Networking is the third pillar of AMD's Advancing AI 2026 rack-scale strategy, and today the company detailed the AMD Pensando silicon and fabric technology that connects the Helios rack. As Helios is AMD's first rack-scale design, the company encountered challenges in interconnecting many GPUs, memories, and data movement speeds within a single system, both for scaling up and scaling out for multi-rack connections inside the data center. Current AI infrastructure must closely follow model development as AI model sizes have grown exponentially, from the original 65-million-parameter Transformer in 2017 to trillion-parameter GPT-4-class systems and now 10-trillion-plus parameter agentic and reasoning models. To run a model with more than 10 trillion parameters, you need to connect dozens of GPUs with high-speed VRAM, as well as a high-speed interconnect to split model weights effectively so latency isn't an issue. The modern interconnect of choice is again the plain-old Ethernet, not proprietary interconnects, which have become the standard for AI networking.

AMD's solution spans three layers: a third-generation Pensando "Salina" DPU on the front end, a first-generation UALink-over-Ethernet (UALoE) scale-up fabric inside the rack, and a second-generation Pensando "Vulcano" AI NIC for scale-out. All of this is managed by AMD's Helios management software and Fabric Manager. AMD outlined challenges that bandwidth needs are doubling in less than two years driven by massive AI models growing at a rapid pace, and that the hardware iteration cycles need to account for intelligence in the data fabric layer, not only compute layer.

MiTAC Computing Technology, a global leader in high-performance and energy-efficient server solutions, is proud to announce its participation at the Supercomputing (SC) 2025 (November 18-20, St. Louis, Missouri), booth 3916. Under the theme "AI Cluster Power - Cool Fast. Scale Faster.", MiTAC Computing will showcase its modular, highly scalable rack infrastructure designed for demanding AI and HPC workloads. The exhibition will demonstrate the company's full spectrum of capabilities, ranging from single AI servers to complete cluster-level integration, with a focus on cutting-edge liquid cooling and energy-efficient designs to maximize performance and sustainability.

Collaborating with key industry players such as AMD, Broadcom, CoolIT, Intel, KIOXIA, Micron, NVIDIA, Samsung, and Solidigm, MiTAC Computing is dedicated to accelerating the development of advanced computing and high-efficiency data centers.

Broadcom Inc. (NASDAQ:AVGO), a global leader in semiconductor and infrastructure software solutions, today announced the shipment of its breakthrough Ethernet switch—the Tomahawk Ultra. Engineered to transform the Ethernet switch for high-performance computing (HPC) and AI workloads, Tomahawk Ultra delivers industry-leading ultra-low latency, massive throughput, and lossless networking.

"Tomahawk Ultra is a testament to innovation, involving a multi-year effort by hundreds of engineers who reimagined every aspect of the Ethernet switch," said Ram Velaga, senior vice president and general manager of Broadcom's Core Switching Group. "This highlights Broadcom's commitment to invest in advancing Ethernet for high-performance networking and AI scale-up."

Broadcom Inc. announced today that it is now shipping the Tomahawk 6 switch series, delivering the world's first 102.4 Terabits/sec of switching capacity in a single chip - double the bandwidth of any Ethernet switch currently available on the market. With unprecedented scale, energy efficiency, and AI-optimized features, Tomahawk 6 is built to power the next generation of scale-up and scale-out AI networks, delivering unmatched flexibility with support for 100G/200G SerDes and co-packaged optics (CPO). It offers the industry's most comprehensive set of AI routing features and interconnect options, designed to meet the demands of AI clusters with more than one million XPUs.

"Tomahawk 6 is not just an upgrade - it's a breakthrough," said Ram Velaga, senior vice president and general manager, Core Switching Group, Broadcom. "It marks a turning point in AI infrastructure design, combining the highest bandwidth, power efficiency, and adaptive routing features for scale-up and scale-out networks into one platform. Demand from customers and partners has been unprecedented. Tomahawk 6 is poised to make a rapid and dramatic impact on the deployment of large AI clusters."

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

MSI has released a brief statement regarding the recent issue of a burned AMD Ryzen 7 9800X3D on the MSI Tomahawk X870 motherboard. The issue was reported over at Reddit, showing both burned CPU and socket, and currently it seems to be an isolated incident. MSI is stepping in to investigate the issue and has released a brief statement.

"Recently, we received a user report indicating damage to an AMD Ryzen 7 9800X3D processor on an MSI MAG X870 TOMAHAWK WIFI motherboard. At MSI, we are fully committed to the quality of our products and have begun investigating this incident. Additionally, we are working closely with AMD and are in contact with GamersNexus, which is independently investigating this incident. We will continue to provide updates as the investigation progresses," said MSI in its official statement.