GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest AMD A620 series motherboards with optimal memory performance and all-round features. With the perfect support of the latest AMD Ryzen 7000 series processors, GIGABYTE A620 motherboards deliver the most competitive AM5 platform for users to enjoy performance flexibly and affordably.

Enhanced by GIGABYTE exclusive layout design and BIOS setting, the A620 lineup can achieve optimal memory performance of DDR5 EXPO/XMP overclocking up to DDR5-6400, which exerts the utmost value and performance of the AM5 platform. Boasted with comprehensive features, GIGABYTE A620 motherboards can best fit users' needs and budget, and become the best choice for users who plans on stepping up to the latest AM5 platform.Meanwhile, GIGABYTE's A620 motherboards boast the innovative PCIe EZ-Latch technology to simplify the upgrade of graphics cards, and to avoid accidental damage to the surrounding components. By GIGABYTE exclusive Q-Flash Plus feature, users can update the BIOS without installing any processor, memory, or even graphics card, making it possible for users to easily enjoy the benefits brought about by the new BIOS code and processors. Further with GIGABYTE GCC software platform, GIGABYTE delivers the competitive A620 platform with user-friendly features and multiple form factor options which covers Micro ATX to Mini ITX.

Raijintek today introduced the Arcadia III, an ATX mid-tower case that's designed to be taller than it is deep. The case measures 210 mm x 410 mm x 485 mm (WxDxH), and is made mainly of SECC steel. There are two variants based on the side-panel, the Arcadia III with its 4 mm-thick tempered glass panel; and the Arcadia III ST with an opaque SECC steel panel. Both feature airy mesh front intakes. Both cases only include one fan, a rather premium 120 mm spinner with hydraulic bearings, 43.2 CFM, but with 3-pin DC control.

Inside, the Arcadia III offers a conventional horizontally-partitioned layout with the bottom partition having a cutout for the PSU label to peek through the side-panel. The main chamber has up to 36.5 cm of length clearance for graphics cards (if no fan or radiator is mounted on the front panel); and height clearance of 16.5 cm for CPu coolers. Fan vents include two 140 mm or 120 mm top exhausts, three 140 mm or 120 mm front intakes, a 120 mm rear exhaust, and interestingly, two 120 mm bottom intakes. This gives you room for a radiator as large as 280 mm on top, and as large as 360 mm on the front (not big enough for 520 mm). The bottom vents aren't convenient for a radiator. Storage options include two 3.5-inch bays in the bottom compartment, and three 2.5-inch mounts. The company didn't reveal pricing.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47H industrial ATX motherboard for 12th/13th Gen Intel Core i9/i7/i5/i3, Pentium and Celeron processors. The IMB-M47H ATX motherboard delivers scalable, high-performance computing power and supports three simultaneous independent displays, external USB, 2.5GbE, and high-performance add-on cards for complex processing tasks in smart manufacturing, 5G manufacturing, semiconductor, and machine vision applications.

The IMB-M47H industrial ATX motherboard supports Gen 12 Intel processors and importantly the latest Intel Core processors that utilize a high-performance hybrid architecture with up to eight E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 12th/13th Gen Intel Core processors boost single-thread performance by 1.36x and multi-thread performance by 1.35x compared to 10th Gen Intel Core processors delivering more power-efficient general-purpose processing and offering powerful processing for intensive operations.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

Antec Inc., a Californian supplier of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, presents the AX90, a model oft he new budget-friendly AX series of Gaming cases. The mid-tower is equipped with three 120 mm ARGB fans in the front as well as one in the rear and is now available at a very affordable price of € 99.99 (recommended retail price including VAT).

The new AX series from Antec offers a large selection of gaming cases with LED lighting and eye-catching front panel designs - all at an affordable price. The new AX90 case has a side panel made of tempered glass and puts the built-in components in the limelight. Diamond-shaped frames in a mesh front panel create not only a visual highlight but also allow for excellent airflow.

