Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

In close cooperation with hyperscalers and server OEMs, Rittal has developed a modular cooling distribution unit (CDU) that delivers a cooling capacity of over 1 MW. It will be the centerpiece exhibit at Rittal's booth A24 at 2024 OCP Global Summit. The CDU uses direct liquid cooling based on water - and is thus an example for new IT infrastructure technologies that are enablers for AI applications.

New technology, familiar handling?
"To put the technology into practice, it is not enough to simply provide the cooling capacity and integrate the solution into the facility - which also still poses challenges," says Lars Platzhoff, Head of Rittal's Business Unit Cooling Solutions: "Despite the new technology, the solutions must remain manageable by the data center team as part of the usual service. At best, this should be taken into account already at the design stage."

MSI's latest MAG CORELIQUID I Series Liquid Cooler receives high praise for its DIY-friendly features, designed to simplify the assembly process. With pre-installed fans, streamlined cables, and UNI bracket, users can save time and effort while enjoying their assembly experience. MSI continues to prioritize delivering the best cooling solutions for our users. To support the latest Intel Core Ultra desktop processors (series 2), our engineering team has developed the LGA 1851 Offset Kit Enhancer-I for the MAG CORELIQUID I Series, engineered to optimize cooling performance. As a token of appreciation for our users, MSI is offering the LGA 1851 Offset Kit Enhancer-I to users free of charge. We invite you to apply and enhance your cooling experience.

Boosting Cooling Efficiency with LGA 1851 OFFSET KIT ENHANCER-I
The new MSI MAG CORELIQUID I Series is tailor-made for Intel Core Ultra desktop processors (series 2) platform. The enhanced LGA 1851 OFFSET KIT ENHANCER-I addresses the heat source shifting of the LGA 1851 socket. This upgraded mounting bracket precisely targets the core heat source, boosting cooling efficiency by approximately 3% when overclocking and ensuring stable operation even under heavy loads. For gamers pushing the limits of performance, this upgrade is about improved cooling performance and a fundamental breakthrough in system stability. MSI's optimized cooling design lets you enjoy top-tier performance output and stable system performance even during intense overclocking or extended operation, fully satisfying the ultimate desire for extreme performance.

Late Tuesday, Microsoft Azure shared an interesting picture on its social media platform X, showcasing the pinnacle of GPU-accelerated servers—NVIDIA "Blackwell" GB200-powered AI systems. Microsoft is one of NVIDIA's largest customers, and the company often receives products first to integrate into its cloud and company infrastructure. Even NVIDIA listens to feedback from companies like Microsoft about designing future products, especially those like the now-canceled NVL36x2 system. The picture below shows a massive cluster that roughly divides the compute area into a single-third of the entire system, with a gigantic two-thirds of the system dedicated to closed-loop liquid cooling.

The entire system is connected using Infiniband networking, a standard for GPU-accelerated systems due to its lower latency in packet transfer. While the details of the system are scarce, we can see that the integrated closed-loop liquid cooling allows the GPU racks to be in a 1U form for increased density. Given that these systems will go into the wider Microsoft Azure data centers, a system needs to be easily maintained and cooled. There are indeed limits in power and heat output that Microsoft's data centers can handle, so these types of systems often fit inside internal specifications that Microsoft designs. There are more compute-dense systems, of course, like NVIDIA's NVL72, but hyperscalers should usually opt for other custom solutions that fit into their data center specifications. Finally, Microsoft noted that we can expect to see more details at the upcoming Microsoft Ignite conference in November and learn more about its GB200-powered AI systems.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing a complete liquid cooling solution that includes powerful Coolant Distribution Units (CDUs), cold plates, Coolant Distribution Manifolds (CDMs), cooling towers and end to end management software. This complete solution reduces ongoing power costs and Day 0 hardware acquisition and data center cooling infrastructure costs. The entire end-to-end data center scale liquid cooling solution is available directly from Supermicro.

"Supermicro continues to innovate, delivering full data center plug-and-play rack scale liquid cooling solutions," said Charles Liang, CEO and president of Supermicro. "Our complete liquid cooling solutions, including SuperCloud Composer for the entire life-cycle management of all components, are now cooling massive, state-of-the-art AI factories, reducing costs and improving performance. The combination of Supermicro deployment experience and delivering innovative technology is resulting in data center operators coming to Supermicro to meet their technical and financial goals for both the construction of greenfield sites and the modernization of existing data centers. Since Supermicro supplies all the components, the time to deployment and online are measured in weeks, not months."

