Viking Modular Solutions, a division of Sanmina-SCI Corporation (Nasdaq: SANM), and leading manufacturer of innovative DRAM modules and Solid State Drive (SSD) solutions, today announced its DDR3 8GB Very Low Profile (VLP) Registered DIMM is available for immediate qualification. Suitable for the most demanding environmental conditions, this high-density VLP RDIMM is optimal for Original Equipment Manufacturer (OEM) customers in the telecommunications, enterprise, cloud and embedded computing markets that need the benefit of high density in a very low profile form factor.

Viking Modular is a leader in creating innovative DRAM packaging solutions that offer excellent signal integrity and thermal management. This latest DDR3 8GB VLP RDIMM uses mainstream 2Gbit DDR3 DRAM to deliver a cost effective, reliable, high-density solution, ideally suited for blade servers, storage bridge bay (SBB), AdvancedTCA (ATCA) and multiple space constrained high performance computing environments.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it had begun sample shipments of its new 32-gigabyte Load Reduced Dual In-Line Memory Module (LRDIMM), the DRAM industry's highest density memory module. The LRDIMM consists of 72 advanced 40nm process 4-gigabit DDR3 SDRAMs in a Double Density Package (DDP).

LRDIMM is a new standard for server memory modules that reduces I/O bus capacity by buffering the I/O bus line with the memory buffer (MB) to simultaneously enable higher system density and faster speed. JEDEC, a standardization body for the semiconductor industry, is studying the adoption of LRDIMM standards. Elpida is actively engaged in promoting its own standard.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced they've begun shipping their new 8GB Registered-ECC DDR3 DRAM modules to support low-voltage Intel Westmere platforms. Our JEDEC standard 1.35V DDR3 ECC/R-DIMM 8GB module running at 1333MHz with latencies of 9-9-9.

Reducing the costs associated with the Enterprise Data Center has become an important goal for the Enterprise server market. Our DDR3 memory product runs at 1.35v instead of the traditional 1.5v. The lower operating voltage reduces memory power consumption by over 20%, in comparison with the standard 1.5V DDR3 memory modules, and translates directly into lower power, less cooling, lower electrical bills, and less CO2 emissions for the data center.

ATP, a leading flash memory manufacturer known for its high quality, durable flash and DRAM memory modules announced its newly released Vertical Slim SATA Embedded Module. With its small size and ratified JEDEC standard, MO-297, the Vertical Slim SATA Embedded Module is an ideal fit for embedded solid state storage applications. The compact design of the Slim SATA solution makes the module the ideal structure for SSD solutions that have space constraints and require high performance and reliability.

The ATP Vertical Slim SATA Module adheres to the JEDEC standard, as well as CE, FCC and RoHS industry compliance and regulatory standards. The small size (54mm(L)x39.8mm(W)x4.0mm(H) and high density of the Vertical Slim SATA makes the module an ideal replacement for the 2.5" HDD. It offers an alternative solution for space constrained embedded applications such as IPC, Blades, Advanced TCA, Networking hosts, POS machines, and enhances the capability, performance and reliability of different applications. The ATP Vertical Slim SATA Module is available in 2GB to 16GB capacities.

Silicon Power, the world's leading manufacturer in flash memory and DRAM module, announced the launch of the pioneering DDR3 1600MHz standard memory module. With this brand-new product, general users can easily reach greater performance without overclocking it. Consistent and compatible with JEDEC standards and DDR3 systems, Silicon Power DDR3 1600MHz standard memory module is definitely perfect for increasing system efficiency.

Silicon Power DDR3 1600MHz standard memory module is consistent and compatible with JEDEC (Joint Electron Device Engineering Council) standards with 1600MHz clock rate, CL9 CAS latency, and 1.5V operating voltage. It adopts new fly-by topology design for more efficient commands, addresses, control signals, and clocks signals. It also supports On-DIE Termination (ODT) to dramatically reduce unwanted reflection signals and maximize speed rate. Meanwhile, Silicon Power insists on using original memory modules and FBGA packaging technology for excellent heat dissipation and accurate data transferring. Silicon Power single / dual / triple-channel memory kits are 100% tested to guarantee high performance of stability, durability and compatibility.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced they are now shipping their new "Green DDR3" to support low-voltage platforms. Our JEDEC standard 1.35V DDR3 SDRAM-VLP is 2GB based on a 1Gb component. This DDR3 memory product features: lower cooling costs, higher efficiency, and most importantly dramatic power savings. "Sometimes doing the right thing is hard; here is on that is easy. With our new green DDR3 you can increase your systems performance and save on total costs, while simultaneously reducing your CO2 footprint"., - SuperTalent COO, CH Lee.