AMD's high-end X670E motherboard chipset combines two Promontory 21 chips working together to deliver a single solution. With regularly-sized ATX motherboards, having two chips to form a chipset is fine, as there is much room on the PCB. However, with Mini-ITX motherboards, packing two Promontory 21 chips is difficult as the PCB area is limited. To combat this, ASUS introduced an interesting solution to solve the problem and allowed the company to ship the high-end X670E chipset inside a Mini-ITX form factor. Thanks to UNIKO's Hardware's findings, we look at the exciting solution ASUS used to solve this problem.

Instead of two Promontory 21 chips side by side, one is placed on the motherboard directly, while the other stands vertically attached by M.2 PCIe slot. Below, the chipset's pictures and the highlight show how it looks disassembled.

With a massive mesh front and metal panel design and flexible configuration options, Antec Inc. presents the latest two additions to the Antec Performance Series: the P20C (with glass side panel) and the P20CE (with sound-dampening side panel). Both versions are now commercially available from 124,99€ (suggested retail price including VAT).

The P20C / P20CE allows limitless possibilities for building a show case. The new flagship is ready to provide users with a more flexible layout as it features seven reusable PCI-E slots for vertical GPU installation. By supporting dual CPU motherboards with a width of up to 330 mm, the P20C / P20CE is the evolution of compatibility. The new chassis adopts a unique metal design, providing a massive airflow. With the full-size dust filter, the case reaches the balance between cooling and easy maintenance. The pin-type metal front panel is effortlessly removable, and the clip-on dust filters make the cleaning process a walk in the park.

ASUS Republic of Gamers (ROG) today announced the ROG Hyperion GR701, a completely reimagined full tower gaming case that offers an uncompromising vision of luxury and performance, engineered to take DIY builds to new heights.

A new benchmark for airflow
The world of PC building has changed. From next-gen graphics cards like the NVIDIA GeForce RTX 4090 to faster-than-ever USB data rates and charging, a PC case needs to support the latest and greatest technologies. ASUS built the ROG Hyperion to be a durable, elegant chassis that is ready for the future of DIY gaming rigs—with an airflow-focused design that keeps components running in top shape.

Leading global motherboard manufacturer, ASRock, proudly announces its new series of Intel B760 motherboards, including B760M Steel Legend WiFi, B760M Pro RS, and special edition B760M PG SONIC WiFi. These feature-filled motherboards are designed to bring supreme performance and the latest technologies - including up to PCI-Express 5.0 & overclocked DDR5 - to benefit more PC enthusiasts, gamers, and office/workstation builds than ever before. The B760 chipset is designed for the latest 13th Generation Intel Core 'K' or 'non-K' series processors (socket LGA1700), while also supporting the previous 12th generation.

Followed by the success and critical acclaim of the ASRock Z790 PG SONIC, the company has released another officially licensed motherboard featuring SEGA's Sonic the Hedgehog: the B760M PG SONIC WiFi. Based on the mainstream Intel B760 chipset, this micro ATX motherboard features all the exciting SONIC elements in a small form factor and budget friendly design.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE's B760 lineup provides premium power and thermal design for the high-frequency operation of Intel 13th gen processors. Meanwhile, the innovative PCIe and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2x2 Type C with 20 Gbps, and up to 3 sets of PCIe 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.

In the Intel product plan, the "Z" chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget friendly options, especially those only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.

Introducing new, enhanced PC cases: Genesis Irid 505 v2 and Irid 503 v2. Better ventilation, design and enhanced filtering for superior protection from dust - these are the most important traits of the new Genesis PC cases: Irid 505 v2 and Irid 503 v2. Enhanced PC cases, Irid 505 v2 and 503 v2, are the company's answer to increasing user demand for spacious PC cases which can include a new generation of multi-core CPUs and highly efficient graphics cards.

