Super Micro Computer, Inc. (SMCI), a global leader in enterprise computing, storage, networking solutions, and green computing technology, is announcing its most advanced GPU server, incorporating eight NVIDIA H100 Tensor Core GPUs. Due to its advanced airflow design, the new high-end GPU system will allow increased inlet temperatures, reducing a data center's overall Power Usage Effectiveness (PUE) while maintaining the absolute highest performance profile. In addition, Supermicro is expanding its GPU server lineup with this new Universal GPU server, which is already the largest in the industry. Supermicro now offers three distinct Universal GPU systems: the 4U,5U, and new 8U 8GPU server. The Universal GPU platforms support both current and future Intel and AMD CPUs -- up to 400 W, 350 W, and higher.

"Supermicro is leading the industry with an extremely flexible and high-performance GPU server, which features the powerful NVIDIA A100 and H100 GPU," said Charles Liang, president, and CEO, of Supermicro. "This new server will support the next generation of CPUs and GPUs and is designed with maximum cooling capacity using the same chassis. We constantly look for innovative ways to deliver total IT Solutions to our growing customer base."

The latest Community Update 1 patch of "Dying Light: Stay Human" adds support for the AMD FidelityFX Super Resolution 2.0 (FSR 2.0) performance enhancement. This adds several more quality-performance presets that improve visuals over FSR 1.0 at a given frame-rate, or improve frame-rate at a given quality-level. The update also improves the game's memory-management of the GPU's video memory in DirectX 12 mode, which should benefit features such as real-time ray tracing. There are other minor fixes for SSAO and TAA temporal anti-aliasing.

Corsair decided it was time to start teasing its upcoming MP700 PCIe 5.0 NVMe SSD, although the company didn't bother providing any images of the drive itself, or any specifications in the teaser. However, Corsair did provide some sequential performance figures, which end up being impressive and disappointing at the same time. The MP700 is said to offer sequential read speeds of up to 10 GB/s or 10,000 MB/s if you prefer and sequential write speeds of 9.5 GB/s. These are obviously very fast speeds, but quite far from what the PCIe 5.0 can deliver and the performance figures are only a bit faster than the best PCIe 4.0 drives. It's likely that we'll see better performance from second generation controllers, just as we did with PCIe 4.0 SSDs, as this gives both the SSD controller makers and the SSD makers a chance to refresh their products a year or two down the line.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products announces its SMART Zefr Memory, a proprietary process that eliminates more than 90% of memory reliability failures and optimizes memory subsystems for maximum uptime. System start-up delays are frequently attributed to memory errors. These failures reduce system efficiency and may also lead to higher maintenance costs and lower system yield rates. These failures reduce system efficiency and may also lead to higher maintenance costs and lower system yield rates. SMART Zefr Memory has been tested under real-world conditions to identify and filter out marginal components that may undermine memory reliability.

SMART Zefr Memory uses a proprietary screening process developed by SMART that when performed on memory modules ensures the industry's highest levels of uptime and reliability. SMART Zefr Memory is ideally suited for data centers, hyperscalers, high performance computing (HPC) platforms, and other environments that run large memory applications and depend on uptime for customers.

MaxLinear Inc. today announced the availability of Panther III, the latest in the company's Panther series of storage accelerators. The company is showcasing this product at the Flash Memory Summit in Santa Clara, CA, August 2 - 4. Booth 111. Businesses need immediate access to larger and larger amounts of data and, at the same time, are faced with security and CAPEX costs challenges. With its 16 nanometer (nm) DPU architecture, Panther III provides breakthrough data reduction, encryption, deduplication, and data protection and sets a new standard in storage acceleration with a high throughput of 200 Gbps and ultra-low single-pass transformation latency.

Panther III opens new opportunities within the storage market, including all-flash-array and non-volatile memory express (NVMe) systems. As with previous generations of Panther products, Panther III offers powerful data reduction technology that intelligently offloads the CPU to open all tiers of storage to their full bandwidth potential with no CPU or software limitations. These capabilities enable intelligent and faster dataset delivery, high-performance analytics, and improved workload accuracy in fast-growing Edge to disaggregated computing of the public cloud.