Standard DDR3 modules measure the standard 1.18 inches, but this DDR3 solution has a vertically optimized module height of .72 inches', This enables better air flow, meaning less cooling costs. This also means that the boards require less material to manufacture, costs less to ship and will have a lower impact on the landfill some day. Not only does this innovative technology save space, help machines run cooler but encourages a more sustainable, eco-friendly solution.

Transcend Information Inc., a worldwide leader in memory and storage products, today launched three new 4GB DDR3 DRAM modules using high-density 2-gigabit (2 Gbit) DDR3 chips: a DDR3-1333 MHz Long-DIMM, a DDR3-1333 MHz SO-DIMM, and a DDR3-1066 MHz SO-DIMM.

Transcend's 4GB 240-pin DDR3-1333 Long-DIMM for desktops runs at 1333 MHz with latencies of 9-9-9, while the 4GB DDR3-1333 SO-DIMM notebook memory module operates at 1333 MHz with latencies of 9-9-9, and the 4GB DDR3-1066 SO-DIMM runs at 1066 MHz with CL7 timings. Each module is optimized for stable 1.5V operation and is made with high density energy-efficient 2 Gbit chips, enabling conscientious users to take advantage of the best power-performance ratio available for their desktop or laptop computer.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 30nm process 2-gigabit DDR3 SDRAM. The new 2-gigabit DDR3 SDRAM used 30nm-level advanced process migration technology to create the DRAM industry's smallest-level 2-gigabit DDR3 SDRAM. It achieves 45% more chips per wafer compared with Elpida's 40nm process products. Also, the new process design developed by Elpida will help contain rising chip costs associated with process migration. As a result, the 2-gigabit DDR3 is slated to become an extremely cost-competitive product.

Elpida's new chip meets the JEDEC specs for the high-speed DDR3-1866 and 1.35V low-voltage, high-speed DDR3L-1600 memory chips, both expected to become mainstream industry products in 2011. Also, the 30nm DDR3 SDRAM is eco-friendly. As a DDR3 SDRAM it achieves one of the industry's lowest levels of electric current usage (approximately 15% less operating and approximately 10% less standby usage compared with Elpida's 40nm products), which contributes to lower PC and digital consumer electronics power consumption.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Ultra-Low Voltage (ULV) and Extreme-Low Voltage (ELV) high-speed DDR3 desktop memory, providing the optimal balance of performance and power efficiency in one solution. Committed to staying ahead of the curve, OCZ is offering enthusiast-grade memory that complies with the latest JEDEC "DDR3L" low-voltage standards which ensures that system RAM runs cooler and more efficiently during intensive multi-tasking, gaming, and productivity applications.

"We are pleased to announce a complete range of low-voltage memory offerings designed for the latest crop of energy efficient platforms," said Eugene Chang, Vice President of Product Management. "In the past, lower voltage meant lower performance, but now with our extreme-low voltage optimized memory, consumers don't have to sacrifice high performance to also achieve energy savings."

Silicon Power, the world's leading manufacturer in flash memory and DRAM module, today (9/10) announced the royal launch of DDR3 large-capacity series with 256Mx8 advanced procedure, adding a brand-new golden troop with enhanced performance to Silicon Power's DRAM family! The product line includes 4GB (single channel), 8GB (dual kit), and 12GB (triple kit), fully compatible with the latest platforms such as Intel Core series, AMD AM3 series, etc.

Silicon Power DDR3 large-capacity series are perfect for Windows 7 64 bits. With such combination, end-users may open numerous programs simultaneously. Even if your computer operates overtime with power-consuming editing / gaming programs, you may still experience the ultimate enjoyment of ultra high-speed and outstanding performance.

