As we witness Apple's generational updates of the M series of chips, the highly anticipated SKU of the 3rd generation of Apple M series yet-to-be-announced top-of-the-line M3 Ultra chip is growing speculations from industry insiders. The latest round of reports suggests that the M3 Ultra might step away from its predecessor's design, potentially adopting a monolithic architecture without the UltraFusion interconnect technology. In the past, Apple has relied on a dual-chip design for its Ultra variants, using the UltraFusion interconnect to combine two M series Max chips. For example, the second generation M Ultra chip, M2 Ultra, boasts 134 billion transistors across two 510 mm² chips. However, die-shots of the M3 Max have sparked discussions about the absence of dedicated chip space for the UltraFusion interconnect.

While the absence of visible interconnect space on early die-shots is not conclusive evidence, as seen with the M1 Max not having visible UltraFusion interconnect and still being a part of M1 Ultra with UltraFusion, industry has led the speculation that the M3 Ultra may indeed feature a monolithic design. Considering that the M3 Max has 92 billion transistors and is estimated to have a die size between 600 and 700 mm², going Ultra with these chips may be pushing the manufacturing limit. Considering the maximum die size limit of 848 mm² for the TSMC N3B process used by Apple, there may not be sufficient space for a dual-chip M3 Ultra design. The potential shift to a monolithic design for the M3 Ultra raises questions about how Apple will scale the chip's performance without the UltraFusion interconnect. Competing solutions, such as NVIDIA's Blackwell GPU, use a high-bandwidth C2C interface to connect two 104 billion transistor chips, achieving a bandwidth of 10 TB/s. In comparison, the M2 Ultra's UltraFusion interconnect provided a bandwidth of 2.5 TB/s.

Apple today announced M2 Ultra, a new system on a chip (SoC) that delivers huge performance increases to the Mac and completes the M2 family. M2 Ultra is the largest and most capable chip Apple has ever created, and it makes the new Mac Studio and Mac Pro the most powerful Mac desktops ever made. M2 Ultra is built using a second-generation 5-nanometer process and uses Apple's groundbreaking UltraFusion technology to connect the die of two M2 Max chips, doubling the performance. M2 Ultra consists of 134 billion transistors—20 billion more than M1 Ultra. Its unified memory architecture supports up to a breakthrough 192 GB of memory capacity, which is 50 percent more than M1 Ultra, and features 800 GB/s of memory bandwidth—twice that of M2 Max. M2 Ultra features a more powerful CPU that's 20 percent faster than M1 Ultra, a larger GPU that's up to 30 percent faster, and a Neural Engine that's up to 40 percent faster. It also features a media engine with twice the capabilities of M2 Max for blazing ProRes acceleration. With all these advancements, M2 Ultra takes Mac performance to a whole new level yet again.

"M2 Ultra delivers astonishing performance and capabilities for our pro users' most demanding workflows, while maintaining Apple silicon's industry-leading power efficiency," said Johny Srouji, Apple's senior vice president of Hardware Technologies. "With huge performance gains in the CPU, GPU, and Neural Engine, combined with massive memory bandwidth in a single SoC, M2 Ultra is the world's most powerful chip ever created for a personal computer."

Apple today at WWDC announced a slew of new products, but one major one that the industry has been waiting for is the Apple silicon update to the Mac Pro. The new Mac Pro features the similarly new M2 Ultra which combines two M2 Max SoCs together via their UltraFusion interconnect, similar to M1 Ultra. M2 Ultra remains on TSMC's 5 nm and features 24-cores as well as configuration options for up to a 76 FSTP GPU slice and 192 GB of unified RAM. Apple is making bold claims about M2 Ultra's performance in comparison to the outgoing Intel Mac Pro, claiming it to be 3x faster than the fastest Intel configuration. The new Mac Pro doesn't change the chassis or aesthetic of the 2019 Intel based Mac Pro, which means that it retains a much wider array of expansion options in both tower or rack mount configurations. Expansion options include eight Thunderbolt 4 ports, two USB 3.2 Type A, two HDMI, dual 10GbE ports, and a 3.5 mm audio jack on the rear. Inside the mostly empty chassis there are six open PCI-E Gen 4 x16 slots for expansion, however Apple will likely still not support third-party graphics options on Apple silicon machines so these slots are for predominantly for accelerator, capture, network, broadcast, and storage expansion boards. However, what appears to be a 12VHPWR sits alongside a pair of SATA expansion ports above the PCI-E on the motherboard. The 2023 M2 Mac Pro will start at $6999 USD and is available starting June 13th.