Editor's note: Our in-depth review of Endorfy Arx 700 Air is now live.

At Computex 2023, Endorfy has launched the Arx 700 Air and Arx 700 ARGB PC cases, designed with maximum cooling potential and easy component access. The cases accommodate a tall cooling system, up to 8 fans, and any current graphics card, with the Arx 700 Air featuring 5 Stratus 140 PWM fans and the Arx 700 ARGB including 4 illuminated Stratus 140 PWM ARGB fans. The design is minimalist, with a tempered glass side panel that allows internal component visibility. Both cases measure 486×228×472 mm (H×W×L) and support ATX, microATX, and ITX motherboards, with a graphics card clearance of 410 mm, CPU cooler clearance of 179 mm, and power supply clearance of 340 mm. They have 7 expansion slots and internal bays that include 1× 2.5"/3.5" and 6× 2.5". The cases can accommodate up to 8 fans and come with built-in dust filters. The front I/O includes 1× USB-C, 2× USB-A, 1× headphones (minijack 3.5 mm), 1× microphone (minijack 3.5 mm), and power and reset buttons. The Arx 700 Air and Arx 700 ARGB are priced at 109 and 119 EUR, respectively.

The Endorfy Arx 500 Air and Arx 500 ARGB are also shown; however, we don't have exact specifications yet, and we expect them to follow soon. Visually, we see that the 500 series is shorter than the 700 series. The cases are priced at 99 and 109 EUR, respectively.

FSP at Computex showed off a handful of its PC cooling products, besides a large selection of high-end PSUs that it specializes in. The MX09 is a high-end dual aluminium fin-stack CPU air cooler. Although a dual fin-stack (D-type) cooler, the two fin-stacks are designed differently. The one on the left (facing the rear end of your case) has a recess toward the bottom, so it doesn't get impeded by elaborate rear I/O shrouds of today's motherboards.

The fin-stack on the right is full length, but its intake fan is a 120 mm and located towards the top, for maximum clearance with the memory. The fan between the two fin-stacks is a 140 mm conveyor. The fins feature a honeycomb bend arrangement for maximum airflow. The cooler uses 7 copper heatpipes that draw heat from the base, spreading it across the two fin-stacks. With its fans in place, the cooler has a height of 160 mm, so it should be compatible with quite a few mid-tower cases. The AP-series of AIO liquid CPU coolers comes in three models based on radiator size—AP42 (420 mm x 140 mm), AP36 (360 mm x 120 mm), and AP24 (240 mm x 120 mm). These use FSP's in-house dual-chamber pump design. Both the MX09 and AP-series support modern CPU socket types, including LGA1700, LGA1200, AM5, and AM4.

There has been no shortage of various SSD coolers to date, but none seems to have implemented a blower fan as yet. Well, Akasa decided that it was a product that was needed in the market and was showing off its Gecko Turbo Cooler at Computex. The heatsink part of the cooler is dwarfed by the blower fan that sits on top of it, making for a rather amusing looking device. As to the noise level, we can only guess, as it wasn't plugged in, but blower fans don't tend to be the quietest fans around. That said, it's likely to bring the best airflow of any M.2 SSD cooler to date, even though it might be a tad excessive, even for PCIe 5.0 SSDs.

ASUS Republic of Gamers (ROG) today announced the new ROG Ryujin III series of all-in-one CPU coolers, with six different models to choose from. Armed with the latest 8th gen Asetek pump, a larger embedded pump fan, and a beefy 240 mm or 360 mm radiator, these units stand ready to tame CPU heat without breaking a sweat. Three style options cater to any aesthetic, and the customizable 3.5-inch LCD display helps users personalize their PC like never before.

To ensure there is an ROG Ryujin III AIO cooler in the perfect style for any build, ROG is launching several new variants. For builders who love the pristine surfaces of an all-white build—and the way that this finish uniquely reflects RGB LED lighting—ROG offers the Ryujin III 240 ARGB White Edition and the Ryujin III 360 ARGB White Edition. For those who prefer classic black, the ROG Ryujin III 240 ARGB and Ryujin III 360 ARGB beckon.

