ASUS today announced the official release of ASUS NUC 14 Pro, one of several mini PCs unveiled at CES 2024. ASUS NUC 14 Pro delivers best-in-class performance thanks to its Intel Core Ultra 7 or 5 processor powered by three AI engines—a Graphics Processing Unit (GPU), a Neural Processing Unit (NPU), and a Central Processing Unit (CPU). Offering high throughput, low power consumption, and fast response, ASUS NUC 14 Pro delivers robust computing capabilities. It also features WiFi sensing for intelligent energy efficiency, along with exceptional security, manageability and stability enabled by Intel vPro Enterprise.

Featuring a 4 x 4 matte black textured chassis constructed of recycled plastic, a replaceable lid, and a VESA mounting plate, this ultra-small-form-factor (uSFF) desktop PC integrates into any workspace, offering maximum functionality without compromising style. Each device comes individually packaged and includes a three-year limited warranty.

TECNO, a global innovative technology brand once again participated in the Mobile World Congress (MWC) 2024 Barcelona, unveiled its two Mini PC products and awarded by "BEST OF MWC" from high technology media-- the"world-first" MEGA MINI Gaming G1 with water-cooling in the smallest gaming Mini PC size, and the MEGA MINI M1 for Pocket-Sized Desktops Solution. In collaboration with TECNO's latest release of AR glasses, the MiniPC can achieve a larger screen for enhanced productivity and a more immersive gaming experience.

Seizing the Edge: Cervoz Adapts to Shifting Data Landscape—The rapid emergence of technologies like AIoT and 5G and their demand for high-speed data processing has accelerated the data transition from the cloud to the edge. This shift exposes data to unpredictable environments with extreme temperature variations, vibrations, and space constraints, making it critical for edge devices to thrive in these settings. Cervoz strategically targets the blooming edge computing sector by introducing an extensive array of compact product lines, enhancing its existing SSDs, DRAM, and Modular Expansion Cards to meet the unique needs of edge computing.

Cervoz Reveals NVMe M.2 SSDs and Connectivity Solutions to Power the Edge
Cervoz introduces its latest compact PCIe Gen. 3x2 SSD offerings, the T421 M.2 2242 (B+M key) and T425 M.2 2230 (A+E key). These space-efficient design and low power consumption feature offer exceptional performance, catering to the storage needs of fanless embedded PCs and motherboards for purpose-built edge applications. Cervoz is also leading the way in developing connectivity solutions, including Ethernet, Wi-Fi, Serial, USB, and CAN Bus all available in M.2 2230 (A+E key) and M.2 2242/2260/2280 (B+M) form factors. The M.2 (B+M key) 2242/2260/2280 card is a versatile three-in-one solution designed for maximum adaptability. While it initially comes in a 2280 form factor, it can be easily adjusted to fit 2260 or 2242 sizes. It offers an effortless upgrade of existing systems without sacrificing connection capability, especially in edge devices.

In a surprising turn of events, SK Hynix has hinted at the possibility of the Compression Attached Memory Module (CAMM) standard, initially designed for laptops, being introduced to desktop PCs. This revelation came from a comment made by an SK Hynix representative at the CES 2024 in Las Vegas for the Korean tech media ITSubIssub. According to the SK Hynix representative, the first implementation is underway, but there are no specific details. CAMM, an innovative memory standard developed by Dell in 2022, was certified to replace SO-DIMM as the official standard for laptop memory. However, the transition to desktop PCs could significantly disrupt the desktop memory market. The CAMM modules, unlike the vertical DRAM sticks currently in use, are horizontal and are screwed into a socket. This design change would necessitate a complete overhaul of the desktop motherboard layout.

The thin, flat design of the CAMM modules could also limit the number that can be installed on an ATX board. However, the desktop version of the standard CAMM2 was announced by JEDEC just a month ago. It is designed for DDR5 memory, but it is expected to become mainstream with the introduction of DDR6 around 2025. While CAMM allows for higher speeds and densities for mobile memory, its advantages for desktops over traditional memory sticks are yet to be fully understood. Although low-power CAMM modules could offer energy savings, this is typically more relevant for mobile devices than desktops. As we move towards DDR6 and DDR7, more information about CAMM for desktops will be needed to understand its potential benefits. JEDEC's official words on the new standard indicate that "DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments." So, we can expect to see CAMM2 in both desktops and some server applications.

