FSP Group, one of the world's leading high-performance OEM and ODM power supply manufacturers, today unveils the next generation DAGGER PRO series 750 W and 850 W SFX power supplies upgraded with ATX 3.0 compliance built to power compact gaming and workstation PCs of 2023. Featuring exciting and innovative design features, the newly upgraded DAGGER PRO series power supplies carry forward its global reputation for product design and functionality. Built into two variants 750 W and 850 W, they bring the latest ATX 3.0 label upgraded to support the power-hungry hardware of the future generation.

Designed to support AMD Radeon RX 7000 series and NVIDIA RTX 40 series graphics cards with industry-leading functionality. They come with a full +12V single-rail power design, fine-tuned to ensure maximum power output without overloading or overheating. Moreover, the DAGGER PRO 850 W is equipped with the 12VHPWR connector, which is PCIe 5.0 compliant, ready to support powerful ITX builds to its maximum potential. FSP's innovative PCB board circuit design and high temperature resistant Japanese electrolytic capacitors are two prime examples of their brilliant component selection and execution designed to deliver next-level functionality in a highly compact package.

SK hynix Inc. announced today that it has started mass production of its 238-layer 4D NAND Flash memory, following the development in August 2022, and that product compatibility test with a global smartphone manufacturer is underway. "SK hynix has developed solution products for smartphones and client SSDs which are used as PC storage devices, adopting the 238-layer NAND technology, and has moved into mass production in May," the company said. "Given that the company secured world-class competitiveness in price, performance and quality for both 238-layer NAND and the previous generation 176-layer NAND, we expect these products to drive earnings improvement in the second half of the year."

The 238-layer product - the smallest NAND in size - has a 34% higher manufacturing efficiency compared to the previous generation of 176-layer, resulting in a significant improvement in cost competitiveness. Besides, with a data-transfer speed of 2.4 Gb per second, a 50% increase from the previous generation, and approximately 20% increase in read and write speed, the company is confident that it will be able to deliver an improved performance to the smartphone and PC customers using this technology.

Neo Forza, a Taiwanese brand entity under Goldkey Technology Corporation, had a booth at Computex 2023, where the company showed its next-generation memory and storage products. Starting off, the company presented its DDR5 memory kits running at 8000 MHz speeds, indicating the maturity of DDR5 and that we are way past the initial 4800 MHz speeds at launch. The demonstrated kit was a part of the company's TRINITY lineup, which was displayed in white. For demo purposes, the kit was configured as two 16 GB DIMMs.

Next up, Neo Forza has showcased its next-generation PCIe Gen 5 NVMe SSD. Running at x4 lanes of the new PCIe 5.0 protocol, the 2 TB SSD was spotted running at 10 GB/s speeds in both read and write tasks set by CrystalDiskMark benchmark. Interestingly, the SSD also boasted a massive heatsink, as shown below.

Cooler Master has showcased a couple of new PSUs at the Computex 2023, including the X Silent series Max and Edge PSUs, which are "near-silent" and fanless models that should be coming soon. In addition, Cooler Master has come up with some high-quality 12VHPWR 90 degree cables that should be better than standard ones.

The X Series Max is described as "near-silent" since it has a low speed RGB fan in order to support higher wattage, but will keep the noise at 20dB. The X Silent Max will be available in models of up to 1300 W and uses a single-piece heat dissipation structure. The X Series Edge is a whole different beast as this is a completely fanless PSU, that features special airflow-improving extended fan cover, vapor chamber technology, and the same single-piece heat dissipation structure. The X Series Edge will go to up to 750 W. Both of these X Series PSUs are ATX 3.0 and PCIe 5.0 compliant, which means they come with 12VHPWR cables, and both support Cooler Master's MasterControl software, allowing users to monitor temperature, current load, and overall performance. Cooler Master also unveiled new 12VHPWR cables, with 90-degree angle that should prevent unnecessary bending, as well as an upgraded connector design with double springs and thicker wire, which should be better than those previous cables and reduce the connector temperatures by 5 degrees.

be quiet!, a German company focusing on creating PC components and accessories, had a strong presence at Computex 2023. Showing off its cases and power supplies, the company introduced a few additions to its portfolio of offerings. For starters, be quiet! has introduced a new case series called Shadow Base. The new Shadow Base lineup is focused on maximum airflow and maximum performance, where the company has made a new open mesh design that allows for "exceptionally high airflow." Inaugurating model of the series is the Shadow Base 800, which comes in three flavors: standard, DX, and FX. The standard edition is just a regular case without flashy RGB; the DX model has an RGB strip, while the FX model is tailored for maximum RGB illumination across the case. With up to E-ATX motherboard support, the case supports three or four 140 mm fans, depending on the variant. You can see the specification sheet below.

