Thermaltake, a leading PC DIY brand for premium hardware solutions, releases the Arcus 380 TG ARGB Mid-Tower Chassis, designed to showcase high-performance hardware through its distinctive panoramic design. A one-piece curved tempered glass panel creates an expansive view of the interior, while five pre-installed Infinity ARGB PWM fans provide vibrant lighting and efficient airflow. Available in Black and Snow editions, the Arcus 380 TG ARGB also features a dual-chamber layout and support for back-connect motherboards, offering a balance of visual appeal and practical functionality.

Curved Tempered Glass for Panoramic Views
The Arcus 380 TG ARGB features a one-piece curved tempered glass panel that wraps around the front and side, providing an uninterrupted view of the internal hardware. Its dual-chamber structure separates key components from cable management areas, keeping the main compartment visually clean. With its expansive glass design, the chassis puts the focus on the hardware and lighting inside.

Cooler Master today announced the QUBE 540 Stainless Steel, combining stainless steel panels with a chassis that adapts to different hardware configurations and workspaces. The case supports ATX motherboards, graphics cards up to 415 mm long without front fans installed, and horizontal or vertical placement. QUBE 540 Stainless Steel is available now on the Cooler Master website in North America.

This special edition uses SUS304 stainless steel panels for corrosion resistance and rigidity. Custom forming tools preserve the QUBE 540's geometry, while two surface treatments serve different purposes: an 8K mirror-polished exterior creates a reflective surface, while the interior's matte hairline finish provides a subtle contrast and helps make minor handling marks less noticeable.

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly introduces the MANO330, a compact Thin Mini-ITX motherboard powered by the Intel Processor N97 or N150 and DDR5 memory. Designed for space-constrained systems that require flexible connectivity and expansion, the MANO330 combines multi-display capability, dual LAN connectivity, versatile M.2 expansion, and industrial I/O in a compact platform. With a wide 12-24 VDC power input, the MANO330 provides system developers with a flexible foundation for smart manufacturing and industrial automation, digital signage, smart retail, and POS applications.

Compact Performance for Space-Constrained Systems
The MANO330 combines a compact Thin Mini-ITX design with Intel Processor N97 or N150 and DDR5-4800 memory support. The N97 supports up to 32 GB of memory, while the N150 supports up to 16 GB. Measuring just 170 x 170 mm, the MANO330 provides the essential computing performance and I/O capabilities needed for embedded systems, helping developers build space-efficient solutions for a wide range of industrial and commercial applications.

Zalman has launched two new mid-tower cases, the S6 Black and S6 V2 Black, with identical dimensions of 412 x 215 x 486 mm and the same core specifications. The only difference between them is that the V2 Black includes two additional 120 mm RGB fans mounted at the top. Both PC cases support ATX, microATX, and Mini-ITX motherboards, feature seven PCIe slots, up to 345 mm GPU clearance, and CPU cooler height up to 165 mm. For storage, there is one 3.5-inch HDD bay, three 2.5-inch SSD bays, and one combo bay. Fan support is generous, up to three 120/140 mm at the front, two 120/140 mm at the top, two 120 mm at the bottom, and one 120 mm at the rear. The S6 Black ships with three fixed-RGB 140 mm front fans and one fixed-RGB 120 mm rear fan. As already stated, the S6 V2 Black adds two fixed-RGB 120 mm fans at the top. Radiator support goes up to 360 mm at the front, 240 mm at the top, and 120 mm at the rear.

Both cases feature a mesh front panel, tempered glass side panel, magnetic top dust filter, and additional filters at the front and bottom. For cable management users gets 22 mm of clearance behind the motherboard tray. Front I/O includes USB-C, one USB 3.0, two USB 2.0, HD audio, and separate power and RGB buttons. The S6 Black is listed at $79.99 on Zalman USA. The S6 V2 Black doesn't have an official price yet, though the small difference in included fans suggests something around $89.