Cooler Master, a global frontrunner in cutting-edge cooling technologies, today announced the Hyper 622 Halo, a new entry in the longstanding Hyper Series that propels Cooler Master's innovative and high-performance technology to new heights.

"I am thrilled to introduce the Hyper 622 Halo, a true testament to Cooler Master's commitment to innovation and uncompromising quality," said Jimmy Sha, CEO of Cooler Master. "This groundbreaking dual tower design not only doubles the cooling power, but also exemplifies our mission to empower enthusiasts and gamers with the ultimate performance and customization options."

GAMDIAS, a leading gaming peripherals manufacturer, has announced the launch of the BOREAS P1-720 dual tower CPU air cooler. Engineered to provide exceptional cooling power, this cooler features a dual asymmetrical heat sink, 7 copper heat pipes, and 2 high-performance PWM fans that work together to maintain low temperatures even during heavy gaming sessions or overclocking.

The BOREAS P1-720 boasts an impressive TDP rating of 270 W, and the dual tower configuration includes two dense aluminium fins that provide a large heat dissipation surface area. The cooler also features an optimized convex copper base design that provides seamless contact with the CPU surface, improving heat transfer capabilities and further increasing the efficiency of thermal conductivity. In addition to its outstanding cooling performance, the BOREAS P1-720 also features a premium all-black design that will complement any system setup. The cooler is fully coated with an all-black finish and has a brushed aluminium finish that gives it a sleek and stylish look.

ENDORFY, the European manufacturer of CPU coolers, power supplies, PC cases and lifestyle products, has announced the release of its latest addition to the liquid cooling system line-up - the Navis F240 ARGB and NAVIS F360 ARGB. The new models combine features like the ultra-silent PWM-controlled ceramic-bearing block-pump and a high-quality radiator with new ARGB-illumination. The ARGB-backlight is embedded in the cooler-block and goes exceptionally well with the pre-installed and very silent Fluctus 120 PWM ARGB fans.

Designed to cater to the needs of the most demanding users, the NAVIS F240 ARGB and NAVIS F360 ARGB series offer exceptional cooling efficiency and an improved acoustic experience. ENDOFY achieves this by utilizing the the award-winning Fluctus 120 PWM fans, which are now equipped with impressive ARGB illumination and can be controlled using PWM-signal in the extended range of 250 to 1.800 RPM.

Air-based CPU cooling maestros Thermalright are expanding their liquid-based cooler portfolio with the addition of two white color-schemed coolers under the Frozen Prism White series. These include two models based on the radiator size—the Frozen Prism White 360, and the Frozen Prism White 240. Their design sees white cover everything from the radiator frames, to the radiator fins, the fiber sleeving of the coolant tubes, the included fans, their frames and impellers; and of course the pump-block itself.

An illuminated ARGB ornament on top of the pump-block; and the illuminated fans, make up their lighting setup. These use standard 3-pin ARGB headers. Each of the included TL-E12W-S V2 fans turns at speeds of up to 1,850 RPM, pushing up to 70.4 CFM of airflow, at 2.64 mm H₂O static pressure. Among the CPU socket types supported by the Frozen Prism series are Intel Socket LGA1700, LGA1200, LGA2066, and LGA115x; and AMD Socket AM5 and AM4. The company didn't reveal pricing.

Thermaltake today launched the ToughAir 710, a premium dual aluminium fin-stack CPU cooler. Measuring 148.6 mm x 146.6 mm x 165 mm (LxWxH), the TA710 is a massive, heavyweight category cooler (with its weight expected to be around the 1 kg-mark). The cooler features a U-type dual fin-stack design. Seven 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU over a base of the same material, with their ends passing through the two fin-stacks. These are ventilated by a pair of 140 mm fans in push-pull configuration, with the second fan nested between the two stacks.

Each of the two included ToughFan 14 spinners turns at speeds of up to 1,400 RPM, pushing up to 81.96 CFM of airflow at 1.81 mm H₂O static pressure, and 23.9 dBA noise output. The fans are rated for 40,000 hours of use. Thermaltake rates the ToughAir 710 as being capable of handling thermal loads of 250 W. Among the CPU socket types supported are LGA1700, LGA2066, LGA1200, LGA115x, AM5, and AM4. The company didn't reveal pricing.

