Edifier International, the award-winning audio electronics designer, reveal the QR65 Desktop Active Monitor speakers - a new all-in-one unit that combines the brand's renowned acoustic technology with immersive Lumia light effects and TurboGaN fast-charging capabilities.

One of 4 Edifier products to win a prestigious Visual Grand Prix 2024 award and also highly recommended with a much sought after VGP 2024 Gold Medal Award, the QR65 is remarkably versatile, placing an emphasis on both compatibility and multi-use functionality. As the brand name develops, audio quality remains paramount with the QR65 featuring an advanced Acoustic Architecture. Equipped with 2.75" mid-low drivers, an aluminium alloy diaphragm and a long-throw design, the QR65 can produce consistently punchy bass frequencies whilst bolstering rich and full-bodied mids. Thanks to 1.25" silk diaphragm dome tweeters, finely tuned by Edifier's world-leading audio engineers, the speakers boast precision-tooled high frequency reproduction, creating crisp and bright trebles that stand out above even the most bass-laden of mixes.

OLED is the future of flat screen displays, as they provide superior color reproduction, dynamic range, response-times, and energy efficiency, over LCD. The latest crop of OLED panels powering notebooks and desktop monitors, however, have a problem that wasn't as prevalent with OLED-based televisions—burn-in. This is what happens when an OLED panel displays a static image for too long, causing regions of the panel to permanently discolor. Some PC monitor makers are jumping in to offer extended warranties against burn-in to their customers, as they realize that they just sold an expensive, exotic piece of technology that could potentially degrade within- or not long after their standard warranty periods. Scientists at the University of Cambridge think they have found a breakthrough solution against OLED burn-in.

Scientists discovered that the main culprit behind OLED burn-in is the blue diode. The blue LED has been an elusive technology that only came into existence several decades after green and red. It's only with the arrival of the blue LED that white could be made, turning LED into mankind's primary lighting source, and eventually the OLED panel. Blue is a relatively higher energy diode, and uses more exotic GaN substrate. The Cambridge scientists discovered that jacketing the blue diode alkylene straps would cut down burn-in, and make the manufacturing process more efficient. They have published their method in the Nature magazine. Unfortunately, it will be a while before display manufacturers take an interest in the new method, and re-tool their OLED production lines to incorporate it—we imagine at least a couple of years.

MICLEDI Microdisplays today announced a first closing of its Series A funding round with participation from imec.xpand, PMV, imec, KBC and SFPIM demonstrating strong support for the company's value proposition and commercial and technological progress achieved in the seed round. Series A follows a significant seed round award and additional non-dilutive funding in the form of grants and other vehicles from VLAIO. This brings the company's total funding to date to nearly $30 million.

"The company's achievements during this seed round have been astounding," said Sean Lord, CEO of MICLEDI. "Our door is open to engagements with some of the world's largest and most innovative electronic product manufacturing companies, most of whom are working on their own internal development projects for augmented reality (AR) displays in such diverse use cases as smart-wearable devices and automotive HUDs. This level of total funding to date is almost unheard of for a four-year-old startup."

The U.S. Department of Commerce today announced $1.5 billion in planned direct funding for GlobalFoundries (Nasdaq: GFS) (GF) as part of the U.S. CHIPS and Science Act. This investment will enable GF to expand and create new manufacturing capacity and capabilities to securely produce more essential chips for automotive, IoT, aerospace, defense, and other vital markets.

New York-headquartered GF, celebrating its 15th year of operations, is the only U.S.-based pure play foundry with a global manufacturing footprint including facilities in the U.S., Europe, and Singapore. GF is the first semiconductor pure play foundry to receive a major award (over $1.5 billion) from the CHIPS and Science Act, designed to strengthen American semiconductor manufacturing, supply chains and national security. The proposed funding will support three GF projects:

We already snapped UGREEN''s frankly unexpected debut of its NASync family of home and SMB NAS servers, earlier this week. Today we take a closer look at its power adapters and fast chargers. We begin our tour with the UGREEN Home EV Charging Station. This is simply an adapter that converts 3-phase 240 V domestic power to a Type-1 (JI772) AC-only socket, with a connecting cable. The adapter is capable of delivering 240 V AC at 32 A, or roughly 7 kVA. Its main function, though is access control. You unlock power using an RFID access keycard, or an app, using an NFC/Bluetooth capable smartphone. This device is hence targeted at large apartment blocks with multi-level car parks, with each parking slot having one of these.

