A mysterious Qualcomm Snapdragon "SM8635" model emerged earlier this month—courtesy of ever reliable smartphone tech tipster Digital Chat Station. They claimed that the unnamed mobile chipset had posted an AnTuTu score of roughly 1.7 million, with specifications including one Cortex-X4 core clocked at 2.9 GHz and an integrated Adreno 735 GPU. TSMC's 4 nm process node was also mentioned—not a particularly big revelation since the latest Snapdragon flagship is a 4 nm part. Early guess work pointed to possible Snapdragon 8s Gen 2 or Snapdragon 8 Gen 3 Lite guises, but a Geekbench Browser leak indicates that SM8635 is destined to become "Snapdragon 8s Gen 3," in Digital Chat Station's opinion.

A Realme "RMX3851" android device was tested in Geekbench 6.2.2—stated specifications include a 3.01 GHz "Big" Core clock, Adreno 735 GPU, and a 1+3+4 cluster configuration. Many believe that the SM8635 is positioned as a cut-down alternative to Snapdragon 8 Gen 3 (SM8650-AB), given that Realme specializes in producing value-oriented "near flagship" specced smartphones. Wccftech has spent hands-on time with various Qualcomm Snapdragon 8 Gen 3-powered devices: "You can see in (Realme's Geekbench entry) that the alleged Snapdragon 8s Gen 3 does not perform on the same level as its elder brother, which scores higher in both single and multi-core. For the sake of reference, I have seen the elder sibling going as high as 2,329 in single-core tests and 7,501 in multi-core tests. So, this chipset is performing at half the speed, but of course, this seems like a device that is not completely ready, so the final scores might improve." Further (insider) leaks or an official Qualcomm announcement will confirm whether the posited "Snapdragon 8s Gen 3" moniker is a good guess, although another leaked chip suggests another path. Roland Quandt reckons that a similarly configured "SM7675" SoC will be joining the Snapdragon 7 Gen family.

The current crop of PCIe Gen 5 based M.2 NVMe SSDs run scorching hot to deliver sequential transfer speeds of 10 GB/s, requiring some massive cooling solutions with tiny fans. All this might change, as Phison, a leading SSD controller manufacturer, unveiled three new controllers at the 2024 International CES. One of these that stands out, is the PS5031-E31T, which is built on the 7 nm node, and could power the first Gen 5 SSDs delivering 10 GB/s without elaborate cooling solutions. This is a big upgrade from the 12 nm node used by their first Gen 5 controllers. The PS5031-E31T is a DRAMless controller meant for mainstream Gen 5 SSDs. This controller has a 4-channel flash interface (16 CE), a PCI-Express 5.0 x4 host interface, supports capacities of up to 8 TB, and is claimed by Phison to offer sequential transfer rates of up to 10.8 GB/s, and up to 1500K IOPS random access; exceeding the fastest Gen 4 SSDs.

Phison also updated its high-end controller lineup with the new PS5026-E26 Max14um. This is a variant of the E26 that's designed for the upcoming Micron B58R NAND flash chip that offers 2400 MT/s per channel transfers. Over the 8-channel interface of the E26, this finally unlocks sequential transfer speeds exceeding 14 GB/s reads, and 12.7 GB/s sequential writes. This is merely a revision of the existing E26 with updated power-optimized firmware, the underlying silicon is identical. The E26 Max14um is the first controller to surpass 1000 MB/s in all three PCMark 10 storage tests. We have a sample of an SSD powered by the E26 Max14um in our labs, and will post our review soon.

