EVGA GeForce RTX 2060 KO Review 85

EVGA GeForce RTX 2060 KO Review

Circuit Board Analysis »

Packaging



The Card


Visually, the EVGA RTX 2060 KO looks identical to some of the company's GTX 1660 Ti models, which isn't surprising as they are using a GTX 1660 Super SC cooler and PCB design as the foundation for the RTX 2060 KO. On the back, you'll find a metal backplate.


Dimensions of the card are 20.0 cm x 10.0 cm.


Installation requires two slots in your system.


Display connectivity options include DisplayPort 1.4a, HDMI 2.0b, and dual-link DVI-D. This DVI connector lacks analog pins; should you still have an analog VGA monitor, you'll have to buy an active DVI-to-VGA adapter.

NVIDIA has updated their display engine with the Turing microarchitecture, which now supports DisplayPort 1.4a with support for VESA's nearly lossless Display Stream Compression (DSC). Combined, this enables support for 8K@30Hz with a single cable or 8K@60Hz when DSC is turned on. For context, DisplayPort 1.4a is the latest version of the standard that was published in April, 2018.

At CES 2019, NVIDIA announced that all their graphics cards will now support VESA Adaptive Sync (aka FreeSync). While only a small number of FreeSync monitors have been fully qualified with G-SYNC, users can enable the feature in NVIDIA's control panel regardless of whether the monitor is certified or not.


The board uses one 8-pin power connector. This input configuration is specified for up to 225 watts of power draw.


GeForce RTX 2060 does not support SLI.

Disassembly


The cooler uses an aluminium fin-stack heatsink. A copper base plate makes contact with the GPU, and two flattened copper heat pipes spread heat across the heatsink. Thick thermal pads pull some heat from the memory chips. Two 90 mm fans ventilate the heatsink.


The metal backplate protects the card against damage during installation and handling.


Interesting design choice. Not only did EVGA use thermal pads as thick as pencil erasers, but they stacked up two near the main cluster of memory chips, to reach between the two flattened heat pipes. Perhaps they did so to disperse retention force rather than convey heat. Now, this thick thermal pad of course doesn't transfer heat from the memory chips to the heatsink all that well as a lot of heat will migrate through the BGA solder balls and into the PCB instead.
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