Memory major Kingston Technology is ready to greet Intel's 2011 Core processor family with a new line of DDR3 memory kits tailored for it. The HyperX Genesis, as it's called, combines faster, lower-latency, and lower-voltage DDR3 memory with a new sporty-looking heatsink design that keeps the modules cool while maintaining standard module height. The heatsink is basically two sheets of metal interlocked at the top, with rows of holes to draw in convectional air currents, to cool the heatsink. Kingston's new HyperX Genesis series is expected to be out in early January, 2011.A video presentation showing the modules from almost all angles follows.

Mushkin Enhanced (Mushkin) released two new DDR3-1600 MHz (PC3-12800) memory kits bearing the company's Radioactive-themed FrostByte heatspreaders. The release includes a 4 GB (2x 2 GB) dual-channel kit best suited for socket LGA1156 systems, and a 6 GB (3x 2 GB) triple-channel kit, best suited for LGA1366 systems. The modules operate at 1600 MHz with timings of 7-9-7-24, with module voltage of 1.65V. Backed by a lifetime warranty, the 4 GB kit is priced at US $67.49, and the 6 GB one at $101.49.

The world-famous DRAM module manufacturer KINGMAX presented overclocking DDR3 2400MHz Nano Gaming RAM. It is the unique and the only one DRAM module can be operated at 2400MHz without conventional heat sink. Instead of adding conventional heat sink, Nano Gaming RAM adopts the nano thermal dissipation technology（NTD Tech）to improve thermal performance by 10%. Its bandwidth can reach up to 19.2GB/sec under low voltage which means the performance will be more conspicuously improved in 3D shooting games that involve more rigorous requirements for speed.

Heat dissipation is always the key issue for the stability of system operation. Particularly in overclocking or 3D games, high temperature may easily cause the instability of operation. Targeting the overclocking and game market, KINGMAX DDR3 Nano Gaming Ram adopting NTD Tech increases the effect of heat radiation, it not only keeps the working temperature far lower than conventional heat sinks, but improves thermal dissipation performance by 10%, thereby effectively maintaining low temperature and high stability. In other words, only NTD Tech can replace conventional heat sinks and only Nano Gaming Ram can allow overclocking enthusiasts and gamers to feel free to challenge the overclocking limit.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it has begun sample shipments of its newly developed 30nm process 4-gigabyte DDR3 SO-DIMM. The new memory module was built using currently available advanced 30nm process DRAM manufacturing technology and is composed of sixteen 2-gigabit DDR3 SDRAMs. It achieves a high density of 4 gigabytes.

Compared with Elpida's 40nm DRAM module, the new product uses 20% less operating current and 30% less standby current consumed by PC systems, and as a DRAM module it achieves one of the lowest levels of current consumption in the industry. The new eco-friendly DRAM product provide an effective power-saving response to today's need for a longer battery life for notebook PCs, netbooks, tablet PCs and other handheld electronic devices.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the launch of a new, highly overclocked, low voltage memory kit. This 4GB Dominator GT memory kit, implemented using a matched pair of 2 GB DIMMs, is guaranteed to operate at 2133MHz, with latency settings of 9-11-9-27, and at a memory voltage of only 1.5V.

"We have seen an increasing number of requests from overclockers for memory that can achieve high clock speeds at lower voltages," stated Thi La, Vice President of Memory Products at Corsair. "At 2133MHz, this 4GB memory is the world's fastest commercially available memory at 1.5 volts."

Patriot Memory, a global pioneer in high-performance memory, NAND flash and computer peripheral solutions today announced the addition of 16GB and 32GB LX Series microSD High Capacity (SDHC) cards. These large capacity cards meet SD Associations Class 10 specifications enabling them to deliver high performance to today's smartphones and other digital devices.

"Today's mobile devices have evolved from simplistic phones to multi-functional tools capable of handling email, music, photos and more," says Meng Jay Choo, Patriot's Flash Product Manager. "Smartphones have become a part of our everyday lives letting us connect with each other. Adding 16GB and 32GB storage solutions let consumers expand the capabilities of these devices."

Micron Technology, Inc. today introduced a portfolio of high-capacity flash memory products that will lengthen the life of NAND for years to come. By integrating the error management techniques in the same NAND package, the new Micron ClearNAND devices alleviate the challenges traditionally found in NAND process shrinks. Micron's ClearNAND portfolio extends the opportunities for more advanced NAND process generations to be used in enterprise servers, tablet PCs, portable media players, and dozens of other consumer applications.

