SK hynix showcased advanced memory technologies for the era of AI and high-performance computing (HPC) at Supercomputing 2025 (SC25), held in St. Louis, the U.S., from November 16-21. Held annually since 1988, SC is the world's largest global HPC conference. It brings together experts from industry, academia, and research institutions to share the latest trends, create opportunities for collaboration, and discuss the future direction of technological advancement. At this year's event, the convergence of AI and HPC emerged as a central topic. Under the theme "Memory, Powering AI and Tomorrow," SK hynix presented its innovative memory lineup set to lead the AI and HPC markets and shared a new technological vision to accelerate data analysis in computing systems.

Innovative Products and Tech Driving AI and HPC Performance
At the event, SK hynix presented core products including HBM, DRAM, and eSSD solutions. Visitors to the booth could also see demonstrations of the products in AI and HPC environments, highlighting the company's technological competitiveness. At the front of the booth, SK hynix displayed its latest HBM products including the 12-layer HBM4 which it developed as a world-first in September 2025. HBM4 features 2,048 input/output (I/O) channels, twice that of the previous generation, delivering a significant increase in bandwidth. Also offering more than a 40% boost in power efficiency, HBM4 is the most suitable solution for ultra-high-performance AI computing systems. In addition, the 12-layer HBM3E, the highest performing commercialized HBM currently available on the market, was presented with NVIDIA's next-generation GB300 Grace Blackwell GPU.

The original Monster Hunter Stories game is back and coming to Nintendo Switch, PC, and PlayStation 4! Become a Monster Rider and hatch, raise, and battle with your favorite monsties in this epic RPG adventure. Become a Monster Rider who raises monsters and forges lifelong bonds with them in this epic adventure set in a vast, vibrant world. Befriend monsters to transform them into your Monsties! Transfer genes between monsters to raise Monsties with their own unique attributes and skills! Utilize your Monstie's Riding Actions out in the field to discover everything the locales have to offer!

Guess your opponent's attack patterns and experience the excitement of mainline Monster Hunter titles while engaging in thrilling, turn-based battles with monsters.
In addition to featuring Japanese and English voice overs, this remastered version also includes a "Museum" mode where you can view concept art and listen to the game's music! Monster Hunter Stories launches on Nintendo Switch, PC, and PS4 on June 14 with refined graphics, a new Museum mode, and content previously released only in Japan. Ride on!

The homebrew and modification community has delved deeper into the recent bout of bricked Nintendo Wii U consoles, unlucky owners are seeing their systems throwing up error codes that indicate an internal memory failure. As covered on TPU almost two weeks ago, it was speculated that leaving a Wii U in a long-term state of unuse was a root cause of the problem. It is now theorized that a simple choice of memory chip is the real issue behind the corruptions, and not a case of leaving your unplugged Wii U stashed in a box somewhere.

An online database has been established on hackmd.io, and a member is collecting hard data from Wii U owners across various online communities and sources. Early indications show that consoles fitted with a Hynix eMMC are leading the pack in terms of number of system failures, Samsung-equipped models are placed in a distant second place, and the Toshiba variant is reported as having zero problems.

Videocardz seems to have snagged some official AMD slides detailing their upcoming Threadripper PRO lineup. AMD is tiering its Threadripper CPU offerings between the Threadripper and Threadripper PRO via added functionality that AMD considers is better suited to the prospective buyers of a PRO-branded Threadripper: professional studios, designers, engineers and data scientists. AMD's positioning for these creatives or scientists is to offer a much improved platform throughput compared to Threadripper: the PRO version supports up to 128 PCIe 4.0 lanes (64 in non-PRO); up to 2 TB of ECC memory support (either in UDIMM (Unbuffered DIMM), RDIMM (Registered DIMM), LRDIMM (Load-Reduced DIMM) and 3DS (three-dimensional stacking) RDIMM vi an 8-channel configuration (4-channel in non-PRO); as well as professional-oriented tools and features such as Pro Security, Pro manageability, and PRO business ready support.

Four different CPUs will reportedly be offered in the Threadripper PRO lineup: the 64-core 3995WX is a relatively known quantity by now; likewise, the 3975WX will mirror consumer parts core counts (32 cores), both with reduced clocks by 100-200 MHz compared to their non-PRO counterparts. AMD seems to also be launching 12 and 16-core PRO Threadrippers in the form of the 3955WX (16-core) and 3945WX (12-core), both with boost clocks being set to 4.3 GHz.

Buffalo Japan introduced the RMSD-C6SA series of Class6 microSDHC cards. Pictured below, the cards are available in capacities of 4 GB (RMSD-4GC6SA), 8 GB (RMSD-8GC6SA), 16 GB (16GC6SA RMSD), and 32 GB (RMSD-32GC6SA). As Class6 devices, transfer rates of at least 6 MB/s are guaranteed. The packages include adapters that convert these cards into standard-size SDHC cards. Compatibility with devices such as the Nintendo Wii, 3DS, DSi, and DSii, is guaranteed. The 4, 8, 16, and 32 GB variants are priced at 2,880 JPY (US $34.6), 3,880 JPY (US $46.7), 8,880 JPY (US $107), and 17,880 JPY (US $215), respectively.

Micron Technology, one of the biggest DRAM companies, has announced that it's working the JEDEC standards organization for computer memory, to standardize a new DRAM interface and die-stacking technology called three-dimensional stacking, or 3DS, which may be incorporated into the upcoming DDR4 standard. X-bit labs has a nice summary of how 3DS works:

The idea behind 3DS is to use specially designed and manufactured master-and-slave DRAM die, with only the master die interfacing with the external memory controller. 3DS technology uses optimized DRAM die, single DLL per stack, reduced active logic, single shared external I/O, improved timing, and reduced load to the external world. This combination of features can improve timing, bus speeds, and signal integrity while lowering both power consumption and system overhead for next-generation modules, according to Micron.