Swayed by all the recently released "Green" products, GeIL today launched a series of green DDR2 memory modules rated to work at 1.6V, lower than the standard 1.8V. Also, the packaging of the Green Series is said to be made of recycled paper pulp. All modules are enhanced with a lifetime warranty as well.

Patriot Memory, a global provider of premium memory module and flash memory solutions, announced today the release of their DDR2 Quad Channel 8GB Kits.

In today's complex, multi-task world, it is becoming increasingly important to be able to switch between scenerios, and still maintain enough memory to run multiple applications," says Saeed Arash Far, Patriot Memory's Technical Marketing Engineering Manager.

Known by computer enthusiasts to be the company with some top quality PC coolers, Xigmatek, has a new product up its sleeve: the Dragoon N422 memory module heatsink cooler. The cooler serves as a replacement for the heatspreaders or stock-heatsinks memory modules come with. It can latch onto most standard-sized 240-pin DDR2 and DDR3 modules.

The cooler consists of two units that dissipate heat from either sides of the module. Each unit consists of a metal plate that makes contact with the module. The plate itself propagates into an arrangement of aluminum fins, but the interesting component is the copper heatpipe that runs through the length of the plate. The heatpipe makes direct contact the memory chips, and conveys heat to a small yet dense aluminum fin array. Two such plates are latched onto a module using screws. The total weight of the cooler per module (two plates) is 105g. It measures 131.1 (L) x 76.5 (W) x 9.6 (H) mm. Due to its design, the cooler can be used only on double-sided modules (modules with DRAM chips on both sides). The Dragoon N422 is yet to reach retail channels so we could tell its price.

Patriot Memory, a global provider of premium memory module and flash memory solutions, announced today the release of their DDR3 Tri Channel Signature Kits.

"With today's economy, 'value' has become even a greater concern for the consumer. Patriot Memory plans on making sure we provide solutions that provide value and the high quality that has made Patriot Memory a leader in the memory industry," says JR Wakabayashi, Marketing Manager for Patriot Memory.

Coming in kits of 3GB (3 x 1GB) and 6GB (3 x 2GB), Patriot's Signature Tri Channel is being offered at 1066MHZ, Cas Latency 7. The Patriot Tri Channel is compatible with all current X58 DDR3 motherboards.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology and the leading producer of high-end graphics memory, announced today that it has begun mass producing GDDR5 graphics memory using 50-nanometer class process technology.

"Our early 2009 introduction of GDDR5 chips will help us to meet the growing demand for higher performance graphics memory in PCs, graphic cards and game consoles," said Mueez Deen, director, mobile and graphics memory, Samsung Semiconductor, Inc. "Because GDDR5 is the fastest and highest performing memory in the world, we're able to improve the gaming experience with it across all platforms," he added.

Toshiba Corporation today announced the prototype of a new FeRAM -Ferroelectric Random Access Memory-that redefines industry benchmarks for density and operating speed. The new chip realizes storage of 128-megabits and read and write speeds of 1.6-gigabytes a second, the most advanced combination of performance and density yet achieved. Full details of the new FeRAM will be presented this week at the International Solid-State Circuits Conference 2009 (ISSCC2009) in San Francisco, USA.

Mushkin, one of the leading manufacturers of high performance computer components, announces the availability of a new DDR3 Triple-Channel-Kit. It's called: "998679r" and is equipped with 6GB and a high frequency of 1600 MHz. The memory will be delivered in a noble aluminium case assembled with unqiue "radioactive" heatspreaders.
"This kit is the ultimate combination of newest technology and fancy design." Proclaims Steffen Eisenstein, CEO of Mushkin Logistic GmbH very proudly, and continues: "The response for the "radioactive" heatspreader was huge, now we will have a hell of a party on DDR3!"

Transcend Information Inc., a global leader in the manufacture of high performance memory modules, is proud to unveil 4GB aXeRam DDR3-1800 memory upgrade kits. Designed specifically for hard-core gamers using only top-binned, premium quality DRAM chips and custom high-purity aluminum heat sinks with cooling fins, aXeRam DDR3-1800 dual-channel kits deliver amazing high-speed overclocking performance while maintaining cool temperatures and rock-solid system stability.

