Seasonic, one of the leading manufacturers of high-quality power supplies for the PC market, has announced a significant enhancement to its customer service offerings. In a move that underscores the company's confidence in its products' durability and performance, Seasonic has extended the warranty period for its VERTEX power supply units from the industry-standard of ten years to as much as 12 years. This extension applies to its popular series of power supplies, known for their reliability and efficiency. The company's decision reflects its commitment to excellence and its belief in the longevity of its components, aiming to provide users with added peace of mind and long-term value.

The VERTEX series of PSUs are Seasonic's first ATX 3.0 models on the market, which bring a plethora of features like complete modularity, 80+ Platinum efficiency, support for PCIe 5.0 devices, 12VHPWR cable, and now an upgraded warranty period of 12 years. The extended warranty indicates that Seasonic is prepared to back its claims of great product lifespan, reinforcing its position as a trusted name in power supply solutions.

TrendForce has issued its latest findings, indicating that the global SSD market has rectified its supply and demand dynamics in 2022, following a resolution in the shortage of master control ICs that had hampered the market in 2021. Despite the normalization of supply, global SSD shipments witnessed a decline, with only 114 million units shipped in 2022—a 10.7% decrease from the prior year.

The top three SSD shipment leaders of 2022 were Kingston, ADATA, and Lexar, with Kingston and ADATA maintaining solid advantages and experiencing growth in market share over 2021. Lexar's growth was attributed to an aggressive push for revenue in anticipation of going public. Kimtigo, in 2022, made significant strides in expanding into industrial control and OEM markets, which in turn boosted its shipment volume and market share. Netac maintained its competitive edge in the SSD market alongside securing several government orders in the enterprise SSD sector, keeping its market share and ranking consistent with the previous year.

Alibaba's T-Head unit, responsible for the design and development of in-house IC design, has announced the first domestic SSD controller based on the PCIe 5.0 specification standard. Called the Zhenyue 510, the SSD controller is aimed at enterprise SSD offerings. Interestingly, the Zhenyue 510 is powered by T-Head's custom Xuantie C910 cores based on RISC-V instruction set architecture (ISA). Supporting the PCIe 5.0 standard for interfacing, the SSD controller uses DDR5 memory as a cache buffer. Regarding the performance, there are no official figures yet, but the company claims to have 30% lower input/output latencies compared to competing offerings. T-Head claims the SSD has an IO processing capability of "3400 Kilo IOs per second, a data bandwidth of 14 Gbytes/s, and an extremely high energy efficiency of 420 Kilo IO per second for every Watt".

This is an essential step towards Chinese self-sufficiency as T-Head has designed various ICs for processing different tasks. Still, now Alibaba's chip design unit has a domestic design for storage as well. Claiming low latency figures, the Zhenyue 510 is suitable for enterprise workloads like big data analysis, as well as AI inference/training systems workloads. The development of Zhenyue 510 started in 1H 2021, and it took the company more than two years to complete the design and validation of the chip to prepare it for deployment. This is the second Chinese-made SSD controller after Yingren Technology (InnoGrit) announced their chip in September.

Leading global motherboard manufacturer, ASRock, proudly announces its new WRX90 WS EVO & TRX50 WS motherboard for new AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors. The new motherboards support 4/8 channel memory up to 1 TB/2 TB DDR5 ECC RDIMM, PCI-Express 5.0 expansion slots, server grade storage expansion such as Slim-SAS & MCIO and 10 Gbps Ethernet, giving ultimate performance for almost every application such as content creating, video rendering, high-end workstation and even AI machine learning.

Ultimate Performance & Rock-Solid Stability
To ensure stability for AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors in all conditions and systems loads, the WRX90 WS EVO & TRX50 WS has been given a flagship-class server grade ultra-low loss PCB and 18+3+3 phase SPS Dr.MOS VRM design to ensure ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

Yesterday Gigabyte revealed a pair of AMD B650 motherboards in white/silver and today the company has added an entirely new X670E model using the same colour scheme. X670E AORUS Pro X doesn't have an equivalent black SKU and it's the first Pro model using the AMD X670 chipset, although the overall PCB appears to be based on the X670 AORUS Elite AX, with some interesting additions. The obvious changes include a PCIe 5.0 x16 slot, courtesy of the X670E AORUS Pro X using the E version of the chipset and this also means dual PCIe 5.0 NVMe M.2 slots, as well as a pair of PCIe 4.0 ones.

