technology that is designed to deliver CD quality 16-bit 44.1kHz lossless audio quality over Bluetooth wireless technology. Qualcomm Technologies has taken a systems level approach and optimized a number of core wireless connectivity and audio technologies, including aptX Adaptive, which work together to auto detect and scale-up and are designed to deliver CD lossless audio when a user is listening to a lossless music file and the RF conditions are suitable.

"At Qualcomm Technologies we're excited about the future of sound, and we're continually looking for ways to help our customers deliver new and exciting listening experiences. Lossless audio means mathematically bit-for-bit exact, with no loss of the audio file and up to now the necessary bit rate to deliver this over Bluetooth has not been available. With many leading music streaming services now offering extensive lossless music libraries, and consumer demand for lossless audio growing, we're pleased to announce this new support for CD lossless audio streaming for Bluetooth earbuds and headsets which we plan to make available to customers later this year," said James Chapman, vice president and general manager, Qualcomm Technologies International, Ltd.

Genesis Mining Gets 485K GPUs Returned by China Supreme Court

Genesis Mining, one of the largest cloud providers of cryptocurrency mining services headquartered in Iceland, has today won a great deal with China's Supreme Court. According to the reports, Genesis is now getting back the 485,000 AMD Radeon RX 470 8 GB graphics cards returned to its mining facilities in hopes of soon usage. What leads to this you might wonder? Previously, Genesis Mining partner, Chuangshiji Technology Limited, which provides hosting services for Genesis, took the company's mining hardware and started listing it without consent from the Iceland-based firm.

As the company filed a lawsuit in China supreme court, the legal disputes were going on for some time and today Genesis has won. According to the report, Genesis is getting back as much as 485,000 AMD Radeon RX 470 8 GB graphics cards with a total mining power of 14.5 TH/s. All these GPUs are now looking for a new home inside Genesis Mining facilities and will be able to provide a bit over a million dollars in mined Ethereum, at today's prices.

NVIDIA Launches RTX A2000: GA106, 3328 Cores, 6 GB, Low-Profile, $450

With its powerful real-time raytracing and AI acceleration capabilities, NVIDIA RTX technology has transformed design and visualization workflows for the most complex tasks, like designing airplanes and automobiles, visual effects in movies and large-scale architectural design. The new NVIDIA RTX A2000—our most compact, power-efficient GPU for a wide range of standard and small-form-factor workstations—makes it easier to access RTX from anywhere.

The RTX A2000 is designed for everyday workflows, so professionals can develop photorealistic renderings, build physically accurate simulations and use AI-accelerated tools. With it, artists can create beautiful 3D worlds, architects can design and virtually explore the next generation of smart buildings and homes, and engineers can create energy-efficient and autonomous vehicles that will drive us into the future. The GPU has 6 GB of memory capacity with error correction code (ECC) to maintain data integrity for uncompromised computing accuracy and reliability, which especially benefits the healthcare and financial services fields.

Editor's Note: The RTX A2000 desktop is completely different to the RTX A2000 for mobile. A2000 mobile is built using GA107, with 2560 GPU cores, 32 ROPs, 4 GB GDDR6 128-bit, the desktop A2000 uses GA106, 3328 cores, 48 ROPs, 6 GB GDDR6 192 bit.

Intel Announces New Xeon W-3300 Processors

Intel today launched its newest generation Intel Xeon W-3300 processors, available today from its system integrator partners. Built for advanced workstation professionals, Intel Xeon W-3300 processors offer uncompromised performance, expanded platform capabilities, and enterprise-grade security and reliability in a single-socket solution.

Intel Xeon W-3300 processors are intelligently engineered to push the boundaries of performance, with a new processor core architecture that transforms for what expert workstation users can accomplish on a workstation.

The Intel Xeon W-3300 processors are designed for next-gen professional applications with heavily threaded, input/output-intensive workloads. Use cases stretch across artificial intelligence (AI), architecture, engineering, construction (AEC), and media and entertainment (M&E). With a new processor core architecture to transform efficiency and advanced technologies to support data integrity, Intel Xeon W-3300 processors are equipped to deliver uncompromising workstation performance.

Red Dead Redemption 2 Update Arrives July 13, Brings NVIDIA DLSS Technology

Rockstar Games, the developer behind plenty of AAA titles, including Red Dead Redemption 2 (RDR2), is preparing an interesting update for all the RDR2 players. Called the "Blood Money" update, it brings new player activities to the Red Dead Online community. As Rockstar describes it, you will "Step into the criminal underworld of Red Dead Online: Blood Money on July 13, and prove you are willing to get your hands dirty in service to notorious and well-connected members of Saint-Denis society." While the update brings interesting content, it also integrates new technologies for visual/graphics improvements. NVIDIA's Deep Learning Super Sampling (DLSS) is also landing on July 13, allowing you to play the game with better performance and image quality if you have a GeForce RTX graphics card.
Check out the Red Dead Online: Blood Money trailer below.