Chinese InnoGrit has proved to be something of a competent contender in the high-end SSD controller market and at Computex 2023 the company was displaying an early sample of its upcoming IG5666 consumer focused PCIe 5.0 NVMe SSD controller. At the moment the company has taped out the controller, but aren't happy with the physical size of the chip and will be doing another tape out for a more optimised chip. Innogrit is using a 16 nm node for the controller, which might be part of the reason why they're having a hard time to get it the right size, but there's also cost reasons that have to be taken into consideration.

Based on the early samples, InnoGrit is expecting it to reach sequential speeds of up to 14 GB/s read and 11 GB/s write. Random performance is said to reach 3 million read and 2.5 million write IOPs. The controller should support up to 16 TB of NAND flash and it supports all common types of NAND up to a speed of 2400 MT/s. The IG5666 is based on the same Tacoma architecture as InnoGrit's IG5669, which is targeting enterprise use, yet delivers similar performance.

Thermaltake has unveiled a whole new range of Toughpower SFX power supplies at the Computex 2023 show in Taipei. Since smaller SFF builds are becoming quite popular these days, it does not come as a surprise that Thermaltake is pushing this PSU form-factor to a whole new level. Thermaltake is not a stranger when it comes to SFX power supplies but its current Toughpower SFX Gold lineup will be expanded with new higher output models and given an ATX 3.0 specification, and it is introducing the new Toughpower SFX Platinum series.

The Thermaltake Toughpower SFX Gold lineup was already available in 450 W, 550 W, 650 W, and 750 W versions, but now, Thermaltake is bringing new 750 W, 850 W, and 1000 W models, which are all compatible with ATX 3.0 specifications and feature a native PCIe 5.0 12+4-pin modular interface. The Toughpower SFX Gold 750 W and 850 W models will use a standard SFX form-factor, while the 1000 W model will be based on a slightly longer SFX-L form factor. The star of the PSU show is the Toughpower SFX Platinum series, also coming in 750 W, 850 W, and 1000 W models, and as the name suggests, these have 80 Plus Platinum efficiency. The Toughpower SFX Platinum will also be compatible with ATX 3.0 specifications and feature the same native PCIe 5.0 12+4-pin modular interface. Both the Toughpower SFX Gold and the Toughpower SFX Platinum series are bundled with SFX to ATX adapter bracket. We expect them both in retail/e-tail soon.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.

"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."

ASRock, a global leader in motherboards, graphics cards, monitors, and small form factor PCs, is excited to announce its participation in the upcoming COMPUTEX Taipei 2023 after years of anticipation. ASRock will showcase a range of breathtaking innovative products and highly anticipated technology demonstrations. Attendees will have the opportunity to explore the ASRock latest products and solutions firsthand; also, get the immersive gaming experience at ASRock booth.

Unveiling the Next-Gen ASRock Monitors
ASRock is set to showcase an exciting lineup of monitors at COMPUTEX 2023, featuring six existing products along with new gaming and business models. The spotlight will be on the PG558KF and PG32UMF, two high-end monitors.

MSI, the world's leading gaming PC hardware brand, is proud to announce the new SPATIUM M570 PRO Series, featuring the revolutionary PHISON E26 PCIe Gen 5 SSD controller and state-of-the-art 3D NAND flash. Designed to push the limits of storage performance, the SPATIUM M570 PRO Series SSD delivers an astonishing top read speed of 14 GB/s, breaking the world record and setting new industry standards.

