The world's leading memory module and flash memory brand, ADATA Technology's e-sports brand XPG specializes in high-performance and stylishly designed e-sports products that cater to gamers, tech enthusiasts, and overclockers. High temperatures generated by high-speed overclocked gaming memory affects system stability, performance, and reliability. Therefore, XPG is leading the industry in applying PCB (printed circuit board) thermal coating technology to overclocked memory, effectively reducing temperatures by more than 10%. This new PCB thermal coating technology will be introduced in the second quarter on high-end overclocked DDR5 gaming memory with a clock speed of 8000MT/s or more, to ensure stable and efficient operation in this grade of memory.

Revolutionary heat dissipating coating effectively reduces temperatures by more than 10%
PCB heat dissipation adopts technology that integrates heat conduction, heat radiation, and insulation into an optimized solder mask which not only insulates, but also dissipates and conducts heat to achieve a superior cooling effect. Compared with standard overclocked DDR5 gaming memory heatsinks, this coating's thermal radiation and heat dissipation effects greatly increase dissipation area and efficiency, slowing heat generation at high clock speeds. Real-world testing demonstrate a 8.5°C temperature reduction in overclocked DDR5 memory with PCB heat dissipating coating technology compared to standard overclocked memory and an enhanced heat dissipation efficiency of 10.8%. Users can enjoy extreme overclocking while maintaining high performance, meeting all challenges without compromise.

BIG SPECIAL PROMOTION FOR THE COMPANY'S 23RD ANNIVERSARY—ARCTIC is blowing out the candles and celebrating its 23rd anniversary this year. Customers can look forward to numerous product offers with at least 23% discounts throughout 2024. Others only celebrate decadal birthdays, ARCTIC's 23 years are reason enough to look back with pride—and gratitude—on almost a quarter of a century of company history. From its beginnings as an underdog and insider tip to the no-brainer in the field of computer cooling, ARCTIC's path was characterized by dedication, with successes and setbacks but, above all, always close to the customers. These can now take part in a large-scale special promotion throughout 2024 with changing product offerings.

"We're turning 23, and we say thank you!" says founder Magnus Huber. "Not only do we look back on over 20 years of expertise, we also want to give something back to our customers for 23 years of loyalty and support." Pur promotion campaign begins with an ARCTIC top seller. The discount promotion starts with ARCTIC top selling and all-time favorite MX thermal paste: offering at least 23% off of all sizes of the MX-4 and MX-6. On Amazon, Ebay and many ARCTIC partners. Valid from January 30 to April 30, 2024. In the next months there will be new offers on Amazon, Ebay as well as in the online shop and by many ARCTIC partners. Customers can stay informed via the Newsletter.

MSI presented a massive table of GeForce RTX 40 SUPER series custom design graphics cards at CES 2024—TPU spent a lot of time photographing and documenting everything GPU-related at the tech company's booth. The kind-of mysterious GeForce RTX 4080 SUPER 16G EXPERT model seemed to get a lot of attention from online PC hardware communities. The brand new and very substantial EXPERT shroud design integrates a Zero Frozr cooling solution, but folks were quick to link its aesthetic (and vapor chamber setup) to NVIDIA's dual fan Founders Edition cooling solution. MSI has not yet published a dedicated GeForce RTX 4080 SUPER 16G EXPERT product page, while all of the other models from CES are uploaded and active.

A tipster on social media has posted a screenshot of the 16G EXPERT's specification sheet—wxnod has uncovered alleged factory settings ahead of review and launch day embargos, although pricing is still unknown at the time of writing. The leaked core figures include a boost clock of 2610 MHz in GAMING and SILENT modes (60 MHz above reference), while the MSI Center software suite can activate an Extreme Performance mode: 2625 MHz. These figures align with the SUPER SUPRIM model's core clock specs—the SUPRIM X sits above everything else as the fastest card in MSI's RTX 4080 SUPER stable. MSI's official introduction stated that the 16G EXPERT: "features a push-pull airflow design for enhanced cooling efficiency. The enclosure is constructed with aluminium Die-Casting for structural strength, while Core Pipe and a Vapor Chamber work to efficiently dissipate heat. Lastly, a patented fan design provides quiet yet reliable airflow." We hope to see the MSI GeForce RTX 4080 SUPER 16G EXPERT's addition to the TPU GPU database.