[Editor's Note: We Reviewed Razer DeathStalker V2 Pro Optical Keyboard here.]

Razer, the leading global lifestyle brand for gamers, today announced the return of the acclaimed DeathStalker keyboard in the form of the new DeathStalker V2 Pro, DeathStalker V2 Pro Tenkeyless, and DeathStalker V2.

With a clean, low-profile design language running across the range, the new DeathStalker V2 line is ideal for gamers looking for a clutter-free desktop set-up. Boasting a sleek, low-profile design, the DeathStalker V2 line is all about high-profile performance, featuring both linear and clicky variants of the Razer Low-profile Optical Switches across the range. Adding to the premium experience are a slim-line aluminium top plate for superb durability, and laser-etched keycaps with an ultra-durable coating for even greater longevity.

It's been a busy couple of days when it comes to Intel and its Arc graphics cards, as not only has the company showed off the Arc A770—which looks identical to the Arc A750—but the company has also refuted that it was ever planning to release an Arc A780 card, despite the existence of the A380 and supposedly an A580. A leak with price brackets and performance tiering has also leaked, which gives us a much better understanding of how Intel is planning on positioning its Arc graphics cards versus NVIDIA and AMD and it doesn't look like Intel is as confident as it sounded just a few months ago.

LinusTechTips got the honour to reveal the Arc A770 card, although there appear to be minuscule differences to the physical appearance between it and the Arc A750. The only thing noticeable is a 3-pin header, possibly for some kind of RGB syncing, next to the 8- and 6-pin power connectors, something not present on the A750 card that Gamers Nexus showed off earlier this week. The good news is that the Arc A770 seems to be running cool, as the card was reportedly only hitting 69 degrees C during some hands-on time, although this will apparently be covered in a separate video next week.

Hyperscalers such as Microsoft, Google, Amazon, etc., all run their cloud divisions with a specific goal. To provide their hardware to someone else in a form called instance and have the user pay for it by the hour. However, instances are usually bound by a specific CPU and memory configuration, which you can not configure yourself. But instead, you can only choose from the few available options that are listed. For example, when selecting one virtual CPU core, you get two GB of RAM and can go as high as you want with CPU cores. However, the available RAM will also double, even though you might not need it. When renting an instance, the allocated CPU cores and memory are yours until the instance is turned off.

And it is precisely this that hyperscalers are dealing with. Many instances don't fully utilize their DRAM, making the whole data center usage inefficient. Microsoft Azure, one of the largest cloud providers, measured that 50% of all VMs never touch 50% of their rented memory. This makes memory stranded in a rented VM, making it unusable for anything else.

At Azure, we find that a major contributor to DRAM inefficiency is platform-level memory stranding. Memory stranding occurs when a server's cores are fully rented to virtual machines (VMs), but unrented memory remains. With the cores exhausted, the remaining memory is unrentable on its own, and is thus stranded. Surprisingly, we find that up to 25% of DRAM may become stranded at any given moment.

Kevin Glynn, aka "Uncle Webb," our associate software author behind popular utilities such as ThrottleStop and RealTemp, developed a new utility named Counter Control, which lets you monitor and log the performance counters of Intel Core processors since 2008 (Core "Nehalem"). During development for ThrottleStop, Kevin discovered a fascinating bug with Windows Defender, the built-in security software of Windows, which causes significantly higher performance impact on the processor than it should normally have. Of course a security software is bound to have some (small) performance impact during real-time protection, but this is much bigger.The first sign that something is happening is that HWiNFO will be reporting a reduced "Effective Clock" speed when the CPU is fully loaded. A much bigger problem is that when Defender is affected by the bug, performance of your machine will be significantly reduced. For example, a Core i9-10850K running at 5.00 GHz all-core loses 1000 Cinebench points (or 6%). Such a performance loss has been reported by owners of Intel Core 8th, 9th, 10th and 11th Gen, both desktop and mobile CPUs, on both Windows 10 and Windows 11. AMD processors are not affected.