Linux Foundation to Form New Open 3D Foundation

The Linux Foundation, the nonprofit organization enabling mass innovation through open source, today announced an intent to form the Open 3D Foundation to accelerate developer collaboration on 3D game and simulation technology. The Open 3D Foundation will support open source projects that advance capabilities related to 3D graphics, rendering, authoring, and development. As the first project governed by the new foundation, Amazon Web Services, Inc. (AWS) is contributing an updated version of the Amazon Lumberyard game engine as the Open 3D Engine (O3DE), under the permissive Apache 2.0 license. The Open 3D Engine enables developers and content creators to build 3D experiences unencumbered by commercial terms and will provide the support and infrastructure of an open source community through forums, code repositories, and developer events. A developer preview of O3DE is available on GitHub today. For more information and/or to contribute, please visit: https://o3de.org

3D engines are used to create a range of virtual experiences, including games and simulations, by providing capabilities such as 3D rendering, content authoring tools, animation, physics systems, and asset processing. Many developers are seeking ways to build their intellectual property on top of an open source engine where the roadmap is highly visible, openly governed, and collaborative to the community as a whole. More developers look to be able to create or augment their current technological foundations with highly collaborative solutions that can be used in any development environment. O3DE introduces a new ecosystem for developers and content creators to innovate, build, share, and distribute immersive 3D worlds that will inspire their users with rich experiences that bring the imaginations of their creators to life.

GIGABYTE Motherboards Feature TPM 2.0 Function to Support Windows 11 Upgrade

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced that the BIOS of their series motherboards, including Intel X299, C621, C232, C236, C246, 200, 300, 400, 500 lineups, as well as AMD TRX40, 300, 400, 500 motherboards are TPM 2.0 function ready, which can pass the upgraded Windows 11 OS. verification.

Windows 11 is the latest operating system from Microsoft, and features dozens of exciting new functions and Android APP support to effectively improve productivity, system security, and gaming performance. However, most of the users might be confusing that Windows 11 requires TPM 2.0 support means they need a TPM module on board for Windows 11 upgrade.

Three Major Arm Licensees Endorse the NVIDIA Takeover

NVIDIA's $40 billion takeover of Arm Holdings plc from SoftBank, got a shot in the arm, as three major licensees of the IP came out in support of the bid. These include Broadcom, MediaTek, and Marvell Technology Group. This development is key for NVIDIA to fight the perception built up by a rival faction, that the democratized nature of the Arm IP would get lost if a chipmaker like NVIDIA owns it. This rival faction is primarily led by Qualcomm.

It's interesting to note the individual backers of the NVIDIA takeover. There is nothing but love between Broadcom and Qualcomm, especially after the former's failed bid to acquire the latter. MediaTek is a major smartphone and IoT SoC maker, dominating the low-cost and mainstream smartphone segments. Marvell is big in datacenter and storage IP. Each of the three are results of huge IP consolidation over the past decade.

GLOBALFOUNDRIES Breaks Ground on New Fab in Singapore with 450K Wafer-per-Year Capacity

GLOBALFOUNDRIES (GF ), the global leader in feature-rich semiconductor manufacturing, today announced it is expanding its global manufacturing footprint with the construction of a new fab on its Singapore campus. In partnership with the Singapore Economic Development Board and with co-investments from committed customers, GF's more than US $4B (S$5B) investment will play an integral role in meeting the growing demand for the company's industry-leading manufacturing technologies and services to enable companies worldwide to develop and scale their business.

In a virtual groundbreaking ceremony, Singapore Minister for Transport and Minister-in-charge of Trade Relations S. Iswaran and Mubadala Investment Company Managing Director and Group CEO H.E. Khaldoon Khalifa Al Mubarak, were joined by: UAE Ambassador to Singapore H.E. Jamal Abdulla Al Suwaidi; Singapore Ambassador to the UAE H.E. Kamal R Vaswani; Singapore Economic Development Board Managing Director Chng Kai Fong; GF Board Chairman Ahmed Yahia Al Idrissi; along with GF executives including CEO Tom Caulfield; CFO David Reeder; SVP and Head of Global Operations KC Ang; SVP of Global Sales Juan Cordovez; VP of Human Resource for APAC and International Fabs Janice Lee; and VP of Technology Development in Singapore Dr. Soh Yun Siah.

COLORFUL Launches the First GPU History Museum

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, announces the launch of the GPU History Museum in partnership with NVIDIA. COLORFUL has recently relocated to Shenzhen New Generation Industrial Park. With that, COLORFUL is proud to announce the launch of the first GPU History Museum in China. The museum will showcase the beginnings of the Graphics Processing Unit (GPU), to the development and evolution of graphics cards up to the present generation.

