For Backbone's first-ever game collaboration, we've partnered with the legendary Kojima Productions to bring you the Backbone One - DEATH STRANDING Limited Edition controller. This collaboration commemorates the release of DEATH STRANDING DIRECTOR'S CUT for iOS. The Backbone One controller features custom product and packaging designs that blend the innovative design of the Backbone One with the artistic vision of Hideo Kojima and his award-winning title, DEATH STRANDING. Backbone One - DEATH STRANDING Limited Edition includes a free copy of DEATH STRANDING DIRECTOR'S CUT for iOS. Your complimentary copy of the game also gives you the ability to play it on iPad and Mac. The best way to experience DEATH STRANDING on your iPhone 15 is with Backbone! Tomorrow Is In Your Hands.

Designed in Partnership with Kojima Productions
Hideo Kojima, the mastermind behind DEATH STRANDING and founder of Kojima Productions, is renowned for his innovative storytelling and game design approach. His collaboration with Backbone is a further testament to his vision of pushing the boundaries of gaming, blurring the lines between console and mobile experiences.

A DigiTimes Asia report posits that TSMC is preparing another VVIP foundry lane for Apple Inc.—insiders claim that the Taiwanese foundry giant is in the process of expanding production capacity into next generation 2 nm nanometer fields. This expensive and time consuming endeavor is only made possible with the reassurance of big customers being added to the foundry's order books. TSMC's 2 nm-class N2, N2P, and N2X process technologies are due in 2025 and beyond (according to recent presentation slides)—these advanced packages are set to drop with all sorts of innovations: nanosheet gate-all-around (GAA) transistors, backside power delivery, and super-high-performance metal-insulator-metal (SHPMIM). According to a DigiTimes source "Apple is widely believed to be the initial client to utilize the (next-gen) process."

Apple and NVIDIA were reported to be ahead of many important clients in the queue for TSMC's 3 nm process nodes, so it is not surprising to see old patterns repeat (according to industry rumors) again. Apple is expected to update its next generation iPhones, iPad, and Mac laptop product lines with more advanced Bionic and M-series chipsets in 2025. Last year's roster included a rollout of 3 nm TSMC silicon across Apple A17 Pro and M3 ARM-based processors.

New York-based security firm Trail of Bits has identified a security vulnerability with various GPU models, which include AMD, Qualcomm, and Apple. This vulnerability, named LeftoverLocals, could potentially allow attackers to steal large amounts of data from a GPU's memory. Mainstream client-GPUs form a sizable chunk of the hardware accelerating AI and LLMs, as they cost a fraction of purpose-built data-center GPUs, and are available in the retail market. Unlike CPUs, which have undergone extensive hardening against data leaks, GPUs were primarily designed for graphics acceleration and lack similar data privacy architecture. To our knowledge, none of the client GPUs use virtualization with their graphics memory. Graphics acceleration in general is a very memory sensitive application, and requires SIMD units to have bare-metal access to memory, with as little latency as possible.

First the good news—for this vulnerability to be exploited, it requires the attacker to have access to the target device with the vulnerable GPU (i.e. cut through OS-level security). The attack could break down data silos on modern computers and servers, allowing unauthorized access to GPU memory. The potential data breach could include queries, responses generated by LLMs, and the weights driving the response. The researchers tested 11 chips from seven GPU makers and found the vulnerability in GPUs from Apple, AMD, and Qualcomm. While NVIDIA, Intel, and Arm first-party GPUs did not show evidence of the vulnerability, Apple, Qualcomm, and AMD confirmed to wired that their GPUs are affected, and that they're working on a security response. Apple has released fixes for its latest M3 and A17 processors, but older devices with previous generations of Apple silicon remain vulnerable. Qualcomm is providing security updates, and AMD plans to offer mitigations through driver updates in March 2024.

Insider information emerging from an LG Display manufacturing plant points to OLED screen production ramping up in the coming months for fitting on next generation Apple iPad Pro models. According to Korea's The Elec, LG as well as rival Samsung's Display division are about to begin production on thin film transistor (TFT) layering for prosumer iOS-driven tablets. LG is allegedly contracted to manufacture upcoming 13-inch iPad Pro display tech, while Samsung is tasked with producing an 11-inch parts. The Korean report proposes that Apple is hoping to get its 13-inch and 11-inch OLED iPad Pro models into a mass production phase by March. Industry insiders think that M3 (ARM-based) chipsets are a natural choice to power these devices.