The strong collaboration and cooperation between MSI and PHISON have made this record possible as both companies share in the excitement of pushing the envelope. "K.S.Pua, CEO of Phison Electronics, said that the cooperation between Phison and MSI started from the SSD product line. Since both companies have their own expertise in NAND controller and computer system integration respectively, and in addition to SSD, MSI has also actively expanded its strategy in the fields of gaming, content creators, commercial, industrial, robotics, and even automotive in recent years, where the application markets are in line with Phison's long-term strategy, so the two companies hit it off. The SPATIUM M570 Pro Series SSD announced by MSI this time adopted Phison's E26 SSD controller. Since the performance of PCIe 5.0 is much faster than the previous generation of PCIe 4.0, the two companies have conducted a lot of tests and discussions on power consumption and heat dissipation, which is a valuable cooperation experience. In the future, Phison will continue to support MSI through controller technology."

As COMPUTEX once again opens its door, MSI, the world leader in gaming, content creation, business & productivity, and AIoT solutions, is all geared up to dominate the show floor with a full slate of new lineup and its Best Choice Award honorees. "We are thrilled to be back at COMPUTEX," said Sam Chern, MSI Vice President of Marketing. "We expect to see users' tech experiences reinvented and MSI is at the forefront. Our COMPUTEX 2023 lineup showcases the ultimate fusion of breakthrough technology and everlasting aesthetics that surpasses all limits and indulges global users with the best possible experience like never before."

This year, MSI themes its booth around The Leap to Singularity, envisioning a future in which the technological singularity brings forth superintelligence to improve human lives. Among the highlights on display will be the Raider GE78 HX Smart Touchpad, Stealth 16 and Creator Z17 laptops powered by up to 13th Gen Intel Core i9 processors and NVIDIA GeForce RTX 40 Series graphics, making them powerhouses for gamers and creators alike.

YEYIAN GAMING, a leading global designer and manufacturer of innovative pre-built gaming PCs, peripherals, and computer components, is thrilled to announce their new PEGASUS ATX 3.0-certified power supplies, designed to meet the power needs of high-performance gaming desktops and professional PCs. These 80 Plus Gold and Platinum certified power supplies deliver reliable and efficient power with wattages ranging from 850 W and 1000 W, ensuring optimal performance and minimal energy waste. The PEGASUS PSUs are built using top-quality Japanese capacitors and are equipped with a 140 mm hydraulic bearing fan for long-lasting durability and quiet operation. The PSU features a unique, fully modular design with low-profile flat cables, making cable management a breeze and making them the ultimate choice for gamers who demand the best.

"Our new 80+ Platinum 1000 W and gold 850 W PEGASUS power supply is the result of our continuous innovation and commitment to deliver quality to our gamers and is inspired by PEGASUS, the winged war horse from Greek mythology. PEGASUS represents our ideal for creating a powerful and reliable PSU that can fly high and soar above all other rivals. The PSU is designed to be quiet, stable, and user-friendly for flawless, hassle-free operation." said Frank Lee, the VP of YEYIAN GAMING.

Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, today announced that its VectorPath accelerator card featuring a Speedster 7t FPGA has been certified by PCI-SIG for PCIe Gen 5 and is the first and only FPGA accelerated CEM add-in card certified for PCIe Gen 5 x16 at 32 gigatransfers per second (GT/s) on the PCI-SIG Integrator's list. VectorPath S7t-VG6 accelerator cards are designed to reduce time to market when developing high-performance compute and acceleration functions for AI, ML, networking and data center applications and are shipping today.

"Achronix continues to drive acceleration in the high-performance FPGA add-in card market," said Craig Petrie, Vice President at BittWare. "Achieving PCI-SIG Gen 5 certification is an important milestone. Our customers can be assured of the highest PCIe bandwidths and have confidence that VectorPath cards will interoperate with Gen 5 servers."

Intel's Programmable Solutions Group today announced that the Intel Agilex 7 with the R-Tile chiplet is shipping production-qualified devices in volume - bringing customers the first FPGA with PCIe 5.0 and CXL capabilities and the only FPGA with hard intellectual property (IP) supporting these interfaces. "Customers are demanding cutting-edge technology that offers the scalability and customization needed to not only efficiently manage current workloads, but also pivot capabilities and functions as their needs evolve. Our Agilex products offer the programmable innovation with the speed, power and capabilities our customers need while providing flexibility and resilience for the future. For example, customers are leveraging R-Tile, with PCIe Gen 5 and CXL, to accelerate software and data analytics, cutting the processing time from hours to minutes," said Shannon Poulin, Intel corporate vice president and general manager of the Programmable Solutions Group.