Asetek announce the appointment of Maja Sand-Grimnitz as vice president (VP) Brand and Digital, and Henrik Lindskou-Mouritsen as VP Global Sales. They bring extensive experience from commercialization of gaming hardware and international sales to drive deployment of Asetek's acclaimed sim racing products and build on the leading position within Liquid Cooling.

"I am pleased to have both Henrik and Maja join Asetek, further strengthening our commercial focus and enabling increased efficiencies by consolidating the management team in Denmark," said André Sloth Eriksen the CEO of Asetek. "We are positioning for significant growth within SimSports and a changing Liquid Cooling market with more direct end-user dialogue over time and potential to capture material revenue synergies across our two business segments under a strong Asetek brand."

Thermaltake, a leading PC DIY brand for premium hardware solutions, is thrilled to release the TH240/280/360/420 V2 Ultra EX ARGB Sync All-In-One Liquid Cooler - Snow Edition. In addition to the previous black edition, the new color is perfect for users looking for an all-white PC build. The TH V2 Ultra EX ARGB Sync series offers an affordable AIO solution with cutting-edge MagForce 2.0 Design and a versatile LCD display. This advanced cooling system delivers exceptional convenience and visual appeal, surpassing your expectations!

The new series features the TH240/360 V2 Ultra EX ARGB Sync models, which utilize 120 mm CT EX ARGB Sync Fans, and the TH280/420 V2 Ultra EX ARGB Sync models, which are equipped with 140 mm CT EX ARGB Sync Fans. These fans are enhanced with the MagForce 2.0 Design, which allows you to connect multiple fans to the AIO with only one cable, and the Pogo pin contact pads included are twice as large as before. This improvement ensures a faster and more stable magnetic connection, making cable management easier and more efficient.

Taipei, Taiwan－September 5th, 2024－Thermaltake, a leading PC DIY brand for premium hardware solutions, is pleased to announce that a total of 71 cooling products are fully compatible with the latest Intel Arrow Lake-S and AMD Ryzen 9000 series processors. The upcoming Intel 15th Gen CPUs feature the new LGA 1851 socket and retain compatibility with the LGA 1700 socket.

Meanwhile, the AMD Ryzen 9000 series is continually designed with the AM5 socket. This indicates that users can seamlessly upgrade to the brand-new Intel and AMD CPUs while pairing up with the existing Thermaltake coolers. Regardless of air coolers, all-in-one liquid coolers, or water blocks, Thermaltake offers a wide range of superior cooling solutions to these next-gen processors.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is pleased to launch the CT120/140 ARGB Sync PC Cooling Fan (2-Fan Pack) and the CT120/140 Reverse ARGB Sync PC Cooling Fan (2-Fan Pack) in Black, White, Hydrangea Blue, and Matcha Green. The CT ARGB Sync series is a PWM fan designed to fit all PC usage scenarios. It features upgraded fan blades to provide better cooling performance and is now available in four colors, including new reverse blade fans, enabling you to create an attractive PC without the limitation of the chassis color and airflow direction.

To meet diverse aesthetic preferences, Thermaltake has revealed numerous products in various colors, and now adding the CT ARGB Sync to the multi-color lineup. These fans come in classic black and white, as well as new colors, Thermaltake's iconic hydrangea blue and matcha green, allowing you to easily unify the PC looks with the components in the same color or design the mixed color setup you like. Additionally, many Thermaltake chassis include the CT series as pre-installed fans, so the individual 2-fan package of the CT ARGB Sync enables you to match the built-in fans inside the cases.

xMEMS Labs, developers of the foremost platform for piezoMEMS innovation and creators of the world's leading all-silicon micro speakers, today announced its latest industry-changing innovation: the xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions.

For the first time, with active, fan-based micro-cooling (µCooling) at the chip level, manufacturers can integrate active cooling into smartphones, tablets, and other advanced mobile devices with the silent, vibration-free, solid-state xMEMS XMC-2400 µCooling chip, which measures just 1-millimeter thin.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced its collaboration with AMD to integrate their recently announced AMD's Ryzen 9000 Series, into a select range of Cooler Master PC Systems. Cooler Master is leveraging AMD's cutting-edge technology to deliver unparalleled performance in their latest products, including the Sneaker X, Ncore 1 Pro, and MasterBox 6 Pro. The collaboration underscores Cooler Master's commitment to pushing the boundaries of what's possible in gaming and professional computing.