BIWIN is a major memory and SSD OEM that manufactures products for leading PC brands, including Lenovo, HP, and Acer. These include everything from USB flash drives, to portable SSDs; and even memory DIMMs. Acer has been trying to enter the DIY hardware market in a big way with its Predator brand, it's tapping into BIWIN for the memory side of things. We've had the Acer Predator Hermes DDR5 RGB series at the high-end; and the Pallas II DDR5 series at the entry level, and Acer is looking to fill the gap with the Vesta II DDR5 series. The original Vesta II series won a Red Dot design award in 2022. The Vesta II comes in certain upper mid-range speeds of DDR5-6000, DDR5-6400, DDR5-6600, and DDR5-6800; with capacities that include 32 GB (2x 16), and 64 GB (2x 32 GB). We also ran into some SSDs that strick to Acer's main marquee, which includes the FA200, a PCIe Gen 4 drive, which is based on a high-end Gen 4 platform, with speeds of up to 7.2 GB/s sequential reads, and up to 6.2 GB/s sequential writes. The drive comes in capacities of up to 4 TB.

Switching gears, we see the first Lenovo-branded DIY client SSDs in the retail channel. The LN960 is a fairly premium M.2-2280 drive with a Gen 4 x4 interface, capacities of up to 4 TB, sequential speeds of up to 7.4 GB/s, and a graphene-based heatspreader. The LN860 is an entry-level NVMe drive based on a Gen 3 x4 interface, with sequential speeds of up to 3.5 GB/s. The LS800 is is being offered more as an upgrade option for those still on older machines with a 2.5-inch SATA 6 Gb/s drive bay. It comes in capacities of up to 1.92 TB, has modern SLC caching technology, and offers sequential speeds of up to 520 MB/s.

Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.

QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today launched the new QXG-10G2SF-X710 10GbE network expansion card. Equipped with the advanced Intel Ethernet Controller X710-BM2, this PCIe Gen 3 card (compatible with PCIe Gen 2) can be installed into a QNAP NAS or Windows /Linux PC, instantly augmenting connectivity with two high-speed 10GbE ports.

Featuring a low-noise fanless design, the QXG-10G2SF-X710 comes with two 10GbE SFP+ (10G/1G) network ports. Users can utilize SMB Multichannel or Port Trunking to combine bandwidth, providing up to 20 Gbps of data transfer potential, thereby accelerating large file sharing and intensive data transmission. The QXG-10G2SF-X710 also supports SR-IOV that enhances network resource allocation for VMware virtualization applications, reducing network bandwidth consumption and significantly lowering CPU usage for virtual machine servers (hypervisors).

PlayStation gamers can now experience the speed and technology of Seagate's PCIe Gen 4 NVMe solid state drives (SSD) on their consoles. Today, Seagate Technology Holdings announced its officially licensed for PlayStation Seagate Game Drive PS5 NVMe SSD. The drive offers gamers the latest PCIe Gen 4 NVMe SSD technology and the fastest performance from the company's line of officially licensed for PlayStation storage products - bringing speed, endurance, and high capacity to PlayStation 5.

Delivering sequential read speeds of up to 7,300 MB/s, the Seagate Game Drive PS5 NVMe SSD catalyses PCIe Gen 4 power with transfer rates up to two times faster than PCIe Gen 3 SSDs. The drive is built with a Seagate-validated E18 controller and 3D TLC NAND to provide advanced speed and durability for console gaming. With a minimalistic heatsink that was designed to seamlessly fit the PlayStation 5 console, the SSD maximises gaming performance and protects the drive's storage from thermal throttling. With simple installation, gamers can play PlayStation 5 games directly from the drive.

The Power of Small: Evolution of Data Storage—since computers were built, making them smaller has never stopped. This is especially evident in the industrial sector, where compactness is highly valued. As a crucial component of computers, data storage has undergone a process of miniaturization as well, leading to the era of M.2 interface SSDs. While some ultra compact fanless PC and rugged mobile PC may adopt smaller embedded storage, such as eMMC (Embedded MultiMediaCard), they significantly lag behind M.2 PCIe SSDs in terms of performance. Therefore, M.2 PCIe SSDs have emerged as the superior choice for those seeking top-notch performance and efficiency in their computing experience.

