Monday, December 3rd 2007
OCZ Announces “Freeze” Extreme Thermal Compound Based on a Proprietary Formula
OCZ Technology Group, Inc. a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today released a unique thermal compound, Freeze, to their line of premium cooling products. Using the latest innovations in thermal management compounds, OCZ Freeze has higher heat conductivity potential than leading silver-based thermal pastes on the market today, offering an ultra-reliable solution for all computing environments.Based on a proprietary formulation of thermally conductive ingredients, OCZ Freeze can lower CPU core temperature as much as ten percent when compared to conventional silver-based compounds that are a popular choice amongst enthusiasts. OCZ Freeze compound helps maximize overclocking results by reducing the thermal barrier between the CPU and cooler, giving you a performance edge during the toughest computing situations.
"Cooling efficiency of any heatspreader or cooler is determined largely by the removal of the heat from the source," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "Transfer rates are highly dependent on the thermal conductance of any interface material along with its spreadability-the higher the spreadability, the thinner the interface layer will be, resulting in better heat transfer between the IC and the cooler. The new Freeze Extreme Conductivity Thermal Compound, based on a novel formula of environmentally-safe, non-silver based components, combines low viscosity with high thermal conductivity for superior performance compared to even our own leading products."
Combining low thermal resistance with high conductivity, OCZ Freeze is the premium choice for enthusiasts looking to get the maximum overclock from their CPU, and supports the stability needed to push your system to its limit.
For more information on the OCZ Freeze Extreme Thermal Compound, please click here.
Source:
OCZ Technology
"Cooling efficiency of any heatspreader or cooler is determined largely by the removal of the heat from the source," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "Transfer rates are highly dependent on the thermal conductance of any interface material along with its spreadability-the higher the spreadability, the thinner the interface layer will be, resulting in better heat transfer between the IC and the cooler. The new Freeze Extreme Conductivity Thermal Compound, based on a novel formula of environmentally-safe, non-silver based components, combines low viscosity with high thermal conductivity for superior performance compared to even our own leading products."
Combining low thermal resistance with high conductivity, OCZ Freeze is the premium choice for enthusiasts looking to get the maximum overclock from their CPU, and supports the stability needed to push your system to its limit.
For more information on the OCZ Freeze Extreme Thermal Compound, please click here.
31 Comments on OCZ Announces “Freeze” Extreme Thermal Compound Based on a Proprietary Formula
:laugh::roll::laugh::roll::laugh::roll:
:toast:
Therefore be it resolved that OCZ shall allow TPU staff to test the “Freeze” Extreme Thermal Compound!
I mean us ;)
it would be so sweet if they could acheive their goal with that product.
ive always liked OCZ because of their interest in the enthusiast community, not to mention the other OBVIOUS reasons.
:toast:
and i certainly am sick of the whole as5/mx2 debate, i'd like to see a new clear winner that becomes a standard on top. though a problem i see is the proprietary formula bit, if this stuff works and lives up to its name, then we might see this costing a good amount of money and the prices of as5/mx2 dropping
Based on OCZ's site:
ten percent* when compared to conventional silver-based compounds that are a popular choice amongst enthusiasts
*measurements based on comparison with OCZ Ultra 5+ silver-based compound
Does OCZ's Ultra 5+ work well in the first place?
wait a second ...
IT IS TOOTHPASTE! On a more serious note, I 200th that notion for a review.
rofl :roll:
:toast:
10% is no joking matter
:toast:
Good luck if you review this :)
Thermal compounds are one of the hardest things to get an accurate, objective review with due to the number of variables involved (ie. Amount of paste, HS pressure, cure time, etc.)
I would like to see it reviewed though.
Maybe you could use a CPU with a TDP of ... oh ... ~130W? :D