Thermalright introduced the Ryzen Mounting System upgrade kit that lends support for Socket AM5 and AM4 to many of its legacy coolers, letting you orient them the correct way. There are two types of these upgrade kits, that support two different kinds of Thermalright's coolers. The TR-AM5-A kit is meant for TRUE Spirit 90 series, Archon IB-E X2 series, Silver Arrow ITX, TRUE Spirit 140 series, and TRUE Spirit 90 series. The TR-AM5-B kit, on the other hand, is meant for the Silver Arrow SB-E series, AXP-200 R, AXP-200 Macho, Archon SB-E, and Silver Arrow ITX-R. These kits aren't free, and when they go on sale later this month, they will be priced around $9.99.

German company GRAUGEAR, an aftermarket/OEM cooling solutions company, released an interesting M.2 SSD cooler for PlayStation 5, which taps into the airflow of the console's main intake fan. The G-PS5HS01-Cov cooler from GRAUGEAR is meant for bare M.2 NVMe SSDs. It consists of an aluminium monoblock heatsink with a single flat 7 mm copper heatpipe running underneath, making contact with hot components on the drive's topside, through silicone-based thermal pads. This heatpipe sneaks up to the intake fan vent of the PS5, with a copper-channel stack in its end, which dissipates some of the drive's heat to the airflow. The company claims that this design offers 50% better cooling compared to drives with heatsinks that maximize the space above the M.2 slot of the PS5, and can lower controller temperatures by 15-20°C, since it is essentially an active cooling solution. The cooler weighs 70 g. The company didn't reveal pricing or availability information.

Jonsbo today released the HX5230, a mid-range tower-type CPU cooler. The cooler features an all-black tower-type design, Five 6 mm-thick nickel-plated copper heatpipes make indirect contact with the processor over a mirror-finish copper base, conveying heat through the anodized aluminium fin-stack, which is ventilated by a 120 mm fan. The fin-stack is capped by a die-cast aluminium top-plate that has a premium brushed-metal appearance. The included fan features a fluid-dynamic bearing, takes in 4-pin PWM input, and turns at speeds ranging between 700 to 1,800 RPM, pushing up to 83.04 CFM of airflow, at up to 2.68 mm H₂O static pressure, and up to 37.6 dBA noise output. Jonsbo claims that the HX5230 can handle thermal loads of up to 230 W. With its fan in place, the cooler measures 128 mm x 75 mm x 158 mm (WxDxH), weighing 704 g. Among the socket types supported are LGA1700, AM5, AM4, and LGA1200. The company didn't reveal pricing.

Phanteks is proud to announce their latest power supplies, the Revolt SFX 850 W Platinum PSU and AMP 1000 W Gold V along with the 12VHPWR PCIE GEN5 Adapter Cable compatible with AMP and Revolt Series PSU (rated 850 W and higher) to unlock the power of next-gen Graphic Cards. Also releasing today is their second generation of Glacier One T30 AIO liquid cooler. The Phanteks Revolt SFX 850 W is ready for the most powerful next-gen hardware in a super-compact SFX footprint. It was built according to the new Intel SFX12V 4.0 platform specifications, which mirror the ATX 3.0 specifications, and comes with native PCIe Gen 5 12VHPWR support out-of-the-box. The high efficiency, 80 PLUS Platinum certification guarantees 92% efficiency at 50% system load.

In collaboration with Seasonic, Phanteks AMP Series are high quality 80 Plus Gold Certified power supplies. The fully modular power supplies provide users with clean and great cable management, flat ribbon cables and includes a 12VHPWR cable for compatibility with next-gen GPUs. The 120 mm Fluid Dynamic Bearing Fan can be temperature controlled in Hybrid Fanless mode for ultimate silent performance.

