Silicon Motion Technology Corporation ("Silicon Motion" or the "Company") today announced its financial results for the quarter ended December 31, 2022. For the fourth quarter of 2022, net sales (GAAP) decreased sequentially to $200.8 million from $250.8 million in the third quarter of 2022. Net income (GAAP) decreased to $23.5 million, or $0.71 per diluted American Depositary Share ("ADS") (GAAP), from net income (GAAP) of $42.9 million, or $1.29 per diluted ADS (GAAP), in the third quarter of 2022.

For the fourth quarter of 2022, net income (non-GAAP) decreased to $41.1 million, or $1.22 per diluted ADS (non-GAAP), from net income (non-GAAP) of $51.2 million, or $1.53 per diluted ADS (non-GAAP), in the third quarter of 2022.

Acer today launched four new Chromebooks to meet the needs of students, teachers and administrators, including its first Acer Chromebook Vero model designed specifically for the education market. These new models provide the latest in durability, performance, and features, making them a powerful tool for helping educators deliver better learning outcomes.

"As a leading provider of Chromebooks for the K12 education market, Acer knows what students and teachers need to keep the focus on learning - and these new Acer Chromebooks deliver what's needed and more," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "Our new Chromebooks provide advances in all the areas that have helped establish them as an essential tool for learning: student-focused durability features, reliable performance and advanced connectivity options to support school technology initiatives."

Intel today debuted its 2023 N-series entry-level mobile processors targeting a range of low-cost notebook applications, such as educational notebooks for bulk purchase and distribution by public schools. These processors are built on the same Intel 7 (10 nm Enhanced SuperFin) node as the 13th Gen Core processors, but come with just "Gracemont" E-cores, and no P-cores.

The silicon physically features two "Gracemont" E-core clusters amounting to 8 E-cores, 6 MB of shared L3 cache, and an iGPU based on the Xe-LP graphics architecture, with 32 EUs (execution units). The silicon also features a GNI 3.0 for basic AI acceleration using a truncated version of the DLBoost instruction set, and an IPU (as in image processing unit), which can improve web-camera experience (on the fly background noise suppression). The iGPU also offers hardware-accelerated AV1 decoding. On the platform-side, the processor features a single-channel DDR5 memory interface that's backwards-compatible with DDR4, and also supports LPDDR5. Storage interfaces include eMMC, UFS 2.1, and NVMe SSD. Wireless networking options available with the platform include fast WiFi 6E and Bluetooth 5.2.

IceWhale Technologies has launched ZimaBoard, a low-cost single board server that functions as personal cloud storage and software router, and allows users to set up a VPN, stream 4K video, access media collections, and reinvent smart home projects on Amazon. Three models with tiered processing power are available in the brand's shop for US customers: ZimaBoard 216 (2 GB RAM, 16 GB eMMC storage, dual-core Intel Celeron processor) is $139.99 USD, ZimaBoard 432 (4 GB RAM, 32 GB eMMC storage, quad-core Intel Celeron processor) is $169.99 USD, and ZimaBoad 832 (8 GB RAM, 32 GB eMMC storage, quad-core Intel Celeron processor) is $229.99 USD.

"Following our Kickstarter campaign and fulfillment to backers in July, we're excited to announce our move to Amazon," said founder Lauren Pan. "Getting here was no small feat, especially after more than a year of chip shortages and unpredictable lockdowns, but here we are. ZimaBoard is one board to rule them all—one that puts individuals back in control."

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

MediaTek today announced its new Kompanio chipsets for Chromebooks: the Kompanio 520 and Kompanio 528. With upgraded computing performance and battery life for entry level Chromebooks, the newest Kompanio chipsets provide a seamless experience so consumers can browse, cloud game, stream and use Google Play apps while enjoying all-day battery life.

"Enhanced power efficiency, speedy performance and reliable connectivity are at the core of a great user experience, and that's exactly what MediaTek's new Kompanio chipsets deliver," said Adam King, Vice President and General Manager, Client Computing Business Unit at MediaTek. "As the No. 1 provider of Arm-based Chromebooks, MediaTek makes the latest AI, connectivity, display and imaging features accessible at every price point."