Intel's semiconductors nodes have been quite controversial with the arrival of the 10 nm design. Years in the making, the node got delayed multiple times, and only recently did the general public get the first 10 nm chips. Today, at IEEE's annual VLSI Symposium, we get more details about Intel's upcoming nodes, called Intel 4. Previously referred to as a 7 nm process, Intel 4 is the company's first node to use EUV lithography accompanied by various technologies. The first thing when a new process node is discussed is density. Compared to Intel 7, Intel 4 will double the transistor count for the same area and enable 20% higher performing transistors.

Looking at individual transistor size, the new Intel 4 node represents a very tiny piece of silicon that is even smaller than its predecessor. With a Fin Pitch of 30 nm, Contact Gate Poly Pitch of 50 nm between gates, and Minimum Metal Pitch (M0) of 50 nm, the Intel 4 transistor is significantly smaller compared to the Intel 7 cell, listed in the table below. For scaling, Intel 4 provides double the number of transistors in the same area compared to Intel 7. However, this reasoning is applied only to logic. For SRAM, the new PDK provides 0.77 area reduction, meaning that the same SoC built on Intel 7 will not be half the size of Intel 4, as SRAM plays a significant role in chip design. The Intel 7 HP library can put 80 million transistors on a square millimeter, while Intel 4 HP is capable of 160 million transistors per square millimeter.

Supercomputing game has been chasing various barriers over the years. This has included MegaFLOP, GigaFLOP, TeraFLOP, PetaFLOP, and now ExaFLOP computing. Today, we are witnessing for the first time an introduction of an Exascale-level machine contained at Oak Ridge National Laboratory. Called the Frontier, this system is not really new. We have known about its upcoming features for months now. What is new is the fact that it was completed and is successfully running at ORNL's facilities. Based on the HPE Cray EX235a architecture, the system uses 3rd Gen AMD EPYC 64-core processors with a 2 GHz frequency. In total, the system has 8,730,112 cores that work in conjunction with AMD Instinct MI250X GPUs.

As of today's TOP500 supercomputers list, the system is overtaking Fugaku's spot to become the fastest supercomputer on the planet. Delivering a sustained HPL (High-Performance Linpack) score of 1.102 Exaflop/s, it features a 52.23 GigaFLOPs/watt power efficiency rating. In the HPL-AI metric, dedicated to measuring the system's AI capabilities, the Frontier machine can output 6.86 exaFLOPs at reduced precisions. This alone is, of course, not a capable metric for Exascale machines as AI works with INT8/FP16/FP32 formats, while the official results are measured in FP64 double-precision form. Fugaku, the previous number one, scores about 2 ExaFLOPs in HPL-AI while delivering "only" 442 PetaFlop/s in HPL FP64 benchmarks.

Today, Logitech expanded its Master Series with two new mechanical keyboards - the full-size MX Mechanical and minimalist MX Mechanical Mini - and MX Master 3S mouse. Logitech's Master Series brings advanced digital creators ultimate productivity tools, featuring high performance mechanical typing and precision tracking. "There is a growing community of software developers who fell in love with mechanical keyboards when they started playing games, and now they want the same feeling of precision and control with their professional desktop keyboard," said Tolya Polyanker, head of the MX Series for Creativity and Productivity at Logitech. "MX Mechanical combines the best of both - Logitech's gaming keyboard expertise with MX Master Series signature experiences."

MX Mechanical and MX Mechanical Mini offer the latest generation of low profile mechanical switches. Tactile Quiet (Brown) key switch makes it Logitech's quietest mechanical keyboard ever with an amazing mechanical typing feel. Clicky (Blue) and Linear (Red) switch options are also available in select markets. The keyboards are designed with dual-colored keycaps for an optimized peripheral view. Smart backlighting, in six lighting options, automatically adjusts brightness for ambient light and switches off when not needed for efficient battery consumption.

