Synopsys, Inc. today announced that its collaboration with Broadcom has achieved interoperability between Synopsys' PCIe 6.x IP solution and Broadcom's PEX90000 series switch. As a cornerstone of next-generation AI infrastructures, PCIe switches play a critical role in enabling the scalability required to meet the demands of modern AI workloads. This milestone demonstrates that future products integrating PCIe 6.x solutions from Synopsys and Broadcom will operate seamlessly within the ecosystem, reducing design risk and accelerating time-to-market for high-performance computing and AI data center systems.

The interoperability demonstration with Broadcom features a Synopsys PCIe 6.x IP solution, including PHY and controller, operating as a root complex and an endpoint running at 64 GT/s with Broadcom's PEX90000 switch. Synopsys will showcase this interoperability demonstration at PCI-SIG DevCon 2025 at booth #13, taking place June 11 and 12, where attendees can see a variety of successful Synopsys PCIe 7.0 and PCIe 6.x IP interoperability demonstrations in both the Synopsys booth and partners' booths.

The majority of PowerColor coverage—emerging from Computex 2025—focused on custom Radeon RX 9060 XT graphics cards. The usual staple of Reaper and Hellhound options were showcased in Taiwan, but a brand-new family made an appearance. As highlighted by Shroud/syurarara (a YouTuber), a whole corner of the brand's booth was dedicated to a lone demonstration unit. Not much context was provided, beyond a logo and an accompanying mascot/icon/protagonist. Shroud shared a couple of tidbits: "apparently a new PowerColor model will be released in the future! It's a mix of white and gray. The name of the new graphics card hasn't been decided yet, but the female character's name is apparently REVA."

Given the lack of specifications and little explanation (provided by company representatives), PowerColor could jump-start a full-blown marketing campaign in the near future. Their brand-new REVA graphics card series seems to be semi-related to the familiar Hellhound IP; observers noticed the presence of two Hellhound emblem-branded cooling fans on the Computex sample/prototype. Despite having an almost direct line to a source at (or adjacent to) PowerColor, VideoCardz did not get an inside scoop on REVA. Their news report opined that the white/gray card could leverage Radeon RX 9070 XT (or non-XT) hardware, and be lined up for a possible global release.

ADATA's XPG sub-brand is best known for producing gaming hardware, but Project INFINITY signals a significant diversification. Two demonstration sample DDR5 UDIMMs were mounted on an open plan build, at the company's Computex booth. Despite bearing XPG branding and gaming-oriented aesthetics, these memory modules are not wholly related to a freshly presented Lancer Neon DDR5 product line. Instead, ADATA has deemed Project INFINITY worthy of inclusion in their "AI Revolution" portfolio.

Impressive credentials are outlined in PR material: "XPG pushes overclocking to new heights with memory solutions that blend extreme performance, bold design, and sustainable materials. Project INFINITY delivers up to 9200 MT/s with 48 GB capacity per module, featuring RGB lighting and an infinity mirror heatsink for a stunning visual effect. For professional workloads." According to an accompanying placard, XPG's bare build utilizes an ultra-expensive ASUS ROG Maximus Z890 Hero mainboard foundation. Intel's Arrow Lake-S flagship CPU—Core Ultra 9 285K—drives the Project INFINITY-centric PC system. Appropriately, the XPG team has selected an ADATA Mars 980 BLADE Gen 5 M.2 SSD, for ultra-fast storage purposes. Hopefully, additional/refined Project INFINITY examples will turn up in the near future.

Over a month ago, TechPowerUp published a review of the Thermaltake TR100 compact dual-chamber ITX chassis. Darksaber was seriously impressed by his Hydrangea Blue variant; thus the resultant "Editor's Choice" and "Great Value" badges of honor. Prior to the receiving of a lone sample evaluation sample, TPU staff members inspected demonstration units on two separate occasions. At last year's Computex trade event, and then at CES 2025. At launch, four colors were made available: Black, Snow (aka white), Matcha Green, and Hydrangea Blue. During the setup of this year's booth, the Thermaltake crew granted early access to members of the press. Upon arrival, TechPowerUp's photographer spotted an intriguing "Gravel Sand" TR100 model. This colorway/finish is a familiar sight, as sported by various readily available "The Tower" and "View" models.