Akasa, a leading provider of thermal solutions, introduced the Euler MX2, a premium aluminium fanless case for Mini-ITX motherboards. It supports Intel LGA1851, LGA1700, LGA1200 and LGA115X socket-based processors up to 35 W TDP and pairs an integrated 220 W DC-to-DC power converter with two internal 2.5" SATA drive bays. The Euler MX2 suits commercial systems that run unattended, such as industrial automation, point-of-sale (POS) and kiosks, surveillance, digital signage, and long-life edge computing.

Akasa's patented spring-loaded mounting system gives the Euler MX2 wide compatibility with Mini-ITX form factor motherboards and consistent, stable thermal contact across the supported socket range. The case supports Intel Core (8th-14th Gen) and Core Ultra (15th Gen) processors up to 35 W TDP. Its fully passive aluminium chassis dissipates heat from the CPU through the external fins. With no fans, the system minimizes noise and mechanical points of failure.

Thermaltake, a leading PC DIY brand for premium hardware solutions, introduces the Stage 500 TG ARGB Mid Tower Chassis, designed to bring PC hardware and personal collections together in one showcase. Available in Black and Snow editions, the Stage 500 TG ARGB features a one-piece curved tempered glass panel, a dedicated display stage, a wooden base, and an integrated bottom light strip, creating a distinctive presentation that blends modern PC hardware with personalized aesthetics.

Curved Tempered Glass Creates Panoramic Views
The Stage 500 TG ARGB features a one-piece curved tempered glass panel that extends across the front and side, providing an uninterrupted panoramic view of the hardware and display area inside. The curved design minimizes visual separation and puts every detail of the build on display.

ASRock Industrial proudly presents its latest lineup of industrial edge computing platform powered by Intel Core Series 3 processors (Wildcat Lake-U), designed to bring power-efficient computing and integrated AI acceleration to mainstream industrial and embedded edge applications. Featuring integrated CPU, GPU, and NPU compute engines with up to 40 platform TOPS, the new platforms support up to 64 GB DDR5 6400 MHz memory, high-speed expansion and storage, rich I/O connectivity, and multi-display capabilities. Spanning industrial motherboards, NUC motherboards, and compact NUC BOX systems, ASRock Industrial's Intel Core Series 3 portfolio provides right-sized computing options for industrial control, HMI, intelligent gateways, smart retail, digital signage, and other mainstream edge applications.

NUC Core 300 BOX Series: Compact, Power-Efficient Edge Computing
The NUC BOX-320 and NUC BOX-304 integrate Intel Core Series 3 processors into compact fanned embedded BOX PCs, powered by the Intel Core 5 processor 320 and Intel Core 3 processor 304, respectively. The systems support up to 64 GB of single-channel DDR5 6400 MHz memory with In-Band ECC. For expansion, the systems provide one M.2 Key E (2230) slot with Wi-Fi 6E and Bluetooth 5.3 for wireless connectivity. Networking includes one Intel 2.5 Gigabit LAN and one Realtek 2.5 Gigabit LAN. Storage configuration includes one M.2 Key M (2242) slot with PCIe Gen 4 x1 and one M.2 Key M (2242/2280) slot with PCIe Gen 4 x2 for SSDs. I/O connectivity includes two USB 3.2 Gen2x2 Type-C and three USB 3.2 Gen 1 Type-A ports. The series supports triple-display output up to 4K through two HDMI 2.1 and DisplayPort 1.4a outputs from Type-C. Intel PTT and a 19 V/90 W power adapter further support secure, ready-to-deploy system integration. Built in a compact 117.5 x 110 x 49 mm fanned chassis with VESA mounting support, the NUC Core 300 BOX Series provides a space-efficient computing platform for smart retail, digital signage, kiosks, HMI, and other mainstream edge applications.

