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TechPowerup IC Diamond Results Thread

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i've used IC diamond in the past and liked it. maybe the next time i tear my loop apart to clean, i will try this new method with the contact paper. looks very intriguing.
 

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Finally got around to remounting my DT Sniper Block again to see if my temps will improve.

Before my contact pressure wasn't parallel with my i5-3570k die.

It was vertical. Here it is.
http://i291.photobucket.com/albums/ll300/ICD7/DTSCT1Papers.jpg

Now my contact pressure is in a horizontal parallel position with my i5-3570k.

Here is the paper in the socket with IB CPU parallel with contact pressure.
http://minidriven.com/BlacknBlueforIB/BLACKZ77Mpower/CPTDIEhorizontalDTSNIPER.JPG

I am hoping that the parallel positioning will lower temps. I will post before and after templs for the new position of mount later on.

I have one more contact paper left which I am going to use for a bare die contact test later on and will also follow up with temp results from running direct die contact with IC Diamond. :rockout:
To me, this contact looks a heck of a lot better than your last one.
 

newtekie1

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Finally got some time at work to test this. Here are my results:

Test Subject:
GTX465 Fermi
Idle Clock:405MHz
Load Clock: 675Mhz
Voltage: 1.05v

Results:

Arctic Silver Alumina
Idle: 48°C @ 52%
Load: 68°C @ 82%
Ambient: 15.5°C

IC Diamond 24
Idle: 48°C @ 52%
Load: 67°C @ 80%
Ambient: 15.5°C

For load I used Kombustor running full screen, rendering the sphere in DX11 with 4xAA and PostFX. I let this run until the temperature stabilized.

I then stopped Kombustor and let the temperature stabilize again to get the idle reading.

And yes, it really is that cold where my computer sits, it is under a desk with a huge A/C vent that runs constantly.
 
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I would love to see all this data condensed into a chart, showing each members results, instead of having to wade through every page.. Very interested in the results..

And yes, it really is that cold where my computer sits, it is under a desk with a huge A/C vent that runs constantly.
I need to get one of those.. Florida ambient temps are murder..
I'd be worried about condensation building up though..
 

brandonwh64

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I would love to see all this data condensed into a chart, showing each members results, instead of having to wade through every page.. Very interested in the results..



I need to get one of those.. Florida ambient temps are murder..
I'd be worried about condensation building up though..
I would too, This would make the thread easier to read what user had gotten during their tests.
 
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Well it took a while, but I finally got to testing it out.

Since Cure time is around 2 Hours. I'll wait till then to OCCT it out. But here is what I got so far.

General Information











Thermalright Generic Thermal Paste OCCT Run





Ambient Temp:78F (25.5C)
Idle Temp: 40-41C
Load Temp:68C

IC Diamond Thermal Compound OCCT Run





Ambient Temp:78F (25.5C)
Idle Temp: 40-41C
Load Temp:69C


Slightly warmer but practically no difference. Not sure if I didn't do something right or if it needs more time to cure.
 
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newtekie1

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I need to get one of those.. Florida ambient temps are murder..
I'd be worried about condensation building up though..
Condensation only happens when computer/part is colder than the air around it. That never happens in this situation, even if the A/C kicks off, the air is still cooler than the computer.

Now if I was to turn the computer off and quickly move it to a warmer part of our office I might get some condensation, but I'd never do that.

Also, it has the negative effect in the Winter when the A/C vent becomes a heat vent...
 
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So far my testing.

i5-3570k at 4.5GHZ 1.175v
With DT Sniper water block.
20 passes of LinX testing in diagnostic mode.

With Mount vertical.



prolimatech pk-1

Ambient Temps: 21C



IC Diamond 24
Ambient Temps 21C.






New testing with Block rotated 90 degree to see if it improves contact for cooling.


Ambient Temps 23C.
TIM IC Diamond 24



Seems about the same..


Next testing will be with direct contact on CPU die. :)
 
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My post has been edited with my final results with 1 day for the ICD to cure.

No significant difference between the two compounds.
 

IC Diamond

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Rotation does not seem to change results much - Giglamesh has tested 5 blocks independently and rotated each one and the only one that showed a real improvement was the Koolance block.

Images are starting to add up I have about 14 so far and contact for the wb's generally is poor. I will post a catalogue of results so far later this weekend.

