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Samsung Talks DDR6-12800, GDDR7 Development, and HBM3 Volume Production

During Samsung's Tech Day 2021, the company presented some interesting insights about the future of system memory technologies and how it plans to execute its production. Starting with the latest DDR5 standard, the company intends to follow JEDEC documents and offer some overclocking modules that surpass the specification advised by JEDEC. While the DDR5 standard specifies memory modules with 6,400 MT/s, Samsung will develop modules capable of overclocking up to 8,400 MT/s. These are not yet confirmed as they are still in the development phase. However, we can expect to see them in the later life of DDR5 memory.

The company also talked about the DDR6 standard, which is supposedly twice as fast as DDR5. The new DDR6 standard is still in early development, and all we know so far is that the number of memory channels per module is seeing a twofold increase over DDR5 to four channels. The number of memory banks also increases to 64. In addition to DDR6 for desktop and server use cases, the company is also working on Low Power DDR6 (LPDDR6) for mobile applications. While the company's LPDDR5 memory goes into volume production using the 1a-nm process at the beginning of 2022, the LPDDR6 is still in early development. The base speed for DDR6 modules will allegedly arrive at 12,800 MT/s, while overclocking modules will join the party at up to 17,000 MT/s. Mobile-oriented LPDDR6 version is also supposed to come with up to 17,000 MT/s speeds.

Gigabyte Launches AMD Radeon RX 6600 Eagle 8G Graphics Card

Gigabyte Technology Co. Ltd, a leading manufacturer of premium gaming hardware, today announced a new AMD Radeon RX 6600 graphics card - the Gigabyte Radeon RX 6600 Eagle 8G. The Eagle graphics card is the best choice for those who desire a unique design optimized for power efficiency and durability, and the ability to experience incredible high-framerate 1080p gaming.

AMD Radeon RX 6600 graphics cards are based on the breakthrough AMD RDNA 2 gaming architecture, designed to deliver the optimal balance of performance and power efficiency. Offering 32 MB of high-performance AMD Infinity Cache, 8 GB of GDDR6 memory, AMD Smart Access Memory technology and other advanced features, the new graphics cards are designed to bring next-generation desktop gaming experiences to the midrange market. They also support AMD FidelityFX Super Resolution, an open-source spatial upscaling solution designed to increase framerates in select titles while delivering high-resolution gaming experiences.

Lenovo Announces New Gen4 ThinkPad and ThinkVision Products

Today, Lenovo announced the latest additions to its ThinkPad and ThinkVision portfolios. The redesigned and re-engineered ThinkPad X1 Extreme Gen 4 delivers more power, better connectivity and rich configuration options in response to customer demand. Powered by up to the latest 11th Gen Intel Core i9 H-Series vPro processors and available with the latest NVIDIA GeForce RTX Laptop GPUs, up to 64 GB DDR4 memory and dual Solid-State Drive (SSD) support, the X1 Extreme Gen 4 is also offered with optional 5G Wireless WAN for high-speed access to cloud data.

With 74 percent of companies planning to permanently shift to more remote working, users need an exceptional collaboration experience. X1 Extreme Gen 4 delivers in spades, thanks to edge-to-edge 16-inch display options up to 4K along with Dolby Vision support, a new FHD webcam, dual noise-cancelling microphones and a user-facing Dolby Atmos Speaker System that is 20 percent larger than previous generation. All this performance wrapped in a legendary ThinkPad durable package that weighs less the 1.81 kg (four pounds).

SK Hynix Fellow Says PC5 DDR5 by 2020, DDR6 Development Underway

The PC5 DDR5 main memory standard could enter the market by 2020, according to SK Hynix research fellow Kim Dong-Kyun. The first such memory standard will be DDR5-5200, which offers nearly double the bandwidth of DDR4-2666. "We are discussing several concepts of the post DDR5," he said. "One concept is to maintain the current trend of speeding up the data transmission, and another is to combine the DRAM technology with system-on-chip process technologies, such as CPU," he added, without offering any additional information. SK Hynix had in 2018 developed a working prototype of a 16-gigabit (2 GB) DDR5 DRAM chip ticking at 5200 MT/s, at 1.1 Volts. A 64-bit wide memory module made with these chips could offer bandwidth of 41.6 GB/s.

SK Hynix is developing its own innovations that could make its DDR5 chips more advanced than the competition without going off-standard. "We have developed a multi-phase synchronization technology that enables keeping the voltage during a high-speed operation in a chip at a low level by placing multiple phases within the IP circuit, so the power used on each phase is low but the speed is high when combined," Kim said. He also mentioned that development of the DDR6 PC memory standard is already underway, with the design goals of doubling bandwidth and densities over DDR5. Advancements in DRAM are propelled not just by the PC ecosystem, but also handhelds and self-driving car electronics.
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