BIOSTAR, a leading manufacturer of consumer and industrial motherboards, edge computing solutions, graphics cards, and storage devices, is currently presenting its latest innovations at Embedded World North America 2026, running from September 22 to 24 at the Anaheim Convention Center in California, USA. At Hall B, Booth 6512, BIOSTAR is spotlighting its comprehensive industrial motherboards, advanced EdgeComp systems, and a cutting-edge EdgeComp MT-N150 DX-M1 edge AI demonstration, delivering high-performance computing solutions tailored for smart manufacturing, smart cities, and smart retail applications.

BIOSTAR's industrial motherboard lineup features the BIW88-AHS, BIH61-AHA, BIPTL-IHT, BITWL-IHT, BIWCL-IHT, BIWCL-PAT, BIRPL-PAT, and BIAST-PAT, offering a versatile range of computing platforms, form factors, and connectivity options for embedded system development. Highlights include the BIW88-AHS, which combines the Intel W880 platform with support for Intel Core Ultra 200 series processors, DDR5 ECC and non-ECC memory, and four 2.5GbE LAN ports. The BIPTL-IHT features the Intel Panther Lake-H platform, DDR5 memory, and quad-display support, while the Wildcat Lake-based BIWCL-IHT and BIWCL-PAT provide Mini-ITX and 3.5-inch single-board computer options, respectively.

DFI, a Qisda Group company and a global leader in embedded motherboards and industrial computers, introduces the ARH171/ARH173, expanding its AI-ready portfolio with a Mini-ITX platform built for space-constrained, mission-critical deployments. Powered by Intel technologies, the ARH171/ARH173 is purpose-built to handle demanding Physical AI workloads from perception to reasoning, enabling next-generation smart logistics and industrial automation.

As Physical AI transitions to operational deployment, intralogistics is driving rapid mobile automation adoption. Mordor Intelligence projects the autonomous mobile robot (AMR) market to expand at a CAGR of nearly 15% through 2029 to counter labor shortages, while advanced systems like 3D cube storage robots require on-device AI to navigate floors, climb racks, and process dense sensor streams in real time.

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly introduces the GMB150, a next-generation Mini-ITX gaming motherboard powered by the latest AMD Ryzen Embedded P100 Series processors. As one of the first Mini-ITX gaming motherboards built on this new platform, the GMB150 combines advanced AMD "Zen 5" architecture, RDNA 3.5 graphics, and the AMD XDNA 2 AI engine into a single SoC, delivering up to 80 TOPS of heterogeneous AI computing performance.

Designed to meet the evolving needs of AI-powered electronic gaming machines, the GMB150 combines AI computing, gaming-specific peripheral integration, and hardware-level security in a compact Mini-ITX platform while maintaining the flexibility to support a wide range of intelligent edge applications. Leveraging the latest AMD Ryzen Embedded P100 Series platform, the GMB150 enables gaming OEMs to build more intelligent, secure, and future-ready electronic gaming machines through AI acceleration, advanced graphics, and trusted security.

SilverStone showcased the ALTA T2 case prototype at Computex earlier this year and is now getting a proper introduction as a super tower built specifically for multi-GPU workstations and high-density AI compute setups. The chassis is constructed from 3 to 8 mm thick aluminium, measuring 260 x 732 x 660 mm and 125.6 liters volume. Motherboard support is extensive, covering XL-ATX, SSI-EEB, SSI-CEB, E-ATX, ATX, microATX, and Mini-ITX formats with no less than eleven PCIe expansion slots for multi-GPU configurations. GPU clearance goes up to 411 mm, and the case includes a graphics cardholder to keep heavy cards in place. SilverStone ALTA T2 cooling features are impressive, using a vertical chimney airflow layout with up to three 420 mm radiators, two large 180 mm intake fans, and multiple additional fan positions. A distro plate mounting bracket is also included for custom loop builds.

