SiPearl, the company designing the highperformance, low-power microprocessor for European supercomputers, has entered into a business collaboration agreement with AMD to provide a joint offering for exascale supercomputing systems, combining SiPearl's HPC microprocessor, Rhea, with AMD Instinct accelerators.

Initially, AMD and SiPearl will jointly assess the interoperability of the AMD ROCm open software with the SiPearl Rhea microprocessor and build an optimized software solution that would strengthen the capabilities of a SiPearl microprocessor combined with an AMD Instinct accelerator. This joint work targets porting and optimization activities of the AMD HIP backend, openMP compilers and libraries, will enable scientific applications to benefit from both technologies.

During The Wall Street Journal Tech Live conference, Greg Joswiak—Apple's SVP of worldwide marketing—begrudgingly said that Apple will comply with the European Union's USB-C charging mandate. He said that Apple has been in a "little bit of disagreement" with the EU over the change to a common charging standard. He made a comment about the fact that the EU initially wanted to standardise on micro USB for charging, but admitted that it never happened. He also claimed that neither USB-C or Apple's own lightning connector would exist today if micro USB had been mandated as the charging standard over 10 years ago, which may or may not be true.

According to Greg Joswiak, Apple feels that their change to chargers fitted with a USB-C port is good enough, since it allows anyone to plug in a USB-C cable into Apple's chargers and charge whatever device they like, regardless of the device connector. However, he conveniently forgot to mention that for such a scenario to work, everyone would have to carry a charging cable around with them, the part most people forget about. He also claimed that moving to USB-C means additional e-waste, due to a billion plus lightning cables being in the market already. The argument doesn't seem to hold though, as it's not as if current Apple device owners are just going to throw out their current devices, because Apple is being forced to move to USB-C. The same holds true for most people who have micro USB devices, they didn't throw them away just because they got some USB-C devices. In fairness, the Lightning cables would end up as e-waste at some point in the future, but so do many old cables of every single type over time. Apple would've preferred the EU not to interfere, as the company believes its solution is superior to USB-C for its customers.

Semiconductor manufacturers worldwide are forecast to expand 300 mm fab capacity at a nearly 10% compound average growth rate (CAGR) from 2022 to 2025, reaching an all-time high of 9.2 million wafers per month (wpm), SEMI announced today in its 300 mm Fab Outlook to 2025 report. Strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions are driving much of the growth.

"While shortages of some chips have eased and supply of others has remained tight, the semiconductor industry is laying the groundwork to meet longer-term demand for a broad range of emerging applications as it expands 300 mm fab capacity," said Ajit Manocha, SEMI President and CEO. "SEMI is currently tracking 67 new 300 mm fabs or major additions of new lines expected to start construction from 2022 to 2025."

From 2024, all mobile devices in the European Union will have to use USB-C as the standard charging port, courtesy of a new law that was passed by the European Parliament. This means that mobile phones, tablets, digital cameras, headphones and headsets, handheld videogame consoles and portable speakers, e-readers, keyboards, mice, portable navigation systems and earbuds, all have to sport a USB-C port for charging in the near future. Many of these devices already do, with the main exception being Apple, although many lower-end devices still rely on micro USB, due to the lower cost. The European Parliament voted 602 in favour of the new law, with only 13 parliamentarians being against and eight that abstained, which shows that most EU nations were in favour of the move.

From 2026, laptops which adhere to the USB PD 3.0 standard, i.e. up to 100 Watts, will be required to charge via USB-C as well. As such, it seems like the EU didn't enforce support for USB PD 3.1, which goes up to 240 Watts. The EU is also planning on enforcing a common wireless charging standard, which is expected to come into effect by the end of 2024. It's not clear which standard will be chosen, but it's highly likely to be the Qi standard, as it's the most commonly used wireless charging standard.

Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022, SEMI announced today in its latest quarterly World Fab Forecast report. The report also shows the global fab equipment industry increasing capacity this year and again in 2023. "After achieving a record level in 2022, the global fab equipment market is projected to remain healthy next year driven by new fabs and upgrade activity," said Ajit Manocha, SEMI President and CEO.

Taiwan is expected to lead fab equipment spending in 2022, increasing investments 47% YOY to US$30 billion, followed by Korea at US$22.2 billion, a 5.5% decline, and China at US$22 billion, a 11.7% drop from its peak last year. Europe/Mideast this year is forecast to log record high spending of US$6.6 billion, a 141% YOY surge this year though outlays remain comparatively smaller than in other regions. Strong demand for high-performance computing (HPC) advanced technologies is driving the region's jump in spending. The Americas and Southeast Asia are also expected to register record high investments in 2023.

