Team Group T-Force Cardea IOPS 1 TB Review 0

Team Group T-Force Cardea IOPS 1 TB Review

Test Setup »

Packaging

Package Front
Package Back


The Drive

SSD Front
SSD Back

The drive uses the M.2 2280 form factor, which makes it 22 mm wide and 80 mm long.

SSD Interface Connector

Like most M.2 NVMe SSDs, the Team Group Cardea IOPS connects to the host system over a PCI-Express 3.0 x4 interface.

SSD Teardown PCB Front
SSD Teardown PCB Back

On the PCB, you'll find the controller, four flash chips, and one DRAM chip.


Included in the package is this heatspreader which Team Group calls "Graphene." It is definitely not Graphene because it's not electrically conductive. It just looks like black paint to me—the actual cooling, or rather heat spreading, is done by the thin copper foil pictured below.


One side has sticky glue, which makes it easy to install the heatspreader.


If you want even better cooling performance, a large metal heatsink is included, too. It uses sticky tape and a clip mechanism to attach the heatsink to the SSD.

Chip Component Analysis

SSD Controller

The flash controller is made by Phison and supports 3D TLC, QLC, and PCI-Express 3.0 x4. It uses eight flash channels and is produced on a 28 nm process at TSMC Taiwan.

SSD Flash Chips

The four flash chips are Toshiba 96-layer 3D TLC NAND.

SSD DRAM Chip

A single Kingston DDR3 chip provides 256 MB of DRAM storage for the controller to store the mapping tables. This is a surprisingly small amount of DRAM for a 1 TB SSD; normally, you'd expect 1 GB per 1 TB.
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Jul 3rd, 2022 17:04 EDT change timezone

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