For storage, the case supports 5.25-inch, 3.5-inch, and 2.5-inch devices, with a drive cage that includes a fan mounting system. Power delivery is handled by a dual-PSU setup, with an ATX or 2U CRPS as the primary and a standard ATX as the secondary, useful for kilowatt-class systems that need headroom beyond what a single PSU can provide. Front I/O features two USB Type-C ports, two USB 3.0 ports, and a combo audio jack. No pricing has been announced yet for the ALTA T2.

AAEON, a leading producer of industrial motherboards, has announced the release of the MIX-Q870A1, a sophisticated Mini-ITX motherboard supporting up to 65 W Intel Core Ultra 200S Series LGA 1851 socket-type processors (formerly Arrow Lake). Compatible with a broad selection of SKUs from the second generation of Intel Core Ultra processor range, the MIX-Q870A1 can leverage the platform's integrated NPU and Xe LPG Graphics for AI acceleration for a total of 36 TOPS alongside optimized multitasking and multicore performance.

A particularly notable inclusion among the MIX-Q870A1's specifications is its 16-lane PCIe Gen 5 slot with bifurcation, which can be split into x16, x8/x8, or x8/x4/x4 configurations through a dedicated jumper. This addition provides a modular foundation for the installation of expansion cards based on project need, meaning that even when equipped with a GPU to bolster the AI acceleration offered by the board's Intel Core Ultra platform, the remaining lanes of its PCIe slot can be used to accommodate additional modules like NVMe SSDs, NICs, frame grabbers, or field bus interface cards.

Cougar has launched the CFV220 RGB, a mid-tower ATX case first shown at Computex 2026 back in June, as we reported here. The chassis, a slightly more compact version of the existing CVF235, measures 235 x 504 x 446 mm with three tempered glass panels and a ventilated lower intake chamber with integrated ARGB lighting. The CFV220 RGB supports Mini-ITX, microATX, ATX, and back-connector motherboards. For cooling it comes with three pre-installed 120 mm ARGB PWM fans, two in the bottom intake and one at the rear. All three fans are running up to 2200 RPM with 5 V 3-pin ARGB and 4-pin PWM headers, syncing with the motherboard RGB. Users can install up to three fans, for a total of six fans, with the top supporting three 120 mm or two 140 mm fans and a 360 mm or 240 mm radiator.

Hardware clearances cover GPUs up to 420 mm, CPU coolers up to 170 mm, and PSUs up to 160 mm. For storage the case has one 3.5-inch bay and one 2.5-inch bay, with a second 2.5-inch bay available if you convert the 3.5-inch one. As with many mid-tower cases, it sports seven expansion slots. The front I/O panel has a USB 3.2 Gen 2x2 Type-C at 20 Gbps, two USB 3.0 Type-A ports, a combo audio jack, and an RGB button. A removable sliding dust filter covers the intake section. The CFV220 RGB case is available in black and white. Cougar hasn't announced its pricing.

Taiwan Commate Computer Inc. (COMMELL), a global leader in industrial single board computers, proudly introduces the LV-6718, a Mini-ITX mobile motherboard powered by Intel Core Ultra Series 3 Processors (PTL-H / Panther Lake-H Platform). Designed for next-generation industrial, edge AI, automation, and smart embedded applications, the LV-6718 delivers powerful computing performance, high-speed memory, advanced AI acceleration, rich I/O connectivity, and flexible display support in a compact Mini-ITX form factor.

Next-Generation Performance with DDR5 and AI Acceleration
The LV-6718 supports Intel Core Ultra Series 3 Processors with advanced 3D performance hybrid architecture, providing excellent computing efficiency for modern embedded workloads. With 2x DDR5 SO-DIMM slots supporting up to 128 GB at 7200 MHz, the LV-6718 offers high memory bandwidth for multitasking, data processing, industrial control, and AI applications.