During the CES 2024 show, the ASUS booth had a wide variety of products on display. Among the more interesting solutions was the highly-anticipated ROG NUC. Initially, Intel sold the NUC design and manufacturing license to ASUS, and we were left wondering how ASUS would adapt its compact design. We had a booth tour and took pictures of the new design in person. The ASUS ROG NUC can be configured with Intel's flagship Meteor Lake-H Core Ultra 9 185H processor, a 16-core/22-thread CPU with a 115 W maximum turbo TDP that boosts up to 5.1 GHz. It features six performance cores, eight efficiency cores, and two low-power performance cores. The system can be equipped with up to an NVIDIA GeForce RTX 4070 Laptop GPU for graphics.

A more affordable option pairs the Core Ultra 7 155H processor with an RTX 4060 Laptop GPU. Other key specifications include support for up to 32 GB of DDR5 memory across two SO-DIMM slots, three M.2 PCIe Gen 4 x4 SSD slots, Intel Killer WiFi 6E and Bluetooth 5.3, 2.5G LAN, Thunderbolt 4, as much as six USB ports, HDMI and DisplayPort outputs, and a choice of Windows 11 Home 64-bit, Ubuntu 22.04 LTS, or no pre-installed OS. The 2.5-liter chassis shows that miniature size can equal big performance and can easily provide great gaming and productivity results.

Back at the Schenker booth, we also spied the Tuxedo Computers Sirius 16. Schenker is the OEM/SI for this brand, which specializes in notebooks, mobile workstations, mini-PCs, commercial desktops, and large workstations; with the singular design goal of making them 100% compatible with and optimized for popular PC Linux distributions, hence the name. These Linux-friendly PCs are designed and assembled in Germany. The Tuxedo Sirius 16, as its name suggests, features a 16-inch 16:9 1440p display; and an illuminated keyboard. All its ports, connectors, audio, and networking interfaces have been tested for 100% compatibility and performance on Linux.

Under the hood is an AMD Ryzen 7 7840HS "Phoenix" processor, with its 8-core/16-thread "Zen 4" CPU, and a cTDP set by Tuxedo at 54 W. This is paired with dual-channel DDR5 SO-DIMM slots, with options going all the way up to 96 GB. Graphics is care of a discrete AMD Radeon RX 7600M XT with 8 GB of memory, and 130 W configured power limit. The notebook features an all-metal chassis, and since the cooling solution isn't as elaborate on the XMG Neo 17 with its bulky 150 W CPU and 175 W GPU; Schenker used the space to cram in an 80 Wh battery (whereas the XMG Neo 17 has a 99 Wh pack). The 40 Gbps USB4 port from the "Phoenix" SoC is wired out. Neato.

During its "Transcendence Virtual Launch Live Event at CES 2024, ASUS has finally revealed a bit more details about its new ASUS Republic of Gamers NUC, codenamed Scorpion Canyon. The ROG NUC will be powered by up to Intel's Core Ultra 9 CPU and up to NVIDIA GeForce RTX 4070 Laptop GPU, all packed in a 2.5-liter chassis.

The flagship CPU choice is the Intel Meteor Lake-H Core Ultra 9 185H CPU, a 16-core/22-thread CPU (6 P-cores, 8 E-cores, and 2 low-power P-cores) which has a 115 W maximum Turbo TDP and Boosts up to 5.1 GHz. The ASUS ROG NUC can also be equipped with up to NVIDIA GeForce RTX 4070 Laptop GPU. The less expensive SKU pairs up the Core Ultra 7 155H with NVIDIA GeForce RTX 4060 Laptop GPU. The rest of the specifications include two DDR5 SO-DIMM slots with support for 32 GB of memory, three M.2 2280 PCIe Gen 4 x4 slots, Intel Killer WiFi 6E and Bluetooth 5.3, 2.5G Intel LAN, single Thunderbolt 4 port and plenty of other USB ports, HDMI and DisplayPort 1.4a outputs, and choice between Windows 11 Home 64-bit, Ubuntu 22.04 LTS, or no OS.