Dynatron focuses on server/workstation cooling solutions, and developed the A49, a Socket AM5 cooler with a dual aluminium fin-stack heatsink that's designed to work with 4U rackmount cases, although it will fit inside ATX tower cases just fine, with its 130 mm height. Two dense aluminium-alloy fin-stacks are skewered by six 6 mm-thick copper heat pipes that make direct contact with the processor over a high-performance thermal pad. The heatsink is ventilated by a custom 103 mm x 103 mm x 30 mm fan that turns at speeds of up to 1800 RPM, pushing up to 35.03 CFM of airflow at 28.8 dBA noise output, and 1.16 mm H₂O static pressure. Dynatron says the cooler can handle thermal loads of up to 170 W. The cooler measures 95 mm x 95 mm x 130 mm, weighing 710 g.

The new NH-U14S DX-4677, NH-U12S DX-4677, NH-U9 DX-4677 and NH-D9 DX-4677 4U are dedicated, customised solutions for Intel's professional LGA4677 platform (Sapphire Rapids), which makes them an ideal fit for both 4th generation Xeon Scalable CPUs (Platinum, Gold, Silver or Bronze) and W-3400 or W-2400 series Xeon processors for workstations such as the w9-3495X, w7-3465X or w7-2495X. Whereas the large 14 cm NH-U14S DX-4677 and 12 cm NH-U12S DX-4677 are an excellent choice for tower-style cases and thus lend themselves to use in high-performance quiet workstations, the smaller NH-D9 DX-4677 4U and NH-U9 DX-4677 fit 4U cases, which makes them perfect for more compact workstations as well as 4U class rack-mount servers that need to run as quietly as possible.

While the NH-U9's direction of airflow is perpendicular to the long axis of the LGA4677 socket, the NH-D9's direction of airflow is parallel to the long axis of the LGA4677 socket. Depending on the orientation of the socket(s) on the motherboard, choosing either the NH-U9 or de NH-D9 enables system builders to align the airflow of the cooler(s) with the exhaust fans of the chassis and thereby ensure optimal system performance. Thanks to their compact footprint, both models are ideal for building dual socket setups with motherboards where larger coolers may interfere with each other.

Eiswolf 2 AiO - now also for custom designs of RTX 4080/4090 and RX 7900XT/XTX GPUs! Alphacool presents additional innovative solutions for cooling Nvidia's Geforce RTX 4080 and 4090 and AMD's RX 7900XT/XTX graphics cards.

The enormous waste heat of the new graphics card generation is excellently dissipated with these coolers. The very good water flow and the large cooling surface are due to the particularly filigree fin structure. The jet plate with revised inflow engine also distributes the water perfectly on the cooling fins. The complete chrome plating of the cooler not only provides resistant protection against acids, scratches and damage, but also achieves a beautiful homogeneity and remarkable shine. The Aurora design of the cooler is kept visually calm and simple. This is evident not only in the cooler's design, but also in the wonderfully even lighting achieved via digitally addressable RGB LEDs.

Powerful coolers for large processors on Intel Socket LGA 4677! With the new Enterprise Solution Jet and Stream CPU coolers, Alphacool presents progressive solutions for CPU cooling in server and workstation systems.

The Alphacool ES Jet CPU Cooler is equipped with a new complex 4-nozzle technology. For the first time, it distributes water evenly over the cooler base via four nozzles incorporated into the cooler. Thereby, all cores of the high-performance processor are optimally supplied and thus effectively and precisely cooled. The organic water flow ensures a disturbance-free water flow and thus increases the cooling performance. This method makes it possible to optimally dissipate waste heat of up to 800 watts. The chrome-plated cooler base is made of copper and is ideally suited for server and workstation systems with its extremely high thermal conductivity.

Noctua today presented the latest addition to its successful NH-L9 series of low-profile CPU coolers: At a height of only 37 mm, the new NH-L9a-AM5 and NH-L9a-AM5 chromax.black are an excellent choice for quiet, ultra-compact HTPCs or Small Form Factor (SFF) systems using AMD's latest, AM5-based Ryzen processors.

