Micron, the US-based manufacturer of various kinds of memory technologies, has today announced some quite interesting products at its Computex 2021 keynote. For starters, the company has announced a new portfolio of products based on 176-layer NAND. There are currently two products listed that use this new technology and those are the Micron 3400 and 2450 M.2 NVMe SSDs. Based on the PCIe 4.0 interface, the 2450 SSD lineup is designed as a value-oriented solution that comes in M.2-2280, M.2-2242, and M.2-2230 sizes. It ranges from 256 GB to 1 TB in capacities, which are supposed to be priced as a value purchase.

In a contrast, the 3400 SSD is M.2-2280 design, meant for only the highest performance. The sequential read speeds go up to 6600 MB/s, while the sequential writes go up to 5000 MB/s (in the case of the 2 TB model). Capacities range from 512 GB to 2 TB and only the 1 TB and 2 TB variants have the 5000 MB/s write speeds, while the 512 GB version is capped at 3600 MB/s speed. Both SSD models are featuring a heat spreader on top of NAND chips and spot an in-house and Micron-developed NVMe 1.4 SSD controller. However, Micron does note that the company is free to use any 3rd party SSD controller as we are deep in component shortages with high demand for SSDs. You can get an in-depth look at the 2450 and 3400 M.2 SSDs from Micron's website.

Sabrent, which has become one of the go-tos in the world of Chia plotting and farming due to the price/performance/endurance ratio of its Rocket NVMe SSDs, has announced a new series of products specifically developed and marketed towards the Chia plotting crowds. Their new Plotripper SSDs (which drink from a quite obvious reference to AMD's Threadripper) have been designed to endure the harsh writing cycles for Chia plotting. Plotting is the process wherein you calculate the cryptographically-generated plots, and which can incur SSDs on a 1.6 TB write workload per 101 GB plot. The finished plot is then usually offloaded to a slow, capacious storage device (such as an external HDD) where it lays, awaiting for network challenges ad-infinitum. At time of writing, the total storage committed to Chia farming is estimated at 14 Exabytes.

The new Plotripper products are available in a mainstream and a "pro" variant. The mainstream Sabrent Plotripper offers a 10,000 TBW for its 2 TB capacity, which is already one of the highest available in consumer drives (until now). The Pro versions, however, promise 27,000 TBW of endurance for its 1 Tb capacity, and a staggering 54,000 TBW endurance rating for the 2 TB one. No word on pricing as of now, but these are sure to become some of the most sought-after SSDs for anyone planning to enter the Chia "farming" scene - and will definitely be priced accordingly.

Today at its Flash Perspective event, Western Digital Corp. unveiled three new SSDs for its WD_BLACK portfolio of products, providing gamers around the world with fast, high-performance storage solutions to upgrade their PC and next-gen console gaming experience.

"Our WD_BLACK brand delivers a clear and simple promise to gamers - fast and reliable storage that enhances their gameplay," said Rob Soderbery, executive vice president and GM, Flash Business, Western Digital. "With today's new products, the WD_BLACK portfolio has diverse flash-powered solutions so that every gamer - whether they're just starting out or more advanced - can explore the rich worlds of today's most inventive games."

Western Digital today introduced another addition to their PCIe 4.0 lineup - which previously consisted only on the WD Black 850, their enthusiast-level offering. Now, the Black 850 gets some entry-level company with the Black 750 SE, which makes use of a 4-channel DRAMless controller to keep the drive fed at some still respectable 3600 MB/s, Sequential Write, and 2830 MB/s Sequential Read speeds (WD isn't quoting the random read/write speeds just yet).

The new WD_Black SN750 SE will start at $49.99 for the 250 GB model. Pricing on the 500 GB and 1 TB capacities hasn't been announced at time of writing, nor is there a mention of a 2 TB model being a part of the current lineup plans. The WD_Black SN750 SE is available for preorder from WD now, and will land on store shelves this summer.