"The pace of NAND scaling is largely responsible for the incredible growth and success the industry has seen to date, and for helping to create new flash-based storage solutions," said Glen Hawk, vice president of Micron's NAND Solutions Group. "While the advantages in NAND scaling are evident, so are the challenges with the technology becoming increasingly more difficult to manage. Micron's ClearNAND products remove this management burden for our customers and extend the life of this all-important technology."

Transcend Information Inc., a worldwide leader in memory and storage products, today launched an 8GB aXeRam DDR3-2000 memory kit that contains two identically matched 4GB memory modules. With a combination of high capacity, high clock speed and exceptionally low voltage of just 1.6V, the new modules are ideal for hardcore gamers, overclockers and professional users reap the benefits of a 64-bit operating system.

64-bit processors have become mainstream in mid-range and high-end systems due to their ability to support memory capacities larger than 4GB, which is essential for memory-hungry applications such as HD video editing, large databases, virtual server farms, etc. With 8GB of total capacity, a clock frequency of 2000MHz and timings of 9-11-9-24, Transcend's newly released dual-channel kit is a comprehensive memory upgrade solution-especially for systems with modern processors running more advanced operating systems.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the Vengeance series of high performance DDR3 memory modules for enthusiasts and system builders.

Vengeance memory modules use carefully selected RAMs to enable excellent overclocking results on current and future generation Intel and AMD platforms. All initial Vengeance memory modules have a low 1.5V supply voltage for maximum compatibility and for energy-efficient operation. Vengeance DDR3 memory kits are available in single, dual, or triple module kits, with sizes ranging from 4GB all the way up to 16GB. All Vengeance modules are equipped with aluminum heat spreaders for thermal performance as well as aggressive appearance.

Apacer, one of the world's leading brands of memory modules, announced today its ARES DDR3 Overclocking Memory Module. The newly-unveiled memory module is named after the god of war "ARES." Features include advanced memory chips, zero noise heat pipe cooling system with a large red aluminum heat dissipation fin. It is able to operate at a blazing-fast clock rate of 2400MHz, allowing not only overclockers to create overclocking miracles but hardcore gamers to achieve their optimum performance during the games.

ARES, the god of war, clad in armor dashing in the ferocious battlefield, is thought to have been invincible in Greek mythology. After the previous launch of second-to-none Aeolus equivalent, Apacer again named its DDR3 memory module from the mythology. Just as its name suggested, ARES DDR3 Overclocking Memory Module promises to deliver amazing and stable overclocking performances that feed the needs of the overclocking experts.

Exceleram - the Highend Memory based in Landau, Germany, announces the availability of the first four Rippler Memory Kits. The name Rippler stands for a new Heatsink designed especially for the overclocking community. The German Exceleram Team completed the development and the Rippler Series is ready to ship now. First shipments are leaving the German warehouse this week. The Rippler Series will be expanded during the next weeks.

"We already have customer requests for other Rippler Kits and we will consider them of course." said Martim Reis Silva - Sales Director Exceleram. As a goody, there are also 2 highend kits with black 8layer PCB available. In the beginning the memory will be delivered in a noble aluminiumbox instead of plastic blister.

Mushkin, a global leader in high-performance computer products, announced today the release of 'Redline Ridgeback', a new variation on a heatsink that has become a staple in the high-performance and overclocking communities. Because of its aggressive yet sleek design and incredible heat dissipation qualities, enthusiasts the world over have demanded the Ridgeback heatsink for their memory cooling needs. Now, this exciting piece of technology has been prepared for Mushkin's world-renowned Redline Series with an engaging and strong blood-red appearance.

"The Ridgeback Project has been an exciting project for both myself and our marketing department. Because of Ridgeback's success, we wanted to offer the cooling technology with a sharp new look, and to give customers new aesthetic options. Case modders and system builders now have a striking new look available to them when using Ridgeback. Redline has always been Mushkin's premier memory line, and we're happy to add Ridgeback to its mix. Our new blood-red Ridgeback heatsinks scream 'performance' and offer it in every respect." - Brian Flood, director of product development.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Xtreme Thermal Exchange (XTE) and Blade 2 high-speed desktop memory, providing the optimal balance of blazing DDR3 performance and cooling efficiency in one solution. Committed to staying ahead of the curve in the high performance segment of the memory market, OCZ is offering high-end memory that keeps pace with intensive overclocking, gaming, and other high-productivity computing environments.