With only a couple of days to go until the official retail availability of the Ryzen 7000-series CPUs and accompanying X670 and X670E motherboards, early pricing of the motherboards are starting to crop up in Europe. Courtesy of @momomo_us we now have pricing from an unknown European retailer for 11 ASUS models, as well as MSI's Godlike board. We also managed to dig up some additional pricing over at Geizhals, which is a European price comparison site, for five ASRock models and one from Gigabyte. Hopefully we're looking at placeholder pricing here, as it's not looking good in terms of value for money. Admittedly, ASUS is known for charging a premium over its competitors, but it's not looking good anywhere right now.

Starting with @momomo_us pricing and MSI for no specific reason, its upcoming MEG X670E Godlike is listed at €2,399 and that doesn't include any kind of liquid cooling accessories. This has to be one of the most expensive consumer motherboards ever, if this is the actual retail pricing it'll sell for. Moving over to ASUS, its Prime X670-P model is listed at €418.53, with the WiFi version jumping to €446.89. This is the first indicator that these are not the actual retail prices, as WiFi versions of motherboards tend to have a $/€/£10-20 premium over non-WiFi models. We're not going to go over every individual board price here, simply look at the attached pictures, but based on these early prices, ASUS has two models for well over €1,000, the ROG Crosshair X670E Hero and the ROG Crosshair X670E Extreme, with the latter being listed at €1,486.95.

Microsoft's USD $68.7 billion acquisition of Activision-Blizzard is running into hurdles with competition regulators in both the UK and the EU, with both Brussels and London hinting at a thorough investigation into the impact the acquisition will have on competition in their respective markets. Microsoft is already a game publisher under Microsoft Games Studio, and makes at least two leading gaming platforms—the Xbox and Windows PC; whereas Activision-Blizzard own a constellation of dozens of game developers, and a mountain of IP over some of the most valuable game franchises of all time.

Britain's Competition and Markets Authority has hinted that the acquisition warrants a "second-phase investigation" since it has concerns that the deal would "result in a substantial lessening of competition within a market or markets in the United Kingdom." Over in Brussels, the EU market regulators, too, are taking a closer look at what the deal could entail for European consumers. Sony Computer Entertainment is particularly unhappy with the acquisition, and is the primary source of opposition to the deal that's invoked by regulators. Sony fears that with this acquisition, Microsoft will be in a position to deny popular game franchises such as "Call of Duty" to the PlayStation platform, and will have too much control over whether Sony can deliver an experience comparable or better than that of the Xbox.Many Thanks to DeathtoGnomes for the tip.

ASRock Arc A380 Challenger ITX graphics card started selling in Europe. German retailer Mindfactory has it listed at 189€, including taxes (non-referral link), and is ready to ship. This is possibly the first listing of the A380 in the EU. Until now, you needed to import the A380 from China (sold by GUNNIR), or from the US, where the ASRock card has been listed on Newegg for a few weeks now. The ASRock A380 Challenger ITX uses an aluminium monoblock heatsink not unlike Intel CPU HSFs, but ventilated by a noise-optimized single 100 mm fan. The card is 19 cm long, and so bags ITX chops. ASRock is running the A380 at a boost frequency of 2.25 GHz, while the memory ticks at 15.5 Gbps (GDDR6-effective). The card features a single 8-pin PCIe power connector.

The intensification of the greenhouse effect has caused unusually high summer temperatures and heat waves that continue to engulf Europe and the rest of the world. Extreme temperatures have caused numerous data centers in Europe to suspend operations to ensure the safety of their equipment and data. In view of this, Team Group has placed greater emphasis on developing more innovative solutions for high-temperature applications, providing consumers with more reliable and durable industrial storage products. Equipped with the industry's first temperature sensing and warning technology and exclusive liquid cooling technology (Taiwan Utility Model Patent: M626519), Team Group's industrial products can help maintain the continuous operation of industrial equipment and monitor equipment temperature to avoid unexpected problems. These solutions help industrial customers and equipment reduce carbon emissions and move towards the goal of sustainable development while remaining under stable operation.

Intel and MediaTek today announced a strategic partnership to manufacture chips using Intel Foundry Services' (IFS) advanced process technologies. The agreement is designed to help MediaTek build a more balanced, resilient supply chain through the addition of a new foundry partner with significant capacity in the United States and Europe. MediaTek plans to use Intel process technologies to manufacture multiple chips for a range of smart edge devices. IFS offers a broad manufacturing platform with technologies optimized for high performance, low power and always-on connectivity built on a roadmap that spans production-proven three-dimensional FinFET transistors to next-generation breakthroughs.