EK, the leading provider of premium liquid cooling solutions, is excited to announce the expanded compatibility of its esteemed EK-Quantum Magnitude sTRX4 water blocks. These flagship cooling solutions, known for their high performance and quality, are now fully compatible with the latest AMD sTR5 and AMD SP6 CPU sockets. This advancement ensures that users of the new sTR5 and SP6 platforms can experience the same superior cooling and craftsmanship that EK-Quantum Magnitude sTRX4 users have long come to trust.

The EK-Quantum Magnitude sTRX4 series, including the Full Nickel, Nickel Acetal, and Nickel Plexi models, maintains its renowned design and efficiency while embracing the evolving landscape of CPU technology. Customers can continue to rely on these solutions for their cooling needs without any changes in product naming or design. Refer to the EK Compatibility Configurator and EK Custom Loop Configurator database for a detailed compatibility list.

The TechPowerUp team visited the EK water blocks booth at the CES 2024 international show. We previously covered the company's latest direct-die all-in-one (AIO) water cooler, but many more products were on display. First in line is EK's Quantum-X NoCase chassis, which contradicts traditional PC enclosures with its open, no outer shell design. This radical departure from convention results in a nearly invisible frame crafted from aluminium for a featherlight weight of approximately 3 pounds. Its design is meticulously engineered to be as airy and lightweight as possible without compromising the support needed for essential hardware and liquid cooling components. The case integrates the advanced Reflection² distro plate, equipped with dual D5 pumps to facilitate separate cooling loops for both the CPU and GPU, ensuring optimal thermal management in a minimalist aesthetic.

During the CES 2024 show, EK unveiled an exciting new addition to their premium all-in-one (AIO) CPU cooler lineup—the EK-Nucleus AIO CR360 Direct Die D-RGB. As the name suggests, this new 360 mm AIO water cooler is purpose-built for direct die cooling of delidded Intel LGA1700 CPUs. The EK-Nucleus Direct Die stands out with its custom cold plate and mounting mechanism, which are exclusively engineered for exposed CPU dies. The nickel-plated copper base ensures compatibility with liquid metal TIMs like the included Thermal Grizzly Conductonaut, which comes in the package. EK has worked with der8auer to provide delidding service kits and tools to facilitate easy DIY removal of the integrated heat spreader (IHS).

The package also contains a contact frame and protective foam for safe liquid metal application. At the heart of the cooler is a powerful AIO pump EK co-developed with the OEM manufacturer, meaning it is not an off-the-shelf pump found in other AIOs and is capable of up to 500 L/h flow rate. The reinforced, sleeved rubber tubing is fitted with aluminium covers for durability. Integrated omnilink connectors allow daisy chaining of the three included 120 mm D-RGB fans for cable management. The EK-Nucleus Direct Die offers extensive RGB lighting customization with illuminated circle accents on the removable pump top covers. The diamond-cut brushed aluminium side panels and radiator cowl add to the premium aesthetic. The new AIO will be available for the Intel LGA1700 platform, with hopefully more versions later. The EK-Nucleus AIO CR360 Direct Die D-RGB is now available for pre-order at €202.90 MSRP price tag.

At CES 2024, Frore Systems, the pioneering developer of AirJet Mini, the world's first Solid-State Active Cooling Chip, unveiled the AirJet Mini Slim - a thinner, lighter, smarter and even more advanced solid-state active cooling chip.

Building on the success of the original AirJet Mini, which garnered widespread recognition, including the prestigious COMPUTEX 2023 Golden Award and CES 2024 "Best of Innovation" Award, Frore Systems continues to accelerate the pace of innovation in thermal management. The AirJet Mini Slim, featuring the same groundbreaking solid-state active cooling design of its predecessor, includes three new features, while remaining silent, lightweight and delivering superior heat removal compared to traditional fans.

