Tuesday, May 19th 2015

CRYORIG Announces New Line of CUSTOMOD Covers and CRYO-Paste

Ahead of Taipei Computex in June, computer cooling innovator CRYORIG is releasing information of two new product lines, the CUSTOMOD line of customization accessories and a new line of CRYO-Paste thermal interfaces. These two new lines are one of the many new items that will be shown at CRYORIG's booth during the coming Computex beginning June 2nd, 2015.

CRYORIG in an act of pushing forward true aftermarket modding and customization possibilities release it's brand new CUSTOMOD line of colored heatsink covers for it's critically acclaimed R1 Universal and R1 Ultimate heatsinks. The CUSTOMOD Cover for R1 will initially come in 6 different colors, Red, Blue, Green, Orange and the original Black and White. Each CUSTOMOD Cover pack comes with two covers for you to match your R1 series heatsink with your PC rig. The high quality finish of the CUSTOMOD Covers has a near metallic feel, fitting perfect with high-end boards from each major mainboard brand.
The CUSTOMOD line will not end with the Covers for R1. CRYORIG plans on introducing many other colors and different coating finishes for the R1 and also for other heatsink models. The CUSTOMOD line will be a stand-alone accessory line for PC users that want the most options to switch and match their PC setup. Currently there are no plans to release fully colored heatsink products.

Working with some of the most well known PC Build/Mod Photographers in Europe, CRYORIG will be featuring the amazing work from Malik Customs, Kurpiewski Concept and many more, to show off the customization possibilities of the CUSTOMOD Covers for R1.

Also being released alongside the CUSTOMOD line of products during Computex will be three new CRYO-Paste thermal interface products, the CP5, CP7 and CP15. Each will feature different characteristics, and will be leveled based on Thermal Performance, Spread Ease and Particle Density. The CP5 will be the absolute best in Performance and Particle Density that CRYORIG has ever had. While CP7 will be a good combination of Performance and easy to apply and spread. The CP15 is extremely easy to apply and is perfect for entry level users. A mini spreader that's specially designed for CPU application is also included, as well as an alcohol pad to clean the CPU surface for a pristine application.

The CUSTOMOD Cover for R1 and the CP5/7/15 will all be on show at Taipei Computex 2015, at Nangang Exhibition Center booth J1318. Both lines will be available worldwide summer, 2015.

For more information, visit the product pages of CUSTOMOD R1 and Cryo Paste.
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16 Comments on CRYORIG Announces New Line of CUSTOMOD Covers and CRYO-Paste

#1
adulaamin
I'd love to buy one of their coolers. Sadly they're not available here. :(
Posted on Reply
#2
romeg
I've used only Noctua and Phanteks coolers, but I've read so many great reviews and comments about Cryorig products that I'll definitely try their R1 in my upcoming Skylake build.
Posted on Reply
#3
cokker
Are they seriously telling you to spread thermal paste?

Don't do this on CPU's...
Posted on Reply
#4
P4-630
cokkerAre they seriously telling you to spread thermal paste?

Don't do this on CPU's...
I always do that, like so many, works well.
Posted on Reply
#5
ironwolf
cokkerDon't do this on CPU's...
...And why not? It's the tried-and-true method since like forever. I prefer to visually see a good even distribution before I slap the cooling device on the processor.
Posted on Reply
#6
ZoneDymo
ironwolf...And why not? It's the tried-and-true method since like forever. I prefer to visually see a good even distribution before I slap the cooling device on the processor.
Posted on Reply
#7
Patriot
ironwolf...And why not? It's the tried-and-true method since like forever. I prefer to visually see a good even distribution before I slap the cooling device on the processor.
Tried and true method is 1.5-2 rice grain dot in the center and let it fill in where it needs.
Trying to spread it yourself gets bubbles.
Posted on Reply
#8
64K
People that tell you to not spread the paste is because they believe that you can end up with air pockets. I don't know if that's true but I've always put a small pea size blob in the center of the CPU and mount the heat sink. It always works fine.
Posted on Reply
#9
P4-630
PatriotTried and true method is 1.5-2 rice grain dot in the center and let it fill in where it needs.
Trying to spread it yourself gets bubbles.
I never had any bubbles with spreading, unless you put too much on it maybe.
Always had cool CPU temps.

Everybody has it's own way of doing I guess...
Posted on Reply
#10
Patriot
P4-630I never had any bubbles with spreading, unless you put too much on it maybe.
Always had cool CPU temps.

Everybody has it's own way of doing I guess...
Try it the other way and watch your temps drop. :)

of note... direct touch heatpipe coolers require a bit more fun need to put a dot on each of the heatpipes.
Posted on Reply
#11
Fx
cokkerAre they seriously telling you to spread thermal paste?

Don't do this on CPU's...
I have always spread thermal paste and always attained excellent results on dozens of PCs.
Posted on Reply
#12
buildzoid
ZoneDymo
That video has been proven wrong time and time again.
Pudget Systems testing
My testing
Der8auer also said in an interview on the OCshow that using a credit card in his testing is the most reliable. I can't find his tests because their scattered around various forums.
Posted on Reply
#14
Initialised
FxI have always spread thermal paste and always attained excellent results on dozens of PCs.
Not really a representative sample. I worked on custom PCs, dozens a week, when I had the builders change from spreading to the pea sized dot we saved loads on CPU paste, our return rate dropped and the frequency of the testers re-pasting or mounting CPU coolers due to high temperatures reduced resulting in higher throughput.
Posted on Reply
#15
SteveS45
Remember that TIM no matter how good, is never as good as physical contact between metal. An added layer adds extra resistance. TIM is meant to fill up the microscopic pores and holes on the metal surface on the CPU and the heatsink. Applying too much just causes heat issues. From my own testing, an extremely thin layer (barely visible) turns in good and even results. Pea and "X" methods are sometimes terrific, and sometimes just average.
Posted on Reply
#16
RejZoR
I always spread and apply force from one side to prevent forming of air bubbles. I only use spot application when I'm lazy. But I hate the fact that you can't ever be sure if it was spread across entire surface or not...
Posted on Reply
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