"Building on our previous lines of enthusiast overclocking memory, the new XTE and Blade 2 DDR3 memory series are designed to set the benchmark once again and deliver the ultimate in performance and stability," said Alex Mei, CMO of OCZ Technology Group. "Featuring new compact, yet highly efficient heatspreader designs, these hand-tested kits are the ideal solution for overclockers gaming and productivity applications, and are optimized for the latest generation of platforms from Intel and AMD."

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced that it was once again selected as 2010's Best PSU and Best Memory Manufacturer by the readers of Custom PC magazine and bit-tech.net, two of the most respected technology publications in the United Kingdom.

The awards were voted for by Custom PC and bit-tech's audience of performance PC enthusiasts, overclockers and gamers. Choosing the companies they judged to have excelled in 2010, Corsair emerged as the clear victor in both the power supply and memory categories.

Power Quotient International (PQI) has released a series of DDR3 server memory modules in response to the advent of cloud computing. DDR3 Registered/ECC server memory modules are powerful additions to PQI's Power Memory product range and symbolize the technical strength and product integrity of PQI memory modules for enterprise applications. DDR3 Registered/ECC server memory modules continuously undergo complete, complex, and rigorous integrity tests to provide both stable and compatible memory solutions that increase performance and ensure the stability of servers and workstations under year-round, high-speed data processing conditions.

DDR3 Registered/ECC server memory modules consist of carefully selected, originally manufactured DRAM IC's paired with PLL (Phase-Lock Loop) chips made by a well-known manufacturer, as well as high specification PCB's, in order to achieve PQI's main objective: high quality. In particular, the DDR3 1333's 32GB/s (tri-channel mode) transmission bandwidth server memory module is capable of meeting the most demanding server environments and enhancing the overall performance of high-end computing systems.

ASUS has announced the latest addition to its Fermi series of DirectX 11 graphics cards with ENGT430/DI/1GD3 (LP). Powered by the NVIDIA GeForce GT430 graphics processor, the ASUS-designed PCI-Express 2.0 ENGT430/DI/1GD3 (LP) card is ideal for home theatre enthusiasts and casual gamers. Built using a specially designed low profile PCB (printed circuit board), the ASUS ENGT430 includes NVIDIA PureVideo engine that accelerates even Blu-ray 3D media. Its use of the highest quality components, including ASUS Dust-Proof fan, GPU Guard, and Fuse Protection ensures that the ASUS ENGT430 remains stable and reliable for long-term use.

Barely a week after pictures of AMD's "Barts" prototype surfaced, it wasn't long before a specifications sheet followed. The all-important slide from AMD's presentation to its add-in board partners made it to sections of the Chinese media. "Barts" is a successor to "Juniper", on which are based the Radeon HD 5750 and HD 5770. The specs sheet reveals that while indeed the GPU looks to be larger physically, there are other factors that make it big:

Memory Controller
Barts has a 256-bit wide memory interface, which significantly increases its pin-count, and package-size. The "Pro" and "XT" variants (which will go on to be HD 6x50 and HD 6x70, respectively), have memory clocked at 1000 MHz and 1200 MHz, respectively, so that's nearly 100% increase in memory bandwidth .

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has expanded its 'Green Memory' initiative going beyond DRAM and solid state drives (SSDs) to include several memory products for PC and mobile application areas. At the seventh annual Samsung Mobile Solutions Forum being held here today, Samsung announced that its 'Green Memory' initiative will now include Samsung LPDDR2 and GDDR5 green memory as well as its GreenDDR3 and Green SSDs.

Stepping up its efforts to increase worldwide interest in Green IT products and eco-friendly solutions, a new website has been launched to promote the expanded initiative to OEM customers and consumers. It provides detailed information on Samsung's green product strategies and green-focused partners, for all three market areas, as well as industry-wide green IT trends.

Toshiba America Electronic Components, Inc. and its parent company Toshiba Corporation, a leading innovator in NAND flash memory technologies and solutions, today announced the launch of 8GB (gigabyte) 16GB and 32GB SDHC UHS-I cards compliant with the SD Memory Card Standard Ver. 3.0 (SD 3.0), UHS104. These new SD cards offer the world's fastest SDHC data read and write speeds.

Toshiba also extended its industry leadership in memory card solutions by unveiling the world's first 4GB, 8GB and 16GB microSDHC UHS-I cards compliant with (SD 3.0), UHS50. Mass production of the new SDHC UHS-I cards and sample shipments of the new microSDHC UHS-I cards will start this November.