DeepCool has unveiled a brand new cooling fan series at CES 2024—an intriguing selection of models include the high-performance FT12 and FT14 offerings. The company's engineers have designed these to be low-noise cooling solutions with excellent durability credentials. Their latest 120 mm and 140 mm models feature powerful 3-phase, 10-pole, 12-slot FOC closed-loop control motors with MQ magnets, and true high-grade fluid dynamic bearings. DeepCool is keen to highlight impressive specifications—namely (up to) 80,000 operating hours and a 5-year long limited warranty period.

The FT12's airflow performance is rated at a maximum of 79 CFM. According to the specification sheet on display at CES, the FT12 has static pressure rated at 4.2 mm/H20, while its noise level has been measured at around 29.9 dB(A). The F14's airflow also sits at 79 CFM, static pressure is 3.6 mm/H20 and noise level is similarly around the 29.9 dB(A) mark. DeepCool summarizes that the standard-sized FT fans are powerful, quiet and durable. Black or white color options were on display at the company's booth.

Featuring a dual pump, dual chamber design for unprecedented cooling efficiency, this AIO cooler is perfect for high-performance CPUs. It's not just about cooling; it's about customizability, style and setting new standards in the industry. Discover how the G11 AIO elevates your PC's performance and aesthetics.

Why Choose the G11 AIO
The G11 AIO is more than a cooling system; it's a commitment to innovative technology and user-centric design. It's perfect for enthusiasts who demand the best in performance, style and customization.

Discover the future of CPU cooling technology with Cooler Master's V8 3DVC. Engineered for high-performance, it features advanced superconductive heat pipes and a redesigned vapor chamber, offering unparalleled cooling efficiency. Perfect for demanding CPUs, it promises top-notch performance and sleek aesthetics. Tune in to explore how the V8 3DVC sets new benchmarks in cooling solutions.

Why Choose the V8 3DVC
The V8 3DVC is more than just a cooling solution; it's a testament to Cooler Master's commitment to innovation and quality. Whether you're a gamer, a creative professional, or a tech enthusiast, this cooler is designed to deliver exceptional performance, reliability, and style.

Intel is expanding immersion cooling collaborations with Taiwanese partners to strengthen its data center offerings for AI workloads. This includes developing an industry-first open IP complete immersion cooling solution and reference design. Partners like Kenmec and Auras Technology will be key in implementing Intel's advanced cooling roadmap. Intel is also cooperating with Taiwan's Industrial Research Institute on a new lab for certifying high-performance computing cooling technologies to international standards. With local ecosystem partners, Intel aims to accelerate next-generation cooling solutions for Taiwanese and global data centers. Advanced cooling allows packing more performance into constrained data center footprints, which is critical for AI's rapid growth. Intel touts a superfluid-based modular cooling system achieving 1500 Watts+ heat dissipation for high-density deployments.

Meanwhile, Kenmec offers a range of liquid cooling products, from Coolant Distribution Units (CDU) to customized Open Rack version 3 (ORv3) water cooling cabinets, with solutions already Intel-certified. Intel wants to solidify its infrastructure leadership as AI workloads surge by fostering an open, collaborative ecosystem around optimized cooling technologies. While progressing cutting-edge immersion and liquid cooling hardware, cultivating shared validation frameworks and best practices ensures broad adoption. With AI-focused data centers demanding ever-greater density, power efficiency, and reliability, cooling can no longer be an afterthought. Intel's substantial investments in a robust cooling ecosystem highlight it as a priority right alongside silicon advances. By lifting up Taiwanese partners as strategic cooling co-innovators, Intel aims to cement future competitiveness.

In the era of high-tech development and the ever-increasing demand for data processing power, data centers are consuming more energy and generating excess heat. As a global leader in thermal solutions, SUNON is at the forefront, offering a diverse range of cutting-edge liquid cooling solutions tailored to advanced data centers equipped with high-capacity CPU and GPU computing for AI, edge, and cloud servers.

SUNON's liquid cooling design services are ideally suited for modern data centers, generative AI computing, and high-performance computing (HPC) applications. These solutions are meticulously customized to fit the cooling space and server density of each data center. With their compact yet comprehensive design, they guarantee exceptional cooling efficiency and reliability, ultimately contributing to a significant reduction in a client's total cost of ownership (TCO) in the long term. In the pursuit of net-zero emissions standards, SUNON's liquid cooling solutions play a pivotal role in enhancing corporate sustainability. They o ff er a win-win scenario for clients seeking to transition toward greener and more digitalized operations.