An Apple analyst—Ming-Chi Kuo—reckons that OLED-equipped iPad Pro models are scheduled for a second quarter 2024 launch, which lands anywhere between April to June. The multinational technology company had a sluggish 2023, in terms of hardware sales, and is likely keen to generate interest with its next-gen iPad Pro range—the addition of OLED technology (a first for Apple tablets) seems to be a key strategy. Mac Rumors believes that: "Apple's OLED iPad Pro shipments forecast for the year have reportedly decreased to 8 million units, down from the 10 million units that were projected for 2024 last year. The reduction is said to be a reflection of broadly sluggish performance across Apple's product lineup. Apple did not release any new iPad models last year, so it will be interesting to see if pent-up demand can offset poor sales."

Apple today announced Apple Vision Pro will be available beginning Friday, February 2, at all U.S. Apple Store locations and the U.S. Apple Store online. Vision Pro is a revolutionary spatial computer that transforms how people work, collaborate, connect, relive memories, and enjoy entertainment. Vision Pro seamlessly blends digital content with the physical world and unlocks powerful spatial experiences in visionOS, controlled by the most natural and intuitive inputs possible—a user's eyes, hands, and voice.

An all-new App Store provides users with access to more than 1 million compatible apps across iOS and iPadOS, as well as new experiences that take advantage of the unique capabilities of Vision Pro. Pre-orders for Apple Vision Pro begin Friday, January 19, at 5 a.m. PST. "The era of spatial computing has arrived," said Tim Cook, Apple's CEO. "Apple Vision Pro is the most advanced consumer electronics device ever created. Its revolutionary and magical user interface will redefine how we connect, create, and explore."

Intel Core Ultra "Meteor Lake" mobile processor may be the the company's most efficient, but isn't a generation ahead of the 13th Gen Core "Raptor Lake" mobile processors in terms of performance. This isn't just because it has an overall lower CPU core count in its H-segment of SKUs, but also because its performance cores (P-cores) actually post a generational reduction in IPC, as David Huang in his blog testing contemporary mobile processors found out, through a series of single-threaded benchmarks. Huang did a SPECint 2017 performance comparison of Intel's Core Ultra 7 155H, and Core i7-13700H "Raptor Lake," with AMD Ryzen 7 7840HS, 7840H "Phoenix, Zen 4," and Apple M3 Pro and M2 Pro.

In his testing, the 155H, an H-segment processor, was found roughly matching the "Zen 4" based 7840U and 7840HS; while the Core i7-13700H was ahead of the three. Apple's M2 Pro and M3 Pro are a league ahead of all the other chips in terms of IPC. To determine IPC, Huang tested all processors with only one core, and their default clock speeds, and divided SPECint 2017 scores upon average clock speed of the loaded core logged during the course of the benchmark. Its worth noting here that the i7-13000H notebook was using dual-channel (4 sub-channel) DDR5 memory, while the Core Ultra 7 155H notebook was using LPDDR5, however Huang remarks that this shouldn't affect his conclusion that there has been an IPC regression between "Raptor Lake" and "Meteor Lake."

Apple has been experimenting with Large Language Models (LLMs) that power most of today's AI applications. The company wants these LLMs to serve the users best and deliver them efficiently, which is a difficult task as they require a lot of resources, including compute and memory. Traditionally, LLMs have required AI accelerators in combination with large DRAM capacity to store model weights. However, Apple has published a paper that aims to bring LLMs to devices with limited memory capacity. By storing LLMs on NAND flash memory (regular storage), the method involves constructing an inference cost model that harmonizes with the flash memory behavior, guiding optimization in two critical areas: reducing the volume of data transferred from flash and reading data in larger, more contiguous chunks. Instead of storing the model weights on DRAM, Apple wants to utilize flash memory to store weights and only pull them on-demand to DRAM once it is needed.

Two principal techniques are introduced within this flash memory-informed framework: "windowing" and "row-column bundling." These methods collectively enable running models up to twice the size of the available DRAM, with a 4-5x and 20-25x increase in inference speed compared to native loading approaches on CPU and GPU, respectively. Integrating sparsity awareness, context-adaptive loading, and a hardware-oriented design pave the way for practical inference of LLMs on devices with limited memory, such as SoCs with 8/16/32 GB of available DRAM. Especially with DRAM prices outweighing NAND Flash, setups such as smartphone configurations could easily store and inference LLMs with multi-billion parameters, even if the DRAM available isn't sufficient. For a more technical deep dive, read the paper on arXiv here.

