An unusual memory configuration has been spotted on an HONOR MagicBook Pro 16 AI laptop—Golden Pig Upgrade (via Weibo) has shared a brief snippet of footage from a Task Manager session. It confirms that non-binary symmetrical LPDDR5(X) memory is now operating within portable Windows 11 devices, at least in China. Crucial 12 GB capacity DDR5 SODIMM products were uncovered a couple of days ago—at the time, tech enthusiasts wondered whether other options were due in the near future. Recent Geekbench Browser entries have unveiled several "HONOR DRA-XX" Intel Core Ultra-powered devices that sport 24 GB memory configurations.

Manufacturers have been deliberating over new 12 GB, 24 GB, and 48 GB standards for roughly two years—we witnessed the release of commercial desktop products last year. It has taken longer for OEM options to arrive, but HONOR seems to be pioneering a rollout within the slimline laptop segment. VideoCardz has analyzed Golden Pig Upgrade's short clip—they believe that the demoed MagicBook Pro 16 (dual-channel) has a soldered-on: "total capacity of 24 GB based on LPDDR5X technology. Instead of relying on SODIMM modules, this laptop has eight individual memory chips, each with a capacity of 3 GB, totaling 24 GB of LPDDR5X-6400 memory." Upcoming enthusiast-class portable systems—with quadruple SODIMM slot setups—could be fitted with maximum 48 GB capacities. The latest developments signal a pleasing breakaway from traditional laptop system memory limits of 16 and 32 GB.

Global technology brand HONOR today unveiled the HONOR MagicBook Pro 16, a revolutionary AI-powered laptop which sets to redefine the traditional laptop landscape. Based on HONOR's platform-level AI capabilities and joint efforts with technology partners such as Microsoft, Intel and NVIDIA, HONOR is bringing PCs into the AI PC era, marking a significant milestone in computing, offering users an unparalleled AI experience and transforming their device interactions.

"At HONOR, our commitment lies in embracing open collaboration with industry partners to foster a flourishing ecosystem. We firmly believe in the transformative power of collaborative synergy, especially in the era of AI. By leveraging the collective expertise of top industry players, we are dedicated to crafting exceptional products and delivering unparalleled experiences to consumers worldwide," said George Zhao, CEO at HONOR.

According to TrendForce's latest research, global smartphone production totaled around 289 million units for 3Q22, showing a slight QoQ drop of 0.9% and a YoY drop of 11%. The smartphone market thus exhibited an extremely weak demand situation as the "iron law" of positive growth in the third quarter was broken after being in effect for years. The contraction of smartphone production during this year's peak season was mainly attributed to smartphone brands giving priority to consumption of channel inventory for whole devices and maintaining a fairly conservative production plan for 3Q22. Moreover, they had kept lowering their production targets due to strong global economic headwinds.

Regarding the performances of the major smartphone brands in 3Q22, Samsung posted around 64.2 million units in device production, showing a QoQ increase of just 3.9%. This was the result of the brand scaling back production since 2Q22 and maintaining a conservative outlook on the future market situation. Due to persistent inventory pressure, Samsung is expected to again post a QoQ decline for 4Q22. In the aspect of product development, Samsung has been the leader in foldable smartphones. This year, the global market share of foldable smartphones is estimated to reach 1.1%; and within this segment, Samsung is expected to hold a market share of almost 90%. As for 2023, the global market share of foldable smartphones is forecasted to climb to 1.5%, and Samsung is forecasted to retain a market share of almost 80% in the segment.

The Semiconductor Industry Association (SIA) today announced Dr. Lisa Su, president and CEO of AMD and an accomplished leader in advancing semiconductor technology, has been named the 2020 recipient of SIA's highest honor, the Robert N. Noyce Award. SIA presents the Noyce Award annually in recognition of a leader who has made outstanding contributions to the semiconductor industry in technology or public policy. Dr. Su will accept the award at the SIA Leadership Forum and Award Celebration, a virtual event that will take place on Thursday, Nov. 19, 2020.

"A tremendous leader in our industry, Lisa Su has successfully advanced leading-edge semiconductor and high-performance computing technologies throughout her career as an accomplished business executive and engineer," said John Neuffer, SIA president and CEO. "Lisa's outstanding achievements have significantly strengthened the semiconductor industry and America's global technology leadership, and she has inspired and opened doors for countless others in tech along the way. On behalf of the SIA board of directors, it is my pleasure to announce Lisa as the 2020 Robert N. Noyce Award recipient in recognition of her impressive accomplishments."