Next up, is the Nexode RG GaN 65 W wall charger, which puts out a couple of USB-C ports, and a type-A port. One of the type-C can deliver 65 W continuous, the other one up to 30 W, and the type-A maxes out at 22.5 W. The total switching capacity is 65 W, if you plug in multiple devices, they're shared accordingly. One of its surfaces has an LED segment display that has some cool retro graphics, and monitoring. There are also a couple of UGREEN DigiNest series power strips. The S780 plugs into a single AC wall mount, puts out two downstream AC plugs, and contains a 200 W GaN based DC fast charger that drives four type-C and one type-A. One of these put out 140 W, the other 100 W, the third one 65 W, and the rest 22.5 W. The CD270 is a more compacted version of this, with just 100 W switching capacity, and one of its type-C ports delivering 100 W. Lastly, there were also a handful power banks from UGREEN, including a 25 Ah space-saving bank that can put out 140 W, and a 20 Ah bank that has 145 W PD and a wireless charging surface,

Could a power bank be more than just a little paperweight with ports on it? Sharge is out to answer just this, with its innovative ultra compact power banks. Some of these are as small as a TWS headset's charging case, but carry enough charge to bail your phone or tablet out in crunch time. A unique design element with all Sharge products is their see-through polycarbonate bodies. The Starship Seer is a copper-colored portable charger that's about the size of a hockey puck, and packs a 10,000 mAh battery, with USB type-A and type-C outputs, along with support for 35 W USB-PD fast charging. It also has a little segment display on top that gives you discharging status, and doubles up as an alarm clock. If made to stay on its own with its fully charged 10,000 mAh battery, this thing might run a whole decade, if not more. Sharge is pricing this at $80. We also came across the keyfob sized Sharge Disk, an M.2-2230 NVMe SSD enclosure that can survive 6-foot drops, meets IP54 resistence, has an active cooling fan for the SSD, and offers a 10 Gbps USB 3.1 Gen 2 interface for the drive, along with UASP. Sharge is pricing this at $60.

The Sharge Internet Hostkey is a retro-futuristic looking power bank that comes in two variants, a 130 W-capable variant packing a 20,000 mAh battery; and a 40 W variant powered by a 10,000 mAh battery. You can charge up to 3 devices at once, with USB-PD of 135 W or 40 W, depending on the variant. It even has a retro-looking 7-segment display that reads out charging and date/time. The 130 W / 20 Ah variant is priced at $199, and the 40 W / 10 Ah variant at $99. Just be careful taking this thing through airports, it might not exactly look like a harmless power bank.

During the 69th annual IEEE International Electron Devices Meeting (IEDM), Intel demonstrated some of its latest transistor design and manufacturing advancements. The first one in line is the 3D integration of transistors. According to Intel, the company has successfully stacked complementary field effect transistors (CFET) at a scaled gate pitch down to 60 nm. With CFETs promising thinner gate channels, the 3D stacked CFET would allow for higher density by going vertically and horizontally. Intel's 7 node has a 54 nm gate pitch, meaning CFETs are already close to matching production-ready nodes. With more time and development, we expect to see 3D stacked CFETs in the production runs in the coming years.

Next, Intel has demonstrated RibbonFET technology, a novel approach that is the first new transistor architecture since the introduction of FinFET in 2012. Using ribbon-shaped channels surrounded by the gate, these transistors allow for better control and higher drive current at all voltage levels. This allows faster transistor switching speeds, which later lead to higher frequency and performance. The width of these nanoribbon channels can be modulated depending on the application, where low-power mobile applications use less current, making the channels thinner, and high-performance applications require more current, making the channels wider. One stack of nanoribbons can achieve the same drive current as multiple fins found in FinFET but at a smaller footprint.

Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating its LightBundle multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2023 in Glasgow, Scotland (https://www.ecocexhibition.com/). Avicena's microLED-based LightBundle architecture breaks new ground by unlocking the performance of processors, memory and sensors, removing key bandwidth and proximity constraints while simultaneously offering class leading energy efficiency.

"As generative AI continues to evolve, the role of high bandwidth-density, low-power and low latency interconnects between xPUs and HBM modules cannot be overstated", says Chris Pfistner, VP Sales & Marketing of Avicena. "Avicena's innovative LightBundle interconnects have the potential to fundamentally change the way processors connect to each other and to memory because their inherent parallelism is well-matched to the internal wide and slow bus architecture within ICs. With a roadmap to multi-terabit per second capacity and sub-pJ/bit efficiency these interconnects are poised to enable the next era of AI innovation, paving the way for even more capable models and a wide range of AI applications that will shape the future."

Baseus Technology, the leading global consumer electronics brand, has prepared a stack of fast-charging USB-C chargers, the "Let's C" lineup. It includes fast chargers, power banks, charging cables, digital power strips, and car chargers for the iPhone 15.

Fast, Durable, and Sustainable Let's C Cables
Baseus Let's C Flash Series II, the USB-C to C Cable is a full-featured cord that supports up to 240 W fast charging and a data transfer speed of up to 40 Gbps, which is perfect for moving ProRes files shot with the new iPhone 15 Pro lineup. It was tested only to take 5s to transfer 10 GB files according to test results from Baseus, and it also supports a high-resolution output going up to 8K@60 Hz. This level would fascinate even videophiles.

Baseus Technology, the leading global consumer electronics brand, launched the PowerCombo Tower Series Power Strip 35 W, an unprecedented charging station on the market with a digital LED display illustrating real-time safety and charging status. The LED display shows the load status, digital protection, and grounded indicators. Its overall design makes it perfect for workspaces, gaming setups, and meeting rooms.

10-in-1 Charging Station in Vertical Space-Saving Design
The Baseus PowerCombo Tower Power Strip 35 W can charge and power up to 10 devices with 6 AC outlets, 2 USB-C ports, and 2 USB-A ports. It comes in a futuristic and space-saving design, like the 6 AC outlets on each side that are more than enough to power an entire desktop ecosystem.

Ugreen, a global leader in charging accessories, has partnered with Navitas Semiconductor, the industry leader in gallium nitride (GaN) power integrated circuits (ICs), to announce the release of the world's first 5-port 300 W GaN desktop charger—the Ugreen Nexode 300 W Desktop Charger.

"Navitas has been working closely with UGREEN for a long time, it is our relentless pursuit of innovation that continues to refresh the milestone of fast charging," said Charles Zha, Vice President and General Manager of Navitas China. "This first 300 W GaN desktop charger based on LLC structure can realize such astonishing power density with such small size, which once again propelled the revolution of GaN fast charging."

Belkin, a leading consumer electronics brand for 40 years, today announced 8 new products across its power, audio and connectivity categories, underscoring Belkin innovation, quality and its commitment to building products more responsibly. Belkin International can be found on the IFA show floor, Exhibit Hall 3.2, booth #119.

Wireless Charging

BoostCharge Pro Universal Easy Align Wireless Charging Pad 15 W
Delivers a fast and seamless charge for Qi-enabled devices at up to 15 W. The large charging surface provides easy alignment, and its non-slip grip material keeps it in place if jostled or vibrates from an incoming call. It's designed with two separate thermal protection systems to control temperatures and prevent overheating of the charger and connected devices.

Anker, the world's #1 mobile charging brand, today introduced its highly anticipated Anker Prime Series, setting a new standard for best-in-class charging solutions for every need. The new generation of high-speed, multi-port chargers were developed to leverage the full benefits of Gallium Nitride (GaN) technology, including more efficient power transfer, compact design and active heat reduction and monitoring. The Anker Prime lineup features the 240-watt charger for high-performance laptops and the 250-watt power bank (also available in two lower watt models) with an optional 100-watt charging base. The compact charging base enables users to wirelessly charge their power bank, and also doubles as a standalone charger. In addition, the Anker Prime series includes a 100-watt charger and 67-watt charger, as well as a sleek and powerful 6-in-1 charging station, ideal for maintaining an uncluttered workspace.