ADATA Technology, the worldwide leading manufacturer in high-performance DRAM modules and NAND Flash application products, today introduced its new XPG Gaming Series DDR3-1333G low voltage memory, designed for gaming enthusiasts who adopt Intel X58, P55, H55 and H57 motherboards, and for HTPC applications. The XPG Gaming Series DDR3-1333G low voltage memory offers cooler operation and lower power consumption with only 1.35V and CL9-9-9-24 timing for demanding environments, enabling eco-friendly personal computers to perform at high speeds and great stability.

"Environmental sustainability is an important principle to us at ADATA, therefore we developed XPG Gaming Series DDR3-1333G low voltage memory, since energy efficiency equates to reduced CO2 emission." said Alex Wu, Project Manager of ADATA Product Management Division. "By utilizing XPG Gaming Series DDR3-1333G low voltage memory, gaming enthusiasts can help to minimize their carbon footprint, saving money on electricity costs, and achieve the right balance of gaming system performance and stability."

PC DDR4-SDRAM, the successor standard for DDR3-SDRAM, which continues increasing memory bandwidths while maintaining the same electrical footprints, surfaced on JEDEC roadmaps, at a recent MemCon conference in Tokyo, Japan. Just the target clock speed range for DDR2-SDRAM was 400~1066 MHz, and that of DDR3-SDRAM is 1066~2133 MHz, the DDR4-SDRAM standard will aim for clock speeds between 2133 and 4266 MHz, with DRAM voltages of 1.1~1.2V, the voltages standards-compliant DDR3 memory will ultimately end up with. Some of the first DDR4 memory chips will be built on the 32 nm or 36 nm manufacturing processes. JEDEC expects sampling of the new memory type to start in 2011 for the industry to come up with appropriate memory controllers and deployment platforms, while actual mass production is slated by 2015.

Viking Modular Solutions, a division of Sanmina-SCI Corporation, and leading manufacturer of innovative memory and flash solutions, today announced its Slim SATA SSD, a case-less, small form-factor and rugged SATA SSD, is available for immediate customer qualification.

Viking Modular Solutions' Slim SATA SSD is an embedded solid state drive solution that delivers outstanding performance in a standard form factor - and is less than half the size of a 2.5" SSD. With its 3Gb SATA II interface and sustained performance of up to 260 MB/s (megabytes per second), the Viking Modular Slim SATA SSD is ideal for telecommunications, gaming, embedded server & storage systems, field computing and defense & aerospace applications.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JEDEC DDR3L, a widely anticipated addendum to its JESD79-3 DDR3 Memory Device Standard. Continuing the evolution of DDR3 as the dominant DRAM standard today, DDR3L will enable a significant reduction in power consumption for a broad range of products that utilize memory; including laptops, desktops, servers, networking systems and a wide array of consumer electronics products. The updated version of JESD79-3, including the DDR3L addendum, is available for free download here.

Called DDR3L for DDR3 Low Voltage, devices adhering to the new standard will operate from a single 1.35V power supply voltage compared to 1.5V in existing devices. Under the new standard, DDR3L memory devices will be functionally compatible to DDR3 memory devices, but not all devices will be interoperable at both voltage ranges.

Samsung Electronics Co., Ltd. and Toshiba Corporation today announced their commitment to development of the most advanced high-performance NAND flash memory technology available today - a double data rate (DDR) NAND flash memory with a 400 megabit-per-second (Mbps) interface, toggle DDR 2.0 specification. The high-performance NAND memory is expected to be of immediate benefit to a host of NAND-based mobile and consumer electronics applications, especially where there is consumer demand for an extra stretch in performance. Both companies will support a standard industry specification to enable broad-scale acceptance of this new high-speed technology.

"Our introduction of high-speed 30 nanometer class* NAND late last year served as an initial pathway for stimulating acceptance of the new high-performance toggle DDR technology," said Dong-Soo Jun, executive vice president, memory marketing, Samsung Electronics. "Now, continual upgrades in high-speed performance will create new applications and broader market opportunities for NAND flash memory. The rapid adoption of fourth generation (4G) smartphones, tablet PCs and solid state drives is expected to drive demand for a broader range of high-performance NAND solutions."