Introducing the Cervoz T425 SSD: Unleash Power in a Tiny Package
To embrace this remarkable trend, Cervoz presents the latest T425, a new M.2 2230 NVMe PCIe Gen 3 x2 SSD. Designed with a compact M.2 2230 form factor (22 mm x 30 mm), it supports both A and E key configurations and utilizes PCIe Gen 3 x2 lanes for high-speed data transfer. With impressive sequential speeds of up to 815 MB/s read and 760 MB/s write, along with storage capacities of 64 GB, 128 GB, and 512 GB, the T425 is the ultimate solution for enhancing the performance of embedded computing systems with space constraints.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of two new PCIe Gen 4 M.2 Solid State Drives—the MP600 MINI and the MP600 CORE XT. These drives extend the CORSAIR SSD range to an ultra-compact M.2 2230 form factor, and a new highly competitive combination of price and performance, allowing a new wave of device upgrades.

The MP600 MINI brings CORSAIR M.2 SSD performance to its smallest ever size, with the M.2 2230 form factor measuring just 22 mm x 30 mm. The MP600 MINI is compatible with popular handheld gaming systems, such as the Valve Steam Deck, as well as thin and light machines where space is at a premium, such as the Microsoft Surface Pro 8 and 9. With an impressive 1 TB of capacity and PCIe Gen 4 performance of up to 4,800 MB/sec read and 4,800 MB/sec write, the MP600 MINI is an ideal performance and storage upgrade for data hungry small-form-factor devices, whether it's to store a growing game collection, or essential files.

Samsung's unannounced Exynos 2400 mobile chipset has been linked to the upcoming Galaxy S24 smartphone family, but internet tipsters have speculated that the in-house SoC will be reserved for the baseline model only. The more expensive Plus and Ultra variants could be the main targets for flagship smartphone fetishists - it is possible that Qualcomm's upper echelon Snapdragon 8 Gen 3 chipset is set to feature within these premium devices. Samsung's Exynos processors are not considered to be fan favorites, but industry insiders reckon that the latest performance figures indicate that Samsung's up-and-comer has the potential to turn some heads. Exact specifications for the Exynos 2400 are not public knowledge - one of the tipsters suggests that a 10-core layout has been settled on by Samsung, as well as a recent bump up in GPU core count - from 6 to 12. The company's own 4 nm SF4P process is the apparent choice set for production line.

A leaker has posted benchmark scores generated by an unknown device that was running an Exynos 2400 SoC - the Geekbench 5 results indicate an average single-core score of 1530 with a peak of 1711. The multi-core average score is shown to be 6210, and the highest number achieved is 6967. Therefore the Exynos 2400 is 31% percent faster (in multi-core performance) than the refreshed Snapdragon 8 Gen 2 variant currently found in Galaxy S23 Ultra smartphones, but the divide between the two in terms of single-core performance is not so great. The 2400 manages to outpace (by 30%) Apple's present generation Bionic A16's average multi-core score, although the latter beats the presumed engineering sample's single-core result by 20%. The Exynos 2400 will face a new lineup of rival mobile processors in 2024 - namely Apple's next generation Bionic A17 and Qualcomm's Snapdragon 8 Gen 3, so it is difficult to extrapolate today's leaked figures into a future scenario.

An online tipster, posting on the Chinese blog site Weibo, has let slip that Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset is touted to pack some hefty graphical capabilities. The suggested Adreno "750" smartphone and tablet GPU is touted to offer a 50% increase over the present generation Adreno 740 - as featured on the recently released and cutting-edge Snapdragon 8 Gen 2 chipset. The current generation top-of-the-range Snapdragon is no slouch when it comes to graphics benchmarks, where it outperforms Apple's prime contender - the Bionic A16 SoC.