TSMC's 2 nm-class foundry node, dubbed N2, will enter mass production only in 2025, a report by the Financial Times says. The premier Taiwan-based foundry has been reportedly showcasing TSMC N2 to its biggest customer for advanced nodes, Apple. The node will likely power Apple's in-house silicon that drives the iPhone 17 Pro and Pro Max devices that are slated for 2025. This implies that the current 3 nm class nodes from TSMC will continue to power Apple silicon into 2024 and its iPhone 16 Pro/Pro Max.

The current Apple A17 Pro and M3 chips powering the iPhone 15 Pro/Max and the H2-2023 Macs are based on TSMC's N3 node, with a 183 MTr/mm² transistor density. TSMC has four other 3 nm-class nodes, with the N3E node that just entered mass production to offer a jump to 215.6 MTr/mm², and its 2024 successor, the N3P, pushing transistor densities further up to 224 MTr/mm². TSMC's first 2 nm-class node, the N2, offers a jump to around 259 MTr/mm², which makes the N3P a nice halfway point for Apple between the N3 and N2, for its 2024 silicon.

Binarly's research team has discovered a collection of security vulnerabilities known as "LogoFAIL", which affects image parsing components within the UEFI firmware of a wide array of devices. These vulnerabilities are especially concerning because they are embedded within the reference code provided by Independent BIOS Vendors (IBVs), affecting not just a single vendor but a broad spectrum of devices that utilize this code. LogoFAIL is particularly dangerous because it allows attackers to bypass crucial security measures such as Secure Boot and Intel Boot Guard by executing a payload during the device's boot process. This is achieved by storing malicious images on the EFI System Partition or within unsigned sections of firmware updates. This method can compromise system security deeply without altering the runtime integrity of the bootloader or firmware, unlike other threats such as BlackLotus or BootHole.

The potential reach of LogoFAIL vulnerability is rather wide, with millions of consumer and enterprise-grade devices from various vendors, including ones like Intel, Acer, and Lenovo, being vulnerable. The exact list of affected devices is still undetermined, but the prevalence of the IBVs' code across numerous devices suggests that the impact could be widespread, with both Windows and Linux users being affected. Only PCs that don't allow any logotype displayed in the UEFI during the boot process are safe. Apple's Macs are secure as they don't allow any add-on images during boot, and some OEM prebuilt PCs, like the ones from Dell, don't allow images in the UEFI. Some makers like Lenovo, AMI, and Insyde have already published notes about cautiously uploading custom images to the UEFI and providing BIOS updates. Consumers and enterprises must check with their OEMs and IBVs for BIOS microcode updates to patch against this vulnerability.Below, you can see the proof of concept in a YouTube video.

Apple has announced a partnership deal with Amkor, one of the leading chip packaging and testing manufacturers, which will build a two billion US Dollar silicon packaging facility in Peoria, Arizona. Being the only US-based OSAT (outsourced semiconductor assembly and test) provider, Amkor has decided to invest its funds and apply for the CHIPS Act, hoping to get a part of the funding from the US government's grant budget. The state-of-the-art facility in Arizona will feature over 500,000 square feet (46,452 square meters) of cleanroom space for packaging and testing chips. Using Amkor's latest technologies, the plant will support advanced computing, automotive, and communications chip packaging. It is tailored to meet the capacity needs of major customer Apple starting in 2025-2026. Apple will be the largest customer, with the Amkor facility packaging Apple-designed chips produced at the nearby TSMC wafer fabrication plant.

Building a chip packaging facility in the US with advanced packaging types means that the domestic manufacturing of advanced silicon is now possible across almost the entire supply chain, with OSAT now being present on US soil as well. In the initial phase, this partnership will enable domestic advanced packaging capabilities for leading-edge chips down to 3 nm nodes, which Apple plans to utilize for its A and M series of processors. Along with the creation of an estimated 2,000 local jobs, the investment serves as a boost to the local economy as well. Additionally, Amkor is TSMC's strategic partner, meaning future designs and packaging will cooperate without any delays.

