• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.
  • The forums have been upgraded with support for dark mode. By default it will follow the setting on your system/browser. You may override it by scrolling to the end of the page and clicking the gears icon.

Intel Ivy Bridge Dual-Core Put Through Clock-to-Clock Benches Against Sandy Bridge

you get the point

So an improvement but nothing WOW realy over SB?


yes it looks like another 20%-25% where are the days that we got 100 % or at least 50% from
one gen to the other now its moving slower and slower the only winner here is the company
they use less silcon per cpu the client get 20% only .

its to soon to tell but it looks like its legit
 
Surly the single core test when both running the same speed the ivy bridge chip should have showed a bigger increase?

Although i admit i have no clue of the relativity of scores within a benchmark i don't use.

Are we going to see die size reported as volume instead of area? Also I wonder what the die shots will look like.

It will still be area and the die shots will look pretty similar, i think the term 3d is not the best way to describe the new transistor as transistors are currently 3d just pretty flat/thin and the new transistors are just taller with more gate material/higher surface area.

I think calling them 3d often gives the idea that the circuit would be 3d as in could be made in a cube or something yet they are still pretty much flat slices of silicone with circuit printed on to it like they are now, it's kind of like they are just using more ink.

Even though i dislike the transistor naming i can't wait to see how they perform on retail chips, i hope the sample used here is early enough that there is more improvements to come before release and hopefully much higher clocked, preferably well over double this chips speed.
 
What I'm hoping for is that the massive power/heat savings from the die shrink + 3d will give us ridiculously high overclocks. I just worry we might be held back by durability issues.

thats the stuff i want to know as well.


i'm all for more thermally efficient hardware, even if performance doesnt make big leaps and bounds.
 
Technically, he used auto-detect, which obviously failed. You are right though; if you select Chinese as the source, it translates as, "This on Techpowerup the"
Chinese and Japanese share enough characters that I'm not surprised that it detected incorrectly. What's the latest rumor-mill information regarding Ivy Bridge release date?
 
will this beat bulldozer?
 
ha ha I was just looking for this post. :laugh:

jackpot :D
but i dont want it to beat bulldozer. AMD deserves more limelight than intel.
 
jackpot :D
but i dont want it to beat bulldozer. AMD deserves more limelight than intel.

Why ? Intel is doing a great job . AMD seems to be doing just fine . Why are there so many AMD fanboys ?

I can not nor will not believe these results . IVY Bridge is too far off and an Engineering sample given to some Japanese guy ( Much like BD ) is just not going to cut it with me . No real BM at all . I just do not get it some how some Japanese guy always gets the first one and we all run going look here it is ! It is like saying look there is Jesus Christ RIGHT OVER THERE ! I do not believe it at all . :shadedshu :slap:
 
Why ? Intel is doing a great job . AMD seems to be doing just fine . Why are there so many AMD fanboys ?

I can not nor will not believe these results . IVY Bridge is too far off and an Engineering sample given to some Japanese guy ( Much like BD ) is just not going to cut it with me . No real BM at all . I just do not get it some how some Japanese guy always gets the first one and we all run going look here it is ! It is like saying look there is Jesus Christ RIGHT OVER THERE ! I do not believe it at all . :shadedshu :slap:

You, sir, clearly didn't even read the thread (it's a Chinese site). As for the BD remarks, all I care is if it's a competitive product to at least SB stuff.
 
You, sir, clearly didn't even read the thread (it's a Chinese site). As for the BD remarks, all I care is if it's a competitive product to at least SB stuff.

Japanese , Chinese WHO CARES ? They are all the same to me as I can not READ any of it any way . It is always some foreigner NEVER some one in the USA NEVER ! Never some one that we can trust NEVER ! Not till they hit the main stream market that is !
 
Last edited:
jackpot :D
but i dont want it to beat bulldozer. AMD deserves more limelight than intel.

What the market doesn't deserve is consumer-socialism (or fanboyism). It will encourage mediocrity and stifle meritocracy.
 
So an improvement but nothing WOW realy over SB?

Ivy Bridge is just the "Tick" in Intel's scheme. We won't see any great improvements till the "Tock" and Haswell.

Also it's a dual core vs a quad core.

Intel-Tick-Tock.jpg
 
Chinese and Japanese share enough characters that I'm not surprised that it detected incorrectly

yeah, must of got confused and just picked the coolest language :cool: (Japanese of course)


1.8ghz sounds like a mobile proccesor to me, you probably looking at something like a core i3 3xxxM

EDIT: Didn't notice there was a second page...
 
Ivy will bring certain ehnancements to many parts of the CPU and iGPU, including new features to improve performace, power management and security. But as for each Tick the most advancement is in the process technology.
 
:rolleyes:

They compared 4 core/4 thread vs. 2 core/4 thread.

Would have made much more sense to use a 2500k and disable two core.

Inconclusive.
 
Ivy Bridge processor (2 cores/4 threads) compared to a Sandy Bridge Core i5-2400 (4 cores/4 threads)? Not a accurate comparison. The Core i5-2400 has twice as many cores (but the same number of threads) and 50% more Level 3 cache. It would have been better to pit the Ivy Bridge chip against an underclocked Core i3-2100 instead.
 
Japanese , Chinese WHO CARES ? They are all the same to me as I can not READ any of it any way . It is always some foreigner NEVER some one in the USA NEVER ! Never some one that we can trust NEVER ! Not till they hit the main stream market that is !

You're a foreigner to most of the world's population. And what makes you think someone in the USA is more trustworthy than someone from an Asian country? :rolleyes:
 
It is like saying look there is Jesus Christ RIGHT OVER THERE ! I do not believe it at all . :shadedshu :slap:
Why not? :p
Japanese , Chinese WHO CARES ? They are all the same to me as I can not READ any of it any way . It is always some foreigner NEVER some one in the USA NEVER ! Never some one that we can trust NEVER ! Not till they hit the main stream market that is !
I completely agree with you. Why would anybody trust those shifty Asians? Americans are clearly the most trustworthy.

:rolleyes:
 
Intel said IB would be 20% faster per-clock then SB.... I don't see it
 
Japanese , Chinese WHO CARES ? They are all the same to me as I can not READ any of it any way . It is always some foreigner NEVER some one in the USA NEVER ! Never some one that we can trust NEVER ! Not till they hit the main stream market that is !

There are still Germans in this World... without them, this Forums wouldnt even exist.;)
It has a Reason, that AMD built its Fabs here (for example).
You will NEVER beat German Engineering!:p

(man, i just love to poke american patriots... so much fun :D)
 
It will still be area and the die shots will look pretty similar, i think the term 3d is not the best way to describe the new transistor as transistors are currently 3d just pretty flat/thin and the new transistors are just taller with more gate material/higher surface area.

I think calling them 3d often gives the idea that the circuit would be 3d as in could be made in a cube or something yet they are still pretty much flat slices of silicone with circuit printed on to it like they are now, it's kind of like they are just using more ink.

Yes, I'm sure the layers will be limited to probably 3-5. Still very thin and surely not cubelike cube-like. But I bet, depending on how it's done, it may look quite odd.
 
The true 3D stacked chips from IBM will be more cube-like. The problem is the cooling, since the density will go up tremendously. The current intel's "3D" is more like a flat fabric with wrinkles.
ibm3dchip.jpg
 
Back
Top