Colorful today introduced the iGame B850I Mini OC V14, a fairly premium Socket AM5 motherboard in the Mini-ITX form-factor, which aesthetically matches its iGame Mini line of SFF-ready GeForce RTX 50-series graphics cards, including the very capable RTX 5070 Mini OC. The board draws power from a combination of 24-pin ATX and a single 8-pin EPS power connector; and conditions it for the CPU with a 9+2+1 phase VRM solution that uses 60 A DrMOS. The Socket AM5 SoC is wired to two reinforced DDR5 DIMM slots, and the board's sole expansion slot, a reinforced PCI-Express 5.0 x16. Both the M.2-2280 slots on this board—one on the obverse side, and the other reverse—are Gen 5, and wired to the processor in a way that they don't subtract lanes from the PEG slot.

The M.2 slot on the obverse side gets a chunky aluminium heatsink. Besides the two M.2 Gen 5 slots, you get two SATA 6 Gbps ports. USB connectivity includes a 20 Gbps USB 3.2 Gen 2x2 front-panel header, and two additional USB 3.2 Gen 1 ports from a separate front-panel header. The rear panel has one 10 Gbps USB 3.2 Gen 2 type-A, two 5 Gbps USB 3.2 Gen 1, and four USB 2.0. Display outputs include both HDMI and DisplayPort. Network connectivity includes Wi-Fi 7 and Bluetooth 5.4 from a MediaTek MT7925 160 MHz WLAN adapter, and a 5 GbE interface driven by a Realtek RTL8126-CG PHY. The onboard audio solution uses a Realtek ALC1200 HDA codec. The company didn't reveal pricing.

Rosewill today announced the FBM-Z Series, a new lineup of three microATX mini tower PC cases designed to simplify the building experience without compromising on style or performance. Each model ships with a pre-installed power supply and a tempered glass side panel, giving builders a strong, display-ready foundation from the moment they open the box. The FBM-Z Series is available now at Newegg and Amazon.

All three FBM-Z cases share a compact microATX/Mini-ITX compatible chassis constructed from durable steel, featuring a tempered glass left-side panel, integrated dust filters, a pre-installed 120 mm PWM rear fan, and front-mounted power supply placement to maximize interior clearance. Builders can support up to 170 mm CPU coolers and GPUs up to 340 mm, making each case ready for a wide range of modern components.

CASECOM brought a handful new cases to Computex 2026 that are variations on the theme of a flotation-effect upper compartment in a horizontally-partitioned layout. The C460A-01 features a mesh intake with a tempered glass side panel. The indentation that gives the upper compartment its floating effect goes about 2 inches inside. The case emasures 420 × 220 × 452 mm. The mid-tower has room for graphics cards up to 41 cm in length, and CPU coolers up to 17 cm in height. You can mount a 360 × 120 mm radiator along the top, and a 240 × 120 mm radiator along the front.

The CASECOM C460M-02 is a compacted version of the C460A-01, designed for microATX and Mini-ITX form-factors. The case is vertically compacted, but retains the depth and width of its sibling, which means you still get 41 cm of length clearance for your graphics card, but the maximum CPU cooler height is slightly reduced to 16.5 cm. The case measures 420 × 220 × 400 mm. Both cases feature ARGB LED illumination in the flotation-effect gap. Both cases come in black and white color variants. The company also has tempered glass variants, where the mesh front intakes makes way for a pillarless front-left edge, and a seamless tempered glass panel running across both sides. Both cases feature RGB controllers with RF remote controls.

Walking the Computex show floor, we stopped at the Apeer2 booth where the company had its ITX Case on display, an unusual Mini-ITX chassis that looks more like a concept at first glance, but is already up for preorder. The whole idea revolves around mounting your monitor directly onto the case instead of using a separate stand or arm. The integrated VESA extension has three fixed positions and supports height adjustment, tilt, and portrait rotation, essentially turning the case and monitor into a single unified desk unit. The main feature is the integrated VESA mount extension with three fixed positions, supporting height adjustment, tilt and portrait rotation. The case itself is made from anodized aluminium with magnetic side panels for tool-free access. Cable management clips are built in.