Faced with time, budget and power constraints, organizations across industries including data center, telecommunications and financial services, turn to FPGAs as flexible, programmable and efficient solutions. Using Agilex 7 with R-Tile, customers can seamlessly connect their FPGAs with processors, such as 4th Gen Intel Xeon Scalable processors, with the highest bandwidth processor interfaces to accelerate targeted data center and high performance computing (HPC) workloads. Agilex 7's configurable and scalable architecture enables customers to quickly deploy customized technology - at scale with hardware speeds based on their specific needs - to reduce overall design costs and development processes and to expedite execution to achieve optimal data center performance.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, continues to expand its data center offerings with liquid cooled NVIDIA HGX H100 rack scale solutions. Advanced liquid cooling technologies entirely from Supermicro reduce the lead time for a complete installation, increase performance, and result in lower operating expenses while significantly reducing the PUE of data centers. Savings for a data center are estimated to be 40% for power when using Supermicro liquid cooling solutions compared to an air-cooled data center. In addition, up to 86% reduction in direct cooling costs compared to existing data centers may be realized.

"Supermicro continues to lead the industry supporting the demanding needs of AI workloads and modern data centers worldwide," said Charles Liang, president, and CEO of Supermicro. "Our innovative GPU servers that use our liquid cooling technology significantly lower the power requirements of data centers. With the amount of power required to enable today's rapidly evolving large scale AI models, optimizing TCO and the Total Cost to Environment (TCE) is crucial to data center operators. We have proven expertise in designing and building entire racks of high-performance servers. These GPU systems are designed from the ground up for rack scale integration with liquid cooling to provide superior performance, efficiency, and ease of deployments, allowing us to meet our customers' requirements with a short lead time."

KIOXIA America, Inc. today announced that its lineup of CD7 Series Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S NVMe SSDs are first to ship on servers and storage from Hewlett Packard Enterprise (HPE). The industry's first EDSFF drives designed with PCIe 5.0 technology, KIOXIA CD7 E3.S SSDs increase flash storage density per drive for optimized power efficiency and rack consolidation. HPE ProLiant Gen11 servers, HPE Alletra 4000 data storage servers and the HPE Synergy 480 Gen11 Compute Module are enabled with the latest PCIe 5.0 interface, enabling up to twice the performance over PCIe 4.0, and come with optionally equipped EDSFF E3.S drive bays.

As a natural evolution of the 2.5-inch form factor, EDSFF E3.S is designed for the needs of high performance flash storage. E3.S enables more dense, efficient deployments in the same rack unit compared to 2.5-inch drives, while improving cooling and thermal characteristics and raising capacities by up to 1.5 - 2x.

Nextorage Japan is preparing its NE5N range of PCIe Gen 5 NVMe SSDs for launch in early June - listings have emerged on Newegg for 2 TB and 1 TB models - with a product page appearing recently on the company's (Japanese language) website. These units boast read and write speeds rated for operation up to 10 GB/s, and are based on Phison's E26 PCIe Gen 5 controller. Nextorage started off as a provider of PlayStation 5-oriented PCIe Gen 4 SSD products, due to company ties to Sony Corporation, but its upcoming NE5N range indicates that it intends to target buyers within the enthusiast PC market.

The initial batch of cutting edge SSDs are unlikely to end up in any PS5 consoles, thanks to a sizable dual formation heatsink - the Japanese company has filed a patent for the bulky two-level structure and heatpipe combination design. Gen 5 SSDs are said to be difficult to tame in terms of heat output, and manufacturers are going to great lengths (and sizes) to provide adequate cooling solutions in advance. Future versions of Nextorage Japan's NE5N NVMe M.2 2280 PCIe Gen 5 SSDs are being refined for compact PCs and laptops, so it will be interesting to find out about the intended thermal tempering for more cramped environments.

