AMD (NASDAQ: AMD) today announced the completion of its acquisition of Xilinx in an all-stock transaction. The acquisition, originally announced on October 27, 2020, creates the industry's high-performance and adaptive computing leader with significantly expanded scale and the strongest portfolio of leadership computing, graphics and adaptive SoC products. AMD expects the acquisition to be accretive to non-GAAP margins, non-GAAP EPS and free cash flow generation in the first year.

"The acquisition of Xilinx brings together a highly complementary set of products, customers and markets combined with differentiated IP and world-class talent to create the industry's high-performance and adaptive computing leader," said AMD President and CEO Dr. Lisa Su. "Xilinx offers industry-leading FPGAs, adaptive SoCs, AI engines and software expertise that enable AMD to offer the strongest portfolio of high-performance and adaptive computing solutions in the industry and capture a larger share of the approximately $135 billion market opportunity we see across cloud, edge and intelligent devices."

Anandtech asked AMD during a meeting at CES about the production nodes used to make its chips at TSMC and the importance of leading edge nodes for AMD to stay competitive, especially in light of the cost of using said nodes. Lisa Su confirmed in her answer to Anandtech that AMD is using an optimised high-performance 5 nm node for its upcoming Zen 4 processor chiplets, which there interestingly appears to be both 2D and 3D versions of. This is the first time we've heard a mention of two different chiplet types using the same architecture and it could mean that we get to see Zen 4 based CPUs with and without 3D cache.

What strikes us as a bit odd about the Anandtech article, is that they mention the fact that several of TSMC's customers are already making 4 nm and soon 3 nm chips and are questioning why AMD wouldn't want to be on these same nodes. It seems like Anandtech has forgotten that not all process nodes are universally applicable and just because you can make one type of chip on a smaller node, doesn't mean it'll be suitable for a different type of chip. For the longest of times, mobile SoCs or other similar chips seem to always have been among the first things being made on new nodes, with more complex things like GPUs and more advanced CPUs coming later, to tweaked versions of the specific node. The fact that TSMC has no less than three 7 nm nodes, should be reason enough to realise that the leading edge node might not be the ideal node for all types of chips.

AMD today announced that AMD President and CEO Dr. Lisa Su will host its 2022 Product Premiere on January 4, 2022. Dr. Su will highlight innovations and solutions featuring upcoming AMD Ryzen processors and AMD Radeon graphics. The AMD Product Premiere livestream will be accessible to the public beginning at 10 a.m. EST on Tuesday, January 4 at AMD.com; replays will be available after the conclusion of the livestream event. The link to the AMD 2022 Product Premiere event page can be found below.

AMD later this month is preparing to address investors as part of a yet-unknown event. The company typically hosts Financial Analyst Day events around Q1-Q2, and goes to the investors with substantial material on the current state of the organization, the products on offer, what's on the horizon, and how it could impact the company's financials. An alleged presentation related to the November 2021 event was leaked to the web. The presentation provides a guided tour of the entire product portfolio of the company, spanning server processors, compute accelerators, consumer graphics, some client processors, and the semi-custom business.

The presentation outlines that the company has so far successfully executed its roadmaps for the client-CPU, server-CPU, graphics, and compute-accelerator segments. In the client CPU segment, it shows a successful execution up to 2021 with the "Zen 3" microarchitecture. In the server space, it mentions successful execution for its EPYC processors up to "Zen 3" with its "Milan" processors, and confirms that its next-generation "Zen 4" microarchitecture, and its sister-architecture, the "Zen 4c," will be built on the 5 nm silicon fabrication node (likely TSMC N5). The presentation also details the recently announced "Milan-X" processor for existing SP3 platforms, which debuts the 3D Vertical Cache technology, bringing up to 96 MB of L3 cache per CCD, and up to 768 MB of L3 cache (804 MB L1+L2+L3 cache) per socket.Update 10:54 UTC: The presentation can now be found on the AMD Investor Relations website.