Keep in mind that the sink is only half the equation, the IHS comprises the other 50%.

The sink could be tested separately using a flat plate or a glass slide with the C/P paper and a clamp like this which will apply approx 45-50 PSI.

The test would tell you whether it is the sink or IHS is not flat











Clean Print BTW

 
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I'm hoping this contact pressure pattern will work great when I delid and go direct contact on the die.



Should have direct contact results in a week or so after I reconfigure and upgrade my loop.
 
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I did the tests right after I replaced the TIM with ICD24...

Tuniq TX-4:


ICD24:


Pressure Pattern:


I'm starting to think I need to lap the base of the cooler... The pressure pattern of my cooler sucks... :banghead:
 
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The best!

This is the best thermal compound I have used so far!
Results:

By itsakjt at 2012-09-16


By itsakjt at 2012-09-16


By itsakjt at 2012-09-16


By itsakjt at 2012-09-16


By itsakjt at 2012-09-16


By itsakjt at 2012-09-16

Before IC Diamond 24(Cooler Master Thermal Fusion 400)


By itsakjt at 2012-09-16

After IC Diamond 24


By itsakjt at 2012-09-16

So you can see that is a straight 1 degree C difference with the fan speed lower as well.
I am sure the difference will be more drastic with a better cooler(I am using the stock AMD cooler).

My specs are on the left.
NOTE: The day I tested the Cooler Master was cooler(2-3 degree C) than today. So my conclusion is IC Diamond 24 is the best thermal compound I have used so far. :)
Next test coming- My Sapphire Radeon HD 6770 1 GB DDR5.
And if you can, can you please tell me the proper method of application on GPUs and laptop CPUs(direct on-die)?
 
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UPDATE:
It seems that the thermal compound is doing even more awesome under high overclocks.
Previously, I could not get to 3.8 GHz as the CPU temp exceeded 64 degree C.
Today I tried 3.8 GHz even with the IMC at 2834 MHz and the RAM at 1744 MHz.
System is super stable. :)
Temps didn't go above 61 degree C even after 1 hr of Prime95.
I am going to buy an IC Diamond 24 after this one's finished and post a pic of it here.
Love you guys at IC Diamond!
All the best. :)
 

t_ski

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Depends on the die size of course, but a small (~3mm) blob should work for an exposed Radeon GPU. VERY IMPORTANT!!! After you mount the cooler, take it off and check the spread to make sure the entire GPU is covered. If it's right, clean it and reapply the same amount. If it's too small, clean and reapply a slightly larger amount. If there's way too much, clean and reapply a slightly smaller amount (enough to cover, but not too much to waste).

A larger GPU core or a GPU with an integrated heat-spreadder will need more compound, similar to application for a CPU with an IHS. Covering the IHS completely is not as critical as an exposed GPU, but it's always a good ideal to mount the cooler and then remove it to check the spread when you are working with a new TIM, especially if it's thickness is different than what you're used too. Remember that a thick compound like this needs significant pressure to work well, so using this on a GPU that has push-pins to hold the heatsink on is probably not a good idea. Use a thinner compound for those.
 

IC Diamond

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Putting together a nice library I have another couple of WB that Gilgamesh has tested which I will add later. Getting great contact not as easy as you would think.

adulaamin -Did not get the type/ manufacturer of your sink


ThermalRightUltraExtreme120



LARKCOOLER ISKY WATER 300 CPU BLOCK



BigWater760i



Ultra120Extreme



xspcRASAWB



/Heatkiller30CU



DTsniperWaterBlock



koolance370



AntecKHLER



ek full wb



CorsairH50



/DTSniper Water Block rotated



Larkcooler CPU WB 500



Corsairh100



EK Supremacy FULL NICKEL courtesy of Gilgamesh

 
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updated post 4 with my results

on Ivy Bridge at 1.25v at 4.6GHz i am seeing a temp drop of 4c at Idle and up to 8c under load

at STOCK i am seeing a drop of 2c at idle and up to 4c under load overall well worth the temp drop its amazing I had to recheck the MX-4 but after multiple attempts its no fluke my chip just seems to like IC diamond paste.
 