"As one of the world's leading fabless chip designers powering more than 2 billion devices a year, MediaTek is a terrific partner for IFS as we enter our next phase of growth," said IFS President Randhir Thakur. "We have the right combination of advanced process technology and geographically diverse capacity to help MediaTek deliver the next billion connected devices across a range of applications."

Today ASML Holding NV (ASML) has published its 2022 second-quarter results. Q2 net sales of €5.4 billion, gross margin of 49.1%, net income of €1.4 billion. Record quarterly net bookings in Q2 of €8.5 billion. ASML expects Q3 2022 net sales between €5.1 billion and €5.4 billion and a gross margin between 49% and 50%. Expected sales growth for the full year of around 10%.

The value of fast shipments*in 2022 leading to delayed revenue recognition into 2023 is expected to increase from around €1 billion to around €2.8 billion.
"Our second-quarter net sales came in at €5.4 billion with a gross margin of 49.1%. Demand from our customers remains very strong, as reflected by record net bookings in the second quarter of €8.5 billion, including €5.4 billion from 0.33 NA and 0.55 NA EUV systems as well as strong DUV bookings.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and GlobalFoundries Inc., a global leader in feature-rich semiconductor manufacturing, today announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300 mm semiconductor manufacturing facility adjacent to ST's existing 300 mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300 mm wafer per year production at full build-out (~42% ST and ~58% GF).

ST and GF are committed to building capacity for their European and global customer base. This new facility will support several technologies, in particular FD-SOI-based technologies, and will cover multiple variants. This includes GF's market leading FDX technology and ST's comprehensive technology roadmap down to 18 nm, which are expected to remain in high demand for Automotive, IoT, and Mobile applications for the next few decades. FD-SOI technology has origins in the Grenoble (France) area. It has been part of ST technology and product roadmap in its Crolles facility since the early beginnings, and it was later enabled with differentiation and commercialized for manufacturing at GF's Dresden facility. FD-SOI offers substantial benefits for designers and customers, including ultra-low power consumption as well as easier integration of additional features such as RF connectivity, mmWave and security.

Back in January, Intel overturned an antitrust ruling by the EU and didn't have to pay the $1.2 billion fine, but it seems like the company isn't satisfied with getting out of having to pay a huge fine, but is now asking the EU to compensate the company for interest lost. As such, Intel has filed for "payment of compensation and consequential interest for the damage sustained because of the European Commissions refusal to pay Intel default interest" with the EU General Court. The sum of money Intel is asking for is based on the European Central Bank's refinancing rate and as the original fine was levied back in 2009, Intel claims they're owed more than half of the value of the fine.

Intel is also expecting further interest on the money, if the payment is late from the EU. It should be noted that the European Commission has already paid Intel €38 million in interest on the fine that was paid back in 2009, but Intel is clearly not happy and is asking for a much greater sum. However, the battle between the European Commission and Intel isn't over, as the Commission is working on appealing the ruling, so depending on the outcome of that appeal, Intel might have to pay back the fine to the EU. For those that don't remember the original reason for the antitrust fine, Intel was accused of giving rebates to certain partners and system integrators to make sure they didn't use AMD products in their systems, among other things.

Graphics card prices have been on a steady decline in the past few months, following their peak in May of last year when we saw double and triple pricing compared to the baseline MSRP value. According to the 3DCenter.org report, which tracks graphics card prices in Germany and Austria, we have information that AMD GPU prices have dipped below MSRP, while NVIDIA GPUs are very close to baseline listed prices. The report tracks Ethereum mining profitability and displays it in the yellow line. As the line is declining, so are the GPU prices. For AMD, the prices are now 8% below the 100% of MSRP. At 92%, consumers can find AMD GPUs at a slight discount. While AMD cards are slightly cheaper, NVIDIA GPUs are now at 102% of the MSRP, the lowest price point since the launch.

Recent news suggests that TSMC isn't too interested in setting up a fab in Europe, but it appears there are other interested parties that are now courting the EU, namely a potential joint venture between GlobalFoundries and STMicroelectronics. The two companies are hoping to get a slice of the same cake as Intel, namely the European Chips Act, to help subsidise the cost of the proposed fab. Although GlobalFoundries are headquartered in New York and STMicroelectronics in Geneva, the latter being a French-Italian conglomerate, the planned location for the new fab will be somewhere in France.

