ASUS today announced Zenbook S 14 (UX5406), one of the thinnest and most portable 14-inch new-era ASUS AI PCs on the market, blending performance with sophistication. The premium Zenbook S 14 showcases a new functional aesthetic, and has been completely redesigned inside and out. The chassis features the new, innovative ASUS Ceraluminum, a high-tech ceramic hybrid material available in a range of nature-inspired colors. This industry-first material offers exceptional strength, effortlessly resisting scratches and wear.

Zenbook S 14 is powered by up to the latest AI-enabled Intel Core Ultra 9 processor (Series 2) and Intel Arc graphics, delivering up to 48 NPU TOPS. Advanced CNC milling enables the integration of an ultraslim vapor chamber in the ultra-quiet ambient cooling system—unique for such a thin device—ensuring up to 28-watt CPU TDP performance with minimal noise. The functional design features a dedicated Copilot key and an enlarged 16:10 seamless touchpad that supports smart gestures.

Lenovo, a global leader in technology innovation, proudly announces a series of groundbreaking products at Lenovo Innovation World 2024, each designed to redefine the future of professional computing and artificial intelligence. At a special event hosted in Berlin, the highlights include the newly designed premium Lenovo ThinkPad X1 Carbon Gen 13 Aura Edition powered by the latest Intel Core Ultra processors (Series 2), and the innovative Lenovo Auto Twist AI PC proof of concept. Lenovo also featured the ThinkPad T14s Gen 6 and the all new ThinkBook 16 Gen 7+ powered by the latest AMD Ryzen AI processors. Additionally, Lenovo introduced the ThinkBook 16 Gen 7 powered by the Snapdragon X Plus 8-core processor. Together, these innovations showcase Lenovo's commitment to delivering cutting-edge technology, exceptional user experiences, and enhanced productivity and creativity for enterprise customers.

Lenovo also announced AI PC Fast Start, a solution designed to help organizations swiftly transition to AI-ready devices, maximizing ROI through AI-powered advisory and simplified deployment. Backed by Lenovo's award-winning support, these services accelerate AI adoption and ensure seamless implementation.

MSI today launched its first wave of Socket AM5 motherboards based on the new AMD X870E and AMD X870 chipsets, which come with drop-in support for the new Ryzen 9000 "Granite Ridge" processors, and new platform I/O. The company debuted products across its four key consumer motherboard brands—MEG, MPG, MAG, and PRO. Leading the pack is the flagship MEG X870E GODLIKE, followed by the performance segment MPG X870E Carbon WIFI, the mid-range MAG X870 Tomahawk WIFI, and the mainstream PRO X870-P WIFI.

The MEG X870E GODLIKE isn't just a flagship motherboard with no feature spared, but designed to be a piece of jewelry. It is shrouded almost entirely in heatsinks. Almost all its onboard I/O faces the front-end, including a 24-pin ATX, and two optional 8-pin PCIe power inputs. The two 8-pin EPS power inputs are exposed near the CPU socket area. A 27-phase VRM powers the CPU, with an active fan-heatsink solution that uses a series of aluminium fin-stack heatsinks with heat-pipes spreading heat among them. The CPU is wired to four DDR5 DIMM slots, supporting over DDR5-8000, with preparation for higher memory OC speeds that may come up in the future. Expansion slots include a PCI-Express 5.0 x16, a second x16 (electrical Gen 4), and a x4. There are four M.2 NVMe slots, three of these are Gen 5, and one Gen 4.

Acer today unveiled the new TravelMate P6 14 AI, leading the market with Copilot+ PCs under 1 kg. This new Windows 11 Pro laptop delivers exceptional performance, mobility and AI capabilities for businesses and institutions. It is powered by Intel Core Ultra processors (Series 2) with a built-in NPU boasting up to 120 total platform TOPS AI performance in a compact, carbon fiber chassis.

This latest TravelMate boasts a stunning 14-inch WQXGA+ (2880x1800) 16:10 display with IPS technology or WUXGA (1920x1200) panel featuring high 400 nit brightness and 100% sRGB color gamut, supporting outstanding picture quality. Thin bezels and a high 82% screen-to-body ratio maximize the screen area for more immersive viewing experiences.