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updated post 4 with my results

on Ivy Bridge at 1.25v at 4.6GHz i am seeing a temp drop of 4c at Idle and up to 8c under load

at STOCK i am seeing a drop of 2c at idle and up to 4c under load overall well worth the temp drop its amazing I had to recheck the MX-4 but after multiple attempts its no fluke my chip just seems to like IC diamond paste.
Them are some awesome temp differences Crazy!!!
 

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Got my IC diamond but it looks like the exact same tube that I bought last year. Is this a new formula?

I thought I was going to be comparing an old formula IC Diamond to a new formula.

Lucky I found some PK-1 laying around.
... bump for a replie to Sonda5's question..
 

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I pulled my block off yesterday for some other work. I found that there was a slight stain in the IHS on the CPU. The waterblock did not show anything - at least, it was very clean in the contact area, but the outer edge was slightly tarnished. I'll post pics up for your review later.
 

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updated post 4 with my results

on Ivy Bridge at 1.25v at 4.6GHz i am seeing a temp drop of 4c at Idle and up to 8c under load

at STOCK i am seeing a drop of 2c at idle and up to 4c under load overall well worth the temp drop its amazing I had to recheck the MX-4 but after multiple attempts its no fluke my chip just seems to like IC diamond paste.
I got about the same over MX-4, though my overclock settings reflect your stock settings temperature wise. Perhaps your ambient temps changed?
 

IC Diamond

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QUOTE]Originally Posted by crazyeyesreaper View Post
updated post 4 with my results

on Ivy Bridge at 1.25v at 4.6GHz i am seeing a temp drop of 4c at Idle and up to 8c under load

at STOCK i am seeing a drop of 2c at idle and up to 4c under load overall well worth the temp drop its amazing I had to recheck the MX-4 but after multiple attempts its no fluke my chip just seems to like IC diamond paste
.

I got about the same over MX-4, though my overclock settings reflect your stock settings temperature wise. Perhaps your ambient temps changed?
[/QUOTE]

crazyeyesreaper To date has the best contact & pressure and no doubt influenced his results.

Thermal Compound performance is all about Contact and Pressure, simple as it gets.

We have demonstrated this extensively on a number of forums, people with good C/P get good results. Quantify the result and you Qualify the result. Just because an end user got "X" result on a test does not mean it is a valid test when the determining/primary factor of the test (C/P) is not quantified -

Every Compound has a different pressure performance curve like the IC Diamond one below, so where are you on the IC Diamond curve? Where are you on the comparison compound curve? You could be at an advantaged point for one and at a disadvantaged pressure on another and that only relates to pressure.

All around high/good pressure will resolve most comparison issues but if you do not have a clue as to whether you are @ 25 lbs or 70 lbs the result is pretty much meaningless

In the catalogue above the samples tested so far are running mostly under 50% contact so the results are qualified the basis for understanding what the data means is available and as I have offered to do a independent lab analysis to quantify the results here to generate a pressure/contact chart of the results here so if anybody would like to return their C/P results I will be more than happy to send them out



 

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Discussion below is from OCUK and relates to how heat flows with an IHS and where you encounter material limitations of the copper

Key thing to remember - increased contact does not increase pressure, but generally increased pressure will increase contact. Pressure is the more dominant of the two.

Let's flip the problem, In engineering a common device used to limit heat flow to sensitive components in an assembly is a “Heat Dam” shown here in figure #3 Where the heat flow is “thermally choked” by reducing the contact area to material limitations. Restricted heat flows with misaligned contact, too little contact, too little pressure, too little compound anything that can restrict flow creates a heat dam.

Heat flows on a differential from hot to cold but if you are thermally choked at a point in the thermal cascade downstream improvements in thermal conductivity offers little difference in performance and shows up as reduced deltas of only a degree or so between compounds or what I sometimes refer to as homogenized test results.

Now back to your situation, your analysis of having contact in the right area is correct rather than forcing the heat flow across the IHS to the sink which is a thermally choked condition pushing to the material limit of the copper. I believe the molehill change from mountain allows a thermal compound to work as designed now by being able to bridge the gap from IHS to sink as in Figure 1. These are the thresholds or tipping points for you guys and all your ducks need to lined up in detail to squeeze the most out of your systems.

For further improvement possibly a degree or two from improved contact and another 1-2 from increased pressure although I lean towards more pressure at this point.

If you could figure a shim to tighten down the sink some more...