The drive uses the M.2 2280 form factor, which makes it 22 mm wide and 80 mm long.
Like most M.2 NVMe SSDs, the Team Group MP33 connects to the host system over a PCI-Express 3.0 x4 interface.
On the PCB, you'll find the controller and four flash chips; a DRAM chip is not available.
Chip Component Analysis
The flash controller is made by Phison and is a new model with support for 3D TLC, PCI-Express 3.0 x4, and DRAM-less operation. It uses four flash channels and is produced on a 28 nm process at TSMC Taiwan.
The four TLC flash chips are made by Toshiba, built using 96-layers on a 15 nanometer 3D NAND production process.