With the reality of high performance Arm processors from Apple and Qualcomm threatening Intel's market share in the client computing space, Intel is working on learner more PCB-efficient client SoCs that can take the fight to them, while holding onto the foundations of x86. The first such form-factor of processors are dubbed -MX. These are essentially -U segment processors with memory on package, to minimize PCB footprint. Intel has fully integrated the PCH into the processor chip with "Meteor Lake," with PCH functions scattered across the SoC and I/O tiles of the processor. An SoC package with dimensions similar to those of -UP4 packages meant for ultrabooks, can now cram main memory, so the PCBs of next-generation notebooks can be further compacted.

Intel had recently shown Meteor Lake-MX packages to the press as a packaging technology demonstration in its Arizona facility. It's unclear whether this could release as actual products, but in a leaked company presentation, confirmed that its first commercial outing will be with Lunar Lake-MX. The current "Alder Lake-UP4" package measures 19 mm x 28.5 mm, and is a classic multi-chip module that combines a monolithic "Alder Lake" SoC die with a PCH die. The "Meteor Lake-UP4" package measures 19 mm x 23 mm, and is a chiplet-based processor, with a Foveros base tile that holds the Compute (CPU cores), Graphics (iGPU), SoC and I/O (platform core-logic) tiles. The "Lunar Lake-MX" package is slightly larger than its -UP4 predecessors, measuring 27 mm x 27.5 mm, but completely frees up space on the PCB for memory.

AMD FidelityFX Super Resolution (FSR) is an open-source resolution upscaling technology that takes lower-resolution input and uses super-resolution temporal upscaling technology, frame generation using AMD Fluid Motion Frames (AFMF) technology, and built-in latency reduction technology to provide greater-resolution output images from lower-resolution settings. While the technology is open-source, it battles in market share with NVIDIA and the company's Deep Learning Super Sampling (DLSS). However, in the mobile space, there hasn't been much talk about implementing upscaling technology up until now. According to a popular leaker @Tech_Reve on X/Twitter, we have information that AMD is collaborating with Samsung and Qualcomm to standardize on upscaling technology implementations in mobile SoCs.

Not only does the leak imply that the AMD FSR technology will be used in Samsung's upcoming Exynos SoC, but some AMD ray tracing will be present as well. The leaker has mentioned Qualcomm, which means that future iterations of Snapdragon are up to adopt the FSR algorithmic approach to resolution upscaling. We will see how and when, but with mobile games growing in size and demand, FSR could come in handy to provide mobile gamers with a better experience. Primarily, this targets Android devices, which Qualcomm supplies, where Apple's iPhone recently announced MetalFX Upscaling technology with an A17 Pro chip.

Apple today unveiled the new 24-inch iMac featuring the amazing M3 chip, making the world's best all-in-one even more powerful and more capable. Thanks to the efficiency of Apple silicon, the new iMac delivers a huge leap in performance in its remarkably thin design and spectrum of seven vibrant colors that users love. iMac with M3 is up to 2x faster than the prior generation with M1.1 And for those upgrading from an Intel-based iMac, the new iMac is up to 2.5x faster than the most popular 27-inch models, and 4x faster than the most powerful 21.5-inch model. It also features an expansive 4.5K Retina display with 11.3 million pixels and over a billion colors, faster wireless connectivity, and a seamless experience with iPhone. Combined with its best-in-class camera, speakers, and mics, along with macOS Sonoma, iMac with M3 is better than ever—perfect for everyone, from families to small businesses, aspiring creatives, students, and gamers. Customers can order the new iMac starting today, with availability beginning Tuesday, November 7.

"We're excited to give iMac a big boost in performance with the M3 chip," said John Ternus, Apple's senior vice president of Hardware Engineering. "Millions of users absolutely love iMac for its stunning design and expansive 24-inch, 4.5K Retina display that's the perfect size to spread out with all their favorite apps and get things done. And now M3 brings even more speed to everything users do, whether multitasking, creating captivating images and videos, working on a business plan, or playing their favorite games. The new iMac with M3 is incredible for anyone, especially those who haven't yet upgraded from Intel, providing a giant leap in performance and capabilities only possible with Apple silicon."