We've known since last week that AMD's upcoming desktop processor socket, AM5, will be a land-grid array (LGA), much like Intel's desktop sockets; and today we have a first-look at what the land-grid will look like, courtesy of ExecutableFix, who first broke news of AM5 being an LGA of 1,718 pins. Below is a render of the AM5 contact pad (the underside of the processor). The 1,718 contacts span across the fiberglass substrate, with no socket island in the middle for ancillaries. All electrical ancillaries are located on the obverse side of the substrate, surrounding the die(s). The substrate area will remain 40 mm x 40 mm, so the processor package will be roughly of the same size as AM4. In comparison, Intel's upcoming LGA1700 package is expected to measure 37.5 mm x 45 mm (a rectangular substrate).

ExecutableFix put out a handful more details about the I/O of this socket. Apparently, AM5 is a pure-DDR5 platform, with no backwards compatibility with DDR4. The socket features a dual-channel DDR5 memory interface. The PCI-Express interface is PCI-Express 4.0, with the socket putting out 28 lanes in total. 16 of these go to the PEG slot(s), four to an M.2 NVMe slot, and possibly the remaining eight as chipset bus. Considering these are Gen 4, the next-generation X670 (X570 successor) chipset could have double the chipset-bus bandwidth compared to Intel Z590. A typical Socket AM5 chip, such as "Rembrandt," could feature a TDP of 120 W, going up to 170 W, according to the source.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen4 7000s Prem. SSD with up to 7 GB/s read speed while optimizing passive thermal dissipation, which promises no throttling under long-lasting operation. Through the SSD Tool Box application, users can have an instant control on overall operation of SSD.

AORUS Gen4 7000s Prem. SSD adopts the PCIe 4.0 NVMe M.2 interface and it equips the latest Phison E18 selected 8-channel controller, which provides users with ultimate random access rate, as well as the high speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. With the read speed up to 7 GB/s and write speed up to 6.85 GB/s, AORUS Gen4 7000s Prem. SSD can power up content creators, gamers, and users eager for extreme performance.

EliteMini TL50 is an ultra-compact and high-performance mini PC specially designed for home and office use. Equipped with Intel 11th generation CPU and Intel Iris Xe graphics. Intel Wi-Fi 6 & triple output, upgrade-friendly & windows 10 pro pre-installed.

TL50 comes with Intel Core i5-1135G7 processor (Tiger Lake), 4 cores/8 threads, backed up by Intel Iris Xe graphics, with 8M Cache, max turbo frequency up to 4.20 GHz. It is 20% faster than its predecessor with more cache memory, DDR4-3200 memory and PCIe 4.0 support. Not only ordinary work but also a little heavy games and video editing can be done comfortably.

Phison Electronics Corp., a global leader in NAND flash controllers and a complete line of storage solutions, and Cigent Technology, Inc., the leader in embedded cybersecurity technology, today unveiled design details behind the partnership that has delivered the industry's first and only line of self-defending storage devices with cybersecurity built into the firmware itself to protect against ransomware, data theft and malicious insider theft.

Phison's innovative and robust NAND flash solutions support a broad range of applications including embedded, consumer, enterprise and automotive. The Phison Crypto-SSD is a line of TCG enabled Self-Encrypting Drives that are designed to pass FIPS 140-3 Level 2 certification. Phison is committed to data security which helps to protect business and government users against loss or theft. Phison's collaboration with Cigent expands the E12DC Crypto-SSD security architecture to add additional compute capabilities, attack detectors and sensors directly on the drive. Together with Cigent, Phison has created a product that raises the bar of data security to a whole new level.