Eurocom Announces Sky Z7 R2 Laptop with Fully-Upgradeable Components

The EUROCOM Sky Z7 R2 has unmatched levels of upgradeability through the Mobile Supercomputer's modular slots, allowing the safe removal and replacement of important hardware components such as the laptop's CPU, GPU, Memory, Storage, LCD, and more. Having slots or sockets allows the Sky Z7 R2 to customized, upgraded and modified with compatible parts- giving this Eurocom Mobile Supercomputer the ability to run the most demanding applications and perform high level tasks for a very long time. As newer and improved technologies emerge within the same chipset, the EUROCOM Sky Z7 R2's hardware components such as the CPU, GPU, RAM, storage, LCD, to name a few, can all be upgraded and replaced relatively easy in order to acquire more power as desired. Having modular components greatly increases the laptop's lifespan for many years and prevents the cycle of having to buy new laptops every few years, which can be the case with most laptops that have non-upgradeable components.

Eurocom's Sky Z7 R2 is one of the few laptops that utilizes modular GPU technology based on the MXM 3.1 version 2.0 socket technology. This means the Mobile Supercomputer's high performance GPU can be replaced at any time as long as it is compatible in the chipset, allowing the EUROCOM Sky Z7 R2 to perform at an extremely high level throughout the duration of its long lifespan. This Mobile Supercomputer can be configured up to the GeForce RTX 3080 which delivers twice the performance as its previous generation counterpart (GeForce RTX 2080). The EUROCOM Sky Z7 R2 offers seamless and stutter-free 4K gaming at 60 FPS, as well as 8K video editing, rendering and gaming.

Micron Delivers 176-layer NAND and 1α (1-alpha) DRAM Technology

Micron, the US-based manufacturer of various kinds of memory technologies, has today announced some quite interesting products at its Computex 2021 keynote. For starters, the company has announced a new portfolio of products based on 176-layer NAND. There are currently two products listed that use this new technology and those are the Micron 3400 and 2450 M.2 NVMe SSDs. Based on the PCIe 4.0 interface, the 2450 SSD lineup is designed as a value-oriented solution that comes in M.2-2280, M.2-2242, and M.2-2230 sizes. It ranges from 256 GB to 1 TB in capacities, which are supposed to be priced as a value purchase.

In a contrast, the 3400 SSD is M.2-2280 design, meant for only the highest performance. The sequential read speeds go up to 6600 MB/s, while the sequential writes go up to 5000 MB/s (in the case of the 2 TB model). Capacities range from 512 GB to 2 TB and only the 1 TB and 2 TB variants have the 5000 MB/s write speeds, while the 512 GB version is capped at 3600 MB/s speed. Both SSD models are featuring a heat spreader on top of NAND chips and spot an in-house and Micron-developed NVMe 1.4 SSD controller. However, Micron does note that the company is free to use any 3rd party SSD controller as we are deep in component shortages with high demand for SSDs. You can get an in-depth look at the 2450 and 3400 M.2 SSDs from Micron's website.

COLORFUL Launches GeForce RTX 3080 Ti and RTX 3070 Ti Graphics Cards

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, proudly introduces the COLORFUL iGame GeForce RTX 3080 Ti and RTX 3070 Ti graphics cards. The line-up consists of the Vulcan, Advanced OC, and NB models. The all-new GeForce RTX 3070 Ti NB takes a new look with its improved cooling and mightier design. The COLORFUL iGame GeForce RTX 3080 Ti and RTX 3070 Ti comes packed with premium features including the One-Key Overclock, customizable RGB lighting, and more to cater to different types of power users, gamers, and PC enthusiasts.

Powered by the NVIDIA Ampere architecture, the GeForce RTX 3080 Ti delivers an incredible leap in performance and fidelity with acclaimed features such as raytracing, NVIDIA DLSS performance-boosting AI, NVIDIA Reflex latency-reduction, NVIDIA Broadcast streaming features and additional memory that allows it to speed through the most popular creator applications as well.

AMD "Milan-X" Processor Could Use Stacked Dies with X3D Packaging Technology

AMD is in a constant process of processor development, and there are always new technologies on the horizon. Back in March of 2020, the company has revealed that it is working on new X3D packaging technology, that integrated both 2.5D and 3D approaches to packing semiconductor dies together as tightly as possible. Today, we are finally getting some more information about the X3D technology, as we have the first codename of the processor that is featuring this advanced packaging technology. According to David Schor, we have learned that AMD is working on a CPU that uses X3D tech with stacked dies, and it is called Milan-X.

The Milan-X CPU is AMD's upcoming product designed for data center usage. The rumors suggest that the CPU is designed for heavy bandwidth and presumably a lot of computing power. According to ExecutableFix, the CPU uses a Genesis-IO die to power the connectivity, which is an IO die from EPYC Zen 3 processors. While this solution is in the works, we don't know the exact launch date of the processor. However, we could hear more about it in AMD's virtual keynote at Computex 2021. For now, take this rumor with a grain of salt.
AMD X3D Packaging Technology
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