Thermal grease is the heat conducting interface between heatsink and CPU. It is an essential necessity in PC assembly. NanoFusion is a thermal compound newly released by Cooler Master aimed for overclockers. With the accomplished 0.019mm Bond Line Thickness (BLT), NanoFusion has successfully minimized thermal resistance to 0.065 °C-cm2/W@40psi which has been proven to be unmatched by any other thermal grease in the market. Besides providing the best performance, NanoFusion is also environmentally safe and in addition, NanoFusion is comprised of non-electrical conductive material, to prevent system short circuitry. Here's the Product Release Sheet.