Toshiba Corporation, reinforcing its leadership in the development and fabrication of cutting-edge, high density NAND flash memories, has announced that it today started mass production of NAND flash memories fabricated with 24nm*1 process technology. This latest technology advance has already been applied to 2bit-per-cell 64-gigabit (Gb) chips that are the world's smallest and offer the highest density on a single chip (8 gigabytes (GB))*2, and which are available from today. Toshiba will also add 32Gb and 3bit per cell products fabricated with the 24nm process technology to its product line-up.

Toshiba leads the industry in fabricating high density, small die size NAND flash memory chips. Application of the 24nm generation process technology will further shrink chip size, allowing Toshiba to boost productivity and bring further enhancements to high density, small sized products. The 24nm process products are also equipped with Toggle DDR, which enhances data transfer speed.

Lexar Media, a leading global provider of memory products for digital media, today announced Crucial Ballistix high-performance memory modules with thermal sensor and temperature-monitoring utility, encased in a radically redesigned and more effective heat spreader. The thermal sensor and monitoring utility allow PC enthusiasts to view memory module temperature in real time, a major benefit for overclockers and enthusiast users constantly battling against excessive system heat. Additionally, the new Crucial Ballistix modules feature a redesigned "finned" heat spreader design that reduces memory module temperature by up to 30% more than the current Crucial Ballistix design. The new Crucial Ballistix modules are initially available exclusively at popular online retailer Newegg.com.

"Ask any PC enthusiast and they'll tell you that system heat is a constant concern," said Crucial Ballistix senior product manager, Jeremy Mortenson. "Our new Crucial Ballistix memory modules offer two incredibly effective tools in memory cooling: thermal sensors for temperature monitoring, and an improved heat spreader design."

Lexar Media, a leading global provider of memory products for digital media, today introduced 8GB Crucial DDR3-1066 (PC3-8500) CL9 very low-profile (VLP), ECC registered dual in-line memory modules (RDIMMs), enabling blade and low-profile server users to populate their systems with up to 144GB of memory, depending upon motherboard and processor configuration. Additionally, these new high-density, low-profile modules are guaranteed compatible with Intel Xeon processors based on the Nehalem architecture. The 8GB Crucial VLP RDIMM modules are available through select resellers worldwide and online.

VLP memory modules enable powerful and compact computing power within server systems, because they are designed to stand vertically in order to accommodate additional memory modules and enable improved system airflow. Blade servers, as well as servers utilized for virtualization, will benefit from these new high-density Crucial VLP modules.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products, today expanded their lineup of DDR3 memory solutions with the launch of its new ultra-high performance Viper II Series Sector 5 Edition Extreme Performance DDR3 memory for Intel P55 platforms.

Patriot Viper II Series Sector 5 Edition modules pass a thorough qualification and screening process on multiple high-performance motherboards using the Intel P55 chipset platforms and Intel Core i7 CPUs to ensure performance at 2500MHz with latency timings of 9-11-9-27. These modules are targeted and designed specifically for performance enthusiasts and overclockers looking to set new benchmark records and push the boundaries of computing performance.

Intel Corporation today culminated the transition to the company's award-winning "Nehalem" chip design with the launch of the Intel Xeon 7500 processor series. In less than 90 days, Intel has introduced all-new 2010 PC, laptop and server processors that increase energy efficiency and computing speed and include a multitude of new features that make computers more intelligent, flexible and reliable.

Expandable to include from two to 256 chips per server, the new Intel Xeon processors have an average performance three times that of Intel's existing Xeon 7400 series on common, leading enterprise benchmarks, and come equipped with more than 20 new reliability features.

Walton Chaintech, one of the world's most well-known memory and storage device manufacturers, announces the availability of its latest memory clock that can reach a memory speed of 2400MHz. To address consumers' diversifying high-speed computing platform needs, this new clock is the industry's fastest computing clock with a transmission bandwidth of 19,200MB/sec per transmission. No more will users be restricted by memory bandwidth when faced with system overclocking, they will be able to maximize their computing systems' performance and potential.

The all-new APOGEE GT DDR3-2400 memory utilizes a 1.6V voltage and 9-11-10-27 timing operation process. Not only is this more powerful than many products currently in the market, different users' requests can be met as Walton Chaintech provides two-in-one KIT packs that are compatible with the widely-used dual-channel motherboards. Users do not have to worry about modular selection; system compatibility is enhanced because the KIT provides two types of capacities, 1GB x2 and 2GB x2, giving users more flexibility.