Samsung Electronics today announced the Galaxy Book4 Edge (15-inch), the latest addition to Samsung's Galaxy Book lineup, now powered by Qualcomm's cutting-edge Snapdragon X Plus 8-core platform. This new Copilot+ PC seamlessly integrates advanced AI capabilities, which elevate productivity and creativity to new heights.

Enhanced connectivity with the Samsung Galaxy ecosystem allows for one easy and efficient workflow across multiple devices, and further improves access to trailblazing Galaxy AI tools. All of these innovations are housed in a slim design featuring a 15.6-inch FHD display, a long-lasting battery with Super-Fast Charging and Samsung's multi-layer Samsung Knox security. The Galaxy Book4 Edge (15-inch) is available in select markets starting October in an iconic Sapphire Blue finish.

Samsung Electronics today announced the Galaxy Book5 Pro 360, a Copilot+ PC and the first in the all-new Galaxy Book5 series. Performance upgrades made possible by the Intel Core Ultra processors (Series 2) bring next-level computing power, with up to 47 total TOPs NPU - and more than 300 AI-accelerated features across 100+ creativity, productivity, gaming and entertainment apps. Microsoft Phone Link provides access to your Galaxy phone screen on a larger, more immersive PC display, enabling use of fan-favorite Galaxy AI features like Circle to Search with Google, Chat Assist, Live Translate and more. And with the Intel ARC GPU, graphics performance is improved by 17%. When paired with stunning features like the Dynamic AMOLED 2X display with Vision Booster and 10-point multi-touchscreen, Galaxy Book5 Pro 360 allows creation anytime, anywhere.

"The Galaxy Book5 series brings even more cutting-edge AI experiences to Galaxy users around the world who want to enhance and simplify their everyday tasks - a vision made possible by our continued collaboration with longtime industry partners," said Dr. Hark-Sang Kim, EVP & Head of New Computing R&D Team, Mobile eXperience Business at Samsung Electronics. "As one of our most powerful PCs, Galaxy Book5 Pro 360 brings together top-tier performance with Galaxy's expansive mobile AI ecosystem for the ultimate AI PC experience."

Intel today launched its most efficient family of x86 processors ever, the Intel Core Ultra 200V series processors. They deliver exceptional performance, breakthrough x86 power efficiency, a massive leap in graphics performance, no-compromise application compatibility, enhanced security and unmatched AI compute. The technology will power the industry's most complete and capable AI PCs with more than 80 consumer designs from more than 20 of the world's top manufacturing partners, including Acer, ASUS, Dell Technologies, HP, Lenovo, LG, MSI and Samsung. Pre-orders begin today with systems available globally on-shelf and online at over 30 global retailers starting Sept. 24. All designs featuring Intel Core Ultra 200V series processors and running the latest version of Windows are eligible to receive Copilot+ PC features as a free update starting in November.

"Intel's newest Core Ultra processors set the industry standard for mobile AI and graphics performance, and smash misconceptions about x86 efficiency. Only Intel has the scale through our partnerships with ISVs and OEMs, and the broader technology ecosystem, to provide consumers with a no-compromise AI PC experience."
--Michelle Johnston Holthaus, Intel executive vice president and general manager of the Client Computing Group

GIGABYTE just released its second AMD 800-series chipset motherboard following last week's debut of the X870E AORUS Master, the more affordable X870 AORUS Elite WIFI7. This board is based on the slightly more affordable AMD X870 (non-E) chipset, which offers connectivity nearly identical to that of the previous-generation AMD B650E, but with the addition of USB4. The board is built in the ATX form-factor, and features a 6-layer PCB. It draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. The CPU VRM solution consists of a 16+2+2 phase setup, with the vCore side of it being 8-phase with phase doubling. The Socket AM5 is wired to four DDR5 DIMM slots for up to 256 GB of memory.