"AMD's just-released 65 W Ryzen CPUs are ideal for building small yet highly powerful systems, and our new NH-L9a-AM5 is the perfect cooler to match", explains Roland Mossig (CEO). "It can easily cool the new 7900, 7700 and 7600 at ultra-quiet fan speeds and offers plenty of headroom if customers want to push them beyond 65 W - we've actually been running up to 130 W on the Ryzen 7950X and 7900X!" Since the original NH-L9a coolers for AM3 and AM4 have received more than 100 awards and recommendations from international hardware websites and magazines, the new AM5 revision builds on the same proven heatsink design to provide excellent low-profile cooling performance for AMD's latest Ryzen processors.

The Cooler Master Hyper 212 series over the years has become synonymous with aftermarket CPU cooling, as possibly the most popular custom CPU cooler. The company modernized it over the years with new heatsink and fan technologies, and it's has undergone a major design- and tech overhaul with the new Hyper 212 Halo. It retains the conventional aluminium fin-stack (type-U) design, with four 6 mm-thick copper heatpipes making direct contact with the CPU at the base, conveying heat to an aluminium fin-stack heatsink that's been capped off with a die-cast aluminium top-plate. The included 120 mm Halo fan features rifle-bearings rated for over 160,000 hours, and features two sets of addressable-RGB LEDs—along the bore of the fan-frame, and the impeller hub. The fan turns at speeds ranging between 650 to 2,050 RPM, pushing up to 51.88 CFM of airflow at 2.89 mm H₂O static-pressure, and 27 dBA maximum noise output. As part of its design modernization, the Hyper 212 Halo gets support for the latest Sockets LGA1700 and AM5.

At the 2023 International CES, Cooler Master showed off two of its latest premium dual fin-stack (type-D) air CPU coolers, the MasterAir MA826 Stealth, and the Hyper 662 Halo. The MA826 Stealth is, unsurprisingly, the more upmarket of the two, and measures 162.2 mm x 150.6 mm x 165.6 mm (LxWxH). A nickel-plated copper base makes contact with the processor. From here eight 6 mm-thick composite-material "superconductive" heatpipes make their way to two aluminium fin-stacks, which are then ventilated by two Mobius series fans—a 120 mm "push" fan, and a 135 mm conveyor fan located between the two fin-stacks. The two stacks are capped off by a die-cast aluminium top-plate. Both fans feature loop dynamic bearings that are rated for over 200,000 hours operation.

The Hyper 662 Halo leads the company's immensely popular Hyper series that's synonymous with aftermarket CPU cooling. This cooler comes in all-white and all-black trims, and is visibly smaller than the MA826 Stealth. It features the same nickel-plated copper base, but with six heatpipes making their way to the two fin-stacks, and a pair of 120 mm fans handling the ventilation. The fans feature two ARGB LED zones (along the bore of the frame and inside the impeller hub), which is where the Holo name derives from. Both coolers support the latest CPU socket types, including LGA1700 and AM5.

Sheetak is expanding their flagship CENTUM product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant increases to cooling power and COP. These new trailblazing CENTUM C3 chips are now available for sample orders. High-volume manufacturing will start in Q2 2023 at Sheetak's Austin facility.

CENTUM C3 chips have been characterized, using standard thermoelectric testing methods, and demonstrate significant increases in maximum temperature differentials, cooling power, and efficiency (COP). The new chips attain temperature differentials more than 115°C for 2-stage coolers with hot-side at 50°C, and more than 160°C for 4-stage devices. The performance and cost metrics are unchallenged by other commercially available products.

Wizmax by Micronics introduced a handful new CPU coolers and purpose-build heatsinks at the 2023 International CES. The CPU cooler lineup is led by the MA Frigate series. The MA4 Frigate, a thick single aluminium fin-stack tower-type cooler. Five 6 mm-thick copper heatpipes make direct contact with the CPU at the base, conveying heat through a thick aluminium fin-stack, which is ventilated by a custom-design 130 mm fan. With this fan in place, the cooler measures 132 mm x 95 mm x 156.4 mm (WxDxH), weighing 990 g. The fan turns at speeds of up to 1,500 RPM, pushing up to 71.7 CFM of airflow at 1.9 mm H₂O static-pressure. The MA4 Frigate is rated for handling thermal loads of up to 210 W.