AMD today announced revenue for the third quarter of 2021 of $4.3 billion, operating income of $948 million, net income of $923 million and diluted earnings per share of $0.75. On a non-GAAP basis, operating income was $1.1 billion, net income was $893 million and diluted earnings per share were $0.73. "AMD had another record quarter as revenue grew 54% and operating income doubled year-over-year," said AMD president and CEO Dr. Lisa Su. "3rd Gen EPYC processor shipments ramped significantly in the quarter as our data center sales more than doubled year-over-year. Our business significantly accelerated in 2021, growing faster than the market based on our leadership products and consistent execution."

AMD will host its Accelerated Data Center Premiere on November 8, 2021 at 11 a.m. ET, showcasing the company's upcoming innovations with AMD EPYC processors and AMD Instinct accelerators. The virtual event is slated to feature presentations from AMD President and CEO Dr. Lisa Su, Senior Vice President and General Manager, Data Center and Embedded Solutions Business Group Forrest Norrod, and Senior Vice President and General Manager, Server Business Unit Dan McNamara. The event will be accessible to the public at this page starting at 11 a.m. ET. A replay will be available and can be accessed after the conclusion of the livestream event.

Editor's Note: We expect AMD to announce several SKUs in its MI200-series "Aldebaran" compute accelerator family, along with a new line of EPYC "Milan-X" enterprise processors that leverage the new "Zen 3+" chiplet that comes with 64 MB 3D Vertical Cache memory on top of the 32 MB L3 cache.

Finally some potentially good news, as AMD's CEO Lisa Su is bringing hope that the current chip shortage situation might improve over the next 18 to 24 months according to a new piece on CNBC. She's expecting new chip fabs to have come online by then, although no details were mentioned, one would presume it involves TSMC in AMD's case.

Lisa Su is quoted saying "We've always gone through cycles of ups and downs, where demand has exceeded supply, or vice versa, this time, it's different." "The pandemic has just taken demand to a new level". This isn't exactly breaking news by now, but it also seems like the demand for computers has reached its peak and is now plateauing ahead of what will likely be a drop in sales come next year, but that doesn't mean the demand for chips will go down. Lisa Su is also expecting further consolidation in the industry, which has its upsides and downsides, but her take on it is that "if you want to do something very large for the industry, you know, scale is important." AMD should know this better than most companies, since they've scaled their business from the brink of bankruptcy to where they are today.

AMD CEO Dr. Lisa Su last Friday joined an exclusive list of personalities whose contributions to he semiconductor industry have been deemed relevant enough to receive the prestigious Robert N. Noyce medal. The award, attributed by the IEEE and funded by Intel, was awarded to Lisa Su in recognition of her "leadership in groundbreaking semiconductor products and successful business strategies that contributed to the strength of the microelectronics industry." Her current and past actions at AMD have pulled most of the weight behind this recognition, as Dr. Lisa Su has completely turned around a company that was bleeding talent and dollars, reversing its 2$ per share lows from AMD's 2014 up to today's $110 per share.

Lisa Su divides her carrier in two parts: the first ten to 15 years where she moved and produced as an MIT-trained electrical engineer, where she earned bachelor's, master's, and doctoral degrees on the subject. The move towards management of research and technological teams actually happened during her stint in IBM; after 11 years at the company, in 2006 she was appointed vice president of IBM's semiconductor research and development center in New York. She then moved on to AMD as senior vice president in charge of the company's global business units, where she was so impressively skilled it only took her two years to become President and CEO of AMD. Her nomination for the Robert N. Noyce Medal paints her as the first woman to have ever received it. In 1993, MIT female graduates where 32% of the total; in 2016, that number increased to 50%.

AMD CEO Dr Lisa Su, in the company's Q2-2021 financial results call, confirmed that the company is on-track to launch the Zen 4 CPU microarchitecture and RDNA3 graphics architecture, in 2022. Zen 4 would herald the first major desktop platform change since the original Zen architecture, with the introduction of a new CPU socket, and support for DDR5 memory. The RDNA3 graphics architecture, meanwhile, is expected to nearly triple SIMD resources over the previous generation, and introduce even more fixed-function hardware for raytracing.