Transcend's 4GB aXeRam DDR3-1800 kit's two identically-matched 240-pin unbuffered 2GB DDR3 1800MHz DIMMs are carefully paired for use in dual-channel configuration, which together provide memory bandwidth of up to 28.8GB/s. To ensure extra-stability and signal integrity at high clock speeds, all aXeRam modules use robust eight-layer PCBs that fully comply with JEDEC standards. The aXeRam 128Mx8 DDR3 DRAM chips are selected with the strictest quality and performance standards and are manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages to assure better thermal dissipation, electrical efficiency and improved overclocking performance. Transcend's aXeRam DDR3-1800 modules also support new Intel Extreme Memory Profile (XMP) technology, which allows users with high-performance motherboards to easily overclock their memory with aXerRam's built-in aggressive speed-maximized profiles, or manually input their own memory timing parameters to take their system to the next level.

A-DATA Technology Co. Ltd., a worldwide leading manufacturer in high performance memory products, announced today that its XPG DDR3 memory modules have broken a new world record on SuperPi 32m. The record was set by utilizing the DFI Lanparty UT X58 motherboard and XPG X Series v2.0 memory, the DDR3-2133X v2.0 2GBx3 triple-channel kit.
The SuperPi 32m record of 6min 40sec 360ms was achieved at a speed of 2237 MHz and latency settings of 8-7-7-21 using DDR3-2133X v2.0 2GBx3 triple-channel kit.

SanDisk Corporation and Sony Corporation today announced the joint development of two expanded formats that will shape the flash memory landscape for years to come. "Memory Stick format for Extended High Capacity (Tentative name)" expands the "Memory Stick PRO" format series to achieve a maximum storage capacity of 2-terabytes (TB), while the "Memory Stick HG Micro" format enables a maximum data-transfer speed of 60 megabytes per second (MB/s), making it one of the fastest-smallest memory card formats to date. Format licensing corresponding to the "Memory Stick format for Extended High Capacity" and the "Memory Stick HG Micro" is scheduled to start in 2009.

Lexar Media, a leading global provider of memory products for digital media, today announced the immediate availability of Crucial Ballistix Tracer DDR3-1333 (PC3-10600) memory modules in three vibrant new colors - green, blue and red. Performance memory enthusiasts and system modders can choose from a variety of Crucial Ballistix Tracer module colors to match their case color scheme or to suit their individual style. The new color modules are available in 3GB and 6GB kits through select resellers worldwide and directly from Crucial's website here.

Lexar Media, a leading global provider of memory products for digital media, today announced the immediate availability of Ballistix DDR3-1333 (PC3-10600) and DDR3-1600 (PC3-12800) three channel DDR3 memory kits. These new kits support the latest Intel chipset technology, based on the Core i7 processors. Ballistix three channel DDR3 memory kits are available in 3GB and 6GB kits through select resellers and directly from Crucial's website.

G.Skill International Co. Ltd., a world leader in extreme performance memory with solid quality, today announces Triple Channel DDR3 2000HMz performance memory at enhanced CL 7-8-7 timings and is designed for the latest Intel Core i7 processors / Intel X58 Express Chipset. This combination affords unparalleled performance margins allowing for the very best Overclocking and memory bandwidth.

A team at Rice University has determined that a strip of graphite only 10 atoms thick can serve as the basic element in a new type of memory, making massive amounts of storage available for computers, handheld media players, cell phones and cameras. In new research available online in Nature Materials, Rice professor James Tour and postdoctoral researchers Yubao Li and Alexander Sinitskii describe a solid-state device that takes advantage of the conducting properties of graphene. Tour said such a device would have many advantages over today's state-of-the-art flash memory and other new technologies. Graphene memory would increase the amount of storage in a two-dimensional array by a factor of five, he said, as individual bits could be made smaller than 10 nanometers, compared to the 45-nanometer circuitry in today's flash memory chips. The new switches can be controlled by two terminals instead of three, as in current chips.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today introduced the Blade Series Triple Channel Memory kit, the latest maximum-performance RAM designed specifically for the Intel Core i7 processor / Intel X58 Express Chipset. At DDR3-2000 CL 7-8-7, the Blade Series harnesses industry-leading speeds at the low voltage required to safely run Core i7's triple channel mode. With the ideal combination of all the factors that formulate the ultimate memory solution- density, speed, latency, and an effective new cooling design-the Blade 2000 kit is guaranteed to please enthusiasts looking to take the hottest Intel platform to new heights.