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the iNA200, a DIN-rail cybersecurity gateway for operational technology (OT) network security. The iNA200 is powered by the Intel Atom x6212RE or x6414RE processor (Elkhart Lake) and has one DDR4-3200 SO-DIMM for up to 32 GB of system memory. For demanding rugged environments, this fanless IIoT edge gateway comes with a wide operating temperature range of -40°C to 70°C and supports wide power input of 9 to 36 VDC with dual power input. The iNA200 also has two 2.5G LAN ports, sufficient storage, and high expandability for various industrial application needs.

"OT cybersecurity is essential for Industry 4.0. Axiomtek's iNA200 is designed to safeguard your OT assets and avoid network threats for critical infrastructure," said Kevin Hsiao, a product manager of Network Computing Platform Division at Axiomtek. "Additionally, our iNA200 features an M.2 Key B slot to enable 5G connectivity for next-generation industrial use cases. With the Trusted Platform Module 2.0 (TPM 2.0) support, this cybersecurity gateway increases security offering hardware-level protection against malware and sophisticated cyber-attacks."

Leveraging its experience in producing innovative IoT solutions, AAEON has announced the newest addition to its IoT Gateway product line with the launch of the
SRG-IMX8P. Powered by Arm NXP i.MX8M Plus Quad-Core Cortex -A53 and Cortex -M7 processors, the SRG-IMX8P harnesses the benefits of an integrated neural processing unit capable of producing 2.3 TOPS. Further, the inclusion of the Arm Cortex -M7 processor offers real-time calculation functionality to enhance machine learning, drastically reducing visual inferencing time for object detection to just 13 ms.

The SRG-IMX8P is also equipped with an industry-leading onboard DDR4L system memory of up to 8 GB, 16 GB eMMC storage and a Micro SD slot for further system storage expansion. Differentiating the SRG-IMX8P from its competitors is the inclusion of two USB 3.0, two RJ-45 GbE, and two CAN-FD ports. These features produce the ideal configuration for advanced edge gateway solutions in Industry 4.0 settings such as vehicle assembly and factory automation applications. The USB 3.0 and RJ-45 LAN ports support more sophisticated camera and sensor peripherals, while the CAN-FD slots enable users to transmit and receive sensor data via the SRG-IMX8P's I/O directly, negating the need for USB-to-CANBus conversion.

KIOXIA America, Inc. today announced that it has begun sampling the latest generation of its JEDEC e-MMC Ver. 5.1-compliant embedded flash memory products for consumer applications. The new products are available in capacities of 64 and 128 gigabytes (GB) and integrate the company's BiCS FLASH 3D flash memory and a controller in a single package.

Demand for mid-range capacities in consumer products such as tablets and IoT devices continues to grow, and though the market continues to shift to UFS, there are cases where e-MMC may still be used. The new KIOXIA e-MMC devices expand the available options. A leading provider of flash memory and storage for consumer applications and mobile devices, KIOXIA has been supporting e-MMC since 2007 and was the first supplier to introduce the higher performance follow-on solution to e-MMC, UFS, in early 2013. Today, the broad KIOXIA lineup of e-MMC and UFS solutions provides support across a wide range of densities (4 GB-1 TB).

CTL announced today the support of CBRS in the updated NL72L and NL72CT-L. "Digital equity and inclusion is a priority for CTL and we believe by adding additional communication technologies to our products, we are one step closer to solving the digital divide. Band 48 has been requested by our most innovative customers, and are excited to address this need in the market." - Erik Stromquist, CEO

Band 48 CBRS (Citizens Broadband Radio Service), often referred to as the private LTE, is the frequency band of 3.50 GHz, operating in the LTE spectrum in the United States, and is perfect for services that require ultra-high resources. LTE was designed to work across a wide range of frequency bands (450 MHz up to 3.80 GHz) referred to as E-UTRA. The LTE technology is capable of supporting two modes of communication, FDD (Frequency Division Duplex) and TDD (Time Division Duplex).

The LattePanda Team launched the world's thinnest pocket-sized hackable computer - LattePanda 3 Delta with global electronic components distributors. The collaboration will ensure that the product choice for LattePanda 3 Delta is passed on to customers through quick, easy online selection via the website of global electronic components distributors and LattePanda.