Expansion slots include a PCI-Express 5.0 x16 wired to the CPU, a PCI-Express 4.0 x16 (electrical Gen 4 x4), and a third PCI-Express 3.0 x16 (electrical Gen 3 x2). The main Gen 5 x16 PEG slot gets a quick-release lever. You press a button, and it ejects the graphics card. Storage connectivity includes three M.2 Gen 5 x4 slots, two of these are wired to the CPU's dedicated Gen 5 x4 NVMe lanes, while the third slot subtracts 8 lanes from the Gen 5 x16 PEG slot. There is a fourth M.2 slot, which is Gen 4 x4, and wired to the X870 FCH. All four slots get heatsinks. Four SATA 6 Gbps ports make for the rest of the storage connectivity.

NETGEAR, the leading provider of innovative and secure solutions for people to connect and manage their digital lives, today expanded its Wi-Fi 7 mesh and standalone router lines with the new Orbi 770 Series Mesh System, NETGEAR's most affordable Wi-Fi 7 mesh system to date build on the company's promise to provide powerful Wi-Fi performance and secure connectivity.

Wi-Fi 7 unlocks 2.4 times faster speeds than Wi-Fi 6, delivers low latency and better handles Wi-Fi interference for families to seamlessly enjoy next gen 4K/8K streaming, video conferencing, gaming, and more. Since the launch of NETGEAR's first Wi-Fi 7 offerings - Nighthawk RS700S, Nighthawk RS300 and Orbi 970 - multi-gig internet speeds have become more affordable, work from home demands have remained steady, and more devices such as AR/VR headsets or AI-focused platforms like Copilot+ have been introduced that require extreme low latency and higher throughput.

GIGABYTE today debuted its AMD 800-series motherboards with the launch of the premium X870E AORUS Master. This will go on to be the company's second most premium product on this chipset, as the company is also planning the X870E AORUS Xtreme. The AORUS Master is still packed to the gills with everything this chipset has to offer, along with high-end onboard devices. The board is built in the ATX form-factor, and draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. It offers a 16+2+2 phase digital VRM featuring 110 A power stages. The board is laid out on a premium 8-layer PCB. You get tall extruded aluminium heatsinks for the CPU VRM, and the topmost M.2 NVMe Gen 5 slot.

The AMD Socket AM5 is wired to four DDR5 DIMM slots that support up to 192 GB of dual-channel DDR5, at speeds of over DDR5-8000. It also puts out no less than three M.2 NVMe Gen 5 slots. Two of these are wired to the dedicated x4 interfaces from the AMD "Raphael" or "Granite Ridge" processor, while one of them subtracts 4 lanes from the board's PCI-Express 5.0 x16 PEG slot. The board's fourth M.2 NVMe slot is Gen 4, and wired to the chipset. The only other expansion slots are a couple of PCI-Express 4.0 x16 (electrical Gen 4 x1). Besides the M.2 slots, you get four SATA 6 Gbps ports completing the board's storage connectivity.

AMD has reportedly pushed the launch of mid-tier models from its AMD 800-series chipset to early 2025, reports ComputerBase.de. With the Ryzen 9000-series "Zen 5" processors already launched earlier this month, and compatible with existing AMD 600-series chipset motherboards with a BIOS update, motherboard vendors are leisurely announcing their motherboards based on the AMD X870E and AMD X870 chipsets. Motherboards based on both offer drop-in compatibility with Ryzen 9000-series processors, and introduce new connectivity features such as 40 Gbps USB4 and Wi-Fi 7.

The company probably wants the two to have some time in the Sun before they're joined by the more affordable B850, which gamers could be drawn to. The AMD B850 has mostly identical platform I/O to the AMD X870, except Gen 5 support for the PCI-Express x16 slot is optional (motherboard vendors can choose to wire this out as Gen 4). The 40 Gbps USB4 is also optional here. You still get CPU overclocking support. The B840 is an entry-level chipset that's being launched to probably phase out the A620 and A620A, since it features similar I/O features to the A620A, but will probably come with drop-in compatibility for 65 W Socket AM5 processors. A deferred launch of the mid-tier chipset isn't too off character for AMD. It launched its popular B450 and B550 chipsets several months after the X470 and X570, respectively.

