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Tensilica Joins HSA Foundation

Tensilica, Inc. today announced that it has joined the HSA (Heterogeneous System Architecture) Foundation, a not-for-profit consortium dedicated to developing architecture specifications that will unlock the performance and power efficiency of parallel computing engines found in many modern devices. Tensilica will contribute its years of experience assisting customers in bringing heterogeneous multicore SoC (system-on-chip) designs to market to the development and promotion of standards for parallel computing.

"Tensilica is a long-established leader in multicore technology, delivering unique solutions that enable both control plane and compute-intensive dataplane functions," stated Steve Roddy, Tensilica's vice president of product marketing and business development. "Tensilica customers today use multiple Tensilica processors for diverse functions such as audio offload, wireless baseband, image processing and general purpose control. We welcome the efforts and ambitions of the HSA to bring standards to the market that will greatly facilitate innovation in embedded applications."

VIA Chooses Tensilica for Solid State Drive (SSD) Chip Design

Tensilica, Inc. today announced that VIA has selected Tensilica's Xtensa dataplane processors (DPUs) for a system-on-chip (SOC) design for solid state drives (SSDs). After conducting a technical evaluation, VIA determined that Tensilica's DPUs provide over four times the performance of competing processors on key algorithms used to benchmark competitive alternatives.

SSDs require faster and more efficient data management and manipulation to increase their throughput (measured in Input/Output Operations per Second, or IOPS). With conventional processors, increasing the clock speed is the common way to increase performance. However, this increases energy consumption and die size, especially as speeds increase so much that designers are forced to move to more complex multi-core solutions.
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