DeepCool, a global brand in designing and manufacturing high-performance computer components for enthusiasts worldwide, announces a highly compatible CPU air cooler that offers impressive heat dissipation power in a compact and efficient design. With a slim profile, the AK400 air cooler serves as a thermal solution that can easily fit into mainstream ATX/MATX system builds. the unique design of the matrix form fin-stack and the non-RGB cover top offers a special aesthetic value to particular users.

The DeepCool AK400 Performance CPU Cooler is highly compatible and offers impressive heat dissipation power of 220 W in a compact and efficient design. Four direct touch copper heat pipes quickly transfer heat away from the processor into a dense matrix fin array heat sink for effective cooling performance.

Last month, Intel released its Arc Alchemist lineup for mobile/laptop configurations. As expected, being the first discrete GPU that the company made, there are some hiccups here and there that happen along the way. Today, we have an interesting case of Intel Arc A350M getting a heavy performance boost with Dynamic Tuning Technology (DTT) disabled. The DTT is Intel's solution to automatically and dynamically allocate power between an Intel processor and an Intel Discrete Graphics Card to optimize performance and improve battery life. This is essentially a competing tech for AMD SmartShift and NVIDIA Dynamic Boost implementations. Thanks to a South Korean YouTuber, BullsLab, we have information that disabling DTT in drivers helps Arc 350M GPU reach higher performance targets.

He found when disabling DTT in drivers that the gaming performance improved significantly and that the Arc 350M was outputting 30-80 more frames per second. This is no slight improvement and shows that the drivers are still not yet mature. Creating a discrete graphics card is not an easy task, as noted here; however, we hope to see Intel put out more fixes in the coming weeks and hopefully end this strange behavior.Below, you can see the YouTube video with benchmarks.

A new quarter and another forecast shattering revenue report from TSMC, as the company beat analysts' forecasts by over US$658 million, with a total revenue for the quarter of US$17.6 billion and a net income of almost US$7.26 billion. That's an increase in net income of 45.1 percent or 35.5 percent in sales. Although the monetary figures might be interesting to some, far more interesting details were also shared, such as production updates about future nodes. As a followup on yesterday's news post about 3 nanometer nodes, the N3 node is officially on track for mass production in the second half of this year. TSMC says that customer engagement is stronger than at the start of its N7 and N7 nodes, with HPC and smartphone chip makers lining up to get onboard. The N3E node is, as reported yesterday, expected to enter mass production in the second half of 2023, or a year after N3. Finally, the N2 node is expected in 2025 and won't adhere to TSMC's two year process technology cadence.

Breaking down the revenue by nodes, N7 has taken back the lead over N5, as N7 accounted for 30 percent of TSMC's Q1 revenues up from 27 percent last quarter, but down from 35 percent in the previous year. N5 sits at 20 percent, which is down from 23 percent in the previous quarter, but up from 14 percent a year ago. The 16 and 28 nm nodes still hold on to 25 percent of TSMC's revenue, which is the same as a year ago and up slightly from the previous quarter. Remaining nodes are unchanged from last quarter.

Apple made some bold claims at the launch of its new Mac Studio computers when it came to the performance of the new systems and it looks like Apple was exaggerating those claims by quite some margin when it comes to the graphics performance. The first reviews of the new Mac Studio went live today and thanks to those reviews, despite the limited benchmarks that were performed on the new systems from Apple, that as so often Apple's performance metrics are still relying on the reality distortion field. Most of the publications that got their hands on the new systems focused on CPU benchmarks and there's no doubt the Ultra version of the M1 processor is a beast when used for things like video rendering and complex image manipulation, where it's butting heads with an AMD Ryzen Threadripper 3970X.