Intel today announced the release of its 14th Gen Core HX series "Raptor Lake Refresh" mobile processors. Processor models from this series are supposed to cap off the upper end of Intel's mobile processor portfolio. Although Intel released the Core Ultra "Meteor Lake" mobile processors late last year, those chips cover the U-segment, and H-segment (ultraportable, thin-and-light, and mainstream); with the fastest model being the Core Ultra 165H, which caps out at 6P+8E+2LP. The HX segment, which started out as enthusiast-class, broadened in scope over the years to cover the bulky gaming notebooks and portable workstations. These chips typically have a power rating of 55 W. All chips have maximum turbo power rating of 157 W. Intel is tapping into its "Raptor Lake Refresh" silicon to carve out these processors. This is a monolithic chip built on the Intel 7 process, and its package is a multi-chip module with an on-package PCH.

The lineup begins with the Core i9-14900HX, which maxes out the "Raptor Lake Refresh" silicon, with an 8P+16E core-count, with 2 MB of L2 cache per P-core, 4 MB of L2 cache per E-core cluster, and a shared 36 MB L3 cache. The processor's full I/O is wired out, including support for dual-channel DDR5 (SO-DIMMs only), a PCI-Express 5.0 x16 connection for discrete GPUs, a PCI-Express 4.0 x4 connection for a CPU-attached M.2 NVMe SSD, and DMI 4.0 x8 link between the processor die and the PCH die. This PCH puts out up to 16 PCIe Gen 4 lanes, besides up to 12 Gen 3 lanes, which notebook designers can combine with discrete Thunderbolt 4 controllers, and the likes. You can expect Wi-Fi 7 to be prevalent in this crop of premium gaming notebooks. The i9-14900HX features a P-core maximum boost frequency of 5.80 GHz, and an E-core boost frequency of 4.10 GHz.

ASRock Industrial releases the NUC Ultra 100 Motherboard Series with breakthrough powered by Intel Core Ultra processors (Meteor Lake-H). Presenting a 3D performance hybrid architecture that supports up to 14 cores and 20 threads, complemented by the latest integrated Intel ARC Graphics and the pioneering Intel NPU AI engine. The NUC Ultra 100 Motherboard Series are designed in NUC form factor, providing two DDR5-5600 MHz memory up to 96 GB, triple storages, 4K quad displays, 2.5G dual LAN, one USB4/Thunderbolt, and four USB 3.2 Gen 2. This advancement expands into enhanced creativity, efficiency, and collaboration using AI across diverse areas such as entertainment, corporate functions, smart retail, kiosks, digital signage, smart cities, embedded industries, Edge AIoT applications, and more.

The NUC Ultra 100 Motherboard Series encompass NUC-155H and NUC-125H models, powered by Intel Core Ultra 7/5 processors 155H/125H (Meteor Lake-H). The Series feature the upgraded dual-channel SO-DIMM DDR5 5600 MHz up to 96 GB memory, plus support for up to 4K quad displays with one DP 2.1 (from USB4), one DP 1.4a (from Type-C), and two HDMI 2.0b with Intel ARC Graphics, providing immersive experience. Notable upgrades extend to the triple storages of one M.2 Key M (2242/2280), one M.2 Key M (2242) with PCIe Gen4x4 for SSD, and one SATA 3.0. Moreover, rich I/O connectivity and expansion include one USB4/Thunderbolt 4, four USB 3.2 Gen 2 (Type-C/Type-A), 2.5G dual LAN, and one M.2 Key E (2230) with PCIe x1, USB 2.0 and CNVi for wireless. The Series also provide 12-24 V DC-in jack for flexible power input, -20°C ~ 70°C wide operating temperature, plus TPM support with Intel Platform Trust Technology (PTT) for enhanced security.

MINISFORUM released the AR900i, an MoDT (mobile on desktop) motherboard in the Mini-ITX form factor that comes with a hardwired Intel Core i9-13900HX mobile processor and a pre-installed cooling solution. The board is priced at $560 on Amazon, with a limited-period $70-off coupon. This is good value, considering that the i9-13900HX is a maxed-out "Raptor Lake" based mobile processor that features all 8 P-cores, all 16 E-cores, and all 36 MB of shared L3 cache physically present on the "Raptor Lake" silicon. The P-cores boost up to 5.40 GHz, and the E-cores up to 3.90 GHz. The only catch with this processor compared to something like a desktop i9-13900, is its power specs that were originally designed for the power constraints of notebooks, with 55 W base power, and 157 W of maximum turbo power, compared to 225 W of the socketed i9-13900.