"When you are on the road with a phone, a tablet, a smartwatch, headphones, and a laptop - how often have you had to make a choice about which product to keep powered on?" asks Steven Yang, CEO of Anker. "At Anker, we understand these dilemmas and are dedicated to providing solutions that empower our customers to stay connected without compromise. Our latest Anker Prime Series has taken a leap forward in delivering charging accessories that not only charge everything faster but also cater to the growing demands of today's diverse devices. With the Anker Prime Series, Anker continues its mission to charge everything, anywhere, faster and all at once; empowering users with unrivaled power, portability, and performance."

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023. Under the theme "Innovation Beyond Boundaries," this year's forum delved into Samsung Foundry's mission to address customer needs in the artificial intelligence (AI) era through advanced semiconductor technology.

Over 700 guests, from customers and partners of Samsung Foundry, attended this year's event, of which 38 companies hosted their own booths to share the latest technology trends in the foundry industry.

The newly established Department for Science, Innovation and Technology (DSIT) in the UK has recently released the UK's National Semiconductor Strategy. Dr. Shih-Chieh Chang, General Director of Electronic and Optoelectronic System Research Laboratories at the Industrial Technology Research Institute (ITRI) of Taiwan had an initial exchange with DSIT. During the exchange, Dr. Chang suggested that Taiwan can become a trustable partner for the UK and that the partnership can leverage collective strengths to create mutually beneficial developments. According to the Strategy, the British government plans to invest 1 billion pounds over the next decade to support the semiconductor industry. This funding will improve access to infrastructure, power more research and development and facilitate greater international cooperation.

Dr. Chang stressed that ITRI looks forward to more collaboration with the UK on semiconductors to enhance the resilience of the supply chain. While the UK possesses cutting-edge capabilities in semiconductor IP design and compound semiconductor technology, ITRI has extensive expertise in semiconductor technology R&D and trial production. As a result, ITRI is well-positioned to offer consultation services for advanced packaging pilot lines, facilitate pre-production evaluation, and link British semiconductor IP design companies with Taiwan's semiconductor industry chain. "The expansion of British manufacturers' service capacity in Taiwan would create a mutually beneficial outcome for both Taiwan and the UK," said Dr. Chang.

ADATA, the world's leading memory module and flash memory brand, in association with its subsidiary gaming performance brand, XPG, will take part in the world's largest computer trade show in Taipei from May 30 to June 2, 2023- Computex Taipei. As an industry leader, ADATA continues to implement the company's brand philosophy of "Innovating the Future" through its businesses. In addition to providing new technological products and solutions, ADATA is also committed to promoting the sustainable development of corporations in order to lead the future.

To realize this year's theme of "The Xtreme Future Leader - Infinite Innovation," ADATA has leveraged emerging technologies to launch new products that are sustainable and extraordinarily innovative including the most powerful Gen 5 SSD, industry-leading CXL (Compute Express Link) memory module, CAMM (Compression Attached Memory Module), XPG titanium power supply (XPG FUSION 1600 W), and professional industrial solutions. Be sure to visit Computex to experience a full range of new products!

Baseus, a leading consumer electronics brand, recently launched an important product: the Baseus PowerCombo Tower series of smart 65 W desktop power strips. Anyone familiar with surge protectors has more or less heard about joules (J), the unit of energy. Baseus PowerCombo Tower series smart version stands out by featuring 1200J surge protection, while the industry standard is between 800 to 1000J, ensuring utmost safety for both individuals and devices.

The second great wall is the BDIP Baseus Digital Intelligent Power, a technology that monitors circuit status to detect malfunctions like overload, overvoltage, undervoltage, overcurrent, short-circuit, and more, then actively cuts off the power in 0.1 seconds, solidifying the barrier. Yet, Baseus has gone further. The case is made of fire-retardant material, ensuring that the product is safe-to-use inside out, and is also superpowered by GaN technology which increases power conversion, resulting in less power loss translating to less heat generation, thereby cutting off the odds of causing damage. In short, this charging station features 8 safety protections, keeping its user and their devices safe 24/7 without requiring supervision.