Toshiba America Electronic Components, Inc.(TAEC) and its parent company Toshiba Corporation today announced the launch of a 128-gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The module is fully compliant with the latest e-MMC standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Samples will be available in September, and mass production will start in the fourth quarter (October to December) of 2010.

The new 128GB embedded device integrates sixteen 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's cutting-edge 32nm process technology and a dedicated controller into a small package 17 x 22 x 1.4mm. Toshiba is the first company to succeed in combining sixteen 64Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced the release of an entry-level line of HyperX memory modules for overclockers and gamers. The HyperX 'blu' memory modules have a new look, run at standard JEDEC speeds and timings, and have headroom for enthusiasts to push the performance envelope.

"The enthusiast community knows the HyperX name is synonymous with high speed, high quality and stylish design. HyperX blu enables us to bring these features to market at a lower price point," said Vincent Kim, HyperX product manager, Kingston. "blu is the latest addition to the HyperX family in our ongoing strategy to match HyperX products with the various enthusiast market segments."

As the demand has increased for PC components for gaming market, including high speed and reliable DRAM module, A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today introduces its new XPG Gaming Series DDR3-2000G and XPG Gaming Series DDR3-2000G v2.0 DRAM module. Designed for favorite gaming and daily computing groups on Intel X58, P55, and H55 platform, the new XPG Gaming Series DDR3-2000G DRAM module is promised to deliver CL9-9-9-24 timing with 1.65V voltage.

"A-DATA is the leader in the reliable and high performance DRAM module," said Richard Shen, manager of A-DATA product management department. "Demand for fast speed combined with high stability DRAM module continues to increase and A-DATA is the leader in this field. Gaming enthusiast can rely on the new XPG Gaming Series DDR3-2000G DRAM module to achieve high speed and stability under the critical environment, while continue to enjoy the ultimate gaming experiences."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD84-A441: Embedded MultiMediaCard (eMMC) Product Standard v4.41. Continuing the evolution of eMMC as an industry-leading memory technology, the new v4.41 contains corrections of critical errata found in the previous v4.4 specification, and offers new, optional features that designers may utilize to improve system performance. The v4.41 update is a replacement of v4.4 which is now considered obsolete. JESD84-A441 is available for free download at www.jedec.org.

Designed for a wide range of applications in consumer electronics, navigational systems and other industrial uses, eMMC is an embedded non-volatile memory system, comprised of both flash memory and a flash memory controller, which simplifies the application interface design and frees the host processor from low-level flash memory management. This benefits product developers by simplifying the non-volatile memory interface design and qualification process - resulting in a reduction in time-to-market as well as facilitating support for future flash device offerings. Small BGA package sizes and low power consumption make eMMC a viable, low-cost memory solution for mobile and other space-constrained products.

Transcend Information, Inc., a global leader in storage and multimedia products, today announced the expansion of its aXeRam product line with the introduction of 6GB DDR3-2000 triple-channel and 4GB DDR3-1600 dual-channel kits. Featuring unparalleled overclocking performance with an exceptionally low voltage of just 1.6V, both new memory kits are designed to meet the strict RAM requirements of gamers and enthusiasts.

Transcend's aXeRam DDR3-2000 memory is now available in triple-channel configuration, designed specifically for high-end motherboards sporting Intel's X58 chipset, including the ASUS P6X58D PREMIUM and Gigabyte's GA-X58A-UD3R. The 6GB DDR3-2000 kit consists of three 2GB modules rated at 2000MHz with timings of 9-9-9-24 and an operating voltage of a mere 1.6V, offering memory bandwidth up to an incredible 48GB/s-an increase of 35% compared to standard 1333MHz memory. Thanks to Transcend's adoption of high thermal efficiency aluminum heat sinks with cooling fins, the aXeRam DDR3-2000 memory kit gives enthusiasts a performance advantage through optimized heat diffusion while overclocking and gaming.

A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announced its DDR3L ("L" for low voltage) 1066/1333 (1.35volt) MHz Registered DIMM and DDR3L 1066/1333 MHz (1.35volt) ECC DIMM low voltage server memories have been certified by Intel, that able to perform lower power consumption with great reliability to increase better efficiency on Westmere-EP processor-based server.