The company's TR100 product page mentions two other color options: Bubble Pink and Mint Strawberry. At the time of writing, their Gravel Sand sibling is not listed. Brand-new taller TR300 and TR200 cases were sat to the left of the original 18.4-liter small form factor (SFF) design. The former seems to be approaching mid-tower elevation; likely voluminous enough to accommodate larger components. An optional front panel piece—sporting Scandi-esque wooden slats—was placed nearby; implying a swappable configuration. Thermaltake's "in-the-middle" TR200 SKUs could be tall enough to accept microATX format motherboards. A snow-white demonstration unit was prepped and running an installed 3.9-inch LCD Screen Kit (also present on the TR300 demo unit)—currently available as an extra attachment for the TR100 series.

Samsung Display announced on May 13 that it will take part in Display Week 2025, held from May 13 to 15 at the McEnery Convention Center in San Jose, California. The event, hosted by the Society for Information Display (SID), brings together display companies and experts from around the world to share cutting-edge technologies and R&D achievements.

Samsung Display is set to unveil a range of next-generation display technologies, including the industry's first non-cadmium 400-nit EL-QD and a 5,000 pixels-per-inch (PPI) RGB OLED on Silicon (OLEDoS) at Display Week 2025, reinforcing its leadership in cutting-edge panel technology. The company will also highlight its leadership in OLED innovation through a range of future-oriented technologies, including organic photodiodes (OPD), advanced sensors capable of measuring biometric data such as heart rate and blood pressure directly from light generated by a panel touched by a patient, and a high-resolution microdisplay that delivers 5,000 PPI in a compact 1.4-inch form factor.

MSI IPC, a global leader in industrial computing and AI-driven solutions, is set to unveil its latest innovations at COMPUTEX 2025, held from May 20 to 23 at the Taipei Nangang Exhibition Center. Visitors can explore MSI IPC's cutting-edge technologies at Booth J0506, Hall 1, 1F.

Introducing the EdgeXpert MS-C931: A Desktop AI Supercomputer
MSI IPC will unveil the EdgeXpert MS-C931, a desktop AI supercomputer built on the NVIDIA DGX Spark platform. Powered by the NVIDIA GB10 Grace Blackwell Superchip, the EdgeXpert MS-C931 delivers 1,000 AI TOPS FP4 performance, equipped with high-speed ConnectX 7 networking, 128 GB unified memory, and support for large language models. Designed for AI developers and researchers, it is ideal for applications in education, finance, and healthcare industries.

Nokia today announced it will showcase its Beacon 24 device at the ALGS esports gaming event, allowing fans and gamers to see firsthand the power of its Wi-Fi 7 solution for eGaming applications. Located in the heart of the convention center's challenging Wi-Fi environment, Nokia's demonstration, in partnership with Qualcomm, SONY, Corsair and EA, offers visitors an exclusive chance to battle a mystery pro head-to-head in the Apex Legends game, powered solely by Nokia's Wi-Fi device. Visitors will also be able to take on some of their favorite gaming content creators as part of a "take-over" event taking place at the Nokia booth.

The Nokia WiFi Beacon 24 embeds unique latency and queuing technology to give service providers a powerful Wi-Fi gateway solution that can rival any commercial and retail device on the market. Equipped with an advanced gaming optimization application available on Nokia's Corteca platform, the Wi-Fi 7 device delivers the ultimate end-user experience, delivering gaming-level latency that optimizes performance.

The 8K Association was at the NAB 2025 Show with several areas of interest. At one end of the booth, there was a demonstration of real time gaming using an AMD-based gaming PC and a special 65" TV flown in from Korea by 8K Association member, Samsung, that supported 120 FPS display. The game was Horizon Forbidden West and the TV was a modified Neo QLED 8K display set enabled with the following features: Auto Low Latency Mode (ALLM), Variable Refresh Rate (VRR), and FreeSync Premium Pro. The PC was from MAINGEAR and used an AMD Ryzen 7 9800X3D CPU and an AMD Radeon RX 9070 XT GPU. The game supports the Steam platform which allows analytics to be shown and confirming the 120 Hz operation. The game was rendered at 5K and was then internally upscaled using AMD ML-based FidelityFX Super Resolution 3 technology.