For some reason, Gigabyte also changed the 2.5 Gbps Ethernet chip from Realtek to Intel, but the specific model isn't mentioned. WiFi will apparently be via a Qualcomm QCNCM865 module, or an MTK/AMD MT7927/RZ738 module, both options supporting 320 MHz wide WiFi 7 channels and Bluetooth 5.3. Gigabyte has also thrown in three extra fan headers, as well as headers for external temperature sensors. However, the one really peculiar feature that has been added to the X670E AORUS Pro X is an internal HDMI port. The internal port appears to be limited to 1080p30 and it's intended for use with a smaller display mounted in windowed cases for diagnostics data and we believe this was a feature ASRock was first with if memory serves. Gigabyte calls this feature Sensor panel Link, but it's unclear if Gigabyte will offer suitable displays or not. There's no word on pricing or an availability date.

Jung-Bae Lee, President and Head of Memory Business of Samsung Electronics, the world's largest NAND memory supplier, has noted in the blog post that Samsung plans to develop its 9th Generation V-NAND memory with over 300 layers, aiming for mass production in 2024. Samsung's V-NAND uses a double-stack structure and is expected to have more active layers than its competitors' 3D NAND memory, such as SK Hynix's forthcoming 321-layer memory. The increase in layers allows Samsung to enhance storage density and performance in its future 3D NAND devices, focusing on input/output (I/O) speed. While the specific performance details of Samsung's 9th Generation V-NAND remain undisclosed, the memory is expected to be used in next-generation PCIe SSDs with the PCIe 5.0 standard.

Jung-Bae Lee has noted: "New structural and material innovations will be critical in the upcoming era of sub-10-nanometer (nm) DRAM and 1,000-layer vertical V-NAND. As such, we are developing 3D stacked structures and new materials for DRAM while increasing layer count, decreasing height, and minimizing cell interference for V-NAND." The 9th installment of V-NAND, scheduled for 2024, is utilizing 11 nm-class DRAM. Additionally, the blog post reassures the commitment to CXL Memory Modules (CMM), which will enable the composable infrastructure of next-generation systems, especially with high-capacity SSDs powered by V-NAND.

Today, AMD announced the much-anticipated AMD Ryzen Threadripper PRO 7000 WX-Series processors and reintroduced the Threadripper processor lineup to the high-end desktop space with the Ryzen Threadripper 7000 Series processors, setting a new standard for computing performance and innovation in the industry.

AMD is introducing the Ryzen Threadripper PRO 7000 WX-Series processors, which will be available later this year to DIY customers, SI partners, and through OEM partners, including Dell Technologies, HP, and Lenovo. Designed for professionals and businesses that demand top-tier performance, reliability, expandability, and security, these processors provide the unparalleled multi-core performance of "Zen 4" Threadripper 7000 Series processors. Additionally, they are bolstered by AMD PRO technologies and offer the enterprise-level security and management features modern businesses require, and feature up to 96 cores and 192 processing threads of incredible performance for the workstation market.

Gigabyte has revealed its first TRX50 motherboard today for AMD's Ryzen Threadripper 7000 Pro and Threadripper 7000 CPUs and to call this board feature packed, would almost be an understatement. The product page is still scant on details, but there's enough there to give us a good idea of what's on offer. The board is a full size ATX board which appears to be somewhere between a high-end consumer board and a workstation board. The heatsink layout isn't as refined as some of Gigabyte's current consumer board, which spoils the overall looks somewhat. With no less than three PCIe 5.0 NVMe M.2 slots and one PCIe 4.0, one has to wonder if the heatsinks covering the SSDs will be enough, considering how hot PCIe 5.0 drives can get.

The board has a further two PCIe 5.0 x16 slots and one PCIe 4.0 x16, so there won't be any need to worry about lack of PCIe lanes per slot here. Somewhat disappointingly, the board only has four DDR5 memory slots, although quad channel support is offered, as well as support for registered DIMMs. The 12 layer PCB also houses a 16+8+4 power phase design, which might be needed based on the expected core count on some of the Threadripper 7000 series CPUs. This is also one of the first boards with onboard USB4 support, with one of the ports offering DisplayPort output, although a DP to DP connection from the graphics card to a DP input on the motherboard is still required. The board also sports a 10 Gbps and a 2.5 Gbps Ethernet port, WiFi 7, a front header for a 20 Gbps USB 3.2 Gen 2x2 port and apparently two audio chips, although the list of specs and the board feature image seem to disagree on what's on offer here. The board is likely to be available at the same time as AMD's new Threadripper CPUs.