ASUS today announced the ROG Rapture GT-BE19000, ASUS RT-BE86U and ROG USB-BE92 during Gamescom 2024. These three devices showcase the ASUS commitment to offering an array of perfomant, reliable and robust featured Wi-Fi 7 products. These three products offers demanding digital homes and offices alongside networking enthusiast and gamers outstanding range, throughput and low latency ensuring outstanding wired and wireless connectivity. Additionally, the ROG Rapture GT-BE19000 alongside the latest Intel Wi-Fi 7 BE200 network card are being demonstrated in a dedicated section at the ASUS Gamescom 2024 booth, where attendees can see these two latest gen devices work ideally to deliver an ultra performance Gigabit+ network experience.

Wi-Fi 7 functionality is coming to Windows 11 later this year, and the new ROG GT-BE19000 can unleash Wi-Fi 7 gaming experiences with speeds up to 2.4 times faster and coverage up to 73% greater. Its ROG Gaming Network feature uses Guest Network Pro to deliver a dedicated Gaming Network SSID and VLAN with complete game-acceleration technology. Meanwhile, the new ASUS RT-BE86U offers up to 20 Gbps of wired capacity, triple that of the RT-AX86U, with 30% more CPU power and rich Ethernet backhaul options to create a feature-packed AiMesh extendable network. And the ROG USB-BE92 tri-band Wi-Fi 7 USB adapter supports both USB Type-A and USB 3.2 Gen 1 x1 Type-C connections, and give users access to the wide-open 6 GHz band for low-interference networking.

Minisforum today announced the G7 Ti Powerhouse, a Versatile mini-PC that offers AI-enhance creativity and raw power. Featuring Intel Core i9-14900HX or i7-14650HX processors and NVIDIA GeForce RTX 4070 graphics, Minisforum G7 Ti delivers unparalleled performance for AI-based workloads. The powerhouse mini-PC solution is optimized for AI features, powered by up to an Intel Core i9-14900HX CPU, and NVIDIA GeForce RTX 4070 Graphics. Minisforum G7 Ti offers avid gamers an unmatched experience and endless possibilities for creators.

Utilized the 14th Gen Intel Core i9-14900HX and i7-14650HX Processor, the AI-enabled CPU delivers 24 cores and 32 threads with 36 MB L3 high-speed cache, that rates the single-core turbo frequency up to 5.8 GHz and max performance at 90 W. The beast CPU helps AI applications, achieving 20% higher performance in the Cinebench R23 test versus previous-generation processors, making Minisforum G7 Ti capable of handling AAA games, video rendering, 3D design, and AI projects.

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, today unveiled its all-new 17-inch ML-17 gaming laptop developed in collaboration with CLEVO. Engineered for gamers who want a larger screen without compromising on power or portability, the ML-17 brings it all with the 14th Gen Intel Core i9-14900HX mobile processor, Thunderbolt 5 technology, NVIDIA GeForce RTX 4090 mobile GPU, and Wi-Fi 7.

"Continuing our partnership with CLEVO and Intel, our new collaboratively-developed 17-inch ML-17 gaming laptop raises the bar on what gaming laptops should be capable of delivering in terms of performance and overall value," said Wallace Santos, CEO at MAINGEAR. "Packed full of the latest, high-performance components, including the most powerful CPUs and GPUs available on the market, as well as premium specs like Thunderbolt 5 and Wi-Fi 7, this laptop delivers a top-tier gaming experience that parallels the kind of high-performance desktop-like gameplay that gamers demand, all in a backpackable form factor."

AMD is readying a successor to its Ryzen 7045 series "Dragon Range" mobile processor for gaming notebooks and portable workstations. While we don't know its processor model naming yet, the chip is codenamed "Fire Range." We are learning that it will retain the FL1 package as "Dragon Range," which means it will be pin-compatible. This would significantly reduce development costs for notebook OEMs, as they can simply carry over their mainboard designs from their notebooks based on "Dragon Range."