The signal was sent to the TV using HDMI 2.1b with DSC support and the impressive smooth visuals attracted a lot of attention from visitors, especially those that were already aware of the game, which is visually very impressive. In the center of the booth was the latest 8KA "sizzle reel" which includes video provided by member company Imax featuring some impressive content scanned from its 70 mm film stock. BZBGear, another 8KA member was showing its range of switches, splitters and HDBaseT transmitters and receivers which all support 8K.

XConn Technologies, the innovation leader in next-generation interconnect technology for the future of high-performance computing and AI applications, today announced a groundbreaking demonstration of dynamic memory allocation using Compute Express Link (CXL) switch technology at CXL DevCon 2025, taking place April 29-30 at the Santa Clara Marriott hotel. The demonstration highlights a major advancement in memory flexibility, showcasing how CXL switching can enable seamless, on-demand memory pooling and expansion across heterogeneous systems.

The milestone, achieved in collaboration with AMD, unlocks a new level of efficiency for cloud, artificial intelligence (AI), and high-performance computing (HPC) workloads. By dynamically allocating memory via the XConn Apollo CXL switch, data centers can eliminate over-provisioning, enhance performance, and significantly reduce total cost of ownership (TCO).

SaxonQ, developer of the first mobile quantum computer, and Quantum Machines, the leading provider of advanced hybrid quantum-classical control solutions, announced today a milestone demonstration of real-time quantum computing on SaxonQ's mobile quantum computer at Hannover Messe 2025. The live demonstrations included a quantum chemical calculation of H₂ energy levels and basic real-time image recognition, marking the first time anyone has shown such applications running on a portable room-temperature quantum computer publicly, demonstrate the potential of mobile quantum computing outside laboratory conditions.

"Developing a mobile quantum computer that runs in real-world environments—without cryogenic cooling and powered by a simple wall plug—is a challenge that requires the best available control technology. Quantum Machines provides exactly that. This successful demonstration proves that we can run reliable quantum operations on-site. It's an exciting step toward bringing quantum computing to industrial applications," says Dr. Frank Schlichting, CEO of SaxonQ.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced in collaboration with TeraHop, a global optical solutions provider for AI driven data centers, the demonstration of the industry's first end-to-end PCIe Gen 6 over optics in the Marvell booth #2129 at OFC 2025. The demonstration will showcase the extension of PCIe reach beyond traditional electrical limits to enable low-latency, standards-based AI scale-up infrastructure.

As AI workloads drive exponential data growth, PCIe connectivity must evolve to support higher bandwidth and longer reach. The Marvell Alaska P PCIe Gen 6 retimer and its PCIe Gen 7 SerDes technology enable low-latency, low bit-error-rate transmission over optical fiber, delivering the scalability, power efficiency, and high performance required for next-generation accelerated infrastructure. With PCIe over optics, system designers will be able to take advantage of longer links between devices that feature the low latency of PCIe technology.

Hunters! Join us on Tuesday March 25th at 7:00AM PDT / 14:00 GMT for a Monster Hunter Wilds Showcase stream, presented by Monster Hunter Wilds producer, Ryozo Tsujimoto! The stream will be approximately 15 minutes with news on the next free title update that we're looking forward to sharing with you! Please note that actual stream time is subject to change.

The unbridled force of nature runs wild and relentless, with environments transforming drastically from one moment to the next. This is a story of monsters and humans and their struggles to live in harmony in a world of duality. Fulfill your duty as a Hunter by tracking and defeating powerful monsters and forging strong new weapons and armor from the materials you harvest from your hunt as you uncover the connection between the people of the Forbidden Lands and the locales they inhabit. The ultimate hunting experience awaits you in Monster Hunter Wilds.

Intel representatives have placed a Panther Lake demonstration sample unit on an actual pedestal; as reported by PC Games Hardware (PCGH). German press outlets and other visitors were greeted by Team Blue's dedicated showcase plinth at this week's Embedded World 2025 expo/trade fair. The Nuremberg-based event is advertised as a "world-leading conference presenting state-of-the art technology and forward-looking research." Attendees and industry watchdogs reckon that the prominently displayed demo piece is an example of Intel's Panther Lake-H (PTL-H) mobile-oriented chip design. Last October, Pat Gelsinger (now ex-CEO) unveiled a physical PTL-H sample on-stage during his special guest appearance at Lenovo Tech World 2024. During a CES 2025 keynote presentation, Michelle Johnston Holthaus (Intel's interim co-boss) confirmed a 2025 launch window, while holding up another (or the same) Panther Lake chip.