The Wizmax MA6 Frigate is the larger sibling, with a type-D dual fin-stack design. Six 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU through a copper base, conveying heat to two fin-stacks, which are ventilated by a pair of 140 mm fans in push-pull arrangement. One-third of the fins in the two fin-stacks are made of copper, and the rest aluminium. Each of the two 140 mm fans turns at speeds of up to 1,500 RPM, pushing up to 83 CFM of airflow at 2.2 mm H₂O. With the fans in place, the cooler measures 146 mm x 165 mm x 165 mm (WxDxH), weighing 1.6 kg. The MA6 Frigate is rated for 250 W thermal loads. Both coolers support the latest CPU socket types, including AM5 and LGA1700.

With the latest crop of AIO liquid coolers getting some smarts such as displays on the pump-block that put out real-time monitoring information, DeepCool figured why not extend this to air coolers? The new Digital series air CPU coolers by DeepCool come with LCD displays that put out real-time monitoring information such as CPU temperature (as measured at the base-plate), and fan speed.

These are essentially upgrades to the company's aluminium fin tower-type CPU coolers with top-plates that have the display and some electronics, instead of what should normally be a die-cast aluminium plate with some optional lighting. Shown at CES were at least four models with a single fin-stack (type-U) design of various sizes, and one dual fin-stack (type-D) design. All of these have a glossy piano-black acrylic top-plate that's framed by an ARGB diffuser. The LCD segment display is somewhere toward the center. The electronics work independently, but you'll need a 4-pin PWM connection for the fan(s), which also power the electronics; and 3-pin ARGB for the lighting.

AMD's latest GPUs have been reported to be experiencing overheating issues, with many users claiming that the vapor chamber cooler works better in a vertical rather than a horizontal position. Regardless of orientation, vapor chamber coolers should equal roughly the same heat dissipation performance and move the heat away from the source; however, testing showed that some reference AMD Radeon RX 7900 XTX GPUs feature defect coolers. According to the testing conducted by Roman "der8auer" Hartung, AMD's Radeon RX 7900 XTX RDNA3 GPUs are experiencing problems with overheating caused by a faulty vapor chamber design.

What der8auer found is that these coolers could have a defect in the manufacturing process, where the liquid inside the vapor chamber faces problems in circulation after condensation. It could relate to manufacturing issues of the cooler itself, with an inadequate amount of fluid or insufficient pressure inside the chamber. For more in-depth testing and performance benchmarks, see the video below. It is important to note that we didn't see other reports that replicate this behavior, so always take these reports with a dash of salt.

Ahead of their market debut early January, we got confirmation of the specifications of the three upcoming AMD Ryzen 7000 series non-X processor SKUs. There will indeed only be three new SKUs, the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900; and no 16-core part. All three SKUs have their TDP rated at 65 W, which means that their PIB (processor in box) retail packages will include a stock cooling solution. The 7600 comes with a Wraith Stealth cooler that's capable of handling thermal loads of 65 W TDP processors at stock speeds; while the 7700 and 7900 will include a feature-packed Wraith Prism RGB cooler that's designed for 140 W TDP processors. Since Socket AM5 has cooler compatibility with AM4, AMD could simply be reusing the same coolers it packed with past-generation Ryzen processors.

The Ryzen 5 7600 comes with an MSRP of USD $229, clock speeds of up to 5.10 GHz boost, and targets the likes of the Intel Core i5-13600 or i5-12600. The $329 MSRP Ryzen 7 7700 ticks at speeds of up to 5.30 GHz boost, and is designed to compete with the Core i7-13700 or i7-12700. The Ryzen 9 7900 has an interesting price tag of $429 (MSRP), ticks at speeds of up to 5.40 GHz boost, and purportedly competes against the Core i9-13900 (non-K) and i9-12900. The three chips should be drop-in compatible with Socket AM5 motherboards being sold right now, likely with no need for a BIOS update. Although launch of these three SKUs in January is certain, the company might use the 2023 International CES keynote address by its CEO Dr Lisa Su to either tease or announce the Ryzen 7000X3D processors featuring 3D Vertical Cache memory, which is known to boost gaming performance.