Intel today announced the 11th generation Core "Tiger Lake-H" mobile processors for notebooks of conventional thickness, gaming notebooks, and mobile workstations. This is the first scale-up of the "Tiger Lake" microarchitecture, with the introduction of a brand new die that has up to 8 "Willow Cove" CPU cores. These processors typically come with TDP of 35-45 W, but the flagship part ships with TDP as high as 65 W. Unlike "Rocket Lake," this chip is built on Intel's latest 10 nm SuperFin silicon fabrication process. With it, Intel is announcing ten processor SKUs—five each for the consumer and commercial notebook market segments. These span across the Core i9, Core i7, and Core i5 brand extensions.

The 10 nm "Tiger Lake-H" silicon measures roughly 190 mm², and has several changes compared to the 4-core "Tiger Lake-U" silicon the company debuted the 11th Gen with. The biggest change is the CPU core count of 8. This lets it not only achieve parity with AMD in mobile CPU core counts, but also purportedly beat it on the back of a higher IPC. Each of these 8 "Willow Cove" cores has 1.25 MB of dedicated L2 cache, and share 24 MB of L3 cache. You get the same "Willow Cove" ISA as the "Tiger Lake-U," including AVX-512 and DLBoost. Next up, the chip features an integrated graphics based on the Gen12 Xe LP graphics architecture, only that the execution units have reduced to just 32 on this silicon, compared to 96 on the 4-core Tiger Lake-U. The new chip enjoys a bigger power budget to run the iGPU at higher clock speeds. There is also a 20-lane PCI-Express Gen 4.0 interface, and a dual-channel DDR4 memory controller.

Singapore cybersecurity firm Flexxon on Monday launched the world's first solid-state drive (SSD) embedded with artificial intelligence (AI) data security. As the "last line of defence" to protect data at the hardware level, the SSD is able to guard against both remote and physical attacks, boasting a range of features including temperature sensors to detect unusual movements that occur. In the event of such an incursion, the device - also known as X-PHY - will alert the user via email and lock itself to prevent any physical tampering. Users may then unlock the device via a dynamic authentication process. For clients with high security needs, such as the military, data may be automatically wiped should the device fall into the wrong hands.

Minister for Foreign Affairs and Minister-in-charge of Singapore's Smart Nation Initiative Vivian Balakrishnan said that the innovation was a "breakthrough" and a significant step in increasing security and safety for end users, having put AI into the firmware layer of an SSD. Congratulating Flexxon on its new product, Dr Balakrishnan - who was the guest-of-honour at the launch - also called on similar companies to include research institutes, universities and the private sector to enhance local research and development efforts in AI.

Seagate Technology today announced the new Seagate One Touch SSD offering NVMe-competitive performance and stylish portability for technology enthusiasts and content creators alike. One Touch SSD delivers maximum sequential read/write speeds (up to 1030 MB/s) and up to 2 TB of storage making it a high-performance external drive optimized for efficiency when managing and transporting important files.

Compatible with Windows and Mac, the drive offers USB compatibility out of the box (exFAT formatted). Seagate's One Touch SSD uses USB 3.2 Gen 2 USB-C technology and is compatible with USB-C and USB 3.0 computers; both cables are included in the box. Also compatible with Android mobile devices, One Touch SSD helps free up extra space by backing up videos, photos, and files using the Seagate Mobile Touch app. Great for those on the go, the drive offers shock-resistance to a drop height of up to 2 meters.

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

Sabrent first teased their upcoming RocketQ Battleship SSD offering 8x 8 TB RocketQ M.2 NVMe SSDs paired with the Highpoint SSD7540 8-port PCIe 4.0 x16 NVMe RAID controller in January. This combination offers 64 TB of NVMe storage with speeds of up to 28 GB/s, the product appears to be nearing release after HighPoint listed the SSD on their website. The RocketQ Battleship has been listed on HighPoint Technologies NVMe AIC Drive Solutions page as coming soon. The RocketQ Battleship won't come cheap with the individual 8 TB RocketQ drives costing 1299 USD each, we would expect the product to retail for north of 10,000 USD if it ever gets a public release.