Recent industry insider whispers have suggested that the Intel Foundry is encountering problems with their 18A node process; thus causing a shift in Panther Lake's release schedule. One prominent leaker claims that Team Blue's opening salvo of PTL-H products will roll out in 2026, but rumors were dismissed by an official source (last week). John Pitzer—Corporate Vice President of Investor Relations at Intel—insisted on multiple occasions, during a fireside chat, that his team's Core Ultra 300 series (aka Panther Lake-H) is on track for launch within the second half of 2025. Intel's Embedded World 2025 booth does not feature any technical rundowns relating to the showcased next-gen offering; their minimalist plinth is simply adorned with blue text spelling out: "Panther Lake." NDA-busting details have emerged online, courtesy of insider leaks—the top-most PTL-H SKU could appear with a 4P+8E+4LP+12Xe3 configuration.

Around late January, concerned owners of high-end ASUS motherboards uploaded photo and video evidence of alleged physical damage caused by the manufacturer's PCIe "Q-Release Slim" system. Social media and forum posts showed worrying scraping and scratching on graphics card interfaces. The North American branch of ASUS responded to reports with a public service announcement: "in our internal testing and evaluation of the extremely small number of cases reported, we found no damage to the motherboard or graphics card that would affect functionality and/or performance....However, it is important to emphasize that any type of PCIe add-in card will exhibit signs of usage and wear marking after 60 continuous insertions and removals." Rival brands have kept tabs on this sorry situation; many offer similar motherboard-mounted GPU quick release systems. Yesterday, GIGABYTE's Japanese office posted a very "on the nose" demonstration of their EZ Latch Plus design.

The AORUS Japan social media account's "Ultimate PCIe Scratch Test" video involved the repeated insertion and removal of a candidate card from a GIGABYTE Z890 AORUS ELITE WIFI7 ICE motherboard. An anonymous employee completed one hundred cycles. Upon the experiment's conclusion, the graphics card's interface displayed zero evidence of physical deterioration. The manufacturer's Japanese AORUS branch boasted (via machine translation): "start building your PC with confidence! GIGABYTE's renowned easy DIY and ultra-durable design ensures smooth, hassle-free builds and rock-solid reliability. No more worrying about peeling golden finger contacts or scratches from metal edges." Their sarcastic delivery seemingly pokes fun at ASUS and the "troubled" Q-Release Slim system; it should be noted that it is a relatively new design. As reported back in early February, ASUS China launched an extensive customer support/compensation program. According to user accounts, some very expensive custom GeForce RTX 50-series cards have suffered cosmetic damage on PCIe interfaces. GIGABYTE's Western web presences have joined in on the fun—the AORUS Official social media account delivered a slightly different spin on their overall message: "game on with confidence! With our renowned DIY-friendly and Ultra Durable design, you'll enjoy a smooth, hassle-free build with rock-solid reliability. No more worries about gold finger paint peeling or scratches from metal edges—our design provides complete protection for both your GPU and motherboard."

pureLiFi, the global leader in LiFi technology, has announced the launch of its ground-breaking LINXC Bridge system, at Mobile World Congress Barcelona. Developed with Solace Power, this innovative solution empowers Fixed Wireless Access (FWA) broadband providers to deliver self-installable, higher quality and more reliable connectivity to consumers using outdoor Customer Premises Equipment (CPE). With this solution broadband customers will experience much faster installation times, more reliable speeds and an improved user experience.

The LINXC Bridge streamlines broadband deployment, eliminating complex installations, significantly reducing subscriber acquisition cost, shortening time to revenue and increasing customer satisfaction. The LINXC Bridge system will be showcased live at the pureLiFi booth (7B27) alongside the latest cutting-edge CPE equipment from demonstration collaborators, Sonim Technologies.