Apple today announced a new MacBook Pro lineup featuring the all-new family of M3 chips: M3, M3 Pro, and M3 Max. With a next-generation GPU architecture and a faster CPU, the M3 family brings even more performance and remarkable new capabilities to MacBook Pro. The new 14‑inch MacBook Pro with M3 is not only great for everyday tasks, but also delivers phenomenal sustained performance in pro apps and games. Perfect for aspiring creatives, students, and entrepreneurs, it now starts at $1,599. The 14 and 16‑inch MacBook Pro with M3 Pro provides even greater performance and additional unified memory support, enabling more demanding workflows for users like coders, creatives, and researchers. The 14 and 16‑inch MacBook Pro with M3 Max delivers performance and capabilities that push the limits of computing. With a monster GPU and a powerful CPU, along with support for up to 128 GB of unified memory, MacBook Pro with M3 Max enables extreme workflows and multitasking across pro apps for users like machine learning programmers, 3D artists, and video editors. M3 Pro and M3 Max models also now come in space black, a gorgeous dark aluminium finish.

All MacBook Pro models feature a brilliant Liquid Retina XDR display with 20 percent brighter SDR content, a built-in 1080p camera, an immersive six-speaker sound system, and a wide array of connectivity options. With up to 22 hours of battery life, the lineup offers the ultimate in pro portability, delivering the same performance whether plugged in or on battery, so users can take their workflows anywhere. Customers can order the new MacBook Pro starting today, with availability beginning November 7.

Apple today announced M3, M3 Pro, and M3 Max, three chips featuring groundbreaking technologies that deliver dramatically increased performance and unleash new capabilities for Mac. These are the first personal computer chips built using the industry-leading 3-nanometer process technology, allowing more transistors to be packed into a smaller space and improving speed and efficiency. Together, M3, M3 Pro, and M3 Max show how far Apple silicon for the Mac has come since the debut of the M1 family of chips.

The M3 family of chips features a next-generation GPU that represents the biggest leap forward in graphics architecture ever for Apple silicon. The GPU is faster and more efficient, and introduces a new technology called Dynamic Caching, while bringing new rendering features like hardware-accelerated ray tracing and mesh shading to Mac for the first time. Rendering speeds are now up to 2.5x faster than on the M1 family of chips. The CPU performance cores and efficiency cores are 30 percent and 50 percent faster than those in M1, respectively, and the Neural Engine is 60 percent faster than the Neural Engine in the M1 family of chips. And, a new media engine now includes support for AV1 decode, providing more efficient and high-quality video experiences from streaming services. The M3 family of chips continues the tremendous pace of innovation in Apple silicon, and brings massive enhancements and new features to the new MacBook Pro and iMac.

According to sources close to Reuters, NVIDIA is reportedly developing its custom CPUs based on Arm instruction set architecture (ISA), specifically tailored for the client ecosystem, also known as PC. NVIDIA has already developed an Arm-based CPU codenamed Grace, which is designed to handle server and HPC workloads in combination with the company's Hopper GPU. However, as we learn today, NVIDIA also wants to provide CPUs for PC users and to power Microsoft's Windows operating system. The push for more vendors of Arm-based CPUs is also supported by Microsoft, which is losing PC market share to Apple and its M-series of processors.

The creation of custom processors for PCs that Arm ISA would power makes the decades of x86-based applications either obsolete or in need of recompilation. Apple allows users to emulate x86 applications using the x86-to-Arm translation layer, and even Microsoft allows it for Windows-on-Arm devices. We are left to see how NVIDIA's solution would compete in the entire market of PC processors, which are expected to arrive in 2025. Still, the company could make some compelling solutions given its incredible silicon engineering history and performant Arm design like Grace. With the upcoming Arm-based processors hitting the market, we expect the Windows-on-Arm ecosystem to thrive and get massive investment from independent software vendors.

The downward spiral for PC shipments continued during the third quarter of 2023 (3Q23) as global volumes declined 7.6% year over year with 68.2 million PCs shipped, according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker. Though demand and the global economy remain subdued, PC shipments have increased in each of the last two quarters, slowing the rate of annual decline and indicating that the market has moved past the bottom of the trough.

PC inventory has also become leaner in the past few months and is near healthy levels in most channels. However, downward pressure on pricing persists and will likely remain an issue within the consumer and business sectors. While most of the top 5 vendors experienced double-digit declines during the quarter, Apple's outsized decline was the result of unfavorable year-over-year comparisons as the company recovered from a COVID-related halt in production during 3Q22. Meanwhile, HP's growth was largely due to the normalizing of inventory.

Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to US $38.1 billion, marking a 12.5% quarterly increase. In this rising tide, NVIDIA seized the crown, officially dethroning Qualcomm as the world's premier IC design house, while the remainder of the leaderboard remained stable.