However, Apple's 64-core GPU isn't quite what the company claimed. In the presentation footnotes Apple provided details on the "highest-end discrete GPU" that they compared to, which was an NVIDIA GeForce RTX 3090. If we were to be kind to Apple, we would say that the company was slightly off target here, but it's actually not even remotely close. Tom's Guide tested the M1 Ultra SoC in Sid Meier's Civilization 6 and got a whopping 38.85 FPS at 1440p, which is beaten soundly by a Lenovo ThinkPad P1 Gen 4 with a GeForce RTX 3070 laptop GPU that scored 64.9 FPS at 4K. Likewise, The Verge decided to test the claims and had a system with an actual GeForce RTX 3090 in it and ran Shadow of the Tomb Raider and the PC managed 142 FPS at 1080p, with the M1 Ultra coming in quite far behind at 108 FPS. Moving up to 1440p the 3090 came in at 114 FPS, with the M1 still trailing behind, if not quite as badly at 96 FPS.

The output value of the world's top 10 foundries in 4Q21 reached US$29.55 billion, or 8.3% growth QoQ, according to TrendForce's research. This is due to the interaction of two major factors. One is limited growth in overall production capacity. At present, the shortage of certain components for TVs and laptops has eased but there are other peripheral materials derived from mature process such as PMIC, Wi-Fi, and MCU that are still in short supply, precipitating continued fully loaded foundry capacity. Second is rising average selling price (ASP). In the fourth quarter, more expensive wafers were produced in succession led by TSMC and foundries continued to adjust their product mix to increase ASP. In terms of changes in this quarter's top 10 ranking, Nexchip overtook incumbent DB Hitek to clinch 10th place.

TrendForce believes that the output value of the world's top ten foundries will maintain a growth trend in 1Q22 but appreciation in ASP will still be the primary driver of said growth. However, since there are fewer first quarter working days in the Greater China Area due to the Lunar New Year holiday and this is the time when some foundries schedule an annual maintenance period, 1Q22 growth rate will be down slightly compared to 4Q21.

ASRock Industrial launches a new range of industrial motherboards powered by 12th Gen Intel Core Processors (Alder Lake-S) with up to 16 cores and 24 threads, supporting the new Intel 600 Series W680, Q670, and H610 chipsets. Featuring high computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 GbE LANs with real-time TSN, multi M.2 Key M, ECC memory, plus TPM 2.0, and wide voltage support. The new series covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards for diverse applications, such as factory automation, kiosks, digital signage, smart cities, medical, and Edge AIoT applications.

The European High Performance Computing Joint Undertaking (EuroHPC JU) has launched 3 new research and innovation projects. The projects aim to bring the EU and its partners in the EuroHPC JU closer to developing independent microprocessor and HPC technology and advance a sovereign European HPC ecosystem. The European Processor Initiative (EPI SGA2), The European PILOT and the European Pilot for Exascale (EUPEX) are interlinked projects and an important milestone towards a more autonomous European supply chain for digital technologies and specifically HPC.

With joint investments of €140 million from the European Union (EU) and the EuroHPC JU Participating States, the three projects will carry out research and innovation activities to contribute to the overarching goal of securing European autonomy and sovereignty in HPC components and technologies, especially in anticipation of the European exascale supercomputers.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard: JESD238 HBM3, available for download from the JEDEC website. HBM3 is an innovative approach to raising the data processing rate used in applications where higher bandwidth, lower power consumption and capacity per area are essential to a solution's market success, including graphics processing and high-performance computing and servers.

In 2016, NVIDIA announced that the company is working on replacing its Fast Logic Controller processor codenamed Falcon with a new GPU System Processor (GSP) solution based on RISC-V Instruction Set Architecture (ISA). This novel RISC-V processor is codenamed NV-RISCV and has been used as GPU's controller core, coordinating everything in the massive pool of GPU cores. Today, NVIDIA has decided to open this NV-RISCV CPU to a broader spectrum of applications starting with 510.39 drivers. According to the NVIDIA documents, this is only available in the select GPUs for now, mainly data-centric Tesla accelerators.