The Snapdragon 8 Gen 3 SoC is expected to launch in the last quarter of 2023, but details of the flagship devices that it will power are non-existent at the time of writing. The tipster suggests that Qualcomm has decided to remain on TSMC's 4 nm process for its next generation mobile chipset - perhaps an all too safe decision when you consider that Apple has upped the stakes with the approach of its Bionic A17 SoC. It has been reported that the Cupertino, California-based company has chosen to fabricate via TSMC's 3 nm process, although the Taiwanese foundry is said to be struggling with its N3 production line. The engineers at Qualcomm's San Diego headquarters are alleged to be experimenting with increased clock speeds running on the next gen Adreno GPU - as high as 1.0 GHz - in order to eke out as much performance as possible, in anticipation of besting the Bionic A17 in graphics benchmarks. The tipster theorizes that Qualcomm will still have a hard time matching Apple in terms of pure CPU throughput, so the consolation prize will lie with a superior GPU getting rigged onto the Snapdragon 8 Gen 3.

Although NAND suppliers have continued to roll back production, there is still an oversupply of NAND Flash as demand for products such as servers, smartphones, and notebooks is still too weak. Therefore, TrendForce predicts that the ASP of NAND Flash will continue to fall in 2Q23, though that decline may shrink to 5~10%. The key to supply and demand returning to a market equilibrium lies in whether NAND suppliers can cut back on production even more. TrendForce believes if demand remains stable, then the ASP of NAND Flash will have an opportunity to rebound in 4Q23; if demand is weaker than expected, then ASP will take longer to recover.

Client SSD: Currently, PC OEM's have managed to liquidate most of their component inventory, and are now gearing up in preparation for mid-year sales events. Suppliers are cutting prices to clear out their inventories of PCIe Gen 3 SSDs, which are gradually being phased out. Meanwhile, prices of PCIe Gen 4 SSDs continue to face downward pressure due to a slow intake of new customer orders. The continuous decline of QLC products in 1Q23 has also dragged down the prices of TLC products, and there is relatively little room for prices to keep falling in 2Q23. While it still remains unclear whether or not demand will recover, TrendForce projects that the prices of PC client SSDs will drop 5~10% in 2Q23.

No more to traditional mechanical drives as the era of high-capacity QLC has arrived. Leading memory brand Team Group today has announced the launch of two QLC SSDs to meet the various needs of users: Team Group MP33Q M.2 PCIe SSD and T-FORCE VULCAN Z QLC SSD come in capacities of up to 2 TB and 4 TB, respectively. Whether for more storage for installing or storing OSs, programs, games, or documents, they are the perfect upgrade solutions for your computer.

In response to different storage upgrade needs of consumers, Team Group MP33Q M.2 PCIe SSD is designed with 3D QLC flash memory chips, PCIe Gen 3 x4 interface and NVMe 1.3 protocol. With up to 2,500 MB/s in read speed and 2,100 MB/s in write speed, it outperforms SATA III SSDs by five times and is available in capacities of up to 2 TB. With its carefully selected 3D QLC NAND flash and SLC Cache technology, Team Group MP33Q M.2 PCIe SSD brings a top-of-the-line solution to the storage market.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today introduced the high-capacity TS-1655 tower 2.5 GbE NAS that can accommodate twelve 3.5-inch hard drives and four 2.5-inch solid-state drives. Designed with a hybrid storage architecture that balances performance and cost, the TS-1655 integrates 8-core computing power, 2.5 GbE high speed and PCIe expansion to improve business efficiency for cross-team file sharing, collaboration, backup and disaster recovery, and virtualization.

"The TS-1655 strikes a cost-performance balance with the HDD/SSD hybrid storage design, while also supporting RAID 50/60 that provides high-capacity NAS users with higher data protection and optimum storage space utilization," said Andy Chuang, Product Manager of QNAP, adding "Moreover, its SSD-focused design includes built-in M.2 NVMe PCIe slots and dedicated 2.5-inch SSD bays to drive performance-demanding business applications while enabling tiered storage for maximized cost-efficiency."