Phison Electronics, a global leader in NAND controllers and storage solutions, announced today that the company has expanded its portfolio of PCIe 5.0 high-speed transmission solutions with PCIe 5.0, CXL 2.0 compatible redriver and retimer data signal conditioning IC products. Leveraging the company's deep expertise in PCIe engineering, Phison is the only signal conditioners provider that offers the widest portfolio of multi-channel PCIe 5.0 redriver and retimer solutions and PCIe 5.0 storage solutions designed specifically to meet the data infrastructure demands of artificial intelligence and machine learning (AI+ML), edge computing, high-performance computing, and other data-intensive, next-gen applications. At the 2023 Open Compute Project Global Summit, the Phison team is showcasing its expansive PCIe 5.0 portfolio, demonstrating the redriver and retimer technologies alongside other enterprise NAND flash, illustrating a holistic vision for a PCIe 5.0 data ecosystem to address the most demanding applications of the AI-everywhere era.

"Phison has focused industry-leading R&D efforts on developing in-house, chip-to-chip communication technologies since the introduction of the PCIe 3.0 protocol, with PCIe 4.0 and PCIe 5.0 solutions now in mass production, and PCIe 6.0 solutions now in the design phase," said Michael Wu, President & General Manager, Phison US. "Phison's accumulated experience in high-speed signaling enables our team to deliver retimer and redriver design solutions that are optimized for top signal integration, low power usage, and high temperature endurance, to deliver interface speeds for the most challenging compute environments."

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its range-wide compatibility and readiness for Intel's new 14th Generation Intel Core processors. With a enormous range of tested and validated components such as DDR5 memory, all-in-one liquid CPU coolers, innovative and reliable power supplies, and blazing fast M.2 SSDs, you can be confident that CORSAIR components will pair exceptionally with the latest in Intel processors to help your PC reach its full potential.

The latest Core processors utilize Intel's new Performance Hybrid Architecture, featuring more efficiency-cores for the best gaming experience—even while streaming and encoding video. Other features, such as Intel Thread Director to keep background tasks from slowing down games and Smart Cache for smoother gameplay and faster load times, make 14th Gen Core processors a great choice for PC gaming. But it's not enough to just have the CPU; you need to complete your system with components that can keep up and tap into its full potential, and that's where CORSAIR comes in.

ASUS, a global infrastructure solution provider, is excited to announce its participation in the 2023 OCP Global Summit, which is taking place from October 17-19, 2023, at the San Jose McEnery Convention Center. The prestigious annual event brings together industry leaders, innovators and decision-makers from around the world to explore and discuss the latest advancements in open infrastructure and cloud technologies, providing a perfect stage for ASUS to unveil its latest cutting-edge products.

The ASUS theme for the OCP Global Summit is Solutions beyond limits—ASUS empowers AI, cloud, telco and more. We will showcase an array of products:

Silicon Power (SP) is thrilled to announce its inaugural participation at the renowned Penny Arcade Expo (PAX) from October 6-8. Together with Mwave and Umart, the company's distributors in Australia, SP will offer exclusive promotions to gaming enthusiasts. The company will also showcase its cutting-edge gaming solutions, including the debut of its groundbreaking product, the XPOWER XS80 PCIe Gen 5 SSD. Taking place at the Melbourne Convention and Exhibition Centre (MCEC), PAX provides the perfect backdrop for SP to unveil its latest innovation, further solidifying the brand's commitment to delivering high-performance storage solutions for gamers.

Game-Changing Gen 5 Performance with the XS80
The XS80 offers exceptional gaming performance with the latest PCIe Gen 5 technology, NVMe 2.0 support, and 232-layer 3D NAND flash, delivering twice the data transfer rate of Gen 4 and four times that of Gen 3.