Since the Core i9-13900HX is a mobile BGA1964 package that remains hardwired to the board, it is not upgradable. MINISFORUM has designed a cooling solution specific to the processor, which uses a large aluminium fin-stack heatsink that relies on an 80 mm case fan for ventilation. There's a secondary fan-heatsink that provides cooling to two M.2-2280 slots north of the processor. Each of these two M.2 slots has a PCI-Express 5.0 x4 wiring, and using either of them subtracts 8 PCIe lanes from the board's sole expansion slot, a PCI-Express 5.0 x16. The board features an M.2 E-key slot that you can pair with your own WLAN card, it comes with provision for dual-MIMO ready antennas. The processor is wired to two DDR5 SO-DIMM slots supporting up to 96 GB of memory. The board draws power from a 24-pin ATX and a single 8-pin EPS, which should prove sufficient for this processor.

IBASE Technology Inc. (TPEx: 8050), a pioneering force in embedded computing solutions, proudly presents the IB961 3.5" Single Board Computer (SBC) engineered for peak performance, extensive connectivity, and unmatched versatility. Harnessing the prowess of 13th Gen Intel Core processors, including the i7-1370PE, i5-1340PE, i5-1335UE, and i3-1320PE, the IB961 delivers exceptional computing capabilities across diverse applications. These processors advance performance hybrid architecture with up to 6 Performance-cores (P-core) and up to 8 Efficient-cores (E-core), ensuring unparalleled power for memory-intensive tasks.

This compact SBC offers a rich array of connectivity options, including M.2 (M-Key, E-Key, B-Key) mini type slots, and USB 3.2 ports, enabling 5G communications and ensuring seamless integration with peripherals. Dual Intel LAN support guarantees reliable, high-speed network connectivity. Integrated graphics from 13th Gen Intel Core mobile processors provide stunning visuals through 2x DisplayPort (1.2), eDP, and LVDS outputs. The IB961 signifies a leap forward in embedded computing technology, empowering businesses to enhance efficiency and adaptability across diverse industrial applications.

Intel is confirmed to be bringing the 14th Gen Core series to the mobile segment, with the Core i7-14700HX surfacing on leaked PugetBench online database. This would be a repeat of how Intel handled its 10th Gen Core series, with the technologically older "Comet Lake" silicon with its higher core count being confined to the mainstream -H, and enthusiast -HX market segments, with the then contemporary "Ice Lake" silicon handling the thin and light -U and -P segments. Intel is close to launching its "Meteor Lake" silicon, which it will likely address the -U, -P, and some tiers of the -H segments with. These could feature a newer Core and Core Ultra product branding, while "Raptor Lake Refresh" retains the more recognizable 14th Gen Core processor model numbering scheme similar to that of its desktop cousin.

Besides the Core i7-14700HX that now surfaced on PugetBench database, there have been leaks about at least two other models from the "Raptor Lake Refresh" mobile pedigree—Core i5-14650HX, and the i9-14900HX. It's very likely that the flagship "i9-14980HK" part is based on "Raptor Lake Refresh," featuring an unlocked multiplier, and power limits rivaling the desktop i9-14900, for notebooks that are really just desktop replacements. The Intel prototype notebook from the i7-14700HX leak features a discrete Arc A570M GPU, and 64 GB of DDR5-4800 SO-DIMM memory. If the power limit convention is carried over from the 13th Gen, you're looking at 55 W processor base power, and 157 W of maximum turbo power (or burst power). What we don't yet know about the i7-14700HX is its core-configuration. The current i7-13700HX features an 8P+8E configuration, and it remains to be seen if the i7-14700HX gets an 8P+12E config similar to its desktop counterpart.

IBASE Technology Inc. (TPEx: 8050), a renowned provider in the design and manufacturing of embedded computing solutions, rolls out the low-power IB838 3.5" single board computer powered by Intel Core i3 N-series (formerly Alder Lake-N) processor. Combining robust computing performance with advanced features, it is positioned to meet diverse needs across multiple industries, including industrial automation and control, retail displays, transportation, and automotive applications.

Fortified with intelligent power handling and a 9 V~36 V DC input range, the IB838 ensures reliability and consistent operations in transportation applications that may encounter variable power conditions. Versatile connectivity makes it ideal for automation processes and data acquisition systems. The SBC offers Type-C, DP++, and eDP or LVDS display options, along with a rich set of I/O interfaces, including two Intel PCI-E 2.5G LAN ports, two USB 2.0 ports, and four USB 3.2 ports (1x Type-C + 3x Type-A).

