Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.

ADATA Industrial, the world's leading brand for industrial-grade embedded storage, officially released today its SATA 31D series of industrial-grade solid-state drives including 2.5-inch ISSS31D, M.2 2280 IM2S31D8, and M.2 2242 IM2S31D4, designed for retail terminals and embedded systems.

The SATA 31D series of industrial-grade SSDs utilize 112-layer 3D TLC flash memory developed by WDC, boasting a P/E Cycle of 3,000 which is comparable to MLC. The 31D series also offers a variety of ultra-thin and compact mainstream specifications such as SATA 2.5-inch, M.2 2280, M.2 2242, and various capacity options from 128 GB to 2 TB. 112-layer 3D NAND (BiCS5) 31D series SSDs all support thermal throttling technology, which reduces SSD transmission performance in stages to effectively mitigate the risk of data damage due to overheating. Furthermore, a LDPC ECC error correction mechanism and End-to-End Data Protection technology ensure reliable data transfer and improve data integrity. The 31D series is eminently suitable for POS systems, information kiosks, digital signage, and embedded equipment.

KIOXIA is betting big on enterprise flash storage, and demoed several of its new and already-launched NVMe products based on the company's 162-layer 3D NAND flash memory, aka 6th Generation BiCS flash. Starting off, we see several single-chip solutions, namely the BiCS5 eTLC, the BiCS Industial TLC, and the BiCS5-QLC. These are complete NVMe SSDs on a single package, targeting embedded systems, industrial PCs, and the likes. They can even be directly embedded on server motherboards to serve as boot drives, freeing up precious chassis space for the main storage devices.

The EM6 is an enterprise network-attached SSD in a 2.5-inch form-factor. This is a NAS-on-a-stick that can be deployed at large scale, and accessible as a network resource, or as an NVMe-over-Fiber device. The CM7 is a high-capacity 2.5-inch (EDSFF E3.S) SSD that comes in sizes of up to 30 TB, and has PCI-Express 5.0 x4 interface with NVMe 2.0 protocol, with endurance of up to 3 DWPD and offering FIPS 140-33 security. We also see the XD6 line of EDSFF E1.S form-factor NVMe SSDs with PCIe 4.0 interfaces, up to 3.84 TB capacity, and 1 DWPD endurance.

ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products today announces the industrial-grade ADATA 31C series 112-layer 3D NAND (BiCS5) solid state drives (SSD) utilizing the SATA III interface. They include the ISSS31C 2.5-inch, IM2S31C8 M.2 2280, and IM2S31C4 M.2 2242 SSDs. All three SSDs are designed to be energy efficient, feature high capacities, and are well suited for high-load industrial systems relating to industrial computing, embedded devices, automation, networking, transportation, and other fields.

The industrial-grade ISSS31C 2.5-inch, IM2S31C8 M.2 2280, and IM2S31C4 M.2 2242 SSDs are all equipped with 112-layer 3D TLC (BiCS5) flash memory developed by WDC and KIOXIA and come with a maximum capacity of 2 TB. They have undergone rigorous temperature verification and testing to ensure they can operate optimally in a wide range of temperatures (from -40 °C to 85 °C) to ensure excellent quality, reliability, and durability.

AI at the edge comes with a host of challenges: limited processing resources, small storage capacities, insufficient memory, security concerns, electrical power requirements, limited physical space on edge devices, and excessive costs. That being said, there is an enormous need for AI at the edge - for devices to learn fast and make decisions in real time. Issues such as latency and distance are current drawbacks that hold edge-to-cloud AI back from reaching its full potential. In some cases, cloud data centers can be as far as hundreds or even thousands of kilometers away from edge devices. Reducing the distance and therefore the latency, by bringing AI into the edge device itself, can open up a world of new possibilities. And, compared to edge-to-cloud AI, AI-enabled edge devices don't need to rely on a stable internet connection, nor do they have as much vulnerability to cyber-security issues, because they don't send data offsite.

Edge AI box computers equipped with compact and high-capacity storage is one of the key factors to make AI come true at the edge. By offloading computation and storage from the cloud to the edge itself, edge computing is enhancing the power and capabilities of the IoT. To help make this a reality, SP Industrial has launched the new MEA3FEV0 SSD Series. This industrial-grade PCIe Gen 3x4 SSD series features support for NVMe 1.3 and BiCS5 112-layer 3D TLC NAND Flash technology. It ticks many boxes that are common problems for edge AI computing: large storage capacities up to 2 TB, small M.2 2242 form factor for minimal space usage, lower power consumption compared to BiCS4, and affordable cost with a DRAM-less design.

Inspired by the way people work today, Western Digital Corp. introduced the Western Digital PC SN740 NVMe SSD to help address the unique needs of the hybrid workforce and elevate the computing experience. "Hybrid and remote work environments have become the 'new normal' for businesses over the past few years and have driven tremendous growth in PC shipments," said Eric Spanneut, vice president, Client and Enterprise SSDs, Flash Business Unit, Western Digital. "As work habits and locations change, there is a tremendous opportunity to support our corporate and commercial PC OEMs with storage solutions that are thin and light, have advanced security features and pack more performance while preserving power efficiency."