A thicker front mesh of the Genesis Irid 505 v2 and 503 v2 provides better filtration for air that goes into the cases in a wide stream thanks to its open front design. The 0.8 mm openings make the front mesh more restrictive dust-wise when compared to other, standard anti-dust filters. Additionally, it is very easy to clean, for example with a wipe, without the need to dismantle anything.

North helps to reimagine the gaming station, introducing natural materials and bespoke details for a case which integrates stylishly into the living space. Merging design and airflow engineering, the case features fine-patterned mesh ventilation and an open front with real walnut or oak panels. The design is complemented by sleek brass or steel details and an integrated tab for easy access to the top of the case.

Developed for an enjoyable building and gaming experience, North offers an intuitive interior layout and generous compatibility. It supports GPUs up to a length of 355 mm, or up to 300 mm with a 360 mm front radiator. For a smooth start, it includes two 140 mm Aspect PWM fans, a USB-C port and drive mounts for up to four 2.5" drives and two 3.5" drives out of the box.

[Editor's note: Our in-depth review of the Fractal Design North is now live]

For those of you familiar with CaseLabs, the demise of the company in 2018 was most likely a sad time when it comes to the history of PC component manufacturers. However, it appears that the company is back in business, under new management and in a new location. CaseLabs was originally from California in the US, but the new owners have moved the company to Sweden. In fact, the key person is said to be a CaseLabs enthusiast by the name of Emil Rytterstedt who bought the rights to the CaseLabs brand in 2021, as well as what appears to be the rights for all of the products that the original company made. For now, the CaseLabs website is back up and running, but the company isn't selling any products, yet.

Based on the information available on the CaseLabs website, the company will initially offer spare parts for existing CaseLabs products, as well as offer support and customer service through it. This will be followed by at least some of the cases that CaseLabs used to offer, which will see some updates, especially when it comes to the I/O options and some other additions such as vertical GPU brackets. However, the longer term plan is to offer new products under the CaseLabs brand, which will apparently start with a smaller form factor case. All the new products will apparently be made in Sweden, so expect CaseLabs products to remain in the premium price segment. For those in the US, the company has already mentioned that the prices will be more expensive than in the past, due to shipping costs. Expect things to kick off sometime in early 2023 when it comes to actual product availability.

A Redditor who goes by mikejc shared the 3D printer model for a contraption that safely bends a 16-pin ATX 12VHPWR connector to a 90° angle for cable-management. It's essentially a crutch to guide the high-gauge cables of the connector, which bends the cable at a safe 3.5 cm distance away from the connector. A properly guided cable reduces mechanical stresses on the contacts of the 12VHPWR connector, improving its durability in scenarios where PC enthusiasts want to manage cable clutter in their PCs. The PC enthusiast community was stirred last week to end-user reports of GeForce RTX 4090 graphics cards with burned 16-pin power connectors.

NVIDIA is responding to reports of the 12+4 pin ATX 12VHPWR power connector of its new GeForce RTX 4090 "Ada" graphics cards being unreliable, and posing a potential fire hazard. The company has reportedly instructed its add-in card (AIC) partners, companies that sell custom-design graphics cards; to collect all retail graphics cards with burnt power connectors, and send them over directly to NVIDIA HQ for investigation. Reports of the 12VHPWR connectors overheating due to improper terminal contact aren't new, but this is the first time a retail product implementing the connector is experiencing reliability issues.

It came to light when a Reddit user posted pictures of a melted 12VHPWR connector from an NVIDIA-supplied adapter that converts four 8-pin PCIe to one 600 W-capable 12VHPWR. There is also charring on the female connector on the card, but the user claims that the card is functional. Later this week, another Reddit user posted similar pictures of a burnt connector for their RTX 4090 card. NVIDIA director of global PR for GeForce, Bryan Del Rizzo, in a statement to The Verge, said that the company is in touch with the first owner who reported this problem, and is reaching out to the other, as part of their investigation.