"Fire Range" is essentially a mobile BGA version of the upcoming Ryzen 9000 "Granite Ridge" desktop processor. The FL1 package measures 40 mm x 40 mm in size, and has substrate for two CCDs and a cIOD, just like the desktop chip. "Fire Range" hence features one or two 4 nm "Zen 5" CCDs, depending on the processor model, and the 6 nm client I/O die. Much like "Dragon Range," the "Fire Range" chip will lack support for LPDDR5, and rely on conventional PC DDR5 memory in the SO-DIMM or CAMM2 form-factors. Besides the CPU core count consisting exclusively of full-sized "Zen 5" cores, the main flex for "Fire Range" over "Strix Point" will be its 28-lane PCIe Gen 5 root-complex, which can wire out the fastest discrete mobile GPUs, as well as drive multiple M.2 NVMe slots with Gen 5 wiring, and other high-bandwidth devices, such as Thunderbolt 4, USB4, or Wi-Fi 7 controllers wired directly to the processor.

MSI, a leading brand in gaming hardware, is thrilled to announce its new partnership with Kepler Interactive, a renowned innovative game publisher. MSI and Kepler Interactive are set to bring gamers an extraordinary experience with the much-anticipated release of Flintlock: The Siege of Dawn, available now on via Steam and Epic Games Store.

Embark on a thrilling journey with Flintlock: The Siege of Dawn by A44 Games, the developers of Ashen. Explore a rich, new world filled with ancient mysteries, engage in explosive, fast-paced combat, and wield powerful firearms and magic in your quest to kill all Gods. Are you ready to reclaim the dawn and restore hope to humanity? Start your epic journey with MSI's special offer—purchase selected MSI products and receive Flintlock: The Siege of Dawn for free on PC. Upgrade your gaming setup with MSI's latest motherboards. Immerse yourself in the captivating world of Flintlock: The Siege of Dawn and experience unparalleled gaming excitement.

ASUS has revealed its upcoming ExpertBook P5 laptop, set to debut alongside Intel's highly anticipated "Lunar Lake" processors. This ultrabook aims to boost AI-capable laptop market, featuring an unspecified Intel Lunar Lake "Core Ultra 200V" CPU at its core. The ExpertBook P5 boasts impressive AI processing capabilities, with over 45 TOPS from its Neural Processing Unit and a combined 100+ TOPS when factoring in the CPU and GPU. The NPU provides efficient processing, with additional power coming from Lunar Lake's GPU with XMX cores, featuring the Xe2 Battlemage architecture. This is more than enough for the Copilot+ certification from Microsoft, making the laptop debut as an "AI PC." The ExpertBook P5 offers up to 32 GB of LPDDR5X memory running at 8333 MT/s, up to 3 TB of PCIe 4.0 SSD storage with two drives, and Wi-Fi 7 support.

The 14-inch anti-glare display features a 2.5K resolution and a smooth 144 Hz refresh rate, ensuring a premium visual experience. Despite its powerful internals, the ExpertBook P5 maintains a solid profile weighing just 1.3 kg. The laptop is housed in an all-metal military-grade aluminium body with a 180-degree lay-flat hinge, making it both portable and versatile. ASUS has also prioritized cooling efficiency with innovative technology that optimizes thermal management, whether the laptop is open or closed. Security hasn't been overlooked either, with the ExpertBook P5 featuring a robust security ecosystem, including Windows 11 secured-core PC framework, NIST-155-ready Commercial-Grade BIOS protection, and biometric login options. While an exact release date hasn't been confirmed, ASUS is preparing ExpertBook P5 and other Lunar Lake-powered laptops to hit the market in the second half of 2024.

Intel's upcoming Core Ultra "Arrow Lake-S" desktop processor introduces a new socket, the LGA1851, alongside the new Intel 800-series desktop chipset. We now have some idea what the 151 additional pins on the new socket are used for, thanks to a leaked platform map on the ChipHell forums, discovered by HXL. Intel is expanding the number of PCIe lanes from the processor. It now puts out a total of 32 PCIe lanes.