In the meantime, AMD is preparing a counter to Intel's 12th Gen Core "Alder Lake-S" processor, in the form of Zen 3 with 3D Vertical Cache, which is also being referred to as the Zen 3+ architecture. These processors feature additional last-level cache, and the company claims a 15% gaming performance uplift, which should help it close the gaming performance gap with Intel, and win on sheer core-count of its big cores. It remains to be seen if Zen 3+ remains on Socket AM4 or if it debuts AM5, as AMD will be under pressure to match "Alder Lake" in platform I/O, which includes DDR5. Dr Su also confirmed that AMD has started shipping the Instinct MI200 "Aldebaran" compute accelerator based on the CDNA2 architecture. AMD's first MCM GPU with two logic dies, "Aldebaran" takes the fight to NVIDIA's top A100 series compute accelerators, and has already scored wins with ongoing HPC/supercomputing projects.

The partnership between Samsung and AMD began in 2019 when the two companies announced that they would work together to integrate Radeon graphics IP in Samsung Exynos processors. We can see the results of this partnership with Dr. Lisa Su confirming at Computex that RDNA2 graphics will be integrated into the next flagship Samsung Exynos SoC. The RDNA2 GPU found in the upcoming mobile chip will include support for raytracing and variable-rate shading with a strong possibility that it will power the next Galaxy S series flagship. Samsung was initially expected to announce this new chipset in June however the event was postponed until July where the complete details and performance numbers will be unveiled.

Update Jun 22nd: The upcoming GPU is expected to be 30% faster than the current Mali-G78 GPU present in Galaxy S21 Ultra which should give it a comfortable lead of ~10% against the next generation Mali GPU. The GPU does appear to suffer from quite severe thermal throttling with a 20% performance drop after the second run and 30% on the third run. Samsung seems pleased with the collaboration and has engaged in talks with AMD to extend the contract for future GPU architectures.

AMD and Google Cloud today announced T2D, the first instance in the new family of Tau Virtual Machines (VMs) powered by 3rd Gen AMD EPYC processors. According to Google Cloud, the T2D instance offers 56% higher absolute performance and more than 40% higher price performance for scale-out workloads. The Tau VM family provides customers with a leading combination of performance, price, and easy integration. The T2D instances, using the leadership performance of 3rd Gen AMD EPYC processors, excels at workloads including web servers, containerized micro-services, data logging-processing, large scale Java applications and more.

"At Google Cloud, our customers' compute needs are evolving," said Thomas Kurian, CEO of Google Cloud. "By collaborating with AMD, Google Cloud customers can now leverage amazing performance for scale-out applications, with great price-performance, all without compromising x86 compatibility." "We designed 3rd Gen AMD EPYC processors to meet the growing demand from cloud and enterprise customers for high-performance, cost-effective solutions with optimal TCO," said AMD President and CEO Dr. Lisa Su. "We work closely with Google Cloud and are proud they selected AMD to exclusively power the new Tau VM T2D instance which provides customers with powerful new options to run their most demanding scale-out workloads."

AMD at its Computex event shed some light on its IP partnership with Samsung. We already knew this was going to be a closer collaboration than most IP licensing deals, as AMD themselves announced this would be a semi-custom solution designed between both companies. AMD CEO Lisa Su described the technology to be embedded in the upcoming Samsung Exynos SoC as being based on RDNA2 - but this likely is just a marketing and clarity perspective on AMD's technology being implemented, since between the design of RDNA2 and the announcement of the Samsung partnership a lot of water has necessarily run under AMD's graphics IP bridge.

Lisa Su did however confirm that two key RDNA2 technologies will find their way into Samsung's Exynos: Variable Rate Shading (VRS) and Raytracing. This isn't he first time VRS has made an appearance on a mobile SoC - it's already been implemented by Qualcomm in the Adreno 660 GPU (part of the Snapdragon 888 SoC design). However, Raytracing does seem to be a first for the SoC market, and Samsung might just edge out competition in its time to market with this technology. more details will certainly be shared as we get closer to the fabled AMD-partnered Exynos release.