The SG10 is an ambitious product designed to push the boundaries of fanless technology and create a gaming case capable of cooling high-performance CPUs and GPUs without the use of fans. This project collaboration between Streacom and Calyos is also aimed at showcasing the application of loop heat pipe technology in PC cooling and represents the first step in creating a viable mainstream high-performance solid-state alternative to water cooling solutions.

The spiritual successor to the SG10 began life as a Kickstarter project launched by Calyos as the NSG S0, and whilst having extensive expertise in cooling, the additional challenges of consumer product manufacturing proved to be a stumbling block. A search ensued to find a partner with suitable experience to get the project back on track, and with experience in both case manufacturing and fanless cooling, Streacom was the natural fit. As can be understood just by glancing at the image, the SG10 represents a complete redesign of the NSG S0. Not a single asset or component was carried over from the original case. This includes the Evaporator that pumps the coolant around the loop and the Condenser that radiates the heat, both core components that make this performance possible. Everything has been entirely re-engineered and improved far beyond the original specification and performance.

The Ryzen 7040 Series processor in Framework Laptop 16 is capable of running at a sustained 45 W TDP (Thermal Design Power) and we put together an excellent thermal solution to ensure it can do that while keeping CPU temperature, touch temperatures, and fan noise to a minimum. That 45 watts of CPU power needs to be efficiently conducted into the vapor chamber, heatpipes, and fins to be carried away through airflow from the fans.

Since neither the CPU die nor the vapor chamber surface are perfectly flat, a thermal interface material is needed to fill in gaps to avoid comparatively insulative air taking up that space. Traditionally, most computers use a thermal grease that has thermally conductive particles suspended in silicone. This works reasonably well, but the silicone itself isn't especially thermally conductive, and the paste can pump out or dry out over time, making it less effective.

EK, the renowned premium liquid cooling pioneer, proudly announces the debut of its latest masterpiece, the EK-Quantum Momentum² Aorus Z790 Master X D-RGB - Plexi. This monoblock is expertly designed for the Intel LGA 1700 socket and engineered with precision for seamless integration with the GIGABYTE Z790 AORUS MASTER X motherboard. The monoblock's addressable D-RGB LED effortlessly harmonizes with Gigabyte RGB Fusion 2.0 control, providing comprehensive lighting customization for each diode and ensuring a dynamic visual spectacle. This monoblock is also fully compatible with EK-Matrix7, further enhancing its versatility within EK's liquid cooling ecosystem.

EK-Quantum Momentum² Aorus Z790 Master X D-RGB - Plexi
This is a complete all-in-one (CPU and motherboard) liquid cooling solution for Intel's 12th, 13th, and 14th Gen processors. The monoblock seamlessly aligns with the LGA 1700 socket on the Gigabyte Z790 Aorus Master X motherboard. The monoblock's unique design, incorporating a specialized metal cover over the I/O section, is noteworthy. This cover serves a dual purpose: it facilitates the mounting of the stock I/O cover without compromising the factory-intended RGB lighting of the motherboard while also functioning as an elegant stand for the original LCD screen.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.

According to @momomo_us, Intel has discontinued its Cryo Cooling Technology as of July 1, 2023, marking the end of one of the tech industry's few sub-ambient cooling options. The technology, which could chill CPUs to 0 degrees Celsius to enhance performance, accompanied Intel's processors from the 10th-generation Comet Lake to the 13th-generation Raptor Lake. Despite its innovative approach to boosting CPU performance, the cooling solution was not widely embraced. The discontinuation comes just before the arrival of the 14th Generation Raptor Lake Refresh, which will not support the Cryo Cooling tech. Intel plans to maintain updates for the existing Cryo Cooling hardware until December 31, 2023.

This specialized cooling method did see some use in products like the Cooler Master MasterLiquid ML360 Sub-Zero and the EKWB EK-QuantumX Delta TEC waterblocks. Interestingly, the technology has managed to work even with non-Intel CPUs, which famous overclocker der8auer managed to get up and running on AMD's Ryzen 9 5950X. Some modifications were in place, but it was possible to do so. The likely reason for shutting down the cryo cooling project is the need for more financial sense to continue to pursue this technology and the effort to keep the cost of R&D down and make funds available for other projects at Intel's laboratories.