AMD's entry-level A620 chipset for Socket AM5 motherboards is nearing launch, as manufacturers such as GIGABYTE and ASUS have started regulatory filing their upcoming products with the Eurasian Economic Commission (EEC). These would hopefully bring the starting prices of AM5 motherboards down to the USD $125 figure AMD promised. AMD will sufficiently differentiate A620 from the B650, using specs such as the lack of CPU overclocking capabilities, only a handful PCIe Gen 3 downstream lanes, and the lack of PCIe Gen 5 on both the PEG and CPU-attached M.2 slots (which could at least be limited to Gen 4 if not Gen 3).

While the motherboards themselves may be cheap, the overall platform costs may still end up higher than Intel's H610 or upcoming H710 chipsets; as Socket AM5 lacks DDR4 memory support, and even at the entry-level you'll be forced to buy DDR5. That said, what A620 promises is platform longevity, that the platform will support future processor generations that launch even beyond 2025. AMD dropped a major hint on A620 chipset motherboards availability in its 2023 CES Keynote address, when it pointed to "65 W CPUs and entry-level motherboards" alongside each other. The 65 W Ryzen 7000 series processors are already out, which means A620 should be just around the corner. February 2023 is when AMD looks to launch its high-end Ryzen 7000X3D processors.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, introduced new QM2 PCIe Gen 3 expansion cards: the QM2-2P-344A and QM2-2P-384A. QM2 cards can be installed in compatible QNAP NAS or Windows /Linux PCs/workstations to add M.2 NVMe SSD slots (M.2 SSD sold separately) for boosting system performance and increasing storage capacity.

"The QM2-2P-344A and QM2-2P-384A are a budget-friendly expansion solution for both QNAP NAS and PC/workstations, providing flexible M.2 NVMe SSD configuration with easy-to-use tool-free installation," said Andy Chuang, Product Manager of QNAP, adding "Compared with SATA-based SSDs, the QM2's PCIe interface provides higher bandwidth to deliver faster transfer speed and data access."

Global technology leader PNY Technologies is delighted to announce the launch of the new innovative and high-performing CS1031 M.2 2280 NVMe Gen 3 x4 SSD. The product is the perfect choice for an NVMe upgrade from a SATA-based solid-state drive (SSD) for various NVMe-enabled devices.

The new product offers users numerous superior qualities to optimize their device's performance, enhance reliability, and lengthen the product's life. For a start, it fosters the advanced internal storage PCIe Gen 3x4 NVMe 1.3 interface to replace SATA, allowing more bandwidth thanks to its multiple lanes and more efficient signaling mechanisms. While SATA was initially made for HDD usage and was only customized for NVMe use, NVMe was designed precisely for SSD, leading to more satisfactory performance than SATA SSD counterparts. Additionally, with multiple form factors, the product is highly adaptable and can be utilized with various storage platforms.

The Minisforum Neptune HX90G all-AMD high-performance mini-PC went on sale at introductory prices. The lunchbox-sized mini-PC packs some serious kit, which includes an AMD Ryzen 9 5900HX "Zen 3" 8-core/16-thread processor, Radeon RX 6600M RDNA2 graphics with 8 GB VRAM, memory options that include dual-channel DDR4 16 GB, 32 GB, and 64 GB; and storage options that include a M.2 NVMe Gen 4 SSD with up to 512 GB capacity. You can also buy it as a barebones, and drop in your own SSD and DDR4 SO-DIMM memory.

What's new here are the introductory prices. The barebones (which gives you the processor and GPU, but not memory or SSD), is priced at $799, down from its $940 regular price. The model with 2x 8 GB memory and 512 GB SSD, is priced at $909, compared to its $1,069 regular price. The 2x 16 GB memory + 512 GB SSD model is going for $969, compared to $1,129 regular price. The top model with 2x 32 GB RAM + 512 GB SSD, can be had at $1,079, compared to its $1,269 regular price.