Intel Corporation today announced its intent to separate its Programmable Solutions Group (PSG) operations into a standalone business. This will give PSG the autonomy and flexibility it needs to fully accelerate its growth and more effectively compete in the FPGA industry, which serves a broad array of markets, including the data center, communications, industrial, automotive, aerospace and defense sectors. Intel also announced that Sandra Rivera, executive vice president at Intel, will assume leadership of PSG as chief executive officer; Shannon Poulin has been named chief operating officer.

Standalone operations for PSG are expected to begin Jan. 1, 2024, with ongoing support from Intel. Intel expects to report PSG as a separate business unit when it releases first-quarter 2024 financials. Over the next two to three years, Intel intends to conduct an IPO for PSG and may explore opportunities with private investors to accelerate the business's growth, with Intel retaining a majority stake.

During the China Chip Storage Future 2023 Storage Industry Trend Summit, Yingren Technology, widely recognized as InnoGrit outside of China, announced the initiation of mass production of its enterprise-level YR S900 PCIe 5.0 SSD controller. Marking a significant breakthrough, the YR S900 stands as China's first domestic PCIe 5.0 SSD controller. Operating on an open-source RISC-V architecture, the YR S900 is engineered to align with U.S. export restrictions, ensuring a seamless design and manufacturing process of the SSD controller. While Yingren Technology remains discreet about the specific process node to produce the YR S900, it's known that the controller embodies a versatile design, with compatibility extending to mainstream NAND from eminent manufacturers, and exhibits an impressive synergy with NAND from Yangtze Memory Technologies Corp (YMTC).

The YR S900 is a quad-channel controller, offering sequential read and write speeds peaking at 14 GB/s and 12 GB/s, respectively, and is equipped with InnoGrit's third-generation ECC engine to optimize 4K LDPC encoding and decoding. This collaboration with Kioxia's XL-Flash results in a low 4K random read latency of 10us, highlighting its potential to deliver higher data throughput, increased stability, and extended service life. The YR S900 encompasses a comprehensive feature set, including FDP, SR-IOV hardware virtualization, CMB, and a range of data encryption algorithms. While the mass production of the YR S900 underscores a monumental stride in SSD solutions within China, it remains to be seen whether adopting this new Chinese technology will enter markets beyond China.

Thanks to the 3D renders and technical drawings obtained by Igor's Lab, we have insights into the structure of Intel's next-generation LGA-1851 socket for Arrow Lake processors. Scheduled to arrive in mid-2024, the LGA-1851 socket was originally intended for Meteor Lake-S desktop processors. However, the socket is now awaiting Arrow Lake since Meteor Lake is now a mobile-only processor generation. The first notable thing about LGA-1851 is that it will directly connect a dedicated PCIe 5.0 x4 interface to the CPU, besides the x16 lanes going to the GPU. This results in native support for high-speed PCIe 5.0 NVMe SSDs that can achieve speeds of over 12 GB/s in both read and write workloads.

Intel Arrow Lake-S will be available with eight P-cores and 16 E-cores in SKUs with different combinations of the two. The accompanying 800 series chipset includes Z890, B860, and H810 models, with an evident absence of H870 SKU. There will be W880 and Q870 workstation-grade chipsets as well. It is worth pointing out that Arrow Lake will enable DRAM capacities of up to 48 GB per DIMM at 6400 MT/s. We expect to hear more about Arrow Lake-S as we near the 2024 launch date and we get to see the Intel 20A node being used in client products. Below, you can see the technical drawings of the Independent Loading Mechanism (ILM) and chipset 3D models.

MSI is excited to announce today the brand-new MAX Series Motherboards for the Z790 chipset and Micro-ATX motherboards for the B760 chipset, which includes the MEG Series, MPG Series, MAG Series, and PRO Series. MSI's Z790 and B760 motherboards paired with Intel Core Next-gen, 13th Gen, and 12th Gen Processors are here to bring even more performance and fine-tuning on the success of the last generation of Processors. As a world-leading motherboard brand, MSI's Z790 MAX Series motherboards are designed to provide the very best performance for gamers and creators.

MSI Z790 MAX Series motherboards have a strong lineup of power phase design boards across every model ranging from our flagship MEG Z790 GODLIKE MAX that has 26 Duet Rail Power System CPU power phases with 105 A SPS to even our entry-level PRO Series motherboard that has increased up to 16 DRPS CPU power phases with 80 A SPS.