The case measures 266 × 222 × 478 mm, weighs 8.27 kg and has enough internal space for graphics cards up to 370 mm long. It can accommodate CPU coolers up to 95 mm tall and SFX/SFX-L power supplies up to 150 mm in length. 240 or 280 mm radiator support and two 80 mm and two 92 mm fans positions are available. Worth mentioning the perforated panels that should help with the airflow.

We have already covered some nifty innovative concepts at Cooler Master's Computex 2026 booth, but the brand is also debuting a new series of cases, ranging from compact affordable models to behemoth workstation cases with silent operation ambitions. Starting with the more affordable consumer case line-up, the Cooler Master Qube line-up is getting both an aesthetic and a size update, with new polished stainless steel and wood-trimmed versions of the Qube 540 E-ATX case, and a new compact Qube 340 case for Mini-ITX and microATX builds. Cooler Master is aiming to launch the Qube 340 at around $45-55 around late July, although an exact date is yet to be confirmed. Despite the small form factor, measuring in at just 386.1 × 230 × 429.4 mm, the Qube 340 has enough internal room for a full-size ATX PSU, up to four 2.5-inch drives, and a 3.5-inch drive bay. The Qube 340 features highly customizable, interchangeable panels and optional, customizable mesh panels. It also comes with a 140 mm non-ARGB fan pre-installed, and the front panel I/O features 2× USB 3.2 Gen 1 Type-A ports, 1× USB 3.2 Gen 2×2 Type-C port, and a 3.5 mm audio combo jack.

Cooler Master has also updated both its high-end gaming and workstation-grade cases, which have an emphasis on a clean aesthetic, low noise emissions, and hardware compatibility. The new Silencio 600 case is an updated version of the noise-optimized case that also prioritizes airflow, thanks to what Cooler Master describes as a noise trapping maze and a special fabric composite material that helps damp fan noise in the front panel. Behind that front panel, the Silencio case can fit up to two 180 mm fans. If high airflow is more your speed, Cooler Master is also showing off the HAF II 500, which is the latest iteration of the legendary HAF case, this time launching alongside a massive 40 mm thick 220 mm thick Mighty40 F220 fan—two of which will be able to be installed in the front intake of the new HAF II 500. The new HAF case will also be able to fit a single 180 × 40 mm exhaust fan in the rear exhaust position. The HAF II 500 is also expected to launch around the end of July 2026.

FPMAX is a Chinese company founded in 2016 operating mostly as an OEM/ODM supplier and component manufacturer. At the Computex 2026 show it presented its Apex PC cases portfolio and updated AIO liquid coolers. The Apex F1 is a mid-tower case measuring 441 × 286 × 490 mm. An interesting feature is the detachable feet that allow for vertical or horizontal orientations. It has curved tempered glass panels, seven expansion slots and supports for ATX/microATX/ITX motherboards. The case can accommodate up to eleven 120 mm fans, two 360 mm radiators (top/side), three 3.5-inch drives and one 2.5-inch drive.

The Apex M1 Mini-ITX mini-tower (345 × 276 × 274.5 mm) sports glass panels, three expansion slots, an SFX PSU mount, one 2.5-inch bay, and one 3.5-inch bay. It houses one 120 mm rear and two 120 mm front fans, with a Type-C and USB 3.0 front I/O.

Akasa came to Computex 2026 with a wide range of products like fanless cases, cooling, adapters, power and connectivity accessories. During our walk in the Akasa booth we first encountered an extensive lineup of passive enclosures. The fanless lineup covers Mini-ITX, Thin Mini-ITX, NUC, and Mini-STX formats targeting AI, IoT, edge, and industrial sectors with TDP support from 10 W to 65 W. The Plato RC is a 39 mm slim sub-1U case for NUC 14/15 Pro units while the Fermi CM5 is a 1U enclosure (185 × 93 × 43.6 mm) built for the 10 W Raspberry Pi CM5 IO board.