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to unveil the BIELK-PAT industrial motherboard and MS-J6412 applications system, tailored to meet the rising demands of modern industries. The BIELK-PAT mainboard is an embodiment of versatility and innovation. Designed to support a broad range of temperature -40 °C ~ 85 °C and 9-24 V operational voltage, the BIELK-PAT mainboard thrives in diverse environments seamlessly integrating into workspaces like outdoor devices, EV charging stations, kiosks, and refrigerated factories. Under its robust framework, it houses an Intel Elkhart Lake SOC Processor and offers display outputs via LVDS, HDMI, and VGA. It supports 2x SO-DIMM DDR4 RAM up to 32 GB 3200 MHz and 2.5 GbE LAN powered by Intel.

Diving deeper into the specifications, the BIELK-PAT features a SATA III and an M.2 slot for storage, along with multiple USB 2.0 and USB 3.0 ports. It is a top choice for SI businesses seeking robust system integration builds with great hardware synergy with Windows 10 and Linux Ubuntu operating systems. The MS-J6412 applications system from BIOSTAR is ideal for fanless embedded system. Compact yet powerful, it is adept at driving POS systems, interactive kiosks, and interconnected IoT devices across many industries supported by its DC-IN design. It boasts a sleek, thin design and ensures quiet computing thanks to its groundbreaking, slim barebone fanless design.

IBASE Technology Inc. (TPEx: 8050), a leading provider of industrial computing solutions, unveils the SI-624-AI industrial AI computer, which won the Embedded Computing Design's Embedded World 2023 Best in Show Award in Germany. This recognition highlights the exceptional performance and innovation of the rugged system in the field of AI deep learning.

The SI-624-AI is designed to meet the demands of high-speed multiple tasks for artificial neural network applications. Powered by the 12th Gen Intel Core CPU and incorporating the NVIDIA Ampere Architecture MXM GPU, this cutting-edge system delivers image processing capabilities that enable real-time analysis of visual data, enhancing automation, quality control, and overall production efficiency for AIoT applications in smart factory, retail, transportation or medical fields. It is suitable for use as a digital signage control system in mission-critical control rooms in transportation networks, smart retail, healthcare, or AI education where remote AI data analysis capabilities are required.

IBASE Technology Inc. (TPEx: 8050), a leading provider of embedded computing solutions, introduces the IB837 3.5" single board computer that is designed for a wide range of IoT applications, including industrial automation, smart retail, healthcare, smart city and edge AI solutions, combining powerful processing capabilities with extensive connectivity options.

At the heart of the IB837 is the onboard Intel Celeron N & J series (formerly Elkhart Lake) processor, offering a good balance of performance and power efficiency. With support for up to 16 GB of DDR4-3200 SO-DIMM memory, the SBC ensures smooth multitasking and efficient operation, delivering exceptional performance while consuming minimal power for applications requiring a compact form factor.

The leading memory brand Team Group has upgraded the capacities of its industrial DDR5 series memory products, by leveraging its outstanding R&D and product design capabilities, taking the lead in launching a 48 GB module, as well as a lower 24 GB option. The capacity upgrades apply to all types of DDR5 products, including the DDR5 non-ECC U/SO-DIMM, DDR5 ECC U/SO-DIMM class, and DDR5 ECC R-DIMM memory modules. They provide higher capacity for applications using high-performance edge computing, embedded computers, personal workstations, and more.

Current industrial DDR5 memory on the market has a maximum capacity of about 32 GB per module. However, with the development of technologies such as cloud, edge computing, the Internet of Things, and big data, the demand for memory capacity is increasing. Edge computing systems need to process large amounts of data from a variety of sensors and devices and perform complex calculations and analyses that require high memory capacity and performance. To meet this demand, Team Group has made capacity upgrades across its industrial DDR5 memory products, offering new 24 GB and 48 GB modules. They bring more application flexibility and enable users to better handle large data sets, complex simulations, and analysis tasks. The enhanced capacities will significantly increase the performance and processing power of edge computing systems, providing users with the ability to run various applications and algorithms more efficiently.