A strong growth in AI server shipments has driven demand for high bandwidth memory (HBM). TrendForce reports that the top three HBM suppliers in 2022 were SK hynix, Samsung, and Micron, with 50%, 40%, and 10% market share, respectively. Furthermore, the specifications of high-end AI GPUs designed for deep learning have led to HBM product iteration. To prepare for the launch of NVIDIA H100 and AMD MI300 in 2H23, all three major suppliers are planning for the mass production of HBM3 products. At present, SK hynix is the only supplier that mass produces HBM3 products, and as a result, is projected to increase its market share to 53% as more customers adopt HBM3. Samsung and Micron are expected to start mass production sometime towards the end of this year or early 2024, with HBM market shares of 38% and 9%, respectively.

AI server shipment volume expected to increase by 15.4% in 2023
NVIDIA's DM/ML AI servers are equipped with an average of four or eight high-end graphics cards and two mainstream x86 server CPUs. These servers are primarily used by top US cloud services providers such as Google, AWS, Meta, and Microsoft. TrendForce analysis indicates that the shipment volume of servers with high-end GPGPUs is expected to increase by around 9% in 2022, with approximately 80% of these shipments concentrated in eight major cloud service providers in China and the US. Looking ahead to 2023, Microsoft, Meta, Baidu, and ByteDance will launch generative AI products and services, further boosting AI server shipments. It is estimated that the shipment volume of AI servers will increase by 15.4% this year, and a 12.2% CAGR for AI server shipments is projected from 2023 to 2027.

The Meteor Lake codename has been linked to the fourteenth generation of Intel's Core lineup for a while, following several significant leaks in 2022 and 2023. According to newly unearthed internal documentation and benchmark data, Intel has confirmed that the Meteor Lake family of CPUs will form its upcoming 14th Gen Core lineup - with laptop variations expected to arrive mid-2023 and heavily speculated desktop units in the fourth quarter, although a middle of the year refresh of Raptor Lake could push the entire Meteor Lake range's release window into 2024.

Meteor Lake is anticipated to be Intel's debuting of a "disaggregated" design - the most advanced laptop CPU variant features a top-of-the-line 6P+8E core configuration. Intel is solely responsible for fabrication of an IOE (I/O) tile (the company's own term for a chiplet) with PCIe 5.0 plus Thunderbolt 4, as well as an SoC tile. The GPU part of the design is rumored to be based on their own Arc Alchemist architecture, and TSMC has been contracted to manufacture this graphics tile - not a big surprise since Intel has also placed substantial manufacturing orders for discrete Arc cards with the Taiwanese foundry.

FSP Group, one of the world's leading high-performance OEM and ODM power supply manufacturers today, is excited to unveil the brand new HYDRO Ti PRO series power supplies designed with high power density, efficient power delivery, and low noise for high-performance PC builds. The all-new HYDRO Ti PRO series offers two fully modular power supply units rated at 850 W and 1000 W, featuring the highly desired 12VHPWR connector, which complies with ATX 3.0 and support for PCIe 5.0, allows top-tier graphics cards to perform at the highest level.

The HYDRO Ti PRO series's sleek and refined industrial design can make any PC build stand out. Engineered with a fully modular layout for easy installation and significantly reduces cable clutter in the case, resulting in a cleaner and more organized build. In addition, they feature a quiet and durable cooling system, thanks to the FDB (Fluid Dynamic Bearing) fan with low noise and a long-lasting life span. This fan ensures the power supply runs quietly and effectively while providing optimal cooling for its components.

Based on a leak courtesy of @momomo_us on Twitter, we now know that Gigabyte will be launching at least four different NVIDIA GeForce RTX 4070 based SKUs next week. Although the leaker only posted a single image of all four cards seen from the edge, it still gives us an idea of what to expect. The leaker also confirmed a rumour, that there will be two different types of GeForce RTX 4070 cards, namely those with a single 8-pin power connector and those with the 16-pin 12VHPWR PCIe 5.0 connector.