Featuring a DRAM-less architecture and leveraging Western Digital's in-house SSD controller design, BiCS5 3D NAND, firmware development, and vertical integration, the new SN740 NVMe SSD underscores the company's strengths in developing innovations that allow customers to unlock the potential of data.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a global leading brand of industrial-grade memory, including flash storage products and DRAM modules, today announces that its in-house developed firmware for 112-Layer (BiCS5) 3D NAND PCIe solid state drives has become University of New Hampshire InterOperability Laboratory (UNH-IOL) NVMe 1.4 certified. The certification reaffirms ADATA's core competencies in R&D and commitment to offering high performance SSDs. UNH-IOL is an independent test facility that provides interoperability and standards conformance testing for networking, telecommunications, data storage, and consumer technology products.

The IM2P32A8 M.2 2280 and IM2P32A4 M.2 2242 industrial-grade solid state drives will benefit from the newly certified firmware. What's more, both SSDs feature 112-layer 3D TLC Flash memory developed by WD and KIOXIA, supports the PCIe Gen3x4 interface, and provides large capacities of up to 2 TB. With ADATA's firmware, they provide improved performance and interoperability. In addition to processing large volumes of data, the SSDs can also serve as storage devices or a boot disk, which can fulfill the needs of applications such as 5G, Industrial Internet of Things (IIoT), smart cities, and telemedicine.

5G's rapid deployment is spiking demand for large amounts of data storage. Emerging 5G applications such as telemedicine, smart healthcare and smart poles require storage devices that can offer high-speed, low-latency and stable operation during high-quality, high-resolution image data transmission to permit AI image recognition and auxiliary diagnoses. Luckily, Apacer's latest PCIe Gen4 x4 SSD is stepping up to the plate. It adopts the latest BiCS5 112-layer 3D NAND Flash memory technology. This means ultra-high performance and reliability, a stable supply and - crucially - a more competitive cost per unit.

Real-time imaging data plays an important role in 5G healthcare applications. But to be effective, it requires high-resolution images that are extremely clear and focused. According to a recent report, "5G in Healthcare Market" released by MarketsandMarkets, telehealth and robotic surgery both grew in response to the challenges posed by COVID-19, and 5G wearable medical devices also became more prevalent for the same reason. Currently, the 5G healthcare market "is valued at an estimated USD 215 million in 2021 and is projected to reach USD 3,667 million by 2026, at a CAGR of 76.3% during the forecast period."

Western Digital Corp. (Nasdaq: WDC) today reported fiscal second quarter 2022 financial results. "I'm proud of the Western Digital team for delivering another quarter of strong results that exceeded guidance, even in the midst of ongoing supply chain disruptions and COVID-related challenges," said David Goeckeler, Western Digital CEO. "While we continue to experience strong demand across our end markets, these challenges continue to present a headwind to near-term results. We've executed well in building a solid foundation for future profitable growth driven by innovative products within our flash and hard drive businesses. As these transitory headwinds subside, we expect to emerge in a stronger position to drive better through-cycle results, creating value for our shareholders, employees and customers."

The company generated $666 million in cash flow from operations, made a total debt repayment of $2.21 billion, issued $1.00 billion in notes and ended the quarter with $2.53 billion of total cash and cash equivalents. During the quarter, the company fully repaid the remaining balance of its Term-Loan B-4 in an amount of $943 million, and repaid $1.27 billion on its Term-Loan A-1. In addition, the company closed a public offering of $1.00 billion aggregate principal amount in senior unsecured notes, bringing total gross debt outstanding to $7.40 billion at the end of the fiscal second quarter.

According to research from Mordor Intelligence, the facial recognition market was valued at USD 3.72 billion in 2020, and is projected to be valued at USD 11.62 billion by 2026, registering a CAGR of approximately 21.71% over the forecast period. Facial recognition technology is finally coming into its own. It has gone beyond police officers looking for a suspect on a surveillance camera. Now, smart AI-driven facial recognition technology is common in smart retail, finance, transportation and even healthcare applications. But as adoption spreads, facial recognition devices are being required to operate in ever-more-challenging locations and environments. Keeping all these developments in mind, Apacer developed and has now released the CH120 series of industrial cards powered by the latest 112-layer BiCS5 3D TLC NAND technology, optimized for both AI facial recognition and smart IoT applications.

BiCS5 promises concrete, measurable advantages for SSDs, as it greatly improves capacity while keeping transmission latency ultra-low. In fact, Apacer's A2-grade CH120 series offers 4,000/2,000 IOPS for 4K image read/write performance. And compromised environments won't slow these cards down either - their wide temperature range means they operate smoothly in temperatures as low as -40 and as high as 85 degrees Celsius. The CH120 series of industrial cards are also equipped with value-adding over-provisioning and SLC-liteX technology. The former drastically reduces write amplification, extending an SSD's operational lifespan, while the latter allows an SSD to increase its endurance to up to 30,000 P/E cycles. That's 10 times higher than standard 3D TLC SSDs.

Kioxia Corporation, a world leader in memory solutions, today announced two new solid state drive (SSD) series scheduled to be released in the fourth quarter of 2021. The EXCERIA PRO and EXCERIA G2 Series are the company's latest consumer-grade solutions for today's hardcore enthusiasts and mainstream DIY system builders. Kioxia's new SSDs, which are products under development, will be on reference exhibit at the China Digital Entertainment Expo and Conference (ChinaJoy) in Shanghai from July 30th to August 2nd.

Using the next generation PCIe Gen4 x4 interface, the EXCERIA PRO Series is built for demanding PC environments. This brand new series will offer more than 2x the max sequential read speeds of the PCIe Gen3 based EXCERIA PLUS Series, delivering a high performance storage experience for content creators, gamers and professionals.