In keeping with Framework's philosophy, the Framework Laptop 16 has socketed memory and storage, making it easy for you to choose what you need on day one and upgrade to more any time later. Our pre-built configurations have set combinations of memory and storage, while on DIY Edition, you can choose any of the modules we offer in the Marketplace or bring your own if you prefer. We've taken both memory and storage to the next level on Framework Laptop 16. For memory, we've created new semi-custom Framework-branded DDR5-5600 modules. For storage, we have two M.2 slots, as well as the ability to add two more in the Expansion Bay for colossal storage capacity.

One core challenge we aimed to solve for memory on the Framework Laptop 16 was being able to offer the same modules for pre-built systems, DIY Edition, and the Framework Marketplace. Historically, we needed to source separate "OEM" modules from Samsung, SK Hynix, and Micron for use in our factory, and "Retail" modules from Crucial to offer in DIY Edition and the Marketplace. Instead, we worked with memory maker ADATA to create custom-label modules that we can use across all areas. Currently, we're leveraging SK Hynix DDR5-5600 memory chips for these modules, but may use other chips that meet the performance bar in the future as well.

ASRock Industrial is introducing new choices in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads that boost computer-intensive edge performance. They come equipped with Intel W680, Q670, and H610 chipsets, and offer support for up to DDR5-5600 memory modules and PCIe Gen 5, allowing expanded possibilities and seamless integration within industry-specific applications.

By harnessing the power of the 13th Gen Intel Core Processors, they leap up to 1.04x/1.34x/1.25x faster in single-thread, multi-thread, and CPU image classification inference performance, respectively, compared to the preceding 12th Gen Intel Core processors. The new 13th Gen Intel CPU motherboards with DDR5 support, available in Mini-ITX, Micro-ATX, and ATX form factors, have been specifically designed to cater to the unique requirements of the Edge AIoT applications in commerce, automation, robot, entertainment, and security industries.

Leading storage device brand, Team Group, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0-70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40-85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, Team Group has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.

Team Group's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.

Details of ASUS' upcoming Prime N100I-D D4 Mini-ITX motherboard has made an appearance in official pictures posted over at Fanlesstech, although the board was apparently shown at Computex. The interesting part here is that it's under ASUS' Prime branding, which suggests that this will be a retail product, rather than something that would only be available to OEM partners. The Intel Processor N100 is a quad core 3.4 GHz chip based on Intel's Alder Lake-N and it has a 6 W TDP, which means it can be passively cooled.

Although the SoC supports DDR4 and DDR5 memory, at least for this specific SKU, ASUS went with DDR4 support in the shape of a single SO-DIMM slot which accepts up to 3200 MHz memory. The board also sports a single PCIe 3.0 x2 M.2 slot, an M.2 slot for an optional WiFi module, a PCIe 3.0 x1 slot and a single SATA connector and a USB 3.0 header. The odd thing here is that the SoC supports a total of nine PCIe lanes, but ASUS only appears to have made use of four of them. Around the back is a pair of 10 Gbps USB Type-A ports, a pair of 5 Gbps USB Type-A ports and two USB 2.0 ports, a PS/2 port, a serial port, a D-Sub VGA connector, a DisplayPort and an HDMI port of unknown version—although the SoC supports DP 1.4 and HDMI 2.1—a Gigabit Ethernet jack and three audio jacks.

Innodisk has the right idea about how to do PCIe Gen 5 NVMe SSDs—to ditch the M.2 form-factor, and make them PCIe add-in cards. This would remove the need for cartoonishly disproportionate cooling solutions with high-pitched 20 mm fans; and rather allow SSD designers to use cooling solutions resembling those of graphics cards. Gen 5 NVMe controllers have a TDP of around 15 W, or roughly similar to that of a motherboard chipset. The M.2-2280 form-factor is tiny for the deployment of a sufficiently large heatsink, and so SSD designers are resorting to active cooling, using 20 mm fans that don't sound pleasant. Most single-slot VGA cooling solutions can make short work of 15 W of heat while being much quieter, some even fanless.

The Innodisk 5TG-P AIC SSD uses a PCIe Gen 5 + NVMe 2.0 SSD controller with a large passive heatsink, a PCI-Express 5.0 x4 host interface, and 32 TB of capacity. The drive runs entirely on slot power, and besides the 3D TLC NAND flash, uses a large DDR4 DRAM cache. The company claims sequential transfer speeds of up to 13 GB/s in either direction. Innodisk is targeting the PCIe 5TG-P at workstation and HEDT use-cases. The company is building them in server-relevant form-factors such as U.2 and E.1S. A CDM screenshot shows 13.62 GB/s sequential reads, with 11.55 GB/s sequential writes.