Tech manufacturer JSAUX announces that its upcoming generation of Steam Deck Docking Stations is available and ready to order. The HB0604 Docking Station features an M.2 SSD slot that will allow players to upgrade the Deck's storage by attaching an external storage unit (not included with the dock). This way, players can expand their library when playing games on a big screen, especially AAA titles that tend to grab a significant chunk of the Deck's storage. This new Docking Station will be on sale on September 7 at 7am PST for a special $99 early bird price for the first 100 orders. After that, next orders will be priced at $129. JSAUX is also offering two bundled M.2 Docks with a 1 TB SSD and a 2 TB SSD storage card. The Dock + 1 TB SSD storage card will have an early bird price of $169 for the first 50 units (after that, it will be sold at $199), the Dock + 2 TB SSD storage card will have an early bird price of $239 for the first 50 units (after that, it will be priced at $269). All customers will get a complimentary portable stand for the Deck (while supplies last), a skin and a keycap with their orders.

Besides the M.2 SSD slot, that supports NVMe and SATA with a 900 MB/s data transfer, the docking Station features a 4K@60 Hz / 2K@120 Hz HDMI 2.0 port, 2 USB-A 3.1 ports, 1 Gigabit Ethernet port as well as a USB-C port for power input that allows charging at 100 W, letting the Steam Deck fully recharge while plugged in. The units bundled with SSD storage will feature M.2 2280 units, featuring PCIe Gen 3 8GT/s interface, up to 4 lanes. The SSDs are compliant with NVMe Express Revision 1.4 and support host memory buffer. Both the 1 TB and the 2 TB units offer up to 3300 MB/s read speeds and up to 2600 MB/s write speeds.

Researchers from Università di Bologna and CINECA, the largest supercomputing center in Italy, have been playing with the concept of developing a RISC-V supercomputer. The team has laid the grounds for the first-ever implementation that demonstrates the capability of the relatively novel ISA to run high-performance computing. To create a supercomputer, you need pieces of hardware that seem like Lego building blocks. Those are called clusters, made from a motherboard, processor, memory, and storage. Italian researchers decided to try and use something different than Intel/AMD solution to the problem and use a processor based on RISC-V ISA. Using SiFive's Freedom U740 SoC as the base, researchers named their RISC-V cluster "Monte Cimone."

Monte Cimone features four dual-board servers, each in a 1U form factor. Each board has a SiFive's Freedom U740 SoC with four U74 cores running up to 1.4 GHz and one S7 management core. In total, eight nodes combine for a total of 32 RISC-V cores. Paired with 16 GB of 64-bit DDR4 memory operating at 1866s MT/s, PCIe Gen 3 x8 bus running at 7.8 GB/s, one gigabit Ethernet port, USB 3.2 Gen 1 interfaces, the system is powered by two 250 Watt PSUs to support future expansion and addition of accelerator cards.

5G's rapid deployment is spiking demand for large amounts of data storage. Emerging 5G applications such as telemedicine, smart healthcare and smart poles require storage devices that can offer high-speed, low-latency and stable operation during high-quality, high-resolution image data transmission to permit AI image recognition and auxiliary diagnoses. Luckily, Apacer's latest PCIe Gen4 x4 SSD is stepping up to the plate. It adopts the latest BiCS5 112-layer 3D NAND Flash memory technology. This means ultra-high performance and reliability, a stable supply and - crucially - a more competitive cost per unit.

Real-time imaging data plays an important role in 5G healthcare applications. But to be effective, it requires high-resolution images that are extremely clear and focused. According to a recent report, "5G in Healthcare Market" released by MarketsandMarkets, telehealth and robotic surgery both grew in response to the challenges posed by COVID-19, and 5G wearable medical devices also became more prevalent for the same reason. Currently, the 5G healthcare market "is valued at an estimated USD 215 million in 2021 and is projected to reach USD 3,667 million by 2026, at a CAGR of 76.3% during the forecast period."

Silicon Power (SP) releases its newest PCIe 3.0 SSD, the UD80, featuring storage capacities up to 2 TB with 3D NAND flash technology. The UD80 strikes a perfect harmony between cost and performance to breathe new life into your system without burning a hole in your pocket. Designed for creators that need more than just a jolt of inspiration, the UD80 provides exceptional value and a performance boost with a PCIe Gen 3 x4 interface - a boost that leaves SATA III SSDs behind in the dust.

