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TechPowerup IC Diamond Results Thread

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Before IC diamond 24


With IC diamond 24

cold Boot up



Fresh max Cpu test


shecked the paste spread, add a bit more
20min max cpu test

 
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so how are these results?
 
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so how are these results?
Not familiar with your benchmark. Looks like load was not the same in between the tests in the before and after.
 
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they are not benchmarks i used keyshot 3 ray tracingsoftware
 
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they are not benchmarks i used keyshot 3 ray tracingsoftware


Use Prime95 or Intel Burn test for load testing before an after changing TIM to o IC Diamond to get idea of temperature difference under 100% load.
 
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i prefer to use stuff that i use daily
 

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System Name Black Killing Machine
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i prefer to use stuff that i use daily
That makes sense but doesn't help me see how good your TIM upgrade helped since I am not familiar with that software.
 
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Spent most of the night swapping out IC Diamond 24 TIM for Liquid Pro TIM on my bare die NO IHS 3570k.


I tried using some Thermal pad around the die on the PCB with the Liquid Pro but I couldn't get the right spacing and my CPU would not post.

So I removed the thermal pad and still would not post.

Messed around with my mount for a few hours and I kept getting error 55 on my MB LED display.

I finally got a snug fit and was able to boot up but my temps are still not that great. My 3rd core is hotter than it has ever been. So I am going to have to redo this mount after I get some rest later on this weekend.


So far from what I am seeing Liquid Pro requires a nearly perfect mount to work right while the IC Diamond was more forgiving on the mount.



Screen shots of my temps so far.

Before with IC Diamond.

26C Ambient


With Liquid Pro
25C Ambient





My 3rd core has never been so hot so I think I may have a bubble in that area. I'm going to let it run prime95 for a few hours to see if the temps settle down. Probably going to have to remount.

IC Diamond is leading right now.
 
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Got the CoolLaboratory Liquid Pro mounted correctly. Beat IC Diamond 24.


Delidded IB i5-3570k @ 4.5GHZ 1.15v with NO IHS with DT SNIPER Water block
http://valid.canardpc.com/show_oc.php?id=2551498



TIM IC Diamond 24
IBT 4.5GHZ Maximum memory tested 5 passes
Ambient Temps 26C
Best Temps seen over a 2 week period using IC Diamond





TIM Liquid Pro
IBT 4.5GHZ Maximum memory tested 10 passes
Ambient Temps 25C
Fresh Install



With IC Diamond 24 average temp of each core was 73C under IBT load. With Liquid Pro average temp of each core is at 61C!! under IBT load. :)

Taking a look at my IB 3570k progress since delidding.

Before Delidding.

Ambient Temp 26C

TIM IC Diamond 24

Temps under LinX load 83C 93C 89C 84C average of 87.25C per core.


Since delidding I have been able to lower my average core temps under IBT 100% load at 4.5GHZ by 26.25C per core!!!
 
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IC Diamond

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SonDa5 - Great Result!

I would not expect that a LM would have that much of a delta over ICD although I would expect a degree or two better under favourable LM application. I believe that removing the IHS besides removing a layer of resistance provides a exceptionally flat surface for improved contact as noted in your Contact test in post #150.

Screw systems are pretty poor mounting systems in general on our fixed test dies we stopped using them as it was awkward to say the least to get a good mount having to alternate tightening and loosing the screws by "feel" and temp observation to jiggle into the best or most even mount for best performance, an eighth of a screw turn could cant the sink in one direction or other and significantly impact temps a degree or two. To get consistency we switched to a centre point spring mount for consistent pressure and contact.

In any event I think this is what happened in you post #159 result Your sink was cocked to one side and LM being the way it is could not fill the gap hence the higher temps. If you watch the Liquid pro application video note the amount applied, the rice sized amount used is enough to cover the area but to the Intel spec of Flat and // to .002 is only approximately 1/3 or 1/4 enough to fill to the extreme end of the spec any voids and as noted in the contact images posted here most lean to much less than ideal.