HighPoint TechnologiesBuilt around Sabrent's diverse Rocket Series of NVMe SSD's, Elite Class AIC drives offer unprecedented storage capacity and class-leading versatility

GIGABYTE today unveiled the M30 line of solid state drives built in the M.2-2280 form-factor, which leverage PCI-Express 3.0 x4 host interface. The drives combine an unknown controller with 256 MB of DDR3L DRAM cache, and 3D TLC NAND flash memory; and comes in capacities of 512 GB and 1 TB. Both these capacity variants have the same amount of DRAM cache. GIGABYTE is using a high-density PCB with 2 oz copper layers, which it claims, can lower controller temperature by up to 15 °C and NAND flash temperature by up to 5 °C.

As for performance, GIGABYTE claims that both capacity variants offer sequential reads of up to 3500 MB/s, and sequential writes of up to 3000 MB/s. The 1 TB variant offers 4K random reads of up to 308,000 IOPS, and random writes of up to 332,000 IOPS; while the 512 GB variant is slightly faster, offering up to 350,000 IOPS 4K random reads, and 302,000 IOPS 4K random writes. The drives are backed by 5-year warranty, the 1 TB variant offers an endurance of 650 TBW, and the 512 GB variant 350 TBW. The company didn't reveal pricing.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today presented two gaming systems of AMD X570 platform with AORUS MODEL X and AMD B550 platform with mini system AORUS MODEL S, which adopt the top-notch components and materials for extreme performance. Enhanced by the strict verification and leading technology, GIGABYTE provides the PC system of extreme performance with optimized heat dissipation and acoustic control. The system maintains cool and quiet even under the full operation, which balance the high performance and low temperature to keep the system acoustic under 40dB without throttling. Furthermore, the three-year warranty of full system offers an ease and comprehensive service for users.

"When tackling the uplift of PC performance, multi-core, high frequency, and copious storage become a must to the premium PC platform, as well as how to make the best components matrix to provide the optimized performance with reliability turns into more inevitable." indicated by Eddie Lin, Vice President of the GIGABYTE Channel Solutions. "The new AORUS system is well-tempered by multiple verification and tuning of GIGABYTE's R&D team, which provide a perfect match of cool, quiet, and powerful performance with compatibility and three-year whole system warranty.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today presented two gaming systems of Intel Z590 platform with AORUS MODEL X and mini system AORUS MODEL S, which adopt the top-notch components and materials for extreme performance. Enhanced by the strict verification and leading technology, GIGABYTE provides the PC system of premium performance with optimized heat dissipation and acoustic control. The system maintains cool and quiet even under the overclocking, which balance the high performance and low temperature to keep the system acoustic under 40dB without throttling. Furthermore, the three-year warranty of full system offers reassuring and comprehensive service for users.

"When tackling the uplift of PC performance, multi-core, high frequency, and copious storage become a standard to the premium PC platform, as well as how to make the best components matrix to provide the optimized performance with reliability turns into more inevitable." indicated by Eddie Lin, Vice President of the GIGABYTE Channel Solutions. "The new AORUS system is well-tempered by multiple verification and tuning of GIGABYTE's R&D team, which provide a perfect match of cool, quiet, and powerful performance with optimized compatibility, Expandability, and three-year warranty of whole system.

Western Digital Corp. (Nasdaq: WDC) today reported fiscal third quarter 2021 financial results. "We reported solid results above the guidance range, driven by increasing momentum of our energy-assisted drives and our second-generation NVMe enterprise SSDs, improving NAND flash pricing trends, along with the continued accelerated digital transformation across end markets," said David Goeckeler, Western Digital CEO.

"Western Digital's strengths in technology and cost leadership, expansive product portfolio and broad routes to market are providing a foundation upon which we are solidifying our position as an essential building block of the digital economy. These strengths, combined with our increased operational and strategic focus enabled by our new business unit structure, are driving results. As we continue to face a dynamic environment, we are seeing the benefits of the synergistic value in the breadth of Western Digital's portfolio, and our unique ability to deliver both hard drive and flash solutions to our diverse end-markets and customer base."