Gigabyte's four SKUs start with the Eagle and Windforce as the more budget friendly options, with the Eagle being the one we'd expect that will sell for the rumoured US$599.99 MSRP. Both of these cards obviously have the 8-pin power connector and seemingly a more basic heatsink compared to the other two cards. The higher-end models include the Gaming and Aero cards, both with 16-pin power connectors and a beefier heatsink with more heatpipes. It's unclear if we'll see a higher-end Aorus branded SKU or not at this point in time, but Gigabyte might forgo it to try to avoid making an overly expensive card that won't sell, considering that the 4070 is still largely an upper mid-range card.

Analyst firm Yole Group has predicted that SSD sales revenues will grow to $67 billion in the year 2028, generated by 472 million unit sales - indicating a very healthy outlook in the long term. However, their predictions for market performance in 2023 appear to be less cheerful for manufacturers of NAND flash memory. The SSD market dynamic was positive in 2021 and the starting months of 2022, but demand has dropped sharply since then due to a number of factors including global inflation, geopolitical tensions, and inventory digestion at electronics manufacturers. Sales revenues in 2022 totaled $29 billion (352 million units), down from $34 billion (400 million units) in 2021 - demonstrating a 14% year-to-year decline.

The continued weakening of global demand in 2023 will have an effect on SSD sales revenues, and the Yole Group has foreseen troublesome outcomes for manufacturers. The average selling price of NAND memory and solid-state drive units has been on the decline in the recent quarters, caused by sluggish demand and a surplus of stock. Despite the grim outlook in the short term, the research body is predicting a compounded annual growth rate (CAGR) of about 15% between 2022 and 2028 for the overall size of the SSD market.

Galax is joining the PCIe 5.0 SSD crowd with its newest HOF Extreme 50 SSD that has been launched in China, and should come to the rest of the markets soon. The Galax HOF Extreme 50 will be only available in 1 TB and 2 TB capacities, and comes with thick heatsink with active cooling via PWM fan.

As it is the case with all other PCIe 5.0 SSDs currently on the market, the HOF Extreme 50 is based on Phison E26 controller paired up with Micron 232-layer 3D NAND flash and up to 4 GB of LPDDR4 DRAM cache. The Galax HOF Extreme 50 is not the fastest Phison E26-based PCIe 5.0 SSD announced, as Gigabyte Aorus Gen 5 1000, MSI Spatium M570 Pro, and Crucial T700, are coming and reaching up to 12 GB/s (12.4 GB/s for the Crucial T700).

ASUS today announced its participation in NVIDIA GTC, a developer conference for the era of AI and the metaverse. ASUS will offer comprehensive NVIDIA-certified server solutions that support the latest NVIDIA L4 Tensor Core GPU—which accelerates real-time video AI and generative AI—as well as the NVIDIA BlueField -3 DPU, igniting unprecedented innovation for supercomputing infrastructure. ASUS will also launch the new ProArt Studiobook Pro 16 OLED laptop with the NVIDIA RTX 3000 Ada Generation Laptop GPU for mobile creative professionals.

Purpose-built GPU servers for generative AI
Generative AI applications enable businesses to develop better products and services, and deliver original content tailored to the unique needs of customers and audiences. ASUS ESC8000 and ESC4000 are fully certified NVIDIA servers that support up to eight NVIDIA L4 Tensor Core GPUs, which deliver universal acceleration and energy efficiency for AI with up to 2.7X more generative AI performance than the previous GPU generation. ASUS ESC and RS series servers are engineered for HPC workloads, with support for the NVIDIA Bluefield-3 DPU to transform data center infrastructure, as well as NVIDIA AI Enterprise applications for streamlined AI workflows and deployment.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47H industrial ATX motherboard for 12th/13th Gen Intel Core i9/i7/i5/i3, Pentium and Celeron processors. The IMB-M47H ATX motherboard delivers scalable, high-performance computing power and supports three simultaneous independent displays, external USB, 2.5GbE, and high-performance add-on cards for complex processing tasks in smart manufacturing, 5G manufacturing, semiconductor, and machine vision applications.

The IMB-M47H industrial ATX motherboard supports Gen 12 Intel processors and importantly the latest Intel Core processors that utilize a high-performance hybrid architecture with up to eight E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 12th/13th Gen Intel Core processors boost single-thread performance by 1.36x and multi-thread performance by 1.35x compared to 10th Gen Intel Core processors delivering more power-efficient general-purpose processing and offering powerful processing for intensive operations.