Thermalright XP90-C Review 4

Thermalright XP90-C Review

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Introduction

Features:
  • All copper design for maximum performance
  • Multiple heatpipes for well spread heat around copper fins
  • Soldered fins to copper base to make effective contact
  • Compatibility across multiple platforms (socket 478/754/775/939/940)
  • Enormous wingspan gives extra cooling to MOSFET or NB chipset
Technical Spec.:

Dimension:
  • L116 x W96 x H75 (mm) Fin only, without fan
  • L116 x W96 x H96 (mm) Fin only, with 25mm thick fan
Weight:
  • 690g (heat sink only)
Recommended Fan
  • Maker: Panaflo (Panasonic)
  • Model: FBL09A12M
  • Size: 92 x 92 x 25 (mm)
  • Bearing: Hydro Wave
  • Voltage: 12V
  • Speed: 2450 rpm
  • Air Flow: 48 CFM
  • Noise Level: 30.0 dBA
  • Weight: 110g (3.88 oz)
AMD: Athlon64 FX 3200+ (socket 939/940) /Athlon64 3200+ (socket 754) and above
Intel: Pentium-4 socket 478 3.2 GHz and above
Intel: Pentium-4 LGA775 2.8GHz and above

For this review the heatsink will be tested with the infamous and outlawed Thermaltake Silent Cat fan.

Features:
  • Application for CPU Heat Sink (for 80x80mm mounting hole pattern)
  • High performing fan, increase airflow by intake air from multi-directional
  • Multi-directional air intake increases airflow while keeping the relative noise at minimal
  • Unique fan frame design significantly reduce the noise level
  • White color, different to traditional styling
  • 90 to 80mm Fan Bracket Adapter included
Detail Specifications
  • P/N: A2013
  • Fan Speed: 250010% RPM
  • Fan Color : White
  • Max. Air Flow: 52.24CFM
  • Fan Dimension: 90x90x25mm
  • Max. Air Pressure: 2.84mmH2O
  • Rated Voltage: 12V
  • Noise: 21 dBA
  • Started Voltage: 7V
  • Bearing Type: 1 Ball 1 Sleeve
  • Rated Current: 0.18A
  • Life Expectation: 60,000 hrs
  • Power Input: 2.16W
  • Connector: 3 Pin
  • Weight: 103 g(0.23lb)

Packaging

The packaging for the XP-90C is the same as the traditional Thermalright packaging, consisting of a plain cardboard box with foam inserts and smaller boxes with the accessories.

Included with the kit are the standard retention module, the LGA775 mounting hardware (the LGA775 RM, backplate, insulating plastic sheet and a set of screws), two sets of fan clips (one for 80mm fans and one for 92mm fans), two longer screws for the standard RM, two silicon strips, and a tube of thermal paste. Thermalright also includes a printed installation guide and a large sticker that you can add to your case and show off your brand loyalty.

A Closer Look

The XP-90C is made the same as its older brother, the XP-90. It consists of four heatpipes and 49 thin fins, 28 of which are attached to its copper base. However, that’s where the similarities end. The XP-90C is all copper, where the XP-90 had a nickel-plated copper base and aluminum fins. On the XP-90C the base does not have a mirror finish (as Thermalright heatsinks never do), but it is flat and relatively smooth. Since the actual size of the base is not much bigger than the CPU heatspreader, the effectiveness of the heatsink has been increased by extending the fins past the base, nearly doubling its size. This adds extra cooling power for the CPU and the surrounding components.

The chrome-plated clips that flank the heatsink allow it to clip onto the retention module. Usually users of a heavy copper heatsink like this would prefer it to be bolted on, but Thermalright has done a wonderful job of making sure this heatsink mounts securely.

The base is made of an extruded piece of solid copper that gets machined flat. The heatpipes rest half in the base and half in the fins. The fins have a near-perfect mirror finish on them, but they smudge and tarnish easily due to the unprotected copper.

The four heatpipes exit the base and curve upwards to the top, where they extend through all 49 fins. Thermalright made sure these pipes extend outward from the heatsink only as much as needed to make sure they do not interfere with any surrounding components.
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