AAEON, an industry leader of AI and IOT solutions, is excited to celebrate the launch of Intel's latest scalable platform, the 3rd Generation Intel Xeon Scalable Processors (formerly Ice Lake-SP). As an associate member of the Intel IoT Solutions Alliance, AAEON is excited to bring this new technology to market with the ARES-WHI0 industrial ATX server board and other future products.

The 3rd Generation Intel Xeon Scalable Processors deliver the next generation of high-end computing performance and support for vital data integrity and security technologies. This new generation of Xeon SP brings higher processing speeds and Intel's Deep Learning Boost technology, allowing for greater acceleration and more efficient processing for AI server applications.

ATP Electronics, the global leader in specialized storage and memory solutions, has announced the launch of its tiniest NVMe flash storage offering: the N700 Series PCIe Gen3 x4 NVMe solid state drives (SSDs, which are available as M.2 Type 1620 heatsink ball-grid array (HSBGA) package. Complying with M.2 specifications, the M.2 Type 1620 HSBGA measures just 16 (L) x 20 (W) x 1.6 (H) mm, supporting high-speed PCIe 3.0 interface x4 lanes and NVMe protocol to deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane. The soldered-down design makes them vibration-proof, while the 291-ball packaging takes up minimal space within tightly confined systems.

For customers who prefer a removable and field-replaceable design, ATP can accommodate the HSBGA onto an M.2 2230 module with the same firmware and NAND configuration. Both variants are suitable for thin and light systems in embedded, industrial and mobile applications. N700 Series SSDs are built with 3D triple-level cell (TLC) configured as pseudo single-level cell (pSLC) NAND flash. By storing only one bit per cell, they increase the reliability and endurance of the NAND flash memory, while benefiting from the lower cost compared with native SLC, due to the higher cell density.

Akasa has added two new aluminium enclosures for M.2 drives to the current range of products. These are compatible with both SATA and NVMe drives and features USB 3.1 Generation 2 connectivity and UASP support, meaning you'll be making the most out of the super-fast data transfer speeds from your M.2 drive of up to 10 Gb/s.

The body on both enclosures are machined out of high-quality aluminium, ensuring a tight, safe fit for the closing mechanism. A tool-free design allows the installation of an M.2 SSD to be quick and easy, whilst also functioning as a heatsink to draw away excess heat from the drive. The sleek and simple Akasa logo finishes off the design perfectly, making the enclosure stand out from the crowd.

AMD seems to be preparing a chipset refresh, and this time, it is coming straight from the top-end market. When the company launched its high-end X570 chipset, it brought the PCIe 4.0 support, which many praised due to its capability to handle much faster NVMe drives. However, it seems like the company is not satisfied with that and it needs to release an updated chipset version called X570S. According to a popular hardware leaker, TUM_APISAK, we have discovered that GIGABYTE is preparing X570S Aorus Pro AX motherboard that will use the refreshed chipset. GIGABYTE already listed several Eurasian Economic Commission (EEC) listings, so the new chipset is sure to hit the market, just at an unknown time.

The S denotes the word silent, meaning that these updated chipsets are capable of working with passive cooling and possibly having a lower TDP compared to 11 and 15 Watts of the X570 chipsets for consumer and enterprise motherboards, respectively. The test was conducted using AMD's newly announced Ryzen 7 5700G processor. The 5000-series of APUs are so far limited to OEMs, so one would guess that GIGABYTE itself made the leak by using a public entry of CPU-Z validation.

