Thermaltake Spedo Advanced Package

Thermaltake Spedo Advanced Package

Packaging & Contents »

Introduction


I would like to thank Thermaltake for supplying the review sample.

Features:
  • Tool-free design for easy installation
  • A.T.C.3 – Advance Thermal Chamber 3 provides maximum cooling & prevent hot air re-circulation
  • C.R.M.3 – Cable Routing Management 3 eliminates cable cluster
  • Independent Adjustable Fan bar
  • Advance cable routing
  • HDD Relocation canister
  • Tool free design
  • Fancool 8 – Installed up to 8 fans
  • Wire-less side panel 23cm fan
  • Superior air circulation design


Specifications:
Model: VI90001W2Z
Case Type:Full Tower
Side Panel:Transparent window
Net Weight:N/A
Dimension (H*W*D):610 x 232 x 536 mm
Sliding motherboard tray:No
Cable management:Yes - C.R.M. 3
Sliding hood:Yes
Adjustable PSU bridge:Yes
Material:All Aluminum
Color:Silver chassis with black mesh
(Also available in black with red mesh)
Cooling System:Front (intake) :
1 140 x 140 x 25mm red LED fan, 1000rpm, 16dBA,
16dBA or 120 x 120 x25 mm fan (optional)
Rear (exhaust) :
TWO 120 x 120 x 25mm TurboFan, 1300rpm, 17dBA
Top (exhaust) :
230 x 230 x 20mm fan, 800rpm, 15dBA,
Bottom (intake) :
120 x 120 x 25mm fan (optional)
CPU (exaust) :
120 x 120 x 25mm fan (optional),
120 x 120 x 25mm TurnoFan, 1300rpm, 17dBA, 230 x 230 x 20mm fan, 800rpm, 15dBA
Motherboards:M-ATX & ATX
Drive Bays:5.25" Drive Bay - 7
3.5" Drive Bay - 1
(Convertible from one 5.25" drive bay)
3.5" Drive Bay (Hidden) - 6
Front I/O:e-SATA connector x 2, USB2.0 x 2,
HD Audio
Expansion Slots:8
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