The inclusion of AMD's CPUs within Cooler Master products will not only elevate gaming and professional experiences but also highlight the symbiotic relationship between powerful processing and efficient cooling. This is a testament to Cooler Master's relentless pursuit of excellence in thermal management, ensuring that each system operates at peak efficiency.

In the age of AI, computing power has become a vital component for driving innovation. For most industries, using professional-grade workstations as the computing engine enables efficient computing and infinite creativity. A workstation is a multi-purpose computer that supports high-performance computing in a distributed network setting. It excels at graphics processing and task parallelism, making it suitable for a wide range of AI applications as well as common visual design tasks.

For example, the workstation can fully meet the requirements for multi-task processing, such as 3D modeling, large-scale industrial drawing, advertising rendering output, non-linear video editing, file rendering production and acceleration, and so on. The computer can also perform effectively in a wide range of model loadings and professional software, as well as remote system maintenance and monitoring in unsupervised settings, which has the potential to revolutionize the application domain.

Antec Inc., leading provider of high-performance computer components and accessories for Casual and High-end gaming, is thrilled to announce the latest additions to its renowned line-up of cooling fans:

Tranquil PWM Fans: Offering an affordable cooling solution which compromises powerful airflow with low noise. Available as single fans or packs of 3 with 120 mm and 140 mm options, all with or without ARGB lighting. MSRP starting at €11.99 / £9.99 single fan and €29.99 / £24.99 for the 3 Pack.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is delighted to announce that the Ceres 350 MX Mid Tower Chassis is available now, offered in 7 colors: Black, Snow, Matcha Green, Hydrangea Blue, Racing Green, Bumblebee, and Bubble Pink. The Ceres 350 MX is an ATX case built with a focus on visual appeal. It supports the latest hidden-connector motherboards for excellent cable management. Furthermore, this case features two interchangeable front panels, enabling PC enthusiasts to choose their preferred setup. Users also can upgrade the Ceres 350 MX with an additional 2.1" Circle LCD Screen Kit, achieving a more eye-catching build.

Besides standard motherboards, the Ceres 350 MX supports hidden-connector motherboards as well, including the ASUS BTF Series, the MSI PROJECT ZERO Series, and the GIGABYTE PROJECT STEALTH Series. It is beneficial for aesthetics inside the chassis by organizing messy cables to the rear. Through the 4 mm tempered glass panel on the left side of the Ceres 350 MX, the outstanding cable management and the RGB lighting of components can fully be displayed. The case comes with a dual interchangeable front panel design, users can install a tempered glass panel for wide viewing or a perforated panel for enhanced airflow.

With the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024. Major CSPs are expected to start building AI server data centers based on this new platform, potentially driving the penetration rate of liquid cooling solutions to 10%.

Air and liquid cooling systems to meet higher cooling demands
TrendForce reports that the NVIDIA Blackwell platform will officially launch in 2025, replacing the current Hopper platform and becoming the dominant solution for NVIDIA's high-end GPUs, accounting for nearly 83% of all high-end products. High-performance AI server models like the B200 and GB200 are designed for maximum efficiency, with individual GPUs consuming over 1,000 W. HGX models will house 8 GPUs each, while NVL models will support 36 or 72 GPUs per rack, significantly boosting the growth of the liquid cooling supply chain for AI servers.

With the PhaseSheet PTM, Thermal Grizzly Holding GmbH presents an electrically non-conductive thermal pad based on a phase change material (PCM). With PhaseSheet PTM, Thermal Grizzly closes the gap between traditional thermal paste and thermal pads based on graphene or carbon thermal pads. This means that the respective advantages in terms of application and thermal conductivity can be combined in one product.

PhaseSheet PTM is a thermal pad that has been optimized for applications where maintenance cycles are subject to long intervals. It is more durable than traditional thermal conductive pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. The maximum thermal conductivity of PhaseSheet PTM develops and stabilizes after around ten thermal cycles above 60 degrees Celsius.

EK, the leading manufacturer of premium liquid cooling gear, is proud to introduce the EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi. This top-tier Ultrablock-class product, part of EK's renowned Quantum Line, is engineered for the ASUS ROG Maximus Z790 Extreme motherboard to ensure flawless compatibility.

The EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi is equipped with the award-winning EK-Quantum Velocity² cooling engine, delivering direct cooling to crucial motherboard components, such as the primary M.2 drive. This monoblock also features:

• Direct connection to Vector² GPU water block and Active Backplate Sets via bypass valves
• Temperature sensors
• Liquid flow meter
• Direct integration with the ROG water-cooling zone
• ILM Replacement Kit

XIGMATEK brought a huge selection of cases to the 2024 Computex, but they also unveiled several new CPU coolers and power supplies, which we'll cover in this article. The Loki M L750 and Loki M L850 are mainstream full-modular PSUs. These meet ATX 3.1 and PCIe Gen 5.1 specs, and put out a modern 12V-2x6 power connector. Under the hood, these feature a single +12 V rail design with DC-to-DC switching, active PFC, and 80 Plus Bronze efficiency. Cooling these PSUs are 120 mm fans tuned for low-noise.

XIGMATEK showed us three models of AIO liquid CPU coolers, the Frozr-O III, and the Frozr Connect Arctic series. The Frozr-O III come in sizes of up to 360 mm x 120 mm, with addressable RGB LEDs for the fans, and the pump-block. This comes in white and black. There is a premium variant of this cooler with a softer lighting diffuser on the pump, some tubing combs, higher static-pressure fans, and what looks like a thicker radiator.

Project XPG NeonStorm PCIe Gen 5 SSD, which won an award at Computex, has a dual active cooling system with an aluminium air duct, liquid cooling, and dual fans. This increases the Gen 5 SSD's cooling efficiency by 10%. The Legend 970 Pro PCIe Gen 5 SSD has read/write speeds up to 14,000/12,000 MB/s, using an aluminium heatsink and a micro fan for better heat dissipation.

The XPG Lancer Neon RGB DDR5 memory module uses a heat dissipating coating on the PCB, a heatsink made of 50% recycled materials, and an eco-friendly manufacturing process. It's the first eco-friendly RGB memory module, performing up to 8,000 MT/s with 16 GB and 24 GB capacities.

In addition to new PC cases, Phanteks brought several new cooling products to the Computex 2024 show, including a whole new NEXLINQ cooling system, Glacier EZ-Fit series of liquid cooling components and kits, as well as a rather interesting fan prototype that will hopefully find its way to the market.

The big part of the Phanteks showcase was the NEXLINQ, a set of cooling components, or an ecosystem as Phanteks likes to describe it, which includes the M25 G2 fans, Glacier One M25 G2 AIO, and a NEXLINQ Hub. The NEXLINQ and components will feature support for the whole new LINQ-6 connector that will be able to provide both power and D-RGB lighting to the fans.

According to Geekerwan, Apple's latest M4 silicon has achieved a remarkable milestone by using liquid nitrogen to chill Apple's M4 iPad Pro. This unconventional approach unlocked great single-core performance, surpassing even the M3 Max and M2 Ultra processors in Geekbench v6 benchmark tests. The setup involved cooling the M4 iPad Pro, equipped with a 3+6 core configuration, using a Kingpin Cooling T-Rex Rev 4 CPU LN2 pot filled with liquid nitrogen. This extreme cooling allowed the M4 processor to operate at an astonishing 4.41 GHz during the benchmark run, resulting in a staggering single-core score of 4,001 points. This score represents a 28% increase over the M3 Max found in the 16-inch MacBook Pro and an impressive 44% improvement over the M2 Ultra powering the Mac Studio.

Notably, the M4's single-core performance is capable of reaching scores in the 3,000s. With liquid nitrogen cooling, it suprases the 4,000-point mark, making this achievement all the more remarkable. While the M4's multi-core performance did not match the lofty expectations set by its single-core power, it still managed to achieve a score of 13,595 points, outperforming both the M3 Max and M2 Ultra, which scored 20,957 and 21,330 points, respectively. This was done on the 3+6 core configuration with three P-cores and six E-cores, which is not the top-end M4 configuration. This shows that with adequate cooling, like MacBooks, the upcoming M4 Pro and M4 Max chips could achieve much higher performance than their predecessors.

EK, a leader in premium liquid cooling solutions, proudly unveils the EK-Quantum Momentum² Quad RAM Module Set D-RGB, an advanced cooling solution meticulously designed for effective thermal management of DDR4 and DDR5 memory modules. This comprehensive set includes a water block capable of covering four RAM sticks with aluminium heatsinks, integrating high-quality cooling efficiency with dynamic RGB lighting to enhance both the performance and visual appeal of any high-end computing setup. The system is specifically engineered to support configurations with four RAM sticks, optimizing cooling for modern high-performance memory arrays.