The UD80 utilizes the speed capabilities of PCIe 3.0 with the efficiency of NVMe and Host Memory Buffer (HMB) technology. Let your creative juices flow with rapid read and write speeds up to 3,400 MB/s and 3,000 MB/s, respectively. At the same time, experience seamless productivity via the higher performance and lower latency that's achieved by NVMe 1.4 and HMB technology.

Today, during Mobile World Congress 2022, Qualcomm Incorporated President and Chief Executive Officer, Cristiano Amon highlighted how Qualcomm Technologies, Inc. is continuing to bring best-in-case experiences to enterprise PCs and drive the convergence of the PC and mobile to increase productivity, connectivity, and security from anywhere. During last month's Consumer Electronics Show, the Company announced that over 200 enterprise customers were testing or deploying Windows 11 on Snapdragon laptops and 2-in-1 devices. Today, Amon outlined how strategic relationships with Microsoft, Lenovo, and many other ecosystem leaders are helping deliver the next generation of enterprise-ready PCs, powered by Snapdragon. Utilizing its global relationships, Qualcomm Technologies continues to lead the PC industry's inevitable transition to innovative and modern solutions from the portfolio of Snapdragon compute platforms.Quotes from key collaborators that Qualcomm Technologies is working with to drive innovation for always on, always connected enterprise PCs through Snapdragon Compute Platforms can be found here.

Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility. Looking into the booming markets and scenarios ranging from surveillance to gaming, networking, and industrial uses, the growing demand for high-speed LAN solutions is promising. Additionally, interference issues are also occurring more often as the size of the PCIe form factor cannot fit in the smaller design of IPC platforms nowadays. Being the leading global provider of industrial embedded flash and memory, Innodisk is introducing the first M.2 10GbE LAN module designed to meet the demand for increased speed and reduced size, high-speed LAN solutions.

Innodisk's EGPL-T101 is the first M.2 2280-to-single 10GbE Base-T Ethernet module which is also the smallest 10GbE expansion solution available today and ten times faster than standard Ethernet. By supporting PCI Express Gen 3x2, the EGPL-T101 module can provide sufficient bandwidth for one 10GbE LAN port suitable for server and industrial applications' high-speed network demands.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces the new ADATA Premier Extreme SDXC SD Express Card. Thanks to the latest SD 7.0 specification, which supports PCIe and NVMe, the Premier Extreme SDXC SD 7.0 Express Card delivers performance on par with SSDs, but in the ultra-portable form factor of an SD Card.

With support for PCIe Gen 3 x1 and NVMe, the Premier Extreme SDXC SD Express Card delivers read and write performance of up to 800/700 MB/s, which is roughly 1.5 times faster than SATA SSDs. When compared to UHS-II SD and UHS-I SD cards, it's about 2.7 and 8 times faster, respectively. This memory card is backward compatible with the UHS-I devices with read and write speed of up to 100 MB/s and conforms to the V30 Video Speed Class.

MSI is announcing the launch of its fastest Gen 3 PCIe NVMe model to its SSD product line - SPATIUM M390 NVMe M.2. MSI continues to refine its identity as a high-performance PC brand and SPATIUM was envisioned to expand our ecosystem and cover the high-performance storage category. These SSDs are built with high-quality, high-density 3D NAND flash that deliver the best compromise of performance and endurance for professionals, content creators, and gamers.

SPATIUM M390 was developed to meet the expectations of mainstream SSD consumers. Offering its PCIe Gen 3 interface with fast speeds up to 3300 MB/sec sequential read and 3000 MB/s sequential write speeds allow users to enjoy rapid file transfers and short loading times. Available storage capacities are 500 GB, and 1 TB. M390 supports a comprehensive range of data error correction features including LPDC ECC and E2E Data Protection, providing a high rated TBW (Terabytes Written) for excellent durability and longevity backed with a limited 5-year warranty.