- Sep 3, 2019
- 2,088 (3.85/day)
- Thessaloniki, Greece
|System Name||PC alive since Aug 18th 2019|
|Processor||Ryzen 5 3600 (PBO Enabled)|
|Motherboard||Gigabyte X570 Aorus Pro, BIOS F32|
|Cooling||Corsair H110i 280mm (Liquid metal for TIM)|
|Memory||Corsair Vengeance LPX DDR4 2x8GB 3466MHz @3600MHz CL16-18-18-18-36 1T, B-die A0|
|Video Card(s)||MSI RX 5700XT Gaming X|
|Storage||Samsung NVMe: 970Pro 512GB (2019, OS drive) / SATA-III: 850Pro 1TB SSD (2015) 860Evo 1TB SSD (2020)|
|Display(s)||24" EIZO FlexScan S2411W 1920x1200, 16:10 60Hz samsung S-PVA 14-bit (16.7M/1.06B colors), 6ms G2G|
|Audio Device(s)||Sound Blaster Z <--optical link--> Logitech Z5500 5.1 500W|
|Power Supply||Corsair HX750i|
|Mouse||Logitech MX Master (Gen1)|
|Keyboard||Logitech G15 (Gen2)|
|Software||Windows 10 Home 64bit (20H2)|
I think that 74mm² is the 8core chiplet.The cpu die area is split into pieces on Ryzen 3000 chips. Zen+ and previous only had a single die.
Which die area is Noctua referencing? the I/O chip?
I liked the point you brought up earlier about Tim 10 Wm2K vs LM 100 Wm2K thermal transmittance.
You'd think the solder I removed and replaced with TIM would had made a HUGE difference. Nah, not like you think.
I'm running a De-lidded 2700x, solder replaced TIM with the stock cooler and it changed the effects of the processor none.
It's not the IHS plate, or the TIM / LM..... It's the density of the transistor count on small die. This is where the "temp spikes" come from.
I can agree for the density of those small dies, but having high thermal resistance (TIM over LM) would only make things worst.
Not having any difference from delidded 2700X I think its because of soldered IHS on the die, over other CPUs that only having "regular" TIM under the hood by stock (and not soldered).
Yes yes... Thats one reason (among others) there is a difference between TDP and max power draw.Not all the cpu heat is dissipated to the heat sink. A great deal of it yes, but some is dissipated through the board as well.