Amkor Licenses Lead-Free Wafer Bumping Technology to AMD
Amkor Technology, Inc. today announced that AMD has entered into an agreement to license Amkor's lead free (Pb-free) electroplated wafer bumping technology. Terms of the license agreement were not disclosed. The electronics industry is striving to reduce or eliminate certain elements and compounds, such as lead, mercury, cadmium and halogen, in favor of "Green" products in response to legislation in Europe and Japan, overall environmental concerns and market pressures. This drive to adopt "Green" products is especially strong in the consumer electronics market.