AI charges ahead, buoying IC design performance amid a seasonal stocking slump
NVIDIA is reaping the rewards of a global transformation. Bolstered by the global demand from CSPs, internet behemoths, and enterprises diving into generative AI and large language models, NVIDIA's data center revenue skyrocketed by a whopping 105%. A deluge of shipments, including the likes of their advanced Hopper and Ampere architecture HGX systems and the high-performing InfinBand, played a pivotal role. Beyond that, both gaming and professional visualization sectors thrived under the allure of fresh product launches. Clocking a Q2 revenue of US$11.33 billion (a 68.3% surge), NVIDIA has vaulted over both Qualcomm and Broadcom to seize the IC design throne.

An Apple "iPhone16,1" was put through the Geekbench 6.2 gauntlet earlier this week—according to database info this pre-retail sample was running a build of iOS 17.0 (currently in preview) and its logic board goes under the "D83AP" moniker. It is interesting to see a unit hitting the test phase only a day after the unveiling of Apple's iPhone 15 Pro and Max models—the freshly benched candidate seems to house an A17 Pro system-on-chip. The American tech giant has set lofty goals for said flagship SoC, since it is "the industry's first 3-nanometer chip. Continuing Apple's leadership in smartphone silicon, A17 Pro brings improvements to the entire chip, including the biggest GPU redesign in Apple's history. The new CPU is up to 10 percent faster with microarchitectural and design improvements, and the Neural Engine is now up to 2x faster."

Tech news sites have pored over the leaked unit's Geekbench 6.2 scores—its A17 Pro chipset (TSMC N3) surpasses the previous generation A16 Bionic (TSMC N4) by 10% in single-core stakes. Apple revealed this performance uplift during this week's iPhone "Wonderlust" event, so the result is not at all surprising. The multi-score improvement is a mere ~3%, suggesting that only minor tweaks have been made to the underlying microarchitecture. The A17 Pro beats Qualcomm's Snapdragon 8 Gen 2 in both categories—2914 vs. 2050 (SC) and 7199 vs. 5405 (MC) respectively. Spring time leaks indicated that the "A17 Bionic" was able to keep up with high-end Intel and AMD desktop CPUs in terms of single-core performance—the latest Geekbench 6.2 entry semi-confirms those claims. The A17 Pro's single-threaded performance is within 10% of Intel Core i9-13900K and Ryzen 9 7950X processors. Naturally, Apple's plucky mobile chip cannot put up a fight in the multi-core arena, additionally Tom's Hardware notes another catch: "A17 Pro operates at 3.75 GHz, according to the benchmark, whereas its mighty competitors work at about 5.80 GHz and 6.0 GHz, respectively."

Baseus Technology, the leading global consumer electronics brand, has prepared a stack of fast-charging USB-C chargers, the "Let's C" lineup. It includes fast chargers, power banks, charging cables, digital power strips, and car chargers for the iPhone 15.

Fast, Durable, and Sustainable Let's C Cables
Baseus Let's C Flash Series II, the USB-C to C Cable is a full-featured cord that supports up to 240 W fast charging and a data transfer speed of up to 40 Gbps, which is perfect for moving ProRes files shot with the new iPhone 15 Pro lineup. It was tested only to take 5s to transfer 10 GB files according to test results from Baseus, and it also supports a high-resolution output going up to 8K@60 Hz. This level would fascinate even videophiles.

Apple today announced AirPods Pro (2nd generation) with MagSafe Charging (USB‑C), making the world's most popular headphones even better. AirPods Pro (2nd generation) continue to revolutionize personal audio by delivering incredible sound quality, up to double the Active Noise Cancellation of their predecessor, an advanced Transparency mode, a more immersive Spatial Audio experience, and an expanded range of ear tip sizes for an even better fit. AirPods Pro (2nd generation) are upgraded with USB‑C charging capabilities, additional dust resistance, and Lossless Audio with Apple Vision Pro. With iOS 17, all AirPods Pro (2nd generation) level up with access to new audio experiences like Adaptive Audio and Conversation Awareness.

AirPods Pro (2nd generation) with MagSafe Charging Case (USB‐C) will be available to order starting today, with availability in stores beginning Friday, September 22.