AMD's next-generation HPC accelerator card, the Instinct MI200, is expected to launch later this year. CEO Dr Lisa Su, speaking at a financial event hosted by JPMorgan stated that the company would launch the next-generation of CDNA architecture this year. The card debuts the company's new CDNA2 compute architecture, and is on its way to supercomputers already announced. The Instinct MI200 HPC accelerator card is based on the new "Aldebaran" compute accelerator package, which is a multi-chip module of not just the compute silicon and memory dies; but one that has multiple compute dies.

AMD today announced that AMD President and CEO Dr. Lisa Su will keynote COMPUTEX 2021, one of the leading global technology tradeshows focused on the theme of "Building Global Technology Ecosystems" in 2021. Dr. Su will present the AMD vision for the future of computing, including the growing adoption of AMD high-performance computing and graphics solutions in the keynote titled "AMD Accelerating - The High-Performance Computing Ecosystem." The digital keynote will be livestreamed at 10:00 AM (GMT+8) on Tuesday, June 1 and can be accessed on the COMPUTEX 2021 Hybrid platform as well as AMD.com.

AMD (NASDAQ: AMD) today announced that its Board of Directors approved a new share repurchase program. Under this program, the company intends to repurchase up to $4 billion of outstanding AMD common stock. AMD expects to fund repurchases through cash generated from operations which have been strengthened by the company's strong operational results.

"Today's announcement reflects our confidence in AMD's business and the successful execution of our multi-year growth strategy," said Dr. Lisa Su, AMD president and CEO. "Our strong financial results and growing cash generation enable us to invest in the business and begin returning capital to our shareholders." Under this program, which is designed to return value to AMD stockholders, offset dilution from stock issuances, and reduce share count over time, the company will repurchase stock in the open market. This repurchase program has no termination date and may be suspended or discontinued at any time.

British competition regulator Competition and Markets Authority (CMA) on Monday, launched an enquiry into the ramifications of AMD's buy-out of FPGA maker Xilinx. The agency is soliciting opinions from the public on whether the $35 billion all-stock purchase will make goods and services less competitive for the UK. Unlike NVIDIA's Arm buyout the Xilinx acquisition is seeing no opposition from tech-giants. The Register notes that AMD could combine Xilinx's FPGAs with its x86 CPU and RDNA SIMD to create highly customizable HPC accelerators. AMD president Dr Lisa Su said "By combining our world-class engineering team and deep domain expertise, we will create an industry leader with the vision, talent and scale to define the future of high performance computing."

TAITRA (Taiwan External Trade and Development Council) announced today that Dr. Lisa Su, President and CEO of AMD, is invited back to deliver a keynote address at COMPUTEX 2021. This digital keynote will be on Tuesday, June 1, at 10:00 AM Taipei time, with the keynote theme "AMD Accelerating - The High-Performance Computing Ecosystem." COMPUTEX displays will be digital this year, with keynotes and forums running on hybrid. "It has been a year unlike others. Technology has gotten us through some of the most challenging times," said James Huang, TAITRA Chairman. "We will continue to transform our exhibition models and practices to meet the evolving needs of our exhibitors, visitors, and media, without losing the most essential element of a trade show - connection."

Dr. Lisa Su is proud to join COMPUTEX once again in 2021. "The past year has shown us the important role high-performance computing plays in our daily lives - from the way we work to the way we learn and play. At this year's COMPUTEX, AMD will share how we accelerate innovation with our ecosystem partners to deliver a leadership product portfolio," said Dr. Lisa Su. At the COMPUTEX | AMD CEO Keynote, Dr. Lisa Su will share the AMD vision for the future of computing, including details of the growing adoption of the AMD high-performance computing and graphics solutions, built for PC enthusiasts and gamers.