EK, the premium water cooling gear manufacturer, has decided to do something special for its American fans this Memorial Day Weekend. Apart from being the unofficial beginning of summer, the last Monday of May has a lot of meaning for many Americans. Memorial Day is the reason why EK has created a special red, white, and blue limited edition Velocity CPU water block with a genuinely noble cause.

The brand new limited version of the water block carries the name EK-Quantum Velocity Honor. It is "decorated" with the US flag and will be sold at the price of $249.99. For each water block sold, EK will donate $100 to a charitable organization. "Being a globally successful company also means that we have the ability and responsibility to make a difference and give something back to the community. We have decided to jump on a project that will make our most loyal fans happy, and at the same time, help those who are in need," said Edvard König, founder of EK.

Semiconductor Manufacturing International Corporation (SMIC), the state-backed Mainland Chinese semiconductor foundry, announced that it commenced mass-production of 14 nm FinFET SoCs for Huawei's HiSilicon subsidiary, a mere one month since Huawei shifting chip orders from TSMC to it. The company is manufacturing Kirin 710A is a revision of the original Kirin 710 SoC from 2018, built on SMIC's 14 nm node. The 4G-era SoC is capable of powering mid-range smartphones for Huawei's Honor brand, and uses an Arm big.LITTLE setup of Cortex A53 and Cortex A57 cores. This represents a major milestone not just for SMIC, but also Huawei, which has seen the company's isolation from cutting-edge overseas fabs such as TSMC. Much of Huawei's fate is riding on the success of SMIC's next-generation N+1 node, which purportedly offers a 57 percent energy-efficiency gain over 14 nm FinFET, rivaling sub-10 nm nodes such as 7 nm; enabling Huawei to build 5G-era SoCs.

While AMD has enjoyed tremendous success in regards to their Ryzen, Threadripper, and EPYC processors penetration into the mobile market has been a bit slow. However, judging by the number of systems on display at CES 2019 that is about to change. Models from Honor, Acer, Samsung, Lenovo, Dell, ASUS, and HP. The one that immediately caught our eye was the Acer Nitro 5 which packs an AMD Ryzen 5 2500U CPU and an AMD Radeon RX 560X GPU. It also comes configured with 8 GB of memory, 256 GB SSD, IPS display and a backlit keyboard. Overall it looks to be a reliable entry level gaming system.

Next up was Dell's two offerings which were the Inspiron 5000 15 and 5000 14 2-in-1. The Inspiron 5000 15 was equipped with a 4c/8t Ryzen 5 3500U with Radeon Vega 8 graphics (512 shaders). It was also fully kitted out with 32 GB of DDR4 memory, 512 GB SSD, and a 1TB HDD making it an excellent option for productivity and heavy multitasking. Meanwhile, the 2-in-1 was equipped with a Ryzen 7 3700U which is a 4c/8t processor with Vega 10 graphics (640 shaders). It also came loaded with 16 GB of DDR4, 2 TB HDD and a 256 GB SSD giving it plenty of memory and storage space considering its more compact size.

Honor, a sub-brand of Chinese electronics giant Huawei, has revealed their brand-new 14-inch MagicBook Ultrabook. The MagicBook is powered by a 8th generation Intel Core processor. It's available with either the Intel Core i5-8250U or the Intel Core i7-8550U processor. Both variants come with 8 GB of memory, a 256 GB SATA SSD, and a dedicated NVIDIA GeForce MX150 graphics card with 2 GB of GDDR5 memory. The MagicBook is 15.8 mm thick and weighs 1.47 kg. In terms of design, the Honor MagicBook features a sleek all-aluminum body similar to the previously announced Huawei Matebook. The MagicBook's cooling solution consists of various heat pipes that are connected to the CPU and GPU. A single fan draws cool air from the three vents located around the ultrabook and pushes the heated air through the rear vent.

The Honor MagicBook has been fitted with a 13.3-inch matte IPS LCD display. The panel boasts a 1080p resolution, 45% NTSC color space, 800:1 contrast, and 250 nits of brightness. The ultrabook also possesses four Dolby Atmos-certified speakers, dual mics, and a fingerprint reader. Thanks to the generous 57.4 Wh battery, the MagicBook is certified for up to 12 hours of battery life. It comes with a USB Type-C port for charging the device, one USB 3.0 port, one USB 2.0 port, a HDMI port, and a 3.5mm audio jack. The Intel Core i5 variant costs CNY 5,000 ($800), while the Intel Core i7 model goes for CNY 5,700 ($910).