Intel Innovation 2023 -- Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing future support for the upcoming 5th Gen Intel Xeon processors. In addition, Supermicro will soon offer early shipping and free remote early access testing of the new Systems via its JumpStart Program for qualified customers. To learn more, go to www.supermicro.com/x13 for details. The Supermicro 8x GPU optimized servers, the SuperBlade servers, and the Hyper Series will soon be ready for customers to test their workloads on the new CPU.

"Supermicro's range of Generative High-Performance AI systems, including recently launched GPUs, continues to lead the industry in AI offerings with its broad range of X13 family of servers designed for various workloads, from the edge to the cloud," said Charles Liang, president, and CEO, Supermicro. "Our support for the upcoming 5th Gen Intel Xeon processors, with more cores, an increased performance per watt, and the latest DDR5-5600 MHz memory, will allow our customers to realize even greater application performance and power efficiency for AI, Cloud, 5G Edge, and Enterprise workloads. These new features will help customers accelerate their business and maximize their competitive advantage."

ASRock Rack, the leading innovative server company, today announced its latest server motherboard lineup now supports the AMD EPYC 8004 Series processors which extend the 4th Gen EPYC Family into new markets.

The AMD EPYC 8004 Series processors bring the benefits of the "Zen 4c" processor core to markets that seek strong performance but also have significant requirements for efficient, dense form factors, limited available power, and quieter operations. "AMD EPYC 8004 Processors are purpose-built to deliver strong performance and energy efficiency in an optimized, single-socket package," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "The combination of impressive performance and streamlined platform componentry of the EPYC 8004 Series CPUs means system builders can offer their customers cost-efficient business-relevant configurations."

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are purpose built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency.

"The AMD EPYC 8004 Series CPUs deliver a great combination of impressive performance and streamlined platform componentry which enables us to develop business-relevant server configurations for our customers," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology. "TYAN's innovative server platform, fueled by EPYC 8004 Series CPUs, empowers us to provide our customers with cost-effective solutions while also expanding into new markets."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the AMD based Supermicro H13 generation of WIO Servers, optimized to deliver strong performance and energy efficiency for edge and telco datacenters powered by the new AMD EPYC 8004 Series processors. The new Supermicro H13 WIO and short-depth front I/O systems deliver energy-efficient single socket servers that lower operating costs for enterprise, telco, and edge applications. These systems are designed with a dense form factor and flexible I/O options for storage and networking, making the new servers ideal for deploying in edge networks.

"We are excited to expand our AMD EPYC-based server offerings optimized to deliver excellent TCO and energy efficiency for data center networking and edge computing," said Charles Liang, president and CEO of Supermicro. "Adding to our already industry leading edge-to-cloud rack scale IT solutions, the new Supermicro H13 WIO systems with PCIe 5.0 and DDR5-4800 MHz memory show tremendous performance for edge applications."

To address customers' growing needs, Intel expanded its Intel Agilex FPGA portfolio and broadened its Programmable Solutions Group (PSG) offerings to handle the increased demand for customized workloads, including enhanced AI capabilities, and to provide lower total cost of ownership (TCO) and more complete solutions. These new products and technologies will be the focus of Intel's FPGA Technology Day (IFTD) on Sept. 18, where hardware engineers, software developers and system architects can interact with Intel and partner experts.

FPGAs play an important role in Intel's portfolio by offering flexible and customizable platform capabilities for demanding applications and workloads. Intel FPGAs solve customer challenges from cloud to edge with AI capabilities across silicon, IP and software. Intel's latest announcements illustrate how the company's increased investment in its FPGA portfolio is unfolding. So far in 2023, Intel has released 11 of 15 expected new products - more new product introductions than ever in Intel's FPGA business. As disclosed in its second quarter 2023 earnings call, Intel reported that its PSG business unit delivered 35% revenue growth year-over-year, marking the third consecutive quarter of record revenue.