From the 32 PCIe lanes put out by the "Arrow Lake-S" processor's system agent, 16 are meant for the PCI-Express 5.0 x16 PEG slot to be used for discrete graphics. Eight are used as chipset bus, technically DMI 4.0 x8 (these are eight lanes that operate at Gen 4 speed for 128 Gbps per direction of bandwidth). There are now not one, but two CPU-attached M.2 NVMe slots possible, just like on the AMD "Raphael" and "Granite Ridge" processors. What's interesting, though, is that not both are Gen 5. One of these is Gen 5 x4, while the other is Gen 4 x4.

TP-Link, a leading global provider of consumer and business networking products, today announced availability of the highly anticipated, 2023 CES Innovation Award Honoree, Archer GE800 BE19000 Tri-Band Wi-Fi 7 Gaming Router. Designed for gaming enthusiasts, the Archer GE800 sets the stage for a new era of gaming performance with jaw-dropping tri-band speeds of up to 19 Gbps†, two 10 Gbps ports, and game-acceleration features that redefine gaming experiences.

The Archer GE800 is the ultimate choice for power-players seeking to elevate their gaming experience with revolutionary Wi-Fi 7 technology. With advanced capabilities like reduced latency and enhanced stability, Wi-Fi 7 creates a superior gaming environment for a more responsive and immersive experience. Offering Wi-Fi speeds of up to 19 Gbps across three bands and 12 streams, supported by dual 10 Gbps and quad 2.5 Gbps wired ports, every device receives unparalleled bandwidth.

Panasonic Connect Canada, Division of Panasonic Corporation of North America, today announced enhancements to the fully rugged and modular TOUGHBOOK 40 laptop. This second generation of the TOUGHBOOK 40, the Mk2, is the company's first PC to feature Intel Core Ultra processors, incorporating the latest CPU, GPU, and NPU technology advancements and up to 16 cores. Its dedicated NPU accelerates artificial intelligence (AI)-driven tasks for customers across law enforcement departments, federal agencies, and utility companies. Compared to the previous generation of Intel processors, these new processors deliver up to 143% faster AI application performance, 73% faster generative AI, and up to 40% lower processor power for AI-enhanced collaboration.

"We are dedicated to developing solutions that not only address the current needs of our customers, but also anticipate their future requirements," said Dominick Passanante, Vice President and GM of Panasonic Connect. "The TOUGHBOOK 40 Mk2, equipped with advanced AI capabilities, is another example of how we're providing the mobile workforce with tools to enhance productivity and efficiency on the job."

Microsoft has unexpectedly halted the rollout of the upcoming Windows 11 24H2 update to Windows Insiders on the Release Preview Channel. The pause was quietly announced through an update to the original release blog post, which had initially touted the preview's new features like Wi-Fi 7 support, Sudo for Windows, Rust in the Windows kernel, and various UI enhancements. Microsoft has not provided an official reason for hitting the brakes on the 24H2 preview rollout. Brandon LeBlanc, the Windows Insider Senior Program Manager, simply stated, "We are working to get it rolling out again shortly."

However, a glimpse at the Microsoft Feedback Hub reveals a multitude of issues reported by Insiders testing the 24H2 build. Complaints range from application freezes and performance degradation to VPN connectivity problems. Some users have even taken to social media to voice their frustrations, with one describing the Arm version as a "disastrous, worst 'release' preview I can remember." The Release Preview Channel is typically recommended for commercial users and those wanting to test upcoming Windows releases before general availability. Meanwhile, the Dev Channel caters to users who are comfortable with instability and rough edges. As The Register notes, the current situation echoes Microsoft's troubled rollout of the Windows 10 October 2018 Update, which contained a data deletion bug.