Enhanced Cooling and Sophisticated Design
The EK-Quantum Momentum² Quad RAM Module Set D-RGB accommodates both single and double-sided DDR4 and DDR5 memory modules, ensuring versatility across different RAM configurations. It features four sleek, black, anodized aluminium heatsinks with an elox finish for enhanced durability and corrosion resistance. This treatment not only improves the heatsinks' appearance but also boosts their thermal conductivity and cooling effectiveness.

The world's leading memory module and flash memory brand, ADATA Technology's e-sports brand XPG specializes in high-performance and stylishly designed e-sports products that cater to gamers, tech enthusiasts, and overclockers. High temperatures generated by high-speed overclocked gaming memory affects system stability, performance, and reliability. Therefore, XPG is leading the industry in applying PCB (printed circuit board) thermal coating technology to overclocked memory, effectively reducing temperatures by more than 10%. This new PCB thermal coating technology will be introduced in the second quarter on high-end overclocked DDR5 gaming memory with a clock speed of 8000MT/s or more, to ensure stable and efficient operation in this grade of memory.

Revolutionary heat dissipating coating effectively reduces temperatures by more than 10%
PCB heat dissipation adopts technology that integrates heat conduction, heat radiation, and insulation into an optimized solder mask which not only insulates, but also dissipates and conducts heat to achieve a superior cooling effect. Compared with standard overclocked DDR5 gaming memory heatsinks, this coating's thermal radiation and heat dissipation effects greatly increase dissipation area and efficiency, slowing heat generation at high clock speeds. Real-world testing demonstrate a 8.5°C temperature reduction in overclocked DDR5 memory with PCB heat dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%. Users can enjoy extreme overclocking while maintaining high performance, meeting all challenges without compromise.

BIG SPECIAL PROMOTION FOR THE COMPANY'S 23RD ANNIVERSARY—ARCTIC is blowing out the candles and celebrating its 23rd anniversary this year. Customers can look forward to numerous product offers with at least 23% discounts throughout 2024. Others only celebrate decadal birthdays, ARCTIC's 23 years are reason enough to look back with pride—and gratitude—on almost a quarter of a century of company history. From its beginnings as an underdog and insider tip to the no-brainer in the field of computer cooling, ARCTIC's path was characterized by dedication, with successes and setbacks but, above all, always close to the customers. These can now take part in a large-scale special promotion throughout 2024 with changing product offerings.

"We're turning 23, and we say thank you!" says founder Magnus Huber. "Not only do we look back on over 20 years of expertise, we also want to give something back to our customers for 23 years of loyalty and support." Pur promotion campaign begins with an ARCTIC top seller. The discount promotion starts with ARCTIC top selling and all-time favorite MX thermal paste: offering at least 23% off of all sizes of the MX-4 and MX-6. On Amazon, Ebay and many ARCTIC partners. Valid from January 30 to April 30, 2024. In the next months there will be new offers on Amazon, Ebay as well as in the online shop and by many ARCTIC partners. Customers can stay informed via the Newsletter.

MSI presented a massive table of GeForce RTX 40 SUPER series custom design graphics cards at CES 2024—TPU spent a lot of time photographing and documenting everything GPU-related at the tech company's booth. The kind-of mysterious GeForce RTX 4080 SUPER 16G EXPERT model seemed to get a lot of attention from online PC hardware communities. The brand new and very substantial EXPERT shroud design integrates a Zero Frozr cooling solution, but folks were quick to link its aesthetic (and vapor chamber setup) to NVIDIA's dual fan Founders Edition cooling solution. MSI has not yet published a dedicated GeForce RTX 4080 SUPER 16G EXPERT product page, while all of the other models from CES are uploaded and active.

A tipster on social media has posted a screenshot of the 16G EXPERT's specification sheet—wxnod has uncovered alleged factory settings ahead of review and launch day embargos, although pricing is still unknown at the time of writing. The leaked core figures include a boost clock of 2610 MHz in GAMING and SILENT modes (60 MHz above reference), while the MSI Center software suite can activate an Extreme Performance mode: 2625 MHz. These figures align with the SUPER SUPRIM model's core clock specs—the SUPRIM X sits above everything else as the fastest card in MSI's RTX 4080 SUPER stable. MSI's official introduction stated that the 16G EXPERT: "features a push-pull airflow design for enhanced cooling efficiency. The enclosure is constructed with aluminium Die-Casting for structural strength, while Core Pipe and a Vapor Chamber work to efficiently dissipate heat. Lastly, a patented fan design provides quiet yet reliable airflow." We hope to see the MSI GeForce RTX 4080 SUPER 16G EXPERT's addition to the TPU GPU database.