Team Group MP33 512 GB M.2 NVMe SSD Review - Zero Thermal Throttling 5

Team Group MP33 512 GB M.2 NVMe SSD Review - Zero Thermal Throttling

Test Setup »

Packaging

Package Front
Package Back


The Drive

SSD Front
SSD Back

The drive uses the M.2 2280 form factor, which makes it 22 mm wide and 80 mm long.

SSD Interface Connector

Like most M.2 NVMe SSDs, the Team Group MP33 connects to the host system over a PCI-Express 3.0 x4 interface.

SSD Teardown PCB Front
SSD Teardown PCB Back

On the PCB, you'll find the controller and four flash chips; a DRAM chip is not available.

Chip Component Analysis

SSD Controller

The flash controller is made by Phison and is a new model with support for 3D TLC, PCI-Express 3.0 x4, and DRAM-less operation. It uses four flash channels and is produced on a 28 nm process at TSMC Taiwan.

SSD Flash Chips

The four TLC flash chips are made by Toshiba, built using 96-layers on a 15 nanometer 3D NAND production process.
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