Porotech, a global leader in microLED and Gallium Nitride (GaN) semiconductor technology, announces the world's first single-panel, full-color microdisplay suitable for augmented reality (AR) applications. The microdisplay is based on Porotech's groundbreaking Dynamic Pixel Tuning (DPT) technology, where DPT microLED pixels can emit any visible color when driven with a specific current density. Porotech will be unveiling the 0.26-inch monolithic full-color microdisplay, along with an AR development platform, during the SID Display Week in Los Angeles from 21-26 May 2023.

Having already demonstrated how a DPT pixel can create a full range of visible colors, Porotech is now unveiling the new innovative active-matrix 0.26-inch microLED display offering 1280x720 resolution, which utilizes a proprietary driving method developed by Porotech that rapidly displays red, green and blue light to enable a full-color RGB display and richly saturated colors.

World-renowned mobile accessory brand Spigen announced its newest series to their mobile charging power accessory lineup: Spigen ArcStation Pro GaN 352, 452, 652. The first two digits mean total output watt and the last number is for the ports. (ex. 352: total 35 W with 2 ports) Some people might think there are not any problems using cheap, low-quality wall chargers to charge their devices. However, those types of chargers could actually damage the devices due to the ripple noise. The new Spigen ArcStation Pro GaN series minimizes ripple noise with Power Quality Technology to charge your device more safely than other wall chargers.

Also with the latest Gallium Nitride (GaN) technology, the ArcStation Pro GaN Wall Charger series is able to perform more efficiently than traditional silicon-based chargers, generating a powerful output and less heat, with a compact size. According to the result of Spigen's charging speed test, this series can charge iPhone 14 Pro up to 84% within an hour. GaN 452 and GaN 652 are also compatible with the 'Samsung Galaxy series' Super Fast Charging 2.0.

A Reddit user has shared their experience of passively cooling an AMD Ryzen 9 7950X, with some modifications to the setup. Using the Streacom DB4 passively cooled case, the user u/AromaticImpress7778 pulled off cooling a processor with 16 cores and 32 threads with a TDP of 170 Watts. Interestingly, the Streacom DB4 case rates CPU support for only 65 Watts, meaning some modifications were in place. To support the high-TDP CPU, the user used two of the one-kilogram copper bars and attached them to the case. Heat is transferred to the two one-kilogram blocks using the case's default plate and an additional 233-gram copper plate for the CPU and motherboard. These big copper blocks are not soldered to the case, but instead, the user puts Thermal Grizzly Conductonaut liquid metal between copper parts and Arctic MX-6 between the case and copper.

To cool the AMD Ryzen 9 7950X and MSI B650I board, accompanied by HDPlex GaN 250 W and 64 GB of memory, the system did well enough for a passive build. After running the system at full load, the CPU reached 95 degrees Celsius for CCD1 and 95 degrees Celsius for CCD2. The external panels of the Streacom DB4 case were getting 50C to 60C of heat. Additionally, the user noted that the usage of this system will be more relaxed, as it will not run under full load for a prolonged period. Regarding the system's total weight, the entire build weighs around 13 KG, with 4.4 KG of that being only copper. The case weighs 7.5 KG, and the other parts weigh about one kilogram.

Edifier, the forward-thinking audio-technology brand, have announced the release of the QD35 - a tabletop, Bluetooth speaker expertly designed combining high spec audio features with 'Lumia Art' effects for the best acoustic/visual effect. The term Lumia was coined by a twentieth-century artist, Thomas Wilfred, when artists began to promote colors and light together in their works as a form of art that uses light. 'Lumia Art' was originally associated with music then latterly paintings. The QD35 is a perfect example of how Edifier have created an aesthetically pleasing speaker incorporating a brilliant, kaleidoscopic display of colored lights. Various preset light effects are available but users can also customize their own light effects using the Edifier Connect app.