The Laplace K12 is a 1.07L Mini-STX option for Kontron hardware, while the Euler CMX Mini-ITX case features an embedded LCD display and 35 W TDP support. ASUS NUC 16 Pro units are accommodated by the Newton N16 (188.6 × 204 × 53.6 mm) up to 28 W.

YCC (Yeou Chih Corporation) showcased its 2026 gaming chassis lineup at Computex. The company is a Taiwanese OEM/ODM manufacturer established in 1995 having an extensive portfolio of PC cases, industrial rackmount chassis and power supplies. To draw attention, the company integrated genuine Swarovski crystals into a variant of its Slant 460 mid-tower chassis. Moreover, several alternative panel options adorned with these crystal accents were on display for those who can't get enough sparkle. Now going back to the PC cases, the Slant 460 measures 389 × 460 × 235 mm, has front and side tempered glass panels and seven expansion slots. For cooling it can accommodate up to seven 120 mm ARGB fans and two 360 mm radiators (top and bottom).

For ATX builds, YCC introduced the D-Cool series, a 446 × 422 × 285 mm dual-chamber mid-tower with a similar 270-degree view, seven expansion slots, top 360 mm radiator mount and up to no less than eleven 120 mm ARGB fans.

At Computex 2026, WizMax, the hardware brand of South Korean Hanmi Micronics, showcased a range of new PC chassis and its Calux aluminium keyboard. The new PC case lineup includes the Prism Max, Prism Pro, Ara Max, Lucent, Vista, Monochrome, and Artrian. The Prism Max is a dual-chamber ATX chassis with BTF motherboard support, three-sided glass panels, support for 410 mm graphics cards, and CPU coolers up to 175 mm tall. The Prism Pro offers a similar design in microATX and Mini-ITX form factors.

The Ara Max supports ATX-BTF motherboards, features a front-mounted PSU layout, clearance for 460 mm graphics cards and 160 mm CPU coolers, and supports up to a 360 mm top radiator. The Lucent and Vista models feature integrated temperature displays, support for ATX-BTF motherboards, graphics cards up to 470 mm long, CPU coolers up to 180 mm tall, and radiators up to 420 mm.

LIAN LI Industrial Co., Ltd., a leading manufacturer of chassis and PC accessories, announces the O11 VISION-M, a dual-chamber microATX chassis that blends panoramic three-sided glass presentation with improved airflow. Designed to retain the visual appeal of the O11 Vision series while addressing airflow limitations commonly associated with full-glass cases, the O11 VISION-M features a ventilated top-glass cut-out aligned with the radiator to improve cooling support. It also features a hidden AIO layout with dedicated tube-routing space, a removable center divider, and a pre-installed 140 mm fan in the second chamber to improve airflow to the radiator. Despite its compact footprint, the case supports up to 12 x 120 mm fans, 360 mm top radiators, 410 mm GPUs, 162 mm CPU air coolers, and 182 mm ATX power supplies.

EINAREX introduces the new EINAREX PULSE PM300, a compact microATX chassis designed for users who want high-performance hardware in a smaller and more transportable format without sacrificing airflow capability or modern compatibility. As gaming systems continue evolving toward cleaner and more space-efficient setups, the PM300 was developed to answer the growing demand for compact builds that remain practical for everyday gaming, creator workloads, LAN events, and flexible desktop environments. Its reduced footprint allows it to integrate naturally into smaller spaces while remaining capable of supporting powerful modern hardware configurations.

Built under the airflow-focused philosophy of the PULSE Series, the PM300 combines a compact structure with optimized ventilation and efficient internal organization to create a chassis that feels agile, practical, and purpose-driven. The PULSE PM300 is engineered around a compact and efficient internal layout that maximizes hardware compatibility while reducing unnecessary volume. Designed for microATX and Mini-ITX systems, the chassis provides a balanced structure that makes transportation and repositioning significantly easier compared to traditional mid-tower systems.