Monday, October 22nd 2012

EverCool Announces TC-200 Thermal Paste

EverCool announced the TC-200 thermal paste in Japan. Designed with high penetrability (relatively low viscosity), the paste is designed especially for chips with uneven surfaces (such as GPUs, motherboard chipset, and CPUs without integrated heatspreaders or IHS), although they'll do just fine with chips that have IHS. The paste features thermal conductivity of 3.8W / mK, thermal resistance of 0.017°C-in²/W, and can maintain its viscosity over a wide temperature range of -50°C to 150°C. It is initially solid in 200 g jars for use by OEMs or enthusiasts who want to stock up, which comes with an application spatula, although smaller packages can be expected in the future.

Source: Hermitage Akihabara
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