The current supply of graphics cards has been very tight all over the world. Starting with the launch of the latest Radeon RX 6000 series of GPUs based on RDNA 2 architecture, AMD has found itself in big trouble when it comes to supply of the silicon, compared to the demand that exists for these new GPUs. We have discussed that many times in the past and saw that it represents a problem spanning everyone involved in getting the silicon chips to the hands of consumers. On Tuesday, April 27th, AMD held its Q1 2021 earnings call and webcast, where the company executives talked about the company's future, underlying problems, and ways of addressing them.

Among many topics covered in the call, AMD's President and CEO, Dr. Lisa Su, has talked about the GPU supply. According to Dr. Su, the company is ramping the production of its Radeon graphics cards, adding that the mobile Radeon GPU lineup is lurking. Here is a full quote from the earnings call.

Dr. Lisa Su—AMD Q1 2021 Earning CallAnd we're well-positioned for further growth as we have tripled our commercial notebook design wins with the largest OEMs this year. In graphics, revenue increased by a strong double-digit percentage year over year and sequentially, led by channel sales growth as revenue from our high-end Radeon 6000 GPUs more than doubled from the prior quarter. We introduced our Radeon 6700 XT desktop GPU with leadership 1440p gaming performance in March and are on track for the first notebooks featuring our leading-edge mobile RDNA 2 architecture to launch later this quarter. We expect Radeon 6000 Series GPU sales to grow significantly over the coming quarters as we ramp production.

AMD (NASDAQ:AMD) and Xilinx, Inc. (NASDAQ:XLNX) announced today that stockholders voted to approve their respective proposals relating to the pending acquisition of Xilinx by AMD. The acquisition will bring together two industry leaders with complementary product portfolios and customers, combining CPUs, GPUs, FPGAs, Adaptive SoCs and deep software expertise to enable leadership in computing platforms for cloud, edge and end devices. Together, the combined company will have the ability to capitalize on opportunities spanning some of the industry's most important growth segments, including data centers, gaming, PCs, communications, automotive, industrial, aerospace and defense.

"For several years, AMD has successfully executed our long-term growth strategy and deepened the company's partnerships to drive high performance computing leadership," said Dr. Lisa Su, AMD president and CEO. "The acquisition of Xilinx marks the next leg in our journey to make AMD the strategic partner of choice for the largest and most important technology companies in the world as an industry leader with the vision, talent and scale to support their future innovation."

AMD (NASDAQ:AMD) today announced revenue for the fourth quarter of 2020 of $3.24 billion, operating income of $570 million, net income of $1.78 billion and diluted earnings per share of $1.45. Fourth quarter net income included an income tax benefit of $1.30 billion associated with a valuation allowance release, which contributed $1.06 to EPS. On a non-GAAP(*) basis, operating income was $663 million, net income was $636 million and diluted earnings per share was $0.52.

For full year 2020, the company reported revenue of $9.76 billion, operating income of $1.37 billion, net income of $2.49 billion and diluted earnings per share of $2.06. Full year results included a fourth quarter income tax benefit of $1.30 billion associated with a valuation allowance release, which contributed $1.07 to annual EPS. On a non-GAAP(*) basis, operating income was $1.66 billion, net income was $1.58 billion and diluted earnings per share was $1.29.

AMD is always in development mode and just when they launch a new product, the company is always gearing up for the next-generation of devices. Just a few months ago, back in November, AMD has launched its Zen 3 core, and today we get to hear about the next steps that the company is taking to stay competitive and grow its product portfolio. In the AnandTech interview with Dr. Lisa Su, and The Street interview with Rick Bergman, the EVP of AMD's Computing and Graphics Business Group, we have gathered information about AMD's plans for Zen 4 core development and RDNA 3 performance target.