"Enterprise often requires 24x7 operations from server memory for data accessing and collecting with reliability and performance requirements," said Richard Shen, manager of A-DATA product management department. "We are proud to offer our DDR3L 1066/1333 MHz R-DIMM and DDR3L 1066/1333 MHz ECC DIMM low voltage server memory that has certified by Intel to enterprise customers, which delivers high performance and great reliability with less power consumption to meet enterprise's critical requirements, as well as to protect and to preserve the environment."

Transcend Information, Inc., a global leader in storage and multimedia products, today announced that its aXeRam DDR3-2000 memory kits have been officially certified under the Intel Extreme Memory Profile (XMP) validation program. Fully compatible with Intel Core i7 processors, the XMP-certified DDR3 kits are designed to operate at a blazing-fast clock frequency of 2000 MHz with an exceptionally low voltage of just 1.6V.

Intel XMP is a performance-packed expansion of the standard DDR3 memory specification. Featuring memory bandwidth up to an incredible 32GB/s, Transcend's aXeRam DDR3-2000 dual-channel memory kit is rated at 2000MHz with timings of 9-9-9-24, allowing performance enthusiasts and gamers to take their Intel Core i7 platform to the next level of memory overclocking performance. The aXeRam DDR3-2000 memory modules have been certified for use on Intel P55-based motherboards, including Gigabyte GA-P55A-UD3, MSI P55-GD80 and Asus P7P55D Deluxe.

A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today introduces its new XPG Gaming Series DDR3-1600G 8GB dual channel kit. Designed for gaming enthusiast who adopts the Intel P55 and H55 motherboards, the XPG Gaming Series DDR3-1600G 8GB dual channel kit offers CL9-9-9-24 timing at a voltage of 1.65V, and high-capacity to optimize the PC performance for ultimate gaming experiences.

"The ultimate gaming experiences are relying on proper choice of PC hardware and overall performance. Therefore, we introduced XPG Gaming Series DDR3-1600G as 8GB dual channel kit." said Action Chen, Deputy Project Manager of A-DATA XPG Department. "Gaming enthusiasts are able now to enjoy the extreme capacity and high speed by using XPG Gaming Series DDR3-1600G 8GB dual channel kit with 64 bit OS and satisfy their insatiable thirst for ultimate gaming experiences."

Lexar Media, a leading global provider of memory products for digital media, today introduced Crucial DDR3L-1333Mhz 1.35v energy-efficient server memory modules in support of the new Intel Xeon processor 5600 series. Available in 1GB, 2GB and 4GB RDIMM and VLP (very low profile) RDIMM modules, Crucial DDR3L memory modules are fully compatible and have been validated with the new Intel Xeon processor 5600 series. Servers across the enterprise, including those utilized for virtualization, data storage and processing, and blade servers will reap the benefits of new Crucial DDR3L memory. Crucial DDR3L memory is available through select resellers worldwide and online at Crucial.com/server.

"The benefits of energy-efficient DDR3L memory are clear - most notably the significant reduction in memory sub-system energy consumption and overall system cooling demands. Moreover, these benefits come without sacrificing the performance gains our customers expect from Intel's next-generation servers," said Jim Jardine, Lexar Media senior worldwide product manager. "Additionally, all Crucial DDR3L 1.35v memory has been fully validated and certified compatible with the Intel Xeon Processor 5600 series, so customers can rest assured their server infrastructure investment will perform reliably and efficiently with Intel's newest processors."

Transcend Information Inc., a worldwide leader in storage and multimedia products, is proud to announce its launch of 8GB DDR3-1066 Registered DIMM (RDIMM) and 4GB DDR3-1333 VLP (Very Low Profile) RDIMM modules. Featuring enhanced capacity, support for triple-channel memory configurations, and an onboard thermal sensor, these new high-density RDIMMs provide customers with cutting-edge support for higher data frequencies and significantly increase memory space.

As Transcend's highest density DDR3 module, the 8GB DDR3-1066 RDIMM is constructed with a robust ten-layer PCB that offers stable performance and durability, and also includes a high thermal efficiency aluminum heat sink to help maintain cool temperatures under load. Offering memory bandwidth up to 8.5GB/s and the flexibility to expand maximum capacity to 48GB (per processor), the 8GB DDR3-1066 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.