The MEG PROSPECT 700 Series is MSI's first high end PC case that sits in the MEG segment. It has 2 models: the MEG PROSPECT 700R and 700RL. The main difference between the 2 models are that the MEG PROSPECT 700R has a 4.3" IPS touch panel while the MEG PROSPECT 700RL has a LED switch button on the IO port instead. This new mid-tower PC cases series enjoys a wide variety of features designed to improve the users' overall experience and better the performance of the entire computer system.

The MEG PROSPECT 700R has a 4.3" touch panel IPS display that can help users manage and control the entire system easily. Through the touch panel, users can control the lighting effects and speed of the fans. Different types of graphics can be displayed as well, including GIFs, photos, weather, or time. Users can also choose to display the internal temperature of the system, which can be shown in accordance with a sensor placed in the system by the users.

US retailer B&H has kindly provided the first B650 motherboard pricing and it's something of a mixed bag. The company has listed no less than seven different models from MSI, ranging in price from US$199.99 to US$329.99. It doesn't appear as if any of these boards are based on the B650E chipset, but based on information TPU were given at Computex, we know that some higher-end B650 boards will cost around the same as some lower-end B650E boards.

As B&H has only listed key features of the boards, it's hard to tell what features some of the boards offer, but the base model is the mATX Pro B650M-A WiFi, which at the very least has one PCIe 4.0 x16 slot, one PCIe 4.0 x4 slot, one PCIe 3.0 x1 slot and two M.2 slots. The board obviously also has WiFi 6E and somewhat surprisingly has 2.5 Gbps Ethernet. On the other hand, it only has a front header for a USB-C port and none around the back. This type of board was supposed to start at or below the US$150 mark and we'll hopefully see a transition to there in due time.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced supporting products for the new AMD AM5 platform starting with two GIGABYTE motherboards, MC13-LE0 & MC13-LE1, that pair a consumer CPU with IPMI management functionalities via BMC. Additionally, a new desktop workstation, W332-Z00, was released using the same motherboard series platform that supports remote management, but the W332 does so with a Realtek NIC that enables DASH.

The new GIGABYTE products designed to support host systems are deceivingly powerful with a small micro-ATX form factor motherboard and enterprise rich out-of-band management features on top of PCIe Gen 5 and DDR5 technologies. These new client friendly products will be found in office settings under a desk rather than a rack in a data center, as they be managed from anywhere, provided there is a network connection. Furthermore, these new products are purpose built for the mainstream AMD B650E chipset with AMD Zen 4 architecture for AMD Ryzen 7000 Series desktop processors.

Sea Sonic Electronics., Co., Ltd. is proud to announce the introduction of the new VERTEX Series of power supplies specifically designed and built to power new PC components requiring the new ATX 3.0 and PCIe 5.0 standards.

On the heel of NVIDIA's recent announcement about the release of the new RTX 4090 VGA cards, we entered a new era, where the power supply, more than ever, has an important role to play. Issues such as VGA excursion power and cable integrity (now with high-grade 12VHPWR connectors) should be resolved.

XPG, a fast-growing provider of systems, components, and peripherals for gamers, Esports pros, and tech enthusiasts, today announces a new series of high performance power supply units. With the newly announced NVIDIA GeForce RTX 40 series GPUs, end users who plan on updating to these latest graphics cards will now need power supply units with a new type of connector. XPG actively works to provide the most up-to-date technology in all their products and happily upgrades/updates product specifications to meet the latest standards where possible. In order to meet the needs of gamers looking to upgrade soon, XPG has developed a new series of power supplies that are both ATX 3.0 compliant and PCIE 5.0 ready.

The 12VHPWR (12 + 4 pin) connector is now required for the next generation of top-tier gaming performance. Meaning you will need a compatible PSU to upgrade. In light of this new connector type and the updated Intel ATX 3.0 specifications, XPG CYBERCORE II series models will come equipped with this new connector type and an updated internal platform.

ASUS today announced the all-new TUF Gaming line of power supplies, designed to provide reliable, stable electricity to gaming PCs for years to come. For this iteration, ASUS engineers have made TUF Gaming PSUs better than ever, with improved 80 PLUS Gold efficiency rating and higher wattages to power any next-generation rig.