The QD35 is an all-in-one music system. It is certified to both "Hi-Res Audio" and "Hi-Res Audio Wireless" standards. The USB-A port and the AUX jack on the rear panel support high-resolution audio signals. With the enhancement of LDAC technology, users can also stream high-quality music with a 96 kHz sampling rate to this speaker via Bluetooth.

Cooler Master brought a wealth of new power supplies at the 2023 International CES, to match the anticipated growth in PSU upgrades with the advent of the ATX 3.0 and PCIe Gen 5 standards. The GX III series will be the main workhorse for Cooler Master in its gaming-grade modular PSU lineup. Boasting 80 Plus Gold efficiency, the GX III comes in capacities ranging between 550 W and 1250 W, and cram in a half-bridge APFC, DC-to-DC switching, LLC, and a fan which offers zero-RPM mode up to a certain load. The 650 W, 750 W, 850 W, 1050 W, and 1250 W models include a 600 W-rated 12VHPWR connector, while the 550 W model includes a 450 W-rated 12VHPWR. Two EPS (CPU power) connectors are standard across all models. Depending on the model, you get two to six 6+2 pin PCIe power connectors. Cooler Master is backing the GX III series PSUs (along with most other PSU models it's launching at CES), with a 10-year warranty.

The V Gold i series features an interesting brushed-gold design element on the body. These 80 Plus Gold-rated modular PSUs come in 750 W and 850 W models. What sets these apart from the GX III series is their semi-digital control, with the PSUs interfacing with the MasterPlus software over USB, for real-time monitoring and basic control. Both models include one 16-pin 12VHPWR connector capable of 600 W continuous power, two 8-pin EPS, three 6+2 pin PCIe power, twelve SATA power, and a couple of legacy power connectors.

ADATA in its exhibition on the sidelines of CES, showed off the Fusion 1600 TITANIUM, an enthusiast-segment 1600 W PSU for highly overclocked PC builds. Designed in collaboration with Delta Electronics (popular for server PSUs and laptop power bricks), the Fusion TITANIUM uses GaNFETs and a planar transformer in its switching circuitry, and is Cybenetics Titanium and 80 Plus Titanium certified. The PSU complies with both ATX 3.0 and PCIe Gen 5 specs for excursion tolerance.

The XPG Fusion 1600 TITANIUM offers two native 16-pin ATX 12VHPWR connectors that are each capable of 600 W continuous power delivery, with 200% excursions within specified limits. You also get at least twelve 6+2 pin PCIe power connectors, and multiple 4+4 pin EPS. A USB 2.0 connection interfaces the PSU with software, with a dedicated UWP app giving you real-time monitoring and data-logging for the PSU.

TECNO, a global innovative technology brand with operations in over 70 markets, recently announced the latest MEGABOOK S1 at TECNO Flagship Product Launch 2022 in Dubai, delivering its first flagship laptop to users.

In 2019, TECNO announced new efforts in building a digital product ecosystem by launching its AIoT business strategy, aiming to deliver digital to every person, home, and organization and help them create a fully- connected smart digital lifestyle. Following this vision, as the upgraded line of MEGABOOK T1, the flagship MEGABOOK S1 highlights the concept of ideas that create wonders, targeting users in professional fields like business and the creative industries, helping them work with ease while still achieving a higher efficiency.

Today, Intel unveiled research breakthroughs fueling its innovation pipeline for keeping Moore's Law on track to a trillion transistors on a package in the next decade. At IEEE International Electron Devices Meeting (IEDM) 2022, Intel researchers showcased advancements in 3D packaging technology with a new 10x improvement in density; novel materials for 2D transistor scaling beyond RibbonFET, including super-thin material just 3 atoms thick; new possibilities in energy efficiency and memory for higher-performing computing; and advancements for quantum computing.

"Seventy-five years since the invention of the transistor, innovation driving Moore's Law continues to address the world's exponentially increasing demand for computing. At IEDM 2022, Intel is showcasing both the forward-thinking and concrete research advancements needed to break through current and future barriers, deliver to this insatiable demand, and keep Moore's Law alive and well for years to come." -Gary Patton, Intel vice president and general manager of Components Research and Design Enablement