It's highly unlikely that this will be a cutting edge or even a leading edge fab, as neither company is in the business of producing products in those market segments. ST makes a wide range of chips from MCUs and other types of microprocessors, to specialised memory products, a wide range of sensors, MEMS based devices and all kinds of electronics for electrical vehicles, as well as highly specialised components for the space industry. GloFo obviously stepped off the competitive foundry ladder some years ago and have been focusing on specialised processes and nodes since then, such as FD-SOI, a technology, something the two companies announced a joint partnership around earlier this year. As such, it's likely that this potential fab will focus on making parts needed for the automotive industry in Europe, among other things. There's still a long way to go and neither company has made any kind of official statement about the potential partnership as yet.

JUPITER, the first European exascale supercomputer, will be hosted by the Jülich Supercomputing Centre in Germany. Exascale supercomputers are systems capable of performing more than a billion billion calculations per second and represent a significant milestone for Europe. By supporting the development of high-precision models of complex systems, they will have a major impact on European scientific excellence.

Lenovo has today officially opened the doors to its first in-house manufacturing facility in Europe. Based in Ullo, Hungary, the factory focuses primarily on building server infrastructure, storage systems and high-end PC workstations used by customers throughout the Europe, Middle East, and Africa region. Extending Lenovo's international manufacturing operations, the investment represents significant economic potential for both the private and public sectors in Hungary, with increased production capacity, greater potential for collaboration with local vendors, and the creation of new job openings. The site already employs over 1,000 full-time staff in a variety of engineering, management & operational roles, with numbers continuing to increase as the facility moves towards full capacity.

Strong infrastructure, skilled labor and a location at the center of Europe made Hungary the natural location for Lenovo's first European in-house manufacturing facility. In addition, part of Lenovo's investment has been supported with local government incentives through the Hungarian Investment Promotion Agency (HIPA). Francois Bornibus, Senior Vice President and EMEA President, at Lenovo, commented: "With our manufacturing facility in Hungary officially open, we've reached a profound milestone in our global manufacturing network optimization and evolution. Hungary's well-connected location puts us much closer to our European customers so that we can fulfil and sustain their needs while remaining at the forefront of innovation. As our business continues to grow around the world, this incredible new facility will play a key role in our plans to ensure future success and bring smarter technology for all to Europe more sustainably, quickly and efficiently."

Global fab equipment spending for front-end facilities is expected to increase 20% year-over-year (YOY) to an all-time high of US$109 billion in 2022, marking a third consecutive year of growth following a 42% surge in 2021, SEMI announced today in its latest quarterly World Fab Forecast report. Fab equipment investment in 2023 is expected to remain strong.

"The global semiconductor equipment industry remains on track to cross the $100 billion threshold for the first time as shown in our latest update of the World Fab Forecast,"said Ajit Manocha, president and CEO of SEMI. "This historic milestone puts an exclamation point on the current run of unprecedented industry growth."

German media is reporting that Intel will be receiving some €6.8 billion in subsidies for its planned Magdeburg fab. Some €2.7 billion has already been set aside for the 2022 federal government budget and the remaining money will be allocated in the 2023 and 2024 budgets. The Magdeburg member of the Bundestag, Martin Kröber, who announced the budget allocation to the local media, said that Intel's establishment in Magdeburg should be a boost for the entire Saxony-Anhalt area.

Intel's total investment in Magdeburg has a budget in excess of €33 billion, which means that the German government is pitching around a fifth of the total investment. That said, the first fab will only end up somewhere around the €17 billion mark, with space for a further two fabs on the location Intel has selected. Production at the new fab is estimated to begin sometime in 2027. In related news, TSMC is said to have decided on skipping Europe for the time being, largely due to lack of local customers, according to Reuters.

Lawmakers in the European Union have formally agreed to make USB Type-C the standard charging port in the union and although there are still a couple of minor hurdles ahead of it becoming a legal requirement, it's expected to be a requirement by the autumn of 2024. For it to become EU wide legislation, the EU parliament and Council still needs to approve the new law, but considering all sides seem to have largely agreed on the details, this is said to be largely formality at this point. However, the new law isn't just about making USB-C the standard used for charging mobile phones, tablets and other types of portable electronics, including laptops, but it also covers chargers and this is where things get a bit tricky.

The EU is legislating for what it calls a "harmonised fast-charging technology", which means that proprietary fast charging technologies might be out. The USB Power Delivery standard already supports fast charging, but it's still limited compared to some of the proprietary charging standards that are coming out of China, where some companies offer a full charge in 15 minutes. This may in itself not be that big of a deal, as all of these standards still use USB-C connectors and can rely on USB PD as a fallback charging method, but the EU also wants to unbundle chargers from devices. This means that any device that requires a proprietary charger to reach its optimal charging performance, will require consumers to buy a charger that used to come bundled with said device. This might not be a major hassle, but it's still an inconvenience in those cases and it's likely this will lead to higher prices for some products as well.