Starting with Zen 4, AMD plans to migrate to the AM5 platform, bringing the new DDR5 and USB 4.0 protocols. The current aim of Zen 4 is to be extremely competitive among competing products and to bring many IPC improvements. Just like Zen 3 used many small advances in cache structures, branch prediction, and pipelines, Zen 4 is aiming to achieve a similar thing with its debut. The state of x86 architecture offers little room for improvement, however, when the advancement is done in many places it adds up quite well, as we could see with 19% IPC improvement of Zen 3 over the previous generation Zen 2 core. As the new core will use TSMC's advanced 5 nm process, there is a possibility to have even more cores found inside CCX/CCD complexes. We are expecting to see Zen 4 sometime close to the end of 2021.

At her 2021 International CES keynote address, AMD CEO Dr. Lisa Su announced the Ryzen 5000 series mobile processor family, which the company thinks has what it takes to beat Intel's 11th Gen Core "Tiger Lake" processor, possibly even its upcoming 8-core version. The Ryzen 5000 mobile processor is based on the new 7 nm "Cezanne" monolithic SoC die. This chip features an 8-core CPU based on the latest "Zen 3" microarchitecture, and its biggest change is the advent of the 8-core CCX, which means all eight cores on "Cezanne" share a common L3 cache.

AMD slides from the CES keynote confirm that the company has not only doubled the L3 cache amount compared to "Renoir," but also quadrupled the maximum addressable L3 cache per core. On "Renoir," the eight cores are split between two CCXs, each with 4 MB of L3 cache. "Cezanne" features a single 8-core CCX with 16 MB of it. The dedicated L2 cache amount remains at 512 KB per core. The "total cache" (L2+L3) adds up to 20 MB. For the 45-Watt Ryzen 5000 HX-series enthusiast mobile processors, the increased caches, coupled with improved IPC and higher clock speeds should be AMD's play against Intel's top H-segment mobile chips. AMD claims that the second-fastest Ryzen 9 5900HX beating Intel's fastest Core i9-10980HK by 13% in raw single-thread performance, 19% in game physics performance, and 35% in overall PassMark performance. The 5980HX should only end up faster.

AMD today announced several senior leadership promotions in support of the company's long-term growth goals. "Our high-performance products and long-term roadmaps have placed AMD on a significant growth trajectory," said Dr. Lisa Su, AMD president and CEO. "Aligning and expanding our senior leadership team around our highest-priority growth opportunities will continue the momentum we have built across our business in 2021 and beyond."AMD announced two executive vice president promotions:

• Darren Grasby to executive vice president and Chief Sales Officer, responsible for driving adoption of AMD products and delivering a world-class customer experience.
• Devinder Kumar to executive vice president and Chief Financial Officer, responsible for continued strengthening of the company's financial profile.

AMD has just had quite an amazing year. From the launch of the Ryzen 5000 series CPUs based on Zen 3 architecture to RDNA 2 based graphics cards, the company has been delivering new solutions in a timely manner. With the upcoming tech conference being CES, we are wondering which companies are going to hold their keynotes virtually. Thanks to the official CES website, we have confirmation that AMD's CEO Dr. Lisa Su will hold a virtual keynote with the goal of "presenting the AMD vision for the future of research, education, work, entertainment, and gaming, including a portfolio of high-performance computing and graphics solutions." That could mean that we could possibly see some new directions for the company and how AMD plans to develop next-generation computing solutions, so stay tuned for more interesting information coming your way on January 11th, when CES kicks-off.

AMD (NASDAQ: AMD) and Xilinx (NASDAQ: XLNX) today announced they have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at $35 billion. The combination will create the industry's leading high performance computing company, significantly expanding the breadth of AMD's product portfolio and customer set across diverse growth markets where Xilinx is an established leader. The transaction is expected to be immediately accretive to AMD margins, EPS and free cash flow generation and deliver industry-leading growth.

The acquisition brings together two industry leaders with complementary product portfolios and customers. AMD will offer the industry's strongest portfolio of high performance processor technologies, combining CPUs, GPUs, FPGAs, Adaptive SoCs and deep software expertise to enable leadership computing platforms for cloud, edge and end devices. Together, the combined company will capitalize on opportunities spanning some of the industry's most important growth segments from the data center to gaming, PCs, communications, automotive, industrial, aerospace and defense.