Hey hunters, how's it going? February is here, which means we are officially in the launch month of Monster Hunter Wilds! On February 28, your journey into the Forbidden Lands begins. Now, to help ensure you have a satisfying, fun experience come launch, we're pleased to share that the Monster Hunter Wilds Benchmark we'd previously mentioned we were looking into, is real, it's ready, and it's live from right now for you to try!

With the Monster Hunter Wilds Benchmark, we want to help our PC players feel more confident about how their PC will run Monster Hunter Wilds. In the next section, we're going to explain what the Monster Hunter Wilds Benchmark is, how it works, as well as some important information and differences you'll see between this and the Open Beta Test 1 and 2 experiences, so please take a moment to check it out.

LG Electronics (LG) has collaborated with Razer and MediaTek to introduce the world's first Bluetooth Ultra-Low Latency (BT ULL) Controller at LG webOS Summit 2024 on September 27. This groundbreaking technology was showcased through an LG webOS smart TV and Razer's Bluetooth gaming controller, demonstrating the game-changing 1 ms input lag.

The webOS summit, which welcomed 300 representatives from 140 partner companies - including content developers, producers and providers - from 24 countries, shared LG's strategic vision and future initiatives for expanding its AI webOS ecosystem and platform business.

SK hynix unveiled an enhanced Accelerator-in-Memory based Accelerator (AiMX) card at the AI Hardware & Edge AI Summit 2024 held September 9-12 in San Jose, California. Organized annually by Kisaco Research, the summit brings together representatives from the AI and machine learning ecosystem to share industry breakthroughs and developments. This year's event focused on exploring cost and energy efficiency across the entire technology stack. Marking its fourth appearance at the summit, SK hynix highlighted how its AiM products can boost AI performance across data centers and edge devices.

Booth Highlights: Meet the Upgraded AiMX
In the AI era, high-performance memory products are vital for the smooth operation of LLMs. However, as these LLMs are trained on increasingly larger datasets and continue to expand, there is a growing need for more efficient solutions. SK hynix addresses this demand with its PIM product AiMX, an AI accelerator card that combines multiple GDDR6-AiMs to provide high bandwidth and outstanding energy efficiency. At the AI Hardware & Edge AI Summit 2024, SK hynix presented its updated 32 GB AiMX prototype which offers double the capacity of the original card featured at last year's event. To highlight the new AiMX's advanced processing capabilities in a multi-batch environment, SK hynix held a demonstration of the prototype card with the Llama 3 70B model, an open source LLM. In particular, the demonstration underlined AiMX's ability to serve as a highly effective attention accelerator in data centers.

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents patterned structures obtained after exposure with the 0.55NA EUV scanner in the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands. Random logic structures down to 9,5 nm (19 nm pitch), random vias with 30 nm center-to-center distance, 2D features at 22 nm pitch, and a DRAM specific lay out at P32nm were printed after single exposure, using materials and baseline processes that were optimized for High NA EUV by imec and its partners in the framework of imec's Advanced Patterning Program. With these results, imec confirms the readiness of the ecosystem to enable single exposure high-resolution High NA EUV Lithography.

Following the recent opening of the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands, customers now have access to the (TWINSCAN EXE:5000) High NA EUV scanner to develop private High NA EUV use cases leveraging the customer's own design rules and lay outs.

MaxLinear, Inc., a leading provider of data storage acceleration solutions for enterprise and data center applications, today announced it will demonstrate the advanced compression, encryption, and security performance of its storage acceleration solution, Panther III, at the Future of Memory and Storage (FMS) 2024 trade show from August 6-8, 2024. The demos will show that Panther III can achieve up to 40 times more throughput, up to 190 times better latency, and up to 1000 times less CPU utilization than a software-only solution, leading to significant cost savings in terms of flash drives and needed CPU cores.

MaxLinear's Panther III creates a bold new product category for maximizing the performance of data storage systems - a comprehensive, all-in-one "storage accelerator." Unlike encryption and/or compression solutions, MaxLinear's Panther III consolidates a comprehensive suite of storage acceleration functions, including compression, deduplication, encryption, data protection, and real-time validation, in a single hardware-based solution. Panther III is engineered to offload and expedite specific data processing tasks, thus providing a significant performance boost, storage cost savings, and energy savings compared to traditional software-only, FPGA, and other competitive solutions.