"LattePanda Team is so proud to cooperate with the global electronic components distributors for this joint launch. It delivers an exciting message to our customers that they can gain fast, easy access to our high-performance and hackable LattePanda 3 Delta anywhere in the world. Our collaboration will assure even higher levels of customer service," said Sandy Zhang, CMO of LattePanda Team.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in NAND Flash controllers and solid-state storage devices, today announces it will be showcasing its unique suite of SSD controller solutions for Datacenter, Notebook PCs and Automotive / Industrial SSDs during the Flash Memory Summit from August 2-4 at the Santa Clara Convention Center, booth #311.

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

The next-generation of UP Board, a credit card-sized SBC (single board computer) was unveiled, revealing a mighty SoC at the helm, the Intel Pentium Silver, Celeron, or Atom "Apollo Lake." The UP 4000 is suitable for most embedded system projects in which you require the x86-64 machine architecture. Competing SBCs tend to be based on Arm or RISC-V architectures. The 85 mm x 56 mm board puts out an Ethernet interface, three 5 Gbps USB 3.0 ports, a type-C USB 3.0 port, and an HDMI display output, besides GPIO. The SoC is hardwired to 8 GB of single-channel DDR4 memory, 64 GB of eMMC storage, Available now for pre-order, the UP Board starts at $116.

Axiomtek - a world-renowned leader relentlessly devoted in the research, development, and manufacturing of innovative and reliable industrial computer products of high efficiency - is pleased to announce its AIE100-T2NX, an ultra-compact fanless edge AI system with the flexibility of PoE PSE support and HDMI input. The high-performance AIE100-T2NX is powered by the NVIDIA Jetson TX2 NX module which integrates the dual-core NVIDIA Denver 2 64-bit CPU, quad-core Arm Cortex -A57 MPCore processor complex, and NVIDIA Pascal architecture GPU with 256 CUDA cores. The AIE100-T2NX is an ideal solution for intelligent edge AI applications, such as smart manufacturing, smart agriculture, smart farming, smart city, and more.

"The AIE100-T2NX with solid fanless design operates under a wide range of temperatures from -30°C to +60°C and withstands vibration up to 3 Grms. In addition, it offers an optional waterproof IP42-rated cover kit for enhanced protection in semi-outdoor environments," said Annie Fu, a product manager of Product PM Division at Axiomtek. "To easily deploy an IP camera, the AIE100-T2NX has one 15 W GbE PoE port for both power and video transmission. This user-friendly AI-powered system offers support for the NVIDIA JetPack software for ease of development in AI computing and deep learning applications such as access control, animal behavior analysis, quality control and traffic management. Moreover, the AIE100-T2NX integrates Allxon Device Management Solutions (Allxon DMS) to provide a cost-effective and simplified device management solution with comprehensive remote management capabilities."

According to TrendForce research, as output from Kioxia and WDC grows month by month, it has become obvious that production capacity is sufficient to meet increased bit demand. However, post-pandemic demand for consumer electronics such as laptops will no longer lead to flagging orders. Coupled with slow destocking among Chinese smartphone brands due to the pandemic and rising inflation, these factors will lead to oversupply in the 3Q22 NAND Flash market, in turn affecting a price drop of 0~5% in 3Q22.

In terms of Client SSD, although a backstop for business notebook orders remains, demand for consumer notebook and Chromebook orders lags behind 2021, especially as PC brands stock more conservatively. Their intention to actively reduce inventory is obvious and the volume of orders in peak season may fall behind last year. However, as SSD production capacity gradually returns to normal, supply of client SSDs continues to increase. In addition, shipments of Kioxia and WDC products been delivered in succession. In order to avoid a sharp increase in inventory, the supply side is willing to let prices spike. Client SSD pricing is expected to reverse direction and move downwards approximately 3-8% in 3Q22.

According to TrendForce research, looking at NAND Flash wafers, the pricing of which more sensitively reflects the market, suppliers are increasingly motivated to cut prices in exchange for sales due to weak retail demand since March and a more conservative outlook for shipments of other end products. The price of NAND Flash wafers is expected to begin falling in May and the supply of NAND Flash will gradually overtake demand in 2H22. The price decline of NAND Flash wafers in 3Q22 may reach 5~10%.

