Thursday, May 4th 2023

Streacom and CALYOS Tease the Unfashionably Late and Beleaguered SG10 for Computex 2023

Streacom have announced that they'll be hosting a booth at Computex with CALYOS, where they'll be showing the fruits of their labors on the long awaited SG10 passive-cooled chassis. If you're unfamiliar with the story of the SG10: back in late 2016 CALYOS made waves in the tech sphere with a novel new passively cooled ATX chassis prototype called the NSG S0. Their passive design relied on phase-change evaporator blocks and 'Loop Heat Pipe' runs out to condenser-finstack cooling zones that consumed the entire rear and front panels of the chassis to cool the GPU and CPU. The total thermal dissipation of this design was estimated at the time to allow for up to 600 W of heat, with final numbers to be determined after the design had been finalized. CALYOS opened a Kickstarter for the NSG S0 in early 2017 which attracted 461 backers and a quarter million Euro to fund the project goal of €150K. Many of the top contributors were told they would be receiving the finished NSG S0 by the end of 2017. A promise that fell immediately flat as the chassis never materialized for backers of the project. Dozens of project updates, excuses, executive changeovers, private funding campaigns, and empty promises finally led to Streacom being involved as the experienced party to redesign and deliver a product on the initial NSG S0 premise.
Streacom joined the project in 2020, 3 years after the original expected delivery window of the NSG S0, and appears to have carried CALYOS's original idea out of the depths of Kickstarter failure oblivion. This is no longer the NSG S0, and backers of the original Kickstarter may likely never get what they originally paid for, but Streacom did promise some concessions for CALYOS's original customers; customized versions of the SG10, 20 free units to the Kickstarter community, and a discounted price for campaign backers (who already paid full price or more for the original NSG S0 all those years ago). Streacom had no part in the initial failure of the NSG S0 and appears to be trying to offer as much recompense as they can. Their SG10 is expected to feature a fairly radical new physical design but retain a roughly 600 W thermal dissipation capacity, with the new design aiming for 195 W for the CPU and 420 W for the GPU at an ambient temperature of 35° Celsius. We can only hold our collective breath and hope the SG10 really exists and doesn't follow the same fate of the NSG S0. Below are the only public teasers yet released for the redesigned SG10.
Source: Streacom
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7 Comments on Streacom and CALYOS Tease the Unfashionably Late and Beleaguered SG10 for Computex 2023

#1
n-ster
Interesting if they manage to pull it off. That glass hotbox design I hope is not the one they decided to go with, it's a teaser they released in 2021 I think
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#2
PLAfiller
n-ster.....That glass hotbox design I hope is not the one they decided to go with.....
Not sure what do you mean. Would it make a difference to thermals if the side panel was made of metal? It looks like there is plenty of space between the body of the case and the glass panel IMO.

EDIT: Ahhh you are referring to the second set of pictures. OK I get it now.
Posted on Reply
#3
piloponth
from the pictures, it is cooling only CPU and GPU. I would be very worried about VRMs around both chips.
Posted on Reply
#4
Fouquin
n-sterThat glass hotbox design I hope is not the one they decided to go with, it's a teaser they released in 2021 I think
Yeah sometime around 2020/2021. Honestly it doesn't matter really as long as the fins aren't impeded, there's no amount of glass that will negatively impact cooling. There's no air path to preserve other than keeping those fins exposed to the outside of the chassis.
Posted on Reply
#5
n-ster
FouquinYeah sometime around 2020/2021. Honestly it doesn't matter really as long as the fins aren't impeded, there's no amount of glass that will negatively impact cooling. There's no air path to preserve other than keeping those fins exposed to the outside of the chassis.
Heat buildup from all the other components and not having passive cooling help cool them would be a concern for sustained workloads. Another issue is acoustics, coil whine and the like. The demographic who wants a passively cooled system enough to buy a 1000$ case has a high chance of caring about acoustics lol
Posted on Reply
#6
Fouquin
n-sterHeat buildup from all the other components and not having passive cooling help cool them would be a concern for sustained workloads. Another issue is acoustics, coil whine and the like. The demographic who wants a passively cooled system enough to buy a 1000$ case has a high chance of caring about acoustics lol
The original was around $650 USD, not quite $1000. And from the renders the redesign is open top and bottom, which given that soaking the top condenser finstack will create air movement should pull air up and past those other components. VRM temps are almost always far within tolerance since those components aren't terribly heat sensitive; 130-150C is really no problem at all for even modern power stages. Coil whine is just going to happen no matter what they do about the design. As evidenced by the constant threads about coil whine on 4090s and 7900 XTXs, that's just not an issue you can resolve with a computer case unless you are even more restrictive with sound treatment and heavy panels.

I actually hope they stuck to a design that retains four solid panels around the sides with an open bottom. If they carried over the idea to have fan mounting points along the bottom than they could easily create a chassis that mimics such designs as the Silverstone Fortress and Raven series; large, high CFM, low noise fans along the bottom that push air through the entire chassis bottom to top and up through that massive condenser that the CPU and GPU are connected to. A pair of 180mm fans at 1200RPM would solve any concerns for component cooling in an instant, and be nearly inaudible. The thermal performance of those old Silverstone designs still ranks exceptionally high against modern chassis, it's an excellent design to mimic.
Posted on Reply
#7
n-ster
FouquinThe original was around $650 USD, not quite $1000. And from the renders the redesign is open top and bottom, which given that soaking the top condenser finstack will create air movement should pull air up and past those other components. VRM temps are almost always far within tolerance since those components aren't terribly heat sensitive; 130-150C is really no problem at all for even modern power stages. Coil whine is just going to happen no matter what they do about the design. As evidenced by the constant threads about coil whine on 4090s and 7900 XTXs, that's just not an issue you can resolve with a computer case unless you are even more restrictive with sound treatment and heavy panels.

I actually hope they stuck to a design that retains four solid panels around the sides with an open bottom. If they carried over the idea to have fan mounting points along the bottom than they could easily create a chassis that mimics such designs as the Silverstone Fortress and Raven series; large, high CFM, low noise fans along the bottom that push air through the entire chassis bottom to top and up through that massive condenser that the CPU and GPU are connected to. A pair of 180mm fans at 1200RPM would solve any concerns for component cooling in an instant, and be nearly inaudible. The thermal performance of those old Silverstone designs still ranks exceptionally high against modern chassis, it's an excellent design to mimic.
I loved the FT05! Depends on the coil whine and if you're okay with solid panels, but if you are, be quiet! cases and Fractal Design cases are really good at attenuating a bunch of random noises. Depends on what kind of system you put in there, but many components can be cooled just fine with a bit of passive airflow but start suffering in a hot box environment. Passive PSUs, 10 GbE NICs let alone more power hungry ones, M.2 NVMe heatsinks and all that. Having some kind of passive airflow path from the back (where there usually is a hole for a rear fan and vented PCI-E slots) combined with a little from the bottom and/or front would at least let some of the heat escape. Maybe not quite 1000$, but their small ITX Streacom DB4 is 400$ or something, so I'm not hopeful :p
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May 4th, 2024 20:17 EDT change timezone

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