Where LM's truly shine are in situations of high contact but low pressure. All thermal compounds have have there own pressure/resistance curve similar to the one below and will vary with particle size and the amount of liquid mixed in so that say a highly liquid stock compound may reach it bond line thickness (BLT) or average particle size at 40 PSI or a more viscous compound as ICD it might be 60 PSI. On on a comparison at 40PSI two compounds would appear the same but at but at a 50% increase in pressure to 60 PSI since the stock is already at it's BLT you see little change whereas the alternate compound will drop several degrees as it closer to it's optimum BLT.

Now Look at the chart below, your LM having no particles in the mix probably hits it's best BLT at a couple of PSI perhaps 5 psi? just by being purely a liquid vs a particle porous media. Now draw a straight horizontal line all the way to 70 PSI it gets no better across the range where particle loaded compounds will continue to improve till they resolve down to their average particle size or ultimate BLT.

I would suggest that to improve ICD performance would be to tighten down the sink but I think this puts the die at some risk with any miscalculation on load balance and while I believe the final result would be close if pressure was increased within a couple of degrees in the final analysis you would be still ahead with the LM as in this situation Low pressure/High contact plays to LM's strengths.

Good test and a nice job on the whole project, 26.25C reduction is nothing to snarf at.

 
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I think IC Diamond works best with good high pressure mount because it takes IC Diamond more pressure to get squeezed down to optimum thickness. It is tough to get a good mount with 4 tightening positions. A single center tightening position would be best.

I think bare die mount is even more tricky than mount with IHS.


Adding a thin layer of Liquid Pro on my block and Die contact areas worked best for me. Most of my mount problems with Liquid Pro were with Liquid Pro only on the die, adding 2 thin layers to die and block surface directly against die worked out great.

Thanks for all the feed back.
 
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IC Diamond

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some Apple Mac book Air results for those that have an interest - Notebooks are almost universally poor contact


 
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I received my sample a month ago but i was a bit busy with work, today i finally got around to do some testing, I have an i7 2600k@4.6Ghz with a H80. I ran a 10 pass of Intel Burn Test on high. these were the maximum temps observed. Ill test again in the morning to give the paste a bit more of cure time. As the temps went down since i first applied it.

Noctua NH-T1
72-80-80-77

IC diamond 24
73-80-81-80

on a side note i recently used it on a laptop since ran out of NH-T1 the consistency was perfect for it, since i cleaned the fan and the heat sink had the stock tim i don't think i can give some measurements, but i saw at least a 10 degree drop on the T9300.
 

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IC Diamond works well but its toughest problem it has is in application. Get the right thickness and contact pressure and it can hold its own with the best of TIMs.
 

IC Diamond

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IC Diamond works well but its toughest problem it has is in application. Get the right thickness and contact pressure and it can hold its own with the best of TIMs.
If you are referencing the thickness/viscosity of IC Diamond that was done by intent as OEM's recommend bulk loadings over 90% (which causes the thick nature with so little liquid, 4%) for high reliability.

We always recommend a compression spread and nothing could be easier - apply the proper sized bead/amount then mount your sink and let the pressure spread the compound.

http://innovationcooling.com/applicationinstructions.htm

Nature of the beast liquid in a porous media - High heat, pressure and overtime the liquid is either pumped out or baked out and compound that is left shrinks and the more liquid the more voids that are left in the joint. IC Diamond bypasses this phase of failure as there is so little liquid it's shrinking or void formation is minimal to virtually nonexistant.

Following example of bake out with void formation is from my daughters Playstation with just a few hundred hours use.



Those nice smooth creamy retail compounds that apply real nice have early failure built in.



Some accelerated reliability tests with some 3X10 glass slides and the attached picture of test result was run for 20 hours at 150C, the center picture ICD is IC Diamond and highlights the stability of IC Diamond The others are commonly used retail performance pastes, all of which are commonly recommended on the forums. The competition compounds feature the formation of voids, and span the range of initial failure to complete failure. IC diamond was observed to have no visible points of failure under these conditions. The picture is back lighted so the void formation is clearly visible
As far as I know we are the only one that publishes reliability data as at the commercial level it is pretty much of a requirement and most certainly the only one that provides it at the retail along with a substantiated argument for it.

Reliability is synonymous with quality which is often missing from most TC discussion's, for the over clocker that changes their sink more often than they do their underwear perhaps not so much a big deal. For the Notebook and Game Station people a re-paste every six months it is a PITA as noted here and other forums it is constant temp battle for some with overheats and yellow lights.
 
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