QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today unveiled the 2U short-depth rackmount TS-873AeU NAS series, including the TS-873AeU and TS-873AeU-RP, with high-performance and energy-efficient AMD Ryzen Embedded V1000 series V1500B 4-core/8-thread, 2.20 GHz processors. The series is available in 8-bay models with single and redundant power supply options. The TS-873AeU series is suitable for tackling resource-demanding applications and tasks, such as virtual machines, intensive multi-user access, or hybrid cloud applications, making it a cost-efficient solution for businesses that depend on virtualization or VDI applications.

The 2U rackmount TS-873AeU series has a short depth design of only 11.7 inches (297.4 mm) for up to 38% reduction in size, making it an excellent choice for smaller racks, wall-mount AV rack cabinets, and network rack cabinets. Space saved by its short depth design can greatly benefit cabling or ventilation. The TS-873AeU series is ideal for flexible deployment and is especially suitable for installation in locations such as offices, audiovisual rooms, and for applications such as security surveillance recording.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today introduced the TS-h973AX QuTS hero NAS that features an AMD Ryzen V1000 series V1500B quad-core 2.2 GHz processor and 10GbE/2.5GbE connectivity. It has four 2.5-inch SSD slots - with two slots supporting both 32 Gbps high-performance U.2 NVMe PCIe Gen 3 x4 SSDs or economical SATA 6 Gb/s SSDs for tackling latency-sensitive applications. Running the dependable ZFS-based QuTS hero operating system, the TS-h973AX delivers business-critical features and enables up to petabyte capacity per shared folder, providing a high-performance yet cost-efficient NAS solution.

"When viewing similar AMD Ryzen NAS on the market, the 9-bay TS-h973AX stands almost unchallenged with its dual U.2 NVMe PCIe Gen 3 x4 SSD slots for optimal I/O and low latency, and 10GbE/2.5GbE connectivity," said Jason Hsu, adding "from entry-level storage needs to large-scale Big Data storage, I/O-demanding applications, and cross-team collaboration - the ZFS-based TS-h973AX is perfect for tackling challenges faced by businesses of all sizes."

AMD today announced the expansion of the AMD Ryzen Embedded ecosystem with two new AMD Ryzen Embedded R1000 low-power processors that provide customers with a new TDP range of 6 up to 10 W. AMD also announced new customers offering Mini PCs based on the AMD Ryzen Embedded processors from Sapphire, SECO, Simply NUC and others.

"AMD is ushering in a new age of high-performance computing for the embedded industry," said Rajneesh Gaur, corporate vice president and general manager, Embedded Solutions, AMD. "We are doing this with cutting-edge technology to display immersive graphics in 4K resolution with AMD Ryzen Embedded processors, and we are now offering access to high performance in power-efficient solutions with these new low-power Ryzen Embedded R1000 processors."

AMD is wading into even deeper waters across Intel's markets with the announcement of new Mini-PCs powered by the company's AMD Ryzen embedded V1000 and R1000 processors. Mini PCs, powered by AMD Ryzen Embedded V1000 and R1000 processors. Multiple partners such as ASRock Industrial, EEPD, OnLogic and Simply NUC have already designed their own takes on Mini-PCs (comparable to Intel's NUC, Next unit of Computing) as a way to give businesses a way to have a small form factor box for different computing needs. These aim to offer a high-performance CPU/GPU processor with expansive peripheral support, in-depth security features and a planned 10-year processor availability.

Until now, AMD's Ryzen Embedded product line had mostly scored one design win here and there, powering handheld consoles such as the Smach Z and such other low power, relatively high-performance environments. When AMD announced the R1000 SoC back in April, it already announced that partners would be bringing their own takes on the underlying silicon, and today is the announcement of that effort.