NZXT, a leader in PC gaming hardware and services, today announces the H6 Flow and H6 Flow RGB, a compact dual chamber mid-tower ATX case. The H6 Flow offers a harmonious blend of performance and visual appeal for PC enthusiasts. Designed for an expansive and uninterrupted view, the H6 Flow is adorned with consistent tempered glass on the front and sides, granting a panoramic peek into the insides of your build. Leveraging its dual chamber architecture, the new angel front panel directs the airflow from the three pre-included 120 mm fans (or 120 mm RGB fans for the H6 Flow RGB version) and two 140 mm fans at the base of the case allow you to cool your heat generating components. The revamped perforated panels come with a design fine-tuned for optimal airflow and superior performance. While all being easy to build with the H6 Flow facilitates generous cable-routing channels and straps, ensuring organized cable management.

EK, the leading premium liquid cooling gear manufacturer, will soon provide a one-stop-shop purchasing option where System Integrators, Data Centers, AI/ML-focused companies, and similar customers can get full enterprise-grade custom liquid-cooling loops for their systems. The products belong to the EK-Pro line of professional liquid cooling solutions tailor-made for HPC systems and high-compute density applications. This means that System Integrators and Data Centers will be able to purchase full liquid cooling loops for their HPC servers and workstations and enjoy all the benefits that water-cooled HPC systems can provide.

The Advantages of Liquid Cooling for HPC Systems
High Performance Computing facilities use servers and workstations that leverage powerful GPUs, multithreaded CPUs, petabytes of RAM, and extensive storage space. All this computing power, despite modern advancements in manufacturing and power efficiency, generates tremendous amounts of heat. In fact, it is estimated that up to 40% of the total energy requirements of these facilities is spent on keeping the IT equipment within acceptable operating temperatures. Plus, the components that use conventional air cooling tend to underperform and have shorter lifespans.

LITEON Technology, the global leading provider of power and cooling solutions, is set to unveil its groundbreaking liquid cooling solutions featuring immersion technology through its new brand, COOLITE. This will be the very first time that LITEON showcases its COOLITE solutions, along with state-of-the-art power solutions at the OCP Global Summit. These pioneering solutions are poised to transform data centers by significantly enhancing efficiency, performance, and sustainability.

LITEON COOLITE Liquid Cooling Solutions Bring a Paradigm Shift in Data Center Cooling
LITEON's COOLITE Liquid Cooling Solutions, with immersion technology, bring a paradigm shift in data center cooling. By immersing servers and components in a specialized cooling fluid, these solutions eliminate the constraints of traditional air-based cooling. This results in significantly improved thermal efficiency, enabling data centers to handle high-performance workloads with ease. Furthermore, the reduced energy consumption and carbon footprint contribute to the sustainability goals of data centers.

Asetek, innovator of gaming hardware for next-level immersive gaming experiences and the creator of the all-in-one (AIO) liquid cooler, today announced that new OEM Partner LIAN LI makes available its Galahad II LCD CPU Coolers, leveraging the superior thermal and acoustic performance and reliability associated with Asetek's most advanced technology to date. The Galahad II LCD AIOs will enable enthusiasts to boost CPU overclocking capability for extreme performance and gamers to enjoy rock-solid stability for immersive gaming.

Asetek and LIAN LI collaborated to create the Galahad II LCD CPU coolers, which are powered by Asetek's Gen8 technology, and are available in black or white in 280 mm or 360 mm radiator sizes for a variety of form factors and cooling requirements. The coolers include a 2.88" LCD screen with 480x480 resolution to display various system information, such as CPU/GPU temperature and load, pump RPM, and coolant temperature. The updated L-Connect 3 software offers users a host of features to allow them to customize the LCD display. In addition to uploading custom videos, the software has built in functions to allow users to record gameplay videos and images for display on the pump cap, a first-of-a-kind feature for AIOs in this premium category. Trim and upload the video portion you want using the included video editor. The L-Connect 3 software also comes with a variety of included presets and filters that users can apply to any imported images and GIFs.