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the Flex EX memory series, featuring breakneck speeds demanded by enthusiasts in an updated compact form factor to maximize memory configurations on your motherboard. These premium high-density modules operate at incredibly fast DDR2 and DDR3 speeds to run the latest memory-intensive games and applications, and offer enthusiasts the thermal management necessary for the stability and performance on high-end gaming and overclocking systems.

Unveiled minutes ago, Corsair is now preparing a brand new series of blazing-fast tri-channel DDR3 DOMINATOR GT modules. Just like a modern fast car, these modules have their own distinctive marks - black and red heatspreaders and special red labels. Initially, Corsair is going to launch a kit that consists of three 2GB modules operating at 2,000MHz at just 1.65V with low latencies of CL7-8-7-20. The new modules are set to become available in "very near future".

Elpida Memory today announced that it had completed development of a 50nm process 2-gigabit Mobile RAM product using 50nm process technology with 193nm (ArF) immersion lithography and copper interconnect. The ultra low-power features of Mobile RAM are ideal for use in mobile phones, portable multimedia devices, portable internet-related devices and other handheld device applications. In its development of Mobile RAM Elpida has focused on conserving electric current. Compared with 70nm products the new 50nm product uses less than half the data retention current and half the operating current. These enhanced features enable double the memory capacity without an increase in system power consumption.

Memory maker A-DATA Technology announced today its latest A-DATA XPG DDR3-1800+ memory kits. Part of the Plus series, these kits are available now in both 2x1GB and 2x2GB dual channel kits, and in triple channel retail packages of 3x1GB and 3x2GB. The kits are JEDEC programmed to operate using CL9-9-9-24 timings, but despite that A-DATA claims flawless operation using CL8-8-8-24 at 1.65V-1.85V. In addition A-DATA ships these kits with limited lifetime warranty and shiny red heatspreaders. For more information, please read the full press release here.

Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that its Board of Directors has decided to acquire a portion of the shares its strategic partner Powerchip Semiconductor Corporation (PSC) owns in Rexchip Electronics Corporation (Rexchip), a Taiwan-based manufacturing joint venture created by PSC and Elpida. Details of the share acquisition appear below.

GeIL Memory USA debuts today no less than 22 new triple-channel DDR3 kits, yes twenty two indeed. These kits are part of the company's Value and Utra series. All kits come with lifetime warranty and aluminum heatspreaders. The full list of all memory kits follows below.

Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has completed development of a 50nm process DDR3 SDRAM. The new DRAM product features the lowest power consumption in the industry, 2.5Gbps ultra high speed and a 1.2V low voltage operation based on the industry's smallest chip size. The new 50nm process DDR3 SDRAM was developed using the industry's most advanced 193nm (ArF) immersion lithography technology and copper interconnect technology and has a chip size of less than 40mm2. Also, the new SDRAM is an eco-friendly DRAM. It operates on not only DDR3 standard 1.5V supply voltage but even lower voltages of 1.35V and 1.2V and contributes to the low-power operations of high-density memory systems such as servers and data centers.

Lexar Media, a leading global provider of memory products for digital media, today announced the immediate availability of Crucial DDR3-1066 (PC3-8500) and DDR3-1333 (PC3-10600) three channel memory kits in support of Intel's next generation Core i7 processors. Users ready to harness the power of three channel memory can find guaranteed-compatible Crucial DDR3 modules in 3GB, 6GB and 12GB kits at Crucial.

Intel Corporation and Micron Technology Inc. today announced mass production of their jointly developed 34nm, 32 gigabit multi-level cell (MLC) NAND flash memory device. Developed and manufactured by the companies' NAND flash joint venture, IM Flash Technologies (IMFT), the process technology is the most advanced process available on the market and enables the industry's only monolithic 32 Gb NAND chip that fits into a standard 48-lead thin small-outline package (TSOP). The companies are ahead of schedule with 34nm NAND production, expecting their Lehi facility to have transitioned more than 50 percent of its capacity to 34nm by year's end.

GeIL Memory has just released the new EVO Cyclone memory cooler. At first sight this cooler is like most other similar solutions on the market, but it has one unique feature. The single fan that cools the memory has a LED display and embedded thermal sensor, that displays the surrounding temperature and real-time fan speed. Apart from this, the 50mm cooler spins at 3400rpm and produces only 21dBa noise. The EVO Cyclone also comes with a height-adjustable clip designed that fits even memory modules with large heatsinks. GeIL is expected to ship the EVO Cyclone in the weeks to come. To learn more about the product, please go to this page.