At the same time, TrendForce indicates that February's contamination incident at Kioxia was expected to tighten the market in 2Q22 and 3Q22. However, as a consequence of rising inflation and the war between Russia and Ukraine, market demand for consumer products in the traditional peak season of the second half of the year is trending conservative and the prices of client SSD, eMMC, and UFS in 3Q22 will be flat compared to 2Q22, breaking from the original expectation that prices may rise. In terms of enterprise SSDs, as demand for data centers remains strong, no significant correction in demand has yet been observed. However, as the overall NAND Flash market gradually moves into oversupply, prices will only grow slightly by approximately 0~5% in 3Q22.

With the announcement of the NVIDIA Jetson AGX Orin developer kit, AAEON is excited to utilize the many benefits that such a powerful system-on-module (SOM) can bring to its own product lines. With the same form factor and pin compatibility as the NVIDIA Jetson AGX Xavier, but with an improvement from 32 TOPS to 275 TOPS, the NVIDIA Jetson AGX Orin is set to make it easier than ever to develop faster, more sophisticated AI applications.

AAEON is therefore pleased to announce two upcoming products available in Q4 which will feature the Jetson AGX Orin 32 GB and Jetson AGX Orin 64 GB as their respective processor modules: the BOXER-8260AI and BOXER-8261 AI@Edge Embedded BOX PCs. Both products will feature the NVIDIA JetPack 5.0 SDK to support the full Jetson software stack to help in the development of AI applications in areas such as high-end autonomous machinery. With two NVIDIA deep learning accelerators (NVDLA), along with a 32 GB 256-bit system memory, the BOXER-8260AI will provide the perfect device for vision-based AI applications. Moreover, its expansive I/O options include 12 RJ-45 slots for PoE, along with DB-9 slots for CANbus and six DIO.

In celebration of Pi Day, OnLogic, a global industrial computing manufacturer and solution provider known for their reliable, orange industrial PCs, has announced that their new Factor 201 Raspberry Pi-powered device is available for pre-order. In addition, they've released more details about the next model in the Factor 200 Series, the Factor 202. Both devices are powered by the Raspberry Pi Compute Module 4, which was developed specifically for industrial products.

"We're delighted that OnLogic has chosen to develop the Factor 201 around Raspberry Pi. Using Raspberry Pi Compute Module 4 with their custom-designed carrier boards and industrial enclosure has allowed OnLogic to offer their customers flexible and reliable solutions, and we see Raspberry Pi hardware being increasingly widely adopted in industry with products like this one," said Gordon Hollingworth, Chief Product Officer at Raspberry Pi Ltd.

ATP Electronics, the global leader in specialized storage and memory solutions, has introduced its latest line of e.MMC devices built on 3D triple level cell (TLC) NAND. Using a new die package, the E750Pi/Pc and E650Si/Sc Series offer long-life performance, optimized power consumption and customizable configuration options. ATP's new E750Pi/Pc Series e.MMC offerings are built with 3D TLC NAND flash but are configured as pseudo SLC (pSLC) to offer endurance on par with SLC NAND, while E650Si/Sc Series in native TLC has near-MLC endurance.

The E750Pi and E650Si Series are industrial temperature-operable (-40°C to 85°C), making them ideal for deployment in scenarios with extreme thermal challenges and harsh environments, while E750Pc and E650Sc support -25°C to 85°C operating temperatures for applications with non-critical thermal requirements.

In 4Q21, NAND Flash bit shipments grew by only 3.3% QoQ, a significant decrease from the nearly 10% in 3Q21, according to TrendForce's investigations. ASP fell by nearly 5% and the overall industry posted revenue of US$18.5 billion, a QoQ decrease of 2.1%. This was primarily due to a decline in the purchase demand of various products and a market shift to oversupply causing a drop in contract prices. In 4Q21, with the exception of enterprise SSD, the supply of which was limited by insufficient upstream components, the prices of other NAND Flash products such as eMMC, UFS, and client SSD, all fell.

TrendForce's summary of NAND Flash market sales performance in 2021 is as follows: although there have been signs of weakening since 2H21, thanks to remote services and cloud demand driven by the pandemic, revenue performance still grew significantly compared to 2020. Revenue reached US$68.6 billion, up 21.1% YoY, the second-biggest increase since 2018.