BIWIN, a leading chip manufacturer for flash storage, reached an agreement with Acer to bring Acer-branded memory and personal SSD storage products to customers in the United States and China. The product offerings will take advantage of BIWIN's manufacturing capabilities and Acer's global brand recognition to provide the latest memory and storage solutions for both professional and home users. The new Acer-branded SSD portfolio offers a range of 2.5" SATA, M.2 SATA and M.2 PCIe NVMe drives. The entry-level 2.5" SA100 offers performance and reliability and is available in capacities from 120 GB to 1.92 TB.

The RE100 is available as a standard 2.5" SATA drive as well as in a smaller M.2 SATA form factor. With capacities from 128 GB up to 1 TB (M.2) and 4 TB (SATA) and with read and write speeds of 560 MB/s and 520 MB/s, the RE100 performs close to the SATA interface's maximum speed and is an extremely reliable solution in terms of speed and capacity to upgrade any desktop PC or laptop to the latest SATA technology. In terms of maximizing performance, an Acer-branded M.2 PCIe Gen3 NVMe drive, the FA100—is available in capacities from 128 GB up to 2 TB, reaching up to 3300 MB/s read and 2700 MB/s write speeds. This exceptional performance is six times faster than standard SATA SSDs.

BIWIN, a leading chip manufacturer for flash storage, reached an agreement with Acer to bring Predator-branded memory and personal SSD storage products to customers in the United States and Canada. The product offerings will take advantage of BIWIN's manufacturing capabilities and Predator's global brand recognition to provide the latest memory and storage solutions for both casual and professional gamers.

The Predator brand is known for providing hardcore PC gamers and esports professionals with high-end gaming solutions that give them a competitive edge. The new high-end flagship memory and storage portfolio under the Predator brand begins with state-of-the-art memory modules and blazing fast solid-state drives. With a powerful "cyberpunk inspired" design to match the power of its performance, the new Predator Apollo memory module series offers speed, style and special lighting. Its ultra-high frequency, ultra-low timing, and overclocking capabilities will satisfy even the most speed-thirsty gamers.

A new cryptocurrency going by the name of Chia could bring about a boom in demand for HDD and SSD, which have been kept relatively untouched by the latest mining and supply constraints. However, optimistic predictions of falling prices for NAND (optimistic for consumers, that is) could prove to be erroneous. Apparently, the new cryptocurrency, which saw its whitepaper being published in February 9th and has already led to shortages of high-performance SSDs from China's Jiahe Jinwei.

The cryptocurrency was designed to be mined in SSDs and HDDs, looking to cut on electricity cost from proof of Work (PoW) cryptocurrencies such as Bitcoin and (still) Ethereum. The intention is for the cryptocurrency to have as broad an appeal as possible, by excluding the need for prohibitive investments in either ASICs (for Bitcoin) or GPUs (for Ethereum and other Dagger/Hashimoto-based calculations). It also leverages that which is most widely available and oftentimes left empty of any workload - storage space. Due to this, it's been reported that Chinese miners are already buying HDDs (4 TB through to 18 TB) and SSDs (mainly NVMe solutions) in bulk. This could prevent technologists from ushering in the current trend of falling storage pricing - if demand becomes as crazy as it has become in the GPU space.

Silicon Power (SP) is releasing its latest PCIe Gen3 x4 SSD, the XD80, available in massive storage capacities up to 2 TB. It is the ideal solution for performance enthusiasts building custom gaming rigs or desktops. Featuring SLC Caching and DRAM Cache Buffer, the XD80 peels rubber with blazing read/write speeds up to 3,400/3,000 MB/s, respectively. Its high-speed PCIe Gen3 x4 interface leaves traditional SATA III SSDs behind in the dust, giving hardcore gamers the competitive edge they need to secure the win.

With NVMe 1.3 support, the XD80 delivers higher performance, lower latency, and lower power consumption for the smoothest gameplay without any lag. The durable aluminium heatsink provides maximum heat dissipation and thermal management. In fact, compared to SSDs without a heatsink, the XD80 keeps temperatures as much as 20% lower, maintaining its stability.