To accelerate humanoid development on a global scale, NVIDIA today announced it is providing the world's leading robot manufacturers, AI model developers and software makers with a suite of services, models and computing platforms to develop, train and build the next generation of humanoid robotics.

Among the offerings are new NVIDIA NIM microservices and frameworks for robot simulation and learning, the NVIDIA OSMO orchestration service for running multi-stage robotics workloads, and an AI- and simulation-enabled teleoperation workflow that allows developers to train robots using small amounts of human demonstration data.

Under the theme "Incredible Speed, Exceeding the Limit," ASMedia showcased its latest USB4 80 Gbps, 120 Gbps, and PCIe Gen 5 physical layer chips at Computex 2024. This demonstration highlighted ASMedia's leading position in the high-speed transmission field and outlined a one-stop solution for high-speed transmission, efficient charging, and multi-device connectivity for future smart working environments.

USB4 redefines data transfer speed
Computex Taipei 2024, ASMedia unveiled its world-leading USB4 80 Gbps and 120 Gbps physical layers, paving the way for the transfer of massive data and high-resolution videos in seconds, significantly improving work efficiency and user convenience. USB4's backward compatibility ensures seamless connection with existing USB devices.

Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek (last week) announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G electrical links and 8x800G optical links for a more flexible deployment. It integrates both MediaTek's in-house SerDes for electrical I/O as well as co-packaged Odin optical engines from Ranovus for optical I/O. Leveraging the heterogeneous solution that includes both 112G LR SerDes and optical modules, this CPO demonstration delivers reduced board space and device costs, boosts bandwidth density, and lowers system power by up to 50% compared to existing solutions.

Additionally, Ranovus' Odin optical engine has the option to provide either internal or external laser optical modules to better align with practical usage scenarios. MediaTek's ASIC experience and capabilities in the 3 nm advanced process, 2.5D and 3D advanced packaging, thermal management, and reliability, combined with optical experience, makes it possible for customers to access the latest technology for high-performance computing (HPC), AI/ML and data center networking.

Leaked Samsung PBSSD presentation material popped up online a couple of days prior to the kick-off day of NVIDIA's GTC 2024 conference (March 18)—reports (at the time) jumped on the potential introduction of a "petabyte (PB)-level SSD solution," alongside an enterprise subscription service for the US market. Tom's Hardware took the time to investigate this matter—in-person—on the showroom floor up in San Jose, California. It turns out that interpretations of pre-event information were slightly off—according to on-site investigations: "despite the name, PBSSD is not a petabyte-scale solid-state drive (Samsung's highest-capacity drive can store circa 240 TB), but rather a 'petascale' storage system that can scale-out all-flash storage capacity to petabytes."

Samsung showcased a Supermicro Petascale server design, but a lone unit is nowhere near capable of providing a petabyte of storage—the Tom's Hardware reporter found out that the demonstration model housed: "sixteen 15.36 TB SSDs, so for now the whole 1U unit can only pack up to 245.76 TB of 3D NAND storage (which is pretty far from a petabyte), so four of such units will be needed to store a petabyte of data." Company representatives also had another Supermicro product at their booth: "(an) H13 all-flash petascale system with CXL support that can house eight E3.S SSDs (with) four front-loading E3.S CXL bays for memory expansion."

Qualcomm Technologies, Inc. unveiled its latest advancements in artificial intelligence (AI) at Mobile World Congress (MWC) Barcelona. From the new Qualcomm AI Hub, to cutting-edge research breakthroughs and a display of commercial AI-enabled devices, Qualcomm Technologies is empowering developers and revolutionizing user experiences across a wide range of devices powered by Snapdragon and Qualcomm platforms.

"With Snapdragon 8 Gen 3 for smartphones and Snapdragon X Elite for PCs, we sparked commercialization of on-device AI at scale. Now with the Qualcomm AI Hub, we will empower developers to fully harness the potential of these cutting-edge technologies and create captivating AI-enabled apps," said Durga Malladi, senior vice president and general manager, technology planning and edge solutions, Qualcomm Technologies, Inc. "The Qualcomm AI Hub provides developers with a comprehensive AI model library to quickly and easily integrate pre-optimized AI models into their applications, leading to faster, more reliable and private user experiences."