Hewlett Packard Enterprise (NYSE: HPE) today announced its ongoing commitment in Europe by building its first factory in the region for next-generation high performance computing (HPC) and artificial intelligence (AI) systems to accelerate delivery to customers and strengthen the region's supplier ecosystem. The new site will manufacture HPE's industry-leading systems as custom-designed solutions to advance scientific research, mature AL/ML initiatives, and bolster innovation.

The dedicated HPC factory, which will become the fourth of HPE's global HPC sites, will be located in Kutná Hora, Czech Republic, next to HPE's existing European site for manufacturing its industry-standard servers and storage solutions. Operations will begin in summer 2022.

Apple today announced Self Service Repair is now available, providing repair manuals and genuine Apple parts and tools through the Apple Self Service Repair Store. Self Service Repair is available in the US and will expand to additional countries—beginning in Europe—later this year.

The new online store offers more than 200 individual parts and tools, enabling customers who are experienced with the complexities of repairing electronic devices to complete repairs on the iPhone 12 and iPhone 13 lineups and iPhone SE (3rd generation), such as the display, battery, and camera. Later this year the program will also include manuals, parts, and tools to perform repairs on Mac computers with Apple silicon.

This past week, the EU's Internal Market and Consumer Protection Committee agreed on adopting USB Type-C as the union's standard charging connector, with 43 votes in favour and two against. It's part of the Radio Equipment Directive and it means that USB-C is now very close to becoming the de facto connector for charging a wide range of consumer electronics. The charging standard will apply to what the committee calls small and medium-sized electronic gadgets and include mobile phones, tablets, digital cameras, headphones and headsets, handheld videogame consoles and portable speakers. Exemptions will apply for devices that are too small to incorporate a USB-C port, such a smart watches, health trackers and some sports equipment.

The directive still has to be approved by the EU parliament, which is expected to happen in May during the plenary session. There will be an initial transition period and the new requirements aren't expected to start to apply until early 2024. In addition to the new directive, the MEPs also want to see clear labelling on devices in terms of how much power they can deliver, since this can sometimes be hard to figure out as a consumer. They also want to see clear labelling on product packaging if a charger is supplied or not. Furthermore, the MEPs want the European Commission to present a strategy with regards to wireless chargers by the end of 2026, to make sure there's some kind of minimal interoperability between the various wireless charging standards. This is said to be to try and avoid market fragmentation, as well as to reduce e-waste and to try and prevent consumer "lock-in" to proprietary charging standards. The EU is said to end up with 11 to 13-thousand tons of e-waste from chargers alone on a yearly basis, so it's not hard to see why the union wants to see a unified charging standard for most electronics.

Last week Intel finalised the installation of its first EUV tool in Fab 34, which is located in Leixlip, Ireland. That comes just two months after Intel started installing its first chipmaking equipment in the fab. The EUV tool is made by ASML, but was shipped to Intel in Hillsboro, Oregon, USA first, before being sent back to Europe. It's unclear why it was shipped to the US first, but it's possible that Intel tested the equipment there and made sure it was to its spec, before shipping it to its new fab.

This is the first of several machines from ASML that are expected to be installed in Fab 34 and Intel says it's "a key enabler of Intel 4 process technology". The ASML machine required four unspecified Boeing aircrafts to ship, as well as 35 trucks to bring it to Fab 34. The machine, or tool as Intel calls it, has been sent in parts since December last year and has only now been completely assembled. For more details, see the video after the break.

After months of rumors and speculations, it looks like we are finally going to receive official information from Intel regarding the exact country the company plans to do semiconductor R&D and manufacturing in within Europe. Today, the company published its media alert post, showing that we are finally going to receive exact information tomorrow. As we have previously reported, the current round of suggestions led to Intel building a fab inside Germany; however, it still remains to be confirmed. Once the information is out, we are going to report on it and finally see where team blue is headed next. You can find the announcement below.

As part of its IDM 2.0 strategy, Intel is committed to investing in research and development (R&D) capabilities and manufacturing capacity to meet the surging demand for advanced semiconductors and to build a more resilient, globally balanced supply chain.

Join a webcast with CEO Pat Gelsinger where he will share details of Intel's latest plans for in semiconductor R&D and manufacturing in Europe.

When: 6 a.m. PDT (2 p.m. CET), Tuesday, March 15
Where: Watch live on the Intel Newsroom.
Event Replay: A video replay will be available on the Intel Newsroom following the webcast.