Minisforum consistently impressed us with its bold small footprint computing solutions over the years, and they've taken things a level up this Computex. Imagine a docking station on which you installed a graphics card like you'd slot in an NES cartridge. That's the Minisforum DEG1 OCulink graphics docking station. The dock resembles an 8-bit era Atari. You install a graphics card vertically on its PCI-Express 4.0 x16 slot (electrical Gen 4 x4), and connect 12 V power from the dock to the card (12V-2x6 and 3x 8-pin supported). The dock connects to the host machine over Oculink (Gen 4 x4).

The R3GAF is a pre-built external GPU based on the AMD Radeon RX 7600M XT. It connects to the host over Oculink, and uses an internap power supply to drive the card, with a configured power limit of 120 W. Besides the GPU's connectivity, the dock puts out a trio pf 5 Gbps USB 3.2 Gen 1 ports. Next up, is a Thunderbolt 4 (40 Gbps) dock that puts out two downstream Thunderbolt ports, a handful USB-C ports, an internal M.2 slot, card reader, and DisplayPort output demuxed from the Thunderbolt uplink.

Gemtek Technology will host an exclusive closed-door event at its Nan Kang office in collaboration with the medical AI company, Dr. AI, during the 2024 Computex Taipei Exhibition. Together, Gemtek and Dr. AI will showcase their latest co-creation: the Wi-Fi 7 AI Router with voice-enabled AI-Powered Healthcare Service.

Gemtek has long been dedicated to revolutionizing home network solutions through innovation. In an effort to further expand its products and services, Gemtek has transformed its latest Wi-Fi 7 AI Router from a mere connection accessory to a state-of-the-art centerpiece for smart indoor applications. The new Wi-Fi 7 AI Router combines the latest Wi-Fi 7 technology with AI capabilities, offering users voice-enabled AI functions alongside its exceptionally high-speed, stable internet connections.

German PC OEM Schenker, along with its two brands—XMG targeted at high-performance mobile workstations and gaming notebooks; and Tuxedo, targeting Linux-friendly notebooks; made a splash at the 2024 Computex. We visited their pullout booth. The EVO 14 is a 14-inch class performance notebook powered by choices of Intel Core Ultra 7 155H "Meteor Lake" or AMD Ryzen 7 8845HS "Hawk Point" mobile processors; an innovative new dual-fan cooling solution, with 65 W sustained power delivery, and an 80 Wh battery pack. The 14-inch display features a 16:10 aspect ratio, 400 nits brightness, and 3K resolution. Memory options go all the way up to 96 GB, and I/O includes either USB4 or Thunderbolt 4, depending on the hardware platform. The EVO 15 is almost identical in terms of specs, but with a larger 99.8 Wh battery, and a 15.3-inch 500 nits display, and a full-sized edge-to-edge keyboard.Update 07:03 UTC: We have some pricing and availability details from Schenker.

GIGABYTE in its Computex 2027 booth showcased a huge lineup of next-generation Socket LGA1851 motherboards based on the top Intel Z890 chipset, which are ready for Intel's Core Ultra "Arrow Lake-S" desktop processors. GIGABYTE has taped out the motherboard model names, so all mentions of Z890 in this article are based on our assumption that it's the name of the next-gen Intel chipset. These chips are expected to bring generational IPC increases from their "Lion Cove" P-cores, "Skymont" E-cores, a more complete PCIe Gen 5 I/O (including for the CPU-attached NVMe slots), and other innovations. If the socket looks similar to the LGA1700, it's because it's identical in physical dimensions, and you can use your LGA1700 cooler on the LGA1851, but the processors are not inter-compatible. The company also showcased a few AMD Socket AM5 motherboards based on the new AMD X870E chipset.

The first motherboard to catch our eye is the Z890 AORUS Tachyon. This board is geared for record-seeking CPU overclocking. The processor is wired to just two DDR5 memory slots (1 DIMM per channel, the best configuration for memory OC); and the CPU-attached NVMe slots being close to the socket, with a combined heatsink. The only expansion slots are a PCI-Express 5.0 x16, and what could be a Gen 4 x8. There are plenty of overclocker-friendly controls, voltage measurement points, diagnostic LEDs, and status displays, scattered all over the board.