NVIDIA DocumentsSome GPUs include a GPU System Processor (GSP) which can be used to offload GPU initialization and management tasks. This processor is driven by the firmware file /lib/firmware/nvidia/510.39.01/gsp.bin. A few select products currently use GSP by default, and more products will take advantage of GSP in future driver releases.
Offloading tasks which were traditionally performed by the driver on the CPU can improve performance due to lower latency access to GPU hardware internals.

A few days ago, we reported a strange Intel Core i5-12490F processor that appeared in the Chinese marketplace. The processor uses the C0 silicon that Intel sits on a pile of and repurposes it to make these odd chips for Asian markets. As we found out, this C0 silicon is a heavily cut-down version, with only six high-performance P-cores present. Compared to the regular Core i5-12400F, it has a bigger L3 cache arriving at 20 MB and slightly higher clock speeds where the base stands at 3.0 G and a boost frequency that manages to ramp up to 4.6 GHz. As a reference, the regular Core i5-12400F has 18 MB of L3 cache, a base frequency of 2.5 GHz, and a boost speed of 4.4 GHz.

Thanks to the early benchmarks, we have the performance numbers in two cases where Intel's Core i5-12490F model is compared to the regular Core i5-12400F. According to the GeekBench data, the first case proves that higher clock speeds of the strange processor, coupled with higher L3 cache, prove to be of help as the single-threaded performance grows by 10%. In comparison, the multi-threaded results show an even more considerable improvement at 15%. The second test shows smaller margins compared to the Core i5-12500, where the Core i5-12490F processor now only leads by 2.5% and 5% in single-threaded and multi-threaded workloads, respectively. This indicates that we have to wait for more benchmarks to see how this design stands in the Alder Lake family and see just how big of an improvement comes from higher frequencies and bigger L3 cache.

Phanteks debuts a host of new products for the upcoming year at CES 2022 - The brand new Evolv Shift XT Mini-ITX Chassis and Revolt SFX Power Supplies, Matte White Editions for the Evolv X & Eclipse P600S Chassis, white SK PWM D-RGB Fans, white AMP Power Supply and a complete range of Gen4 PCIe Riser Cables and Gen4 Vertical GPU Bracket.

Brand new and unique Evolv Shift XT Mini-ITX Chassis and super compact Revolt SFX Power Supplies
Evolv Shift XT - Compact, Powerful, Futureproof
The Evolv Shift XT brings a unique small form factor that can extend in size to tailor to your cooling performance needs. The Evolv Shift XT has no compromise on performance with support for powerful hardware, whether in Compact, Aircooled, or Liquid Cooled Mode.

congatec - a leading vendor of embedded and edge computing technology - introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel's innovative performance hybrid architecture. Offering of up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low power Efficient-cores (E-cores) and DDR5 memory support to accelerate multithreaded applications and execute background tasks more efficiently.

Today as part of CES 2022, Intel demonstrated advancements and momentum with Mobileye, progress toward discrete graphics leadership and the launch of the newest members of the 12th Gen Intel Core family. With these milestones, Intel furthers its commitment to enable the industry and its customers and partners to harness the technology superpowers - ubiquitous computing, cloud-to-edge infrastructure, pervasive connectivity and artificial intelligence - at the heart of the digital transformation.

During the Intel news conference, Gregory Bryant, executive vice president and general manager of the Client Computing Group, was joined by Lisa Pearce, vice president of the Visual Compute Group, and Prof. Amnon Shashua, Mobileye CEO, to share Intel's progress across multiple strategic businesses. "The Intel execution engine is back. From advancing the PC to high-performance graphics to autonomous driving solutions, Intel and Mobileye are proud to create new ecosystems and opportunities across multiple industries," Bryant said. "Together with our partners and customers, we are driving new innovation across products, platforms and services, and delivering on our vision of enabling world-changing technology that improves the lives of every person on the planet."