WDC recently stated that certain materials were contaminated in late January at NAND Flash production lines in Yokkaichi and Kitakami, Japan which are joint ventures with Kioxia, according to TrendForce's investigations. Before this incident, TrendForce had forecast that the NAND Flash market will see a slight oversupply the entire year and average price from Q1 to Q2 will face downward pressure. However, the impact of WDC's material contamination issue is significant and Samsung's experience during the previous lockdown of Xi'an due to the pandemic has also retarded the magnitude of the NAND Flash price slump. Therefore, the Q1 price drop will diminish to 5~10%. In addition, according to TrendForce, the combined WDC/Kioxia NAND Flash market share in the 3Q21 was as high as 32.5%. The consequences of this latest incident may push the price of NAND Flash in Q2 to spike 5~10%.

The contaminated products in this incident are concentrated in 3D NAND (BICS) with an initial estimate of 6.5exabytes (approximately 6,500M GB) affected. According to TrendForce, damaged bits account for 13% of the group's output in 1Q22 and approximately 3% of the total output for the year. The normal production schedule for the entire line has yet to be confirmed. It is worth noting that the damages announced by WDC likely do not account for total losses stemming for this event and the number of damaged Kioxia parts has not been aggregated, so the total number of affected bits may increase further.

NAND Flash prices for 1Q22 are expected to decline by 8-13% QoQ, compared to TrendForce's previous forecast of 10-15% QoQ, primarily due to PC OEMs' increased orders for PCIe 3.0 products and the impact of the lockdown in Xi'an on PC OEMs' price negotiation approaches. To mitigate potential risks in logistics, NAND Flash buyers are now more willing to accept a narrower decline in contract prices in order to obtain their products sooner. However, as the Xi'an lockdown has not noticeably affected the local fabs' manufacturing operations, the movement of NAND Flash contract prices going forward will likely remain relatively unaffected by the lockdown.

In addition, TrendForce finds that the daily number of new COVID-19 cases in Xi'an has recently undergone a noticeable drop, and the local government has also announced that that the emergency level has been downgraded. As such, Samsung's and Micron's local production facilities are returning to normal with respect to workforce and operational capacity. Samsung's local production base manufactures NAND Flash products, whereas Micron's local production base is responsible for the testing and packaging of DRAM chips as well as the assembly of DRAM modules. The impacts of the lockdown mainly relate to delays in the deliveries of memory products to customers. On the other hand, the event has not caused a tangible loss in memory production.

Axiomtek - a world-renowned leader relentlessly devoted in the research, development, and manufacturing of innovative and reliable industrial computer products of high efficiency - is pleased to announce its partnership with leading AI chipmaker Hailo to launch the RSC100, a state-of-the-art ARM-based edge AI computer (also named Plato). The ARM-based RSC100 (Plato) supports the Hailo-8 edge AI processor, the latter of which features up to 26 TOPS for running deep learning applications at full scale efficiently, intelligently, and sustainably. The partnership with Hailo offers customers a new level of AI solutions across a wide range of market segments such as smart city, smart retail, industry 4.0, and smart transportation.

"Hailo has gained a lot of experience in developing high-performance AI processors suitable for edge devices. The powerful yet affordable RSC100 (Plato) is our first fanless edge AI computing system that adopts the Hailo-8. The RSC100 (Plato) provides system developers with highly efficient implementation of innovative AI solutions at reduced time-to-market and engineering costs. With the advanced AI performance, the RSC100 (Plato) is well suited for use in smart city applications, including smart surveillance, smart factory, smart agriculture, and smart transportation," said Ken Pan, the product manager at Axiomtek.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled an extensive lineup of cutting-edge automotive memory solutions designed for next-generation autonomous electric vehicles. The new lineup includes a 256-gigabyte (GB) PCIe Gen3 NVMe ball grid array (BGA) SSD, 2 GB GDDR6 DRAM and 2 GB DDR4 DRAM for high-performance infotainment systems, as well as 2 GB GDDR6 DRAM and 128 GB Universal Flash Storage (UFS) for autonomous driving systems.

"With the recent proliferation of electric vehicles and the rapid advancement of infotainment and autonomous driving systems, the semiconductor automotive platform is facing a paradigm shift. What used to be a seven to eight-year replacement cycle is now being compressed into a three to four-year cycle, and at the same time, performance and capacity requirements are advancing to levels commonly found in servers," said Jinman Han, executive vice president and head of Memory Global Sales & Marketing at Samsung Electronics. "Samsung's reinforced lineup of memory solutions will act as a major catalyst in further accelerating the shift toward the 'Server on Wheels' era."