Intel and Submer, a company specializing in immersion cooling, are set to unveil a creative immersion cooling system at the OCP Global Summit. This system can efficiently dissipate 1,000 W of power in a single-phase liquid cooling setup designed for deployment in data centers. Unlike traditional water cooling, immersion cooling systems offer higher efficiency and reliability. The solution developed by Submer and Intel is based on a Forced Convection Heat Sink (FCHS) and leverages a heat exchanger for heat transfer with a second liquid. The primary advantage of immersion cooling is its lack of active components on the cooling element, making it possible for immersed systems to operate without them for extended periods.

In this new system, a copper cooler is housed with two fans at one end to enhance liquid flow through the heat sink using forced convection. However, this active cooling component contradicts the traditional passive concept of immersion cooling based on natural convection. In its initial phase, Submer and Intel utilized Xeon processors with an 800 W TDP, with plans to increase that figure to 1,000 W in the next step. This Forced Convection Heat Sink (FCHS) offers the advantages of easy manufacturing and cost-effective usage while effectively dissipating up to 1,000 W of waste heat, making it a compelling option for immersion cooling. There are even possibilities of being 3D printed, according to Submer, and the plan is to achieve cooling of 1kW+ chip. We expect to hear more about the system during the OCP Global Summit, running from October 17 to 19, as currently, we only have a lower-resolution image from Submer's press release.

InWin Development Inc. (InWin), a leading innovator in PC enthusiast and gaming hardware, has introduced the first ever fully modular case, the ModFree PC chassis. Fully interchangeable and expandable, it allows PC enthusiasts to freely transform the design, layout, and structure to meet their exact needs and preferences in hardware and cooling. InWin offers a Base Edition preset featuring Mod-I and Mod-II modules along with three InWin Jupiter AJ140 ARGB case fans. The Deluxe Edition preset comes with Mod-I, Mod-II, and two Mod-III modules, and four Jupiter AJ140 fans too.

ModFree: An Easy, Sustainable System
The ModFree ecosystem is designed around toolless interlocking clips that allow users to easily swap modules around. Unlike conventional chassis, ModFree uses an inverted motherboard design that allows users to showcase their hardware from the left side of the desk instead of competing for space with the mouse pad on the right. Investing in this ecosystem ensures an upgrade to add more cooling or more space is just a module away, which also helps to reduce the environmental impact considering you would no longer need to build an entire new system anytime you need to upgrade. ModFree offers a 3D interactive assembly guide with easy-to-follow demonstrations and ideas for how to use each module. Users can also experiment with designs directly in the app.

EK, the renowned manufacturer of premium PC water cooling equipment, introduces yet another addition to its Pro lineup: the EK-Pro Manifold 2CPU 8GPU - Acetal, a specialized coolant delivery system designed for use with a great multitude of water blocks in workstations and servers. Like the previous EK-Pro Manifold 2CPU 6GPU - Acetal, this manifold has all the perks of its smaller brother with compatibility for an extra two GPUs.

Efficient Cooling Distribution
The EK-Pro Manifold 2CPU 8GPU - Acetal redefines cooling precision with its impeccable coolant distribution. Featuring multiple industry-standard G1/4" In and Out ports, it guarantees optimal coolant flow, ensuring flawless cooling for both CPUs and GPUs. With the capacity to accommodate two CPUs and impressive eight-GPU configurations in parallel or semi-parallel, this high-performance manifold opens new horizons for liquid cooling in workstation and server environments.

EK, the renowned manufacturer of premium PC water cooling equipment, introduces the newest addition to its Pro lineup: the EK-Pro Manifold 2CPU 6GPU - Acetal, a specialized coolant delivery system designed for use with multiple water blocks in workstation systems.

Efficient Cooling Distribution
The EK-Pro Manifold 2CPU 6GPU - Acetal redefines cooling precision with its impeccable coolant distribution. Featuring multiple industry-standard G1/4" In and Out ports, it guarantees optimal coolant flow, ensuring flawless cooling for both CPUs and GPUs. With the capacity to accommodate two CPUs and impressive six-GPU configurations in parallel or semi-parallel, this high-performance manifold opens new horizons for liquid cooling in workstation environments.