Like previous-generation TUF Gaming power supplies, the latest up to 1200 W Gold PSUs are built with military-grade components for reliable long-term usage, with a protective coating over the PCB to protect against short-circuits from moisture and dust. The 135 mm axial-tech fan design increases air pressure to keep operating temperatures low, without the noise of typical premium fans—and the new PSUs also feature a dual ball bearing for extended longevity.

Last year Cooler Master unveiled a milestone in the history of contemporary technology: the very first small form factor power supply in the market with 850 W, V SFX Gold series. Today, Cooler Master takes the successor and pushes the limit to the maximum. Introducing V SFX Platinum, a series of small form factor power supply focused on high density and maximum power. While increasing the efficiency rate from Gold to Platinum, we also added ATX 3.0 and PCI-e Gen 5 connector so even with the Mini-ITX build; this will be your last stop when choosing the right power supply.

High Density / Performance-Focused
The V SFX Platinum comes with 2 different wattages: 1100 W and 1300 W targeting Mini-ITX system builders who wants to go bold with their setup, but doesn't have enough juice from the power supply. It also comes with a free SFX-ATX bracket that unlocks the limitations between each form factors, giving end-users more freedom and potential builds in the future. The V SFX Platinum are built with Full Bridge LLC design, quiet 92 mm silent fan and 100% Japanese capacitors. By adding PCIe Gen 5 connector, V SFX Platinum can unlock it's true potential and power up all Nvidia RTX 40 series GPU in the future.

G.SKILL International Enterprise Co., Ltd. is excited to announce the MD2 mid-tower PC case, a stylish ATX case designed for high-performance builds, featuring a sleek front panel design. Available in black or white, the MD2 mid-tower case is designed for versatile cooling options, a spacious interior, and comes with a 4 mm tempered-glass side panel to show off the internal system hardware.

The MD2 case front panel design is inspired by the S-curves of race tracks and incorporates side vents for improved airflow to keep internal components cool. The front panel RGB lighting is designed with a spring-loaded contact, in place of wiring, for easy removal and easy access during front fan installation or cleaning the front magnetic filter.

Today CHIEFTEC is proud to introduce the new iteration of the highly successful Uni series: UC-03B-OP. The slim ATX Tower - That it is possible to offer a state-of-the-art and technically advanced ATX Tower at a highly competitive cost has been proven beyond every reasonable doubt by the new UC-03B-OP chassis from CHIEFTEC.

The Tower, not being overloaded with frills and uncalled-for features, sets a new accent in the ATX Tower without appearing bulky. On the interior, the chassis offers enough space for an ATX board of the latest generation and a standard PS II type PSU. The cooling concept is well thought through and can be optionally fitted with two 60 mm and/or 120 mm fans respectively.

With diagonal mesh front panel design, cool ARGB effects and a lot of internal space, Antec Inc. presents the DP503. The case is now commercially available from 110€ (suggested retail price including VAT). Despite the ARGB effects, the front panel offers an elegant gaming exterior.The diagonal mesh panel design ensures huge air intake for the best cooling performance. Ventilation grids on the top, at bottom and at the PSU chamber of the case accelerate the airflow. Magnetic and pull-out dust filters at the top and the bottom allow for easy cleaning and maintenance. The 4 mm non-drilled tempered glass side panel lets the user show off the build, while the interior of the chassis allows plenty of space for watercooling and case fans.

This new Antec tower measures 483 x 220 x 490 mm (DxWxH) and is compatible with E-ATX, ATX, micro-ATX and ITX motherboards. In terms of fan support, the case accommodates three 120 mm / three 140 mm or two 185 mm in the front, three 120 mm fans / two 140 mm fans on top as well as one 120 mm fan in the rear and two fans on the PSU shroud. Three 120 mm ARGB fans in the front are already included in this neat gaming case.