Capacity: | 1.9 TB (1920 GB) |
---|---|
Variants: | 1.9 TB 3.8 TB 7.5 TB |
Overprovisioning: | 6403.9 GB / 358.1 % |
Production: | Active |
Released: | Jan 2023 |
Part Number: | Unknown |
Market: | Enterprise |
Form Factor: | U.2 |
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Interface: | PCIe 4.0 x4 |
Protocol: | NVMe 1.4 |
Power Draw: |
5.0 W (Idle) 14.0 W (Avg) Unknown (Max) |
Manufacturer: | Microchip Flashtech Microsemi |
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Name: | PM8640 NVMe3108 Edison |
Architecture: | ARM 64-bit Cortex-A53 + CoreLink CCN-502 + CoreLink GIC-500 |
Core Count: | 6-Core |
Foundry: | TSMC FinFET |
Process: | 16 nm |
Flash Channels: | 8 @ 1,200 MT/s |
Chip Enables: | 16 |
Controller Features: | DRAM (enabled) |
Manufacturer: | YMTC |
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Name: | Xtacking 2.0 (CDT1B) |
Type: | TLC |
Technology: | 128-layer |
Speed: | 1600 MT/s |
Capacity: | Unknown |
ONFI: | 4.1 |
Topology: | Charge Trap |
Die Size: | 60 mm² (8.5 Gbit/mm²) |
Planes per Die: | 4 |
Decks per Die: | 2 |
Word Lines: |
141 per NAND String
90.8% Vertical Efficiency |
Read Time (tR): | 50 µs |
Program Time (tProg): | 620 µs |
Block Erase Time (tBERS): | 9.0 ms |
Die Read Speed: | 1280 MB/s |
Die Write Speed: | 70 MB/s |
Endurance: (up to) |
3000 P/E Cycles |
Page Size: | 16 KB |
Block Size: | 2304 Pages |
Plane Size: | 1980 Blocks |
Type: | DDR4 |
---|---|
Capacity: | Unknown |
Sequential Read: | 6,800 MB/s |
---|---|
Sequential Write: | 2,600 MB/s |
Random Read: | 740,000 IOPS |
Random Write: | 130,000 IOPS |
Endurance: | 3504 TBW |
Warranty: | 5 Years |
MTBF: | 2.0 Million Hours |
Drive Writes Per Day (DWPD): | 1.0 |
Write Cache: | N/A |
TRIM: | Yes |
---|---|
SMART: | Yes |
Power Loss Protection: | Yes |
Encryption: |
|
RGB Lighting: | No |
PS5 Compatible: | No |
NAND Die:Read Time (tR): Maximum is 50 µs, typical is lower |