The advent of PCIe 5.0 SSDs with Phison's E26 controllers has been a double-edged sword. While these SSDs offer impressively high data throughputs, they come with a significant drawback: severe overheating issues that can cause the SSDs not only to throttle down but to shut off entirely. TechPowerUp first noted this issue back in May, in our Corsair MP700 review, where the uncooled drive shut down after 86 seconds of reads and after 55 seconds of writes. Regarding criticism from tech reviewers, Corsair has released a firmware update (version 22.1) for its MP700 SSD to ensure that it throttles down rather than shutting off when overheated. Yet, many other SSDs like the Crucial T700, Seagate FireCuda 540, Gigabyte Aorus Gen 5 10000, and ADATA Legend 970 still suffer from temperature issues.

However, it's crucial to note that these extreme overheating problems occur only when the SSDs run without any cooling. While some manufacturers have planned firmware updates to address the issue, Corsair is the only company that has taken tangible action so far. Crucial has released a new firmware (PACR5102), but the ComputerBase report indicates that the SSD continues to shut off at high temperatures. The problem, though, can generally be mitigated with proper cooling. Whether using the included cooler or placing the SSD under a motherboard cover, temperatures usually stay below the critical limit, thus avoiding a complete shutdown. When we tested the SSTC Tiger Shark Elite 2 TB with Phison E26 (with updated firmware) without adequate cooling, the SSD continued to operate and throttled down, indicating that the remaining SSDs using this controller need a proper firmware update that throttles the SSD instead of shutting it down.

Silicon Motion's product manager, Liu Yaoren, has predicted that the first notebook models to feature PCIe 5.0 SSD storage will hit retail around late 2024. This information was disclosed during the company's key note presentation at 2023's Flash Memory Summit Conference and Exhibition, but only picked up on by media outlets in recent days. The American-Taiwanese company showcased their SM2508 controller on the showroom floor—this is advertised as their answer to Phison's E26. The upcoming Silicon Motion-designed controller "promises to deliver sequential read and write speeds of up to 14 GB/s. Random performance is rated at 2.5 million IOPS read and 2.4 million IOPS write." NAND flash speeds of up to 3600 MT/s provide some future proofing.

ITHome has reported on further technical details released by Huirong Technology/Silicon Motion—their flagship SM2508 IC also uses the more advanced TSMC 6 nm process technology, (and) has a built-in dual-core Cortex R8 processor." The memory controller's operational TDP is rated at around 3.5 W—the firm believes that their product shows the "ultimate potential of PCIe Gen 5 performance" with ultra-low power consumption, although no thermal figures were disclosed to attendees. MSI premiered its PCIe Gen 5 SSD compatible laptop series earlier this year, but aftermarket parts with sizable heatsinks are proving to be a tricky fit.

Lexar, a leading global brand of flash memory solutions, is unveiling a variety of new products that are estimated to be launched in Q4 2023. Designed for photography professionals and PC enthusiasts to accelerate their workflow, the expanded portfolio includes a new microSD card, internal SSDs, DRAM, and portable SSDs.

The new Professional GOLD micro SDXC UHS-II card, available in 128 GB and 256 GB, leverages the high-speed performance and a Video Speed Class 60 (V60) rating, allowing users to quickly capture, play back, and transfer high-definition multimedia files, including 4K video, with a read transfer speed up to 280 MB/s. This card is also great for use with gaming devices, sports camcorders, tablets, or smartphones, and drones.

TrendForce research reveals that, due to the impacts of high inflation and economic downturn, CSPs are adopting more conservative strategies when it comes to capital expenditure and consistently reducing their annual server demand forecasts. Currently, CSPs in China have reported a decline in cloud orders compared to last year, leading to a subsequent decrease in annual procurement volumes for enterprise SSDs. In North America, some clients have postponed mass production timelines for new server platforms while ramping up investments in AI servers. These factors have resulted in enterprise SSD orders falling below expectations. Consequently, global enterprise SSD revenue hit an all-time low in the second quarter, totaling just $1,500 million—a QoQ decrease of 24.9%.

Demand for AI servers remains strong in the third quarter, while orders and shipment momentum for general-purpose servers have yet to show signs of recovery. This continues to put pressure on the purchasing volume of enterprise SSDs, and annual bit volume is expected to be lower than last year. Meanwhile, vendors have once again reduced capacity utilization to slow down inventory growth. Server customers still maintain high inventory levels, and their purchasing momentum remains insufficient. This is expected to lead to an approximate 15% QoQ decline in the average price of enterprise SSDs in the third quarter, which may further result in a lackluster revenue performance for the peak season.