Apple today announced iPhone 15 and iPhone 15 Plus, featuring an industry-first color-infused back glass with a stunning, textured matte finish, and a new contoured edge on the aluminium enclosure. Both models feature the Dynamic Island, and an advanced camera system designed to help users take fantastic photos of everyday moments in their lives. A powerful 48MP Main camera enables super-high-resolution photos and a new 2x Telephoto option to give users a total of three optical zoom levels—like having a third camera. The iPhone 15 lineup also introduces the next generation of portraits, making it easier to capture portraits with great detail and low-light performance. Building on Apple's innovative satellite infrastructure, Roadside Assistance via satellite can connect users to AAA if they have car trouble while off the grid. With A16 Bionic for powerful, proven performance; a USB‑C connector; Precision Finding for Find My friends; and industry-leading durability features, iPhone 15 and iPhone 15 Plus represent a huge leap forward.

iPhone 15 and iPhone 15 Plus will be available in five stunning new colors: pink, yellow, green, blue, and black. Pre-orders begin Friday, September 15, with availability beginning Friday, September 22.

Apple today debuted iPhone 15 Pro and iPhone 15 Pro Max, designed with aerospace-grade titanium that's strong yet lightweight to deliver Apple's lightest Pro models ever. The new design also features contoured edges and a customizable Action button, allowing users to personalize their iPhone experience. Powerful camera upgrades enable the equivalent of seven pro lenses with incredible image quality, including a more advanced 48MP Main camera system that now supports the new super-high-resolution 24MP default, the next generation of portraits with Focus and Depth Control, improvements to Night mode and Smart HDR, and an all-new 5x Telephoto camera exclusively on iPhone 15 Pro Max. A17 Pro unlocks next-level gaming experiences and pro performance. The new USB‑C connector is supercharged with USB 3 speeds—up to 20x faster than USB 2—and together with new video formats, enables powerful pro workflows that were not possible before. And with the addition of Roadside Assistance via satellite, the iPhone 15 Pro lineup builds on Apple's innovative satellite infrastructure to connect users to help if they have car trouble while off the grid.

iPhone 15 Pro and iPhone 15 Pro Max will be available in four stunning new finishes, including black titanium, white titanium, blue titanium, and natural titanium. Pre-orders begin Friday, September 15, with availability beginning Friday, September 22.

Industry experts were expecting Apple to rely on their own in-house 5G modem tech once a previous deal with a development partner expired, but the big A has returned to pastures of old—Qualcomm Technologies yesterday announced: "that it has entered into an agreement with Apple Inc. to supply Snapdragon 5G Modem‑RF Systems for smartphone launches in 2024, 2025 and 2026. This agreement reinforces Qualcomm's track record of sustained leadership across 5G technologies and products."

Reports suggest that multiple issues have plagued development of Apple's proprietary 5G modem, with 2024's iPhone 16 lineup already rumored to rely on Qualcomm's RF system. Apple has invested heavily in its custom modem operation—the "majority" of Intel's smartphone modem business was acquired back in 2019, while 2021 insider talk had TSMC lined up as a manufacturing partner for 5G chips. According to their latest investment relations material, Qualcomm anticipates that it will supply around 20% of modem chips in Apple iPhones.

According to the latest report from Nikkei, HP, the world's second-largest PC manufacturer after Lenovo, is making strategic shifts in its laptop production bases. In a move that reflects broader trends among tech giants, HP is collaborating with various Electronic Manufacturing Service (EMS) providers to move a significant part of its laptop production out of China to other countries such as Thailand, Mexico, and eventually Vietnam. For 2023 alone, the production outside of China is expected to range from a few million units up to 5 million, a noteworthy figure given HP's total global PC shipments of 55.2 million units. Commercial notebooks are slated for production in Mexico, catering to HP's primary market, North America, with consumer laptops made in Thailand. Additionally, a shift to Vietnam is on the horizon for 2024. Thailand's mature PC supplier ecosystem is anticipated to facilitate a smoother transition for HP.

HP's reconfiguration of manufacturing locations aligns with similar initiatives by other tech giants. Dell, for example, is also reducing its reliance on Chinese-made chips and aims to manufacture at least 20% of its laptops in Vietnam this year. Apple has likewise commenced MacBook production in the same country. Several factors are driving these relocations, with rising manufacturing costs in China, including labor recruitment challenges and increased labor costs, being key among them. Geopolitical tensions between the U.S. and China also weigh in on these decisions, especially since the U.S. is a crucial market for both HP and Dell. Despite the diversification, HP reaffirms its commitment to continue operations in China, particularly in Chongqing, a significant laptop production hub since 2008.