Team Group's T-Create line of memory products is targeted squarely at content creators, and characterized by their slender, sober product design. The company unveiled several new products in this brand, spanning from DDR5 PC memory to portable SSDs, docking stations, USB flash drives, and even memory cards. On the memory front, Team Group showed us both standard-size DDR5 DIMMs for desktops, and SO-DIMMs meant for laptops. A simple matte-black heat spreader dons the desktop variant. The desktop DDR5 module comes in speed-based variants spanning between DDR5-6000 and DDR5-6800, while the SO-DIMMs come in DDR5-5200 to DDR5-5600. What's interesting is that both come in high-capacity variants, with the desktop T-Create DDR5 coming in 64 GB (2x 32 GB) to 128 GB (2x 64 GB), while the SO-DIMMs come in 16 GB thru 64 GB kit sizes.

The company also showed off a plethora of new storage products, beginning with the T-Create Classic TC-200 NFC, and the larger T-Create Expert USB4. The TC-200 has a USB 3.2x2 type-C interface that's capable of 20 Gbps interface speed, which it uses to offer sequential transfer rates of up to 2 GB/s reads/writes. It also integrates an NFC reader, so it can be locked and unlocked using smartcards or mobile applications running on NFC-capable smartphones. This drive comes in capacities of 500 GB, 1 TB, and 2 TB. The larger T-Create Expert USB4, as its name suggests, features a 40 Gbps USB 4.0 type-C interface, and an impressive 4 GB/s maximum sequential transfer speed. Rounding things off in the PC storage space is the T-Create Classic M.2 docking station. This looks a lot like a cylindrical water cooling reservoir, except you pop in an M.2 NVMe SSD. Don't add water.

PC OEM giant Acer has a growing lineup of retail channel PC products, including DIY enthusiast PC hardware under its Predator brand. The company showed some of this off at the 2023 Computex, in a booth organized by its memory products OEM BIWIN. First up, we have the Predator Hermes RGB line of high-end DDR5 memory kits. These feature elaborate aluminium heatspreaders with RGB LED illumination. We caught one of these in action, with a multi-zone RGB lighting. The Hermes RGB comes in 32 GB (2x 16 GB), and 64 GB (2x 32 GB) kits, and in speeds of DDR5-6800, DDR5-7200, DDR5-7600, DDR5-7800, and DDR5-8000, with CAS latencies ranging between 32 to 36T, and module voltages between 1.40 V to 1.45 V.

Among the consumer storage products showed off by the company include the MSC300 line of UHS-I microSDXC cards capable of 160 MB/s sequential speeds, which comes in capacities ranging between 32 GB to 256 GB. Among the SSD products shown were stuff we are already familiar with, including the FA100 Gen 4 NVMe SSD, RE100 Gen 3 NVMe SSD, the SA100 and RE100 SATA 6 Gbps SSDs; the SD100 lines of DDR4 and DDR5 SO-DIMM memory for laptops; CFE100 line of CFexpress cards, and and handful USB flash drives (UFDs).

IBASE Technology Inc., a leading global provider of industrial-grade digital signage players, is pleased to unveil the SI-111-N, a palm-sized fanless 4K digital signage player system based on the Intel Atom x6211E and Celeron N6210 processors. Equipped with an HDMI 2.0b port that supports 3840 x 2160 @60Hz resolution, the industrial-grade system enables businesses to easily connect to a 4K display and create immersive visual experiences that attract attention and effectively promote their products or services.

IBASE values sustainable development and ESG practices. The SI-111-N incorporates various energy-saving features, including IBASE's proprietary iSMART green technology that enables power on/off scheduling with power resume capabilities, and the Observer utility that remotely monitors system voltages and temperature to ensure the system is operating efficiently while minimizing energy consumption. The SI-111-N's extensive I/O connectivity offers a rich array of expansion options, reliable data handling, and wireless operation, which includes 1x 2.5GbE LAN, 1x COM (RS-232) port, 1